CN209798154U

CN209798154U - Device for heating and cooling electroplating cathode contact

Info

Publication number: CN209798154U
Application number: CN201920327437.4U
Authority: CN
Inventors: 徐日进
Original assignee: Fuzhou Shock Absorber Ltd By Share Ltd
Current assignee: Fuzhou Shock Absorber Ltd By Share Ltd
Priority date: 2019-03-14
Filing date: 2019-03-14
Publication date: 2019-12-17
Anticipated expiration: 2029-03-14

Abstract

the utility model relates to an electroplate technical field, and disclose an electroplate device that cathode contact generated heat and cooled down, including the electroplating box, the inner chamber right side wall fixed mounting of electroplating box has the response module, the bottom fixedly connected with pipe of electroplating box, the outside fixed mounting of pipe has the condensation piece, the stationary blade has all been welded to the left and right sides of pipe, the positive fixedly connected with locating plate of stationary blade, the locating plate is positive about the equal threaded connection in both ends have the bolt, the back fixedly connected with fly leaf of locating plate. This electroplating cathode contact device that generates heat and cool down cools down the plating solution after participating in the electroplating through the condensation piece, then the inside filter screen of fly leaf can filter the impurity in the plating solution, prevents that impurity from getting into the hydrologic cycle and polluting the work piece, and the plating solution is in the mobile state all the time at the in-process of electroplating, avoids the plating solution temperature to rise and influences the electroplating effect.

Description

Device for heating and cooling electroplating cathode contact

Technical Field

The utility model relates to an electroplate technical field, specifically be an electroplate device that cathode contact generated heat and cooled down.

Background

In the electroplating process, a plating metal or other insoluble materials is used as an anode, a workpiece to be plated is used as a cathode, cations of the plating metal are reduced on the surface of the workpiece to be plated to form a plating layer, in order to eliminate interference of other cations and enable the plating layer to be uniform and firm, a solution containing the plating metal cations is used as an electroplating solution to keep the concentration of the plating metal cations unchanged, and the purpose of electroplating is to plate a metal plating layer on a base material and change the surface property or the size of the base material.

Electroplating can improve the effects of wear resistance, conductivity, light reflection, corrosion resistance, beauty enhancement and the like, but the cathode can generate heat in electroplating, so that the temperature of electroplating solution is raised, the electroplating effect can be influenced after the temperature of the electroplating solution is raised, impurities deposited at the bottom of a tank cannot be filtered completely in electroplating, workpiece pollution is easily caused, quantitative supplement is difficult to be realized on the loss of the electroplating solution caused in the circulating process of the electroplating solution, the electroplating effect is not uniform, the reliability of the electroplating process is reduced, and therefore the device for reducing the temperature by contacting with the electroplating cathode to generate heat is provided to solve the problems.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model is not enough to prior art, the utility model provides an electroplate device that cathode contact generated heat and cooled down, possess the advantage that degradable and feature of environmental protection are good, it can generate heat to have solved the negative pole when electroplating, lead to the plating solution to heat up, can influence the effect of electroplating after the plating solution intensifies, in electroplating, can't filter the impurity of deposit at the tank bottom totally, easily cause the work piece to pollute, accomplish the ration to the plating solution loss that causes among the plating solution circulation process and supply very difficultly, make the effect of electroplating very inhomogeneous, reduce the problem of electroplating process reliability.

(II) technical scheme

For the purpose that realizes above-mentioned degradable and feature of environmental protection are good, the utility model provides a following technical scheme: a device for heating and cooling by electroplating cathode contact comprises an electroplating box, wherein a sensing module is fixedly arranged on the right side wall of an inner cavity of the electroplating box, a guide pipe is fixedly connected to the bottom of the electroplating box, a condensing sheet is fixedly arranged on the outer portion of the guide pipe, fixing sheets are welded on the left side and the right side of the guide pipe, a positioning plate is fixedly connected to the front side of each fixing sheet, bolts are in threaded connection with the left end and the right end of the front side of the positioning plate, a movable plate is fixedly connected to the back side of the positioning plate, a filter screen is fixedly connected to the inner portion of the movable plate, a liquid storage box is fixedly connected to one end, away from the electroplating box, of the guide pipe, a guide pipe is fixedly connected to the left side of the liquid storage box, a, the outside fixed mounting of feed liquor pipe has the solenoid valve, the one end fixedly connected with electroplating solution case that the connecting pipe was kept away from to the feed liquor pipe, electroplating solution case's top fixedly connected with feed liquor mouth.

Preferably, the top of the electroplating box is provided with an electroplating port, the left side of the electroplating box is provided with a liquid inlet, and the bottom of the electroplating box is provided with a liquid passing port.

Preferably, the induction module comprises a contact, a sensor and a controller, the guide pipe is spiral, and the guide pipe, the electroplating box, the liquid storage box and the flow guide pipe are communicated.

Preferably, the inner wall of the guide pipe is provided with an arc-shaped sliding groove at one side opposite to the two fixing pieces, and the front surface of the guide pipe is provided with an insertion hole at one side opposite to the two fixing pieces.

Preferably, the locating plate is the arcuation, and the positive left and right sides of locating plate all sets up symmetrical screw hole, two the front of stationary blade all sets up screw hole.

Preferably, the liquid inlet pipe and the connecting pipe are integrated, and one end of the connecting pipe, which is far away from the circulating pump, is fixedly connected with a liquid inlet formed in the left side of the electroplating tank.

(III) advantageous effects

Compared with the prior art, the utility model provides an electroplate device that cathode contact generated heat and cooled down possesses following beneficial effect:

The device for heating and cooling by electroplating cathode contact comprises a circulating pump, a liquid guide pipe, a connecting rod, a liquid guide pipe, a liquid level sensing module, a liquid inlet pipe, a liquid outlet pipe, a liquid, timely and quantitatively replenishing electroplating solution.

Drawings

FIG. 1 is a front view of the structure of the present invention;

Fig. 2 is a top view of the positioning plate structure of the present invention.

In the figure: 1 electroplating box, 2 response modules, 3 pipes, 4 condensation pieces, 5 stationary blades, 6 locating plates, 7 bolts, 8 movable plates, 9 filter screens, 10 liquid storage tanks, 11 honeycomb ducts, 12 circulating pumps, 13 liquid inlet pipes, 14 solenoid valves, 15 electroplating liquid boxes, 16 liquid inlet nozzles and 17 connecting pipes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, an electroplating cathode contact heating and cooling device comprises an electroplating box 1, wherein an electroplating opening is formed in the top of the electroplating box 1, a liquid inlet is formed in the left side of the electroplating box 1, a liquid passing opening is formed in the bottom of the electroplating box 1, a sensing module 2 is fixedly mounted on the right side wall of an inner cavity of the electroplating box 1, the sensing module 2 comprises a contact, a sensor and a controller, a conduit 3 is fixedly connected to the bottom of the electroplating box 1, the conduit 3 is spiral, the conduit 3, the electroplating box 1, a liquid storage box 10 and a flow guide pipe 11 are communicated, an arc-shaped chute is formed in the inner wall of the conduit 3 and located at one side opposite to two fixing pieces 5, a jack is formed in the front of the conduit 3 and located at one side opposite to the two fixing pieces 5, a condensing piece 4 is fixedly mounted outside the conduit 3, fixing pieces 5 are welded, the front of the fixing plate 5 is fixedly connected with a positioning plate 6, the positioning plate 6 is in an arc shape, the left side and the right side of the front of the positioning plate 6 are provided with symmetrical threaded holes, the left end and the right end of the front of the positioning plate 6 are in threaded connection with bolts 7, the back of the positioning plate 6 is fixedly connected with a movable plate 8, the interior of the movable plate 8 is fixedly connected with a filter screen 9, one end of the conduit 3 away from the electroplating tank 1 is fixedly connected with a liquid storage tank 10, the left side of the liquid storage tank 10 is fixedly connected with a flow guide pipe 11, one end of the flow guide pipe 11 away from the liquid storage tank 10 is fixedly provided with a circulating pump 12, the top of the circulating pump 12 is fixedly connected with a connecting pipe 17, one end of the connecting pipe 17 away from the circulating pump 12 is fixedly connected with a, one end of the liquid inlet pipe 13 far away from the connecting pipe 17 is fixedly connected with an electroplating liquid tank 15, and the top of the electroplating liquid tank 15 is fixedly connected with a liquid inlet nozzle 16, so that the aims of temperature reduction and good environmental protection are fulfilled.

When the electroplating device is used, substances to be electroplated are placed in the electroplating box 1, the circulating pump 12 is started to pump out electroplating solution in the liquid storage box 10, the electroplating solution enters the electroplating box 1 through the flow guide pipe 11 and the connecting rod 17 to electroplate the substances, the electroplating solution after being electroplated enters the liquid storage box 10 through the guide pipe 3 again, the condensing sheet 4 outside the guide pipe 3 cools the high-temperature electroplating solution when the electroplating solution passes through the guide pipe 3, then the filter screen 9 in the movable plate 8 can filter impurities in the electroplating solution to prevent the impurities from entering water circulation to pollute workpieces, the electroplating solution is always in a flowing state in the electroplating process to avoid the electroplating solution temperature from rising to influence the electroplating effect, when the induction module 2 senses that the liquid level of the electroplating solution drops, the electromagnetic valve 14 outside the liquid inlet pipe 13 is opened to enable the electroplating solution in the electroplating solution box 15 to enter the connecting rod 17 through the liquid inlet pipe 13, timely and quantitatively replenishing electroplating solution.

In conclusion, the device for heating and cooling by contact of electroplating cathode comprises a circulating pump 12 for pumping out the electroplating solution in a liquid storage tank 10 by putting the substances to be electroplated into an electroplating tank 1, a guide pipe 11 and a connecting rod 17 for allowing the electroplating solution to enter the electroplating tank 1 for electroplating the substances, a guide pipe 3 for allowing the electroplating solution to enter the liquid storage tank 10 again, a condensing sheet 4 outside the guide pipe 3 for cooling the electroplating solution with high temperature by allowing the electroplating solution to pass through the guide pipe 3, a filter screen 9 inside a movable plate 8 for filtering impurities in the electroplating solution to prevent the impurities from entering water circulation to pollute the workpiece, and the electroplating solution is always in a flowing state in the electroplating process to prevent the electroplating solution from being influenced by the temperature rise, when the sensing module 2 senses the liquid level of the electroplating solution to fall, a solenoid valve 14 outside the liquid inlet pipe 13 is opened, make the plating solution in the plating solution case 15 get into the inside of connecting rod 17 through feed liquor pipe 13, in time quantitative replenishment plating solution, the negative pole can generate heat when having solved electroplating, lead to the plating solution to heat up, can influence the effect of electroplating after the plating solution heaies up, in electroplating, can't filter the impurity of deposit at the tank bottom totally, easily cause the work piece to pollute, accomplish quantitative replenishment hardly to the plating solution loss that causes among the plating solution circulation process, make the effect of electroplating very inhomogeneous, reduce the problem of electroplating process reliability.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an electroplate device that cathode contact generated heat and cooled down, includes electroplating box (1), its characterized in that: the device comprises an electroplating box (1), an induction module (2) is fixedly mounted on the right side wall of an inner cavity of the electroplating box (1), a guide pipe (3) is fixedly connected to the bottom of the electroplating box (1), a condensation sheet (4) is fixedly mounted on the outer portion of the guide pipe (3), fixing sheets (5) are welded on the left side and the right side of the guide pipe (3), a positioning plate (6) is fixedly connected to the front of the fixing sheets (5), bolts (7) are connected to the left end and the right end of the positioning plate (6) in a threaded manner, a movable plate (8) is fixedly connected to the back of the positioning plate (6), a filter screen (9) is fixedly connected to the inner portion of the movable plate (8), a liquid storage box (10) is fixedly connected to one end of the guide pipe (3) far away from the electroplating box (1), a guide pipe (11) is fixedly connected to, the top fixedly connected with connecting pipe (17) of circulating pump (12), the left side fixedly connected with feed liquor pipe (13) of connecting pipe (17), the outside fixed mounting of feed liquor pipe (13) has solenoid valve (14), the one end fixedly connected with electroplating liquid case (15) of connecting pipe (17) are kept away from in feed liquor pipe (13), the top fixedly connected with feed liquor mouth (16) of electroplating liquid case (15).

2. the electroplating cathode contact heating and cooling device according to claim 1, wherein: the electroplating tank is characterized in that an electroplating opening is formed in the top of the electroplating tank (1), a liquid inlet is formed in the left side of the electroplating tank (1), and a liquid passing opening is formed in the bottom of the electroplating tank (1).

3. The electroplating cathode contact heating and cooling device according to claim 1, wherein: the induction module (2) comprises a contact, a sensor and a controller, the guide pipe (3) is in a spiral shape, and the guide pipe (3), the electroplating box (1), the liquid storage box (10) and the guide pipe (11) are communicated.

4. The electroplating cathode contact heating and cooling device according to claim 1, wherein: the inner wall of the guide pipe (3) is positioned on one side opposite to the two fixing pieces (5) and provided with an arc-shaped sliding groove, and the front face of the guide pipe (3) is positioned on one side opposite to the two fixing pieces (5) and provided with an insertion hole.

5. The electroplating cathode contact heating and cooling device according to claim 1, wherein: the locating plate (6) is arc-shaped, symmetrical threaded holes are formed in the left side and the right side of the front face of the locating plate (6), and threaded holes are formed in the front face of the fixing piece (5).

6. The electroplating cathode contact heating and cooling device according to claim 2, wherein: the liquid inlet pipe (13) and the connecting pipe (17) are integrated, and one end of the connecting pipe (17) far away from the circulating pump (12) is fixedly connected with a liquid inlet formed in the left side of the electroplating box (1).