KR20120052190A - 반도체 디바이스들의 금속화 시스템에서 우수한 전자이주 성능 제공 및 민감성 로우-ｋ 유전체의 열화 감소 - Google Patents

반도체 디바이스들의 금속화 시스템에서 우수한 전자이주 성능 제공 및 민감성 로우-ｋ 유전체의 열화 감소 Download PDF

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KR20120052190A
KR20120052190A KR1020117022595A KR20117022595A KR20120052190A KR 20120052190 A KR20120052190 A KR 20120052190A KR 1020117022595 A KR1020117022595 A KR 1020117022595A KR 20117022595 A KR20117022595 A KR 20117022595A KR 20120052190 A KR20120052190 A KR 20120052190A
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South Korea
Prior art keywords
dielectric material
thermo
forming
copper
layer
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Korean (ko)
Inventor
올리버 아우벨
요에르그 호하제
프랑크 페우스텔
아셀 프레우제
Original Assignee
어드밴스드 마이크로 디바이시즈, 인코포레이티드
에이엠디 팹 36 리미티드 라이어빌리티 컴퍼니 & 코. 카게
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Publication of KR20120052190A publication Critical patent/KR20120052190A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/093—Manufacture or treatment of dielectric parts thereof by modifying materials of the dielectric parts
    • H10W20/096—Manufacture or treatment of dielectric parts thereof by modifying materials of the dielectric parts by contacting with gases, liquids or plasmas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/23—Cleaning during device manufacture during, before or after processing of insulating materials
    • H10P70/234—Cleaning during device manufacture during, before or after processing of insulating materials the processing being the formation of vias or contact holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/052—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers by treatments not introducing additional elements therein
    • H10W20/0526—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers by treatments not introducing additional elements therein by thermal treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/093—Manufacture or treatment of dielectric parts thereof by modifying materials of the dielectric parts
    • H10W20/097—Manufacture or treatment of dielectric parts thereof by modifying materials of the dielectric parts by thermally treating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/906—Cleaning of wafer as interim step

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Chemical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)
KR1020117022595A 2009-02-27 2010-02-22 반도체 디바이스들의 금속화 시스템에서 우수한 전자이주 성능 제공 및 민감성 로우-ｋ 유전체의 열화 감소 Withdrawn KR20120052190A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009010844.0A DE102009010844B4 (de) 2009-02-27 2009-02-27 Bereitstellen eines verbesserten Elektromigrationsverhaltens und Verringern der Beeinträchtigung empfindlicher dielektrischer Materialien mit kleinem ε in Metallisierungssystemen von Halbleiterbauelementen
DE102009010844.0 2009-02-27

Publications (1)

Publication Number Publication Date
KR20120052190A true KR20120052190A (ko) 2012-05-23

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KR1020117022595A Withdrawn KR20120052190A (ko) 2009-02-27 2010-02-22 반도체 디바이스들의 금속화 시스템에서 우수한 전자이주 성능 제공 및 민감성 로우-ｋ 유전체의 열화 감소

Country Status (6)

Country Link
US (1) US8153524B2 (https=)
JP (1) JP2012519373A (https=)
KR (1) KR20120052190A (https=)
CN (1) CN102388449A (https=)
DE (1) DE102009010844B4 (https=)
WO (1) WO2010097190A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008063417B4 (de) * 2008-12-31 2016-08-11 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Lokale Silizidierung an Kontaktlochunterseiten in Metallisierungssystemen von Halbleiterbauelementen
US8710660B2 (en) * 2012-07-20 2014-04-29 Taiwan Semiconductor Manufacturing Company, Ltd. Hybrid interconnect scheme including aluminum metal line in low-k dielectric
US9373579B2 (en) * 2012-12-14 2016-06-21 Taiwan Semiconductor Manufacturing Company, Ltd. Protecting layer in a semiconductor structure
CN103871959B (zh) * 2012-12-17 2017-11-03 中芯国际集成电路制造(上海)有限公司 互连结构及其制造方法
US20150206798A1 (en) * 2014-01-17 2015-07-23 Taiwan Semiconductor Manufacturing Company, Ltd. Interconnect Structure And Method of Forming
US10020260B1 (en) * 2016-12-22 2018-07-10 Globalfoundries Inc. Corrosion and/or etch protection layer for contacts and interconnect metallization integration
US10515896B2 (en) 2017-08-31 2019-12-24 Taiwan Semiconductor Manufacturing Co., Ltd. Interconnect structure for semiconductor device and methods of fabrication thereof
CN114664656A (zh) 2020-05-22 2022-06-24 北京屹唐半导体科技股份有限公司 使用臭氧气体和氢自由基的工件加工

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6259160B1 (en) * 1999-04-21 2001-07-10 Advanced Micro Devices, Inc. Apparatus and method of encapsulated copper (Cu) Interconnect formation
JP4034227B2 (ja) * 2002-05-08 2008-01-16 Ｎｅｃエレクトロニクス株式会社 半導体装置の製造方法
US6869878B1 (en) * 2003-02-14 2005-03-22 Advanced Micro Devices, Inc. Method of forming a selective barrier layer using a sacrificial layer
US7268074B2 (en) * 2004-06-14 2007-09-11 Enthone, Inc. Capping of metal interconnects in integrated circuit electronic devices
JP4903374B2 (ja) * 2004-09-02 2012-03-28 ローム株式会社 半導体装置の製造方法
US7309658B2 (en) * 2004-11-22 2007-12-18 Intermolecular, Inc. Molecular self-assembly in substrate processing
DE102005035740A1 (de) * 2005-07-29 2007-02-08 Advanced Micro Devices, Inc., Sunnyvale Verfahren zur Herstellung einer isolierenden Barrierenschicht für eine Kupfermetallisierungsschicht
JP2007053133A (ja) * 2005-08-15 2007-03-01 Toshiba Corp 半導体装置及びその製造方法
DE102005057057B4 (de) * 2005-11-30 2017-01-05 Advanced Micro Devices, Inc. Verfahren zur Herstellung einer isolierenden Deckschicht für eine Kupfermetallisierungsschicht unter Anwendung einer Silanreaktion
US7972954B2 (en) * 2006-01-24 2011-07-05 Infineon Technologies Ag Porous silicon dielectric
US20070228571A1 (en) * 2006-04-04 2007-10-04 Chen-Hua Yu Interconnect structure having a silicide/germanide cap layer
US20070287294A1 (en) 2006-06-08 2007-12-13 Taiwan Semiconductor Manufacturing Co., Ltd. Interconnect structures and methods for fabricating the same
JP5204964B2 (ja) * 2006-10-17 2013-06-05 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2008172051A (ja) * 2007-01-12 2008-07-24 Nec Electronics Corp 半導体装置およびその製造方法
DE102007022621B4 (de) 2007-05-15 2017-06-01 Advanced Micro Devices Inc. Verfahren zur Herstellung einer dielektrischen Deckschicht für eine Kupfermetallisierung unter Anwendung einer thermisch-chemischen Behandlung auf Wasserstoffbasis
JP2009016520A (ja) * 2007-07-04 2009-01-22 Tokyo Electron Ltd 半導体装置の製造方法及び半導体装置の製造装置
US7776740B2 (en) * 2008-01-22 2010-08-17 Tokyo Electron Limited Method for integrating selective low-temperature ruthenium deposition into copper metallization of a semiconductor device
US7928003B2 (en) * 2008-10-10 2011-04-19 Applied Materials, Inc. Air gap interconnects using carbon-based films

Also Published As

Publication number Publication date
JP2012519373A (ja) 2012-08-23
DE102009010844B4 (de) 2018-10-11
DE102009010844A1 (de) 2010-09-02
CN102388449A (zh) 2012-03-21
US20100221911A1 (en) 2010-09-02
US8153524B2 (en) 2012-04-10
WO2010097190A1 (en) 2010-09-02

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