KR20120064038A - 현상 장치, 이를 구비하는 현상 도포 시스템 및 현상 방법 - Google Patents

현상 장치, 이를 구비하는 현상 도포 시스템 및 현상 방법 Download PDF

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Publication number
KR20120064038A
KR20120064038A KR1020110130164A KR20110130164A KR20120064038A KR 20120064038 A KR20120064038 A KR 20120064038A KR 1020110130164 A KR1020110130164 A KR 1020110130164A KR 20110130164 A KR20110130164 A KR 20110130164A KR 20120064038 A KR20120064038 A KR 20120064038A
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KR
South Korea
Prior art keywords
substrate
developing
region
cleaning
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020110130164A
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English (en)
Korean (ko)
Inventor
미쯔히로 사까이
히로노부 가지와라
가쯔히로 도노까와
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20120064038A publication Critical patent/KR20120064038A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020110130164A 2010-12-08 2011-12-07 현상 장치, 이를 구비하는 현상 도포 시스템 및 현상 방법 Withdrawn KR20120064038A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2010-273529 2010-12-08
JP2010273529A JP5449116B2 (ja) 2010-12-08 2010-12-08 現像装置、これを備える現像塗布システム、および現像方法

Publications (1)

Publication Number Publication Date
KR20120064038A true KR20120064038A (ko) 2012-06-18

Family

ID=46505462

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110130164A Withdrawn KR20120064038A (ko) 2010-12-08 2011-12-07 현상 장치, 이를 구비하는 현상 도포 시스템 및 현상 방법

Country Status (2)

Country Link
JP (1) JP5449116B2 (https=)
KR (1) KR20120064038A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110610853A (zh) * 2018-06-15 2019-12-24 东京毅力科创株式会社 基片处理装置和基片处理方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6418531B2 (ja) * 2015-03-05 2018-11-07 新電元工業株式会社 レジスト現像装置、レジスト現像方法及び半導体装置の製造方法
JP7058550B2 (ja) * 2018-05-16 2022-04-22 東京エレクトロン株式会社 現像処理装置および現像処理方法
CN110794656A (zh) * 2018-08-03 2020-02-14 夏普株式会社 抗蚀膜形成基板的制造方法及其所涉及的工序管理系统

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3704064B2 (ja) * 2001-07-05 2005-10-05 東京エレクトロン株式会社 液処理装置および液処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110610853A (zh) * 2018-06-15 2019-12-24 东京毅力科创株式会社 基片处理装置和基片处理方法

Also Published As

Publication number Publication date
JP2012124308A (ja) 2012-06-28
JP5449116B2 (ja) 2014-03-19

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PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000