KR20120051895A - Wafer cleaning mechine and wafer cleaning method - Google Patents

Wafer cleaning mechine and wafer cleaning method Download PDF

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Publication number
KR20120051895A
KR20120051895A KR1020100113239A KR20100113239A KR20120051895A KR 20120051895 A KR20120051895 A KR 20120051895A KR 1020100113239 A KR1020100113239 A KR 1020100113239A KR 20100113239 A KR20100113239 A KR 20100113239A KR 20120051895 A KR20120051895 A KR 20120051895A
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KR
South Korea
Prior art keywords
wafer
cleaning
wafers
wafer cleaning
cleaning apparatus
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Application number
KR1020100113239A
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Korean (ko)
Inventor
정은도
조희돈
Original Assignee
주식회사 엘지실트론
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Priority to KR1020100113239A priority Critical patent/KR20120051895A/en
Publication of KR20120051895A publication Critical patent/KR20120051895A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

Embodiments relate to a wafer cleaning apparatus and a wafer cleaning method.
A wafer cleaning method according to an embodiment includes loading a first set of wafers into a cleaning bath; And inserting a second set of wafers between each wafer of the first set to load the cleaning bath.

Description

Wafer cleaning device and wafer cleaning method {Wafer Cleaning Mechine and Wafer Cleaning Method}

Embodiments relate to a wafer cleaning apparatus and a wafer cleaning method.

The process for manufacturing a wafer for manufacturing a semiconductor device includes a cutting process for slicing a silicon ingot after growth of a silicon ingot, an edge grinding process for rounding the edges of the sliced wafer, and a wafer process due to the cutting process. Lapping process to planarize rough surface, cleaning process to remove various contaminants including particles attached to wafer surface during edge grinding or lapping process, surface grinding process to secure shape and surface suitable for post process and wafer edge Edge polishing process.

The wafer cleaning process is a process of removing impurities remaining on the wafer using a chemical solution and deionized water.

Meanwhile, as the demand for semiconductors increases, batch type cleaning apparatuses are being used in various ways to increase productivity and cleaning efficiency of wafer cleaning apparatuses.

The batch type cleaning device according to the prior art is more productive than the sheet type, but there is a limit to the productivity of the batch type cleaning device because a wafer of one cassette is put in one batch. have. Of course, there is a method of increasing the size of the cleaning device, but this is a situation that needs to improve the cleaning efficiency while utilizing the existing cleaning equipment to increase the burden on the plant facilities.

In addition, the batch type cleaning apparatus according to the prior art ensures uniform cleaning conditions of wafer to wafer since all wafers of one cassette are put in one batch. It's hard to do

For example, as all of the 25 wafers are introduced into the batch as shown in FIG. 1, the flow of chemical or ultrapure water (DIW) in the batch does not affect the entire wafer uniformly. LLS (Localized Light Scatters) differences occur for each slot.

In particular, when the cleaning operation proceeds according to the prior art, the particle (Particle) quality between slots occurs, especially in the case of slot 25, the difference is very large.

The reason for the large quality difference in slot 25 is that among the 25 wafers in the batch, the wafer located inside forms a laminar flow, but the wafer in the edge area causes the laminar flow. This is because it does not form and forms turbulence and affects the wafer surface.

On the other hand, slot 1 does not have a significant effect, but slot 25 has a large effect because the wafer backside (wafer backside) is located on the outside of the batch, slot 25 is the front (side) to the outside of the batch This is because it directly affects wafer particle quality.

An embodiment is to provide a wafer cleaning apparatus and a wafer cleaning method that can improve the productivity of the cleaning apparatus.

In addition, the embodiment is to provide a wafer cleaning apparatus and a wafer cleaning method that can make the cleaning quality between wafers uniform.

A wafer cleaning apparatus according to the embodiment includes a cleaning bath; And a transfer robot for loading a wafer into the cleaning bath, wherein the transfer robot comprises: a first driver for moving the wafer cassette in an axial direction; And a second driver capable of rotating the wafer cassette.

In addition, a wafer cleaning method according to an embodiment includes the steps of loading a first set of wafers into a cleaning bath; And inserting a second set of wafers between each wafer of the first set to load the cleaning bath.

According to the wafer cleaning apparatus and the wafer cleaning method according to the embodiment, the productivity of the cleaning apparatus can be improved by performing the cleaning while the second set of wafers are sandwiched between the first set of wafers.

Further, according to the embodiment, the cleaning quality between wafers can be made uniform by arranging the backside of the outermost wafer toward the cleaning bath.

1 is a table showing the particle quality per slot in the cleaning apparatus according to the prior art.
2 is an illustration of a cleaning method according to the first embodiment in the wafer cleaning apparatus according to the embodiment.
3 is an exemplary view of a cleaning method according to a second embodiment in a wafer cleaning apparatus according to the embodiment.
Figure 4 is an exemplary operation of the transfer robot for the cleaning method according to the second embodiment in the wafer cleaning apparatus according to the embodiment.

In the description of the embodiments, each wafer, apparatus, chuck, member, sub-region, or surface is referred to as being "on" or "under" Quot ;, " on "and" under "include both being formed" directly "or" indirectly " In addition, the criteria for "up" or "down" of each component are described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

(Example)

2 is an illustration of a cleaning method according to the first embodiment in the wafer cleaning apparatus according to the embodiment.

According to an embodiment, a first set of wafers 110, for example a first cassette (not shown) on which 25 wafers are loaded, is loaded into a wafer transfer chamber (WTC) (not shown), and the wafer The first set of wafers 110 are arranged horizontally in the transfer chamber.

Thereafter, the first set of wafers 110 is rotated 90 degrees. As a result, the first set of wafers 110 are disposed in a vertical configuration and placed on a wafer pusher and aligner (hereinafter referred to as "wafer aligner") (not shown).

The operation of the wafer aligner is as follows. When the first set of wafers 110 are transferred from the wafer transfer chamber in a vertical form, the wafers are inserted into and mounted in grooves formed in the pair of edge bars. Thereafter, after the wafer is separated from the edge bar, the wafer is rotated by rotating the roller by driving the motor of the motor unit to align the wafer. When the alignment of the entire wafer is complete, the first set of wafers 110 are unloaded and transferred to a cleaning bath 210.

On the other hand, an embodiment is to provide a wafer cleaning apparatus and a wafer cleaning method that can improve the productivity of the cleaning apparatus.

To this end, in the wafer cleaning method according to the embodiment, after the loading of the first set of wafers 110 into the cleaning bath 210, the second set of wafers 120a is transferred to each of the first sets of wafers 110. Interposed between the loading may include the step of loading the cleaning bath (210).

According to the wafer cleaning apparatus and the wafer cleaning method according to the embodiment, a breakthrough method of increasing the productivity of the cleaning apparatus by almost twice is provided.

Accordingly, according to the wafer cleaning apparatus and the wafer cleaning method according to the embodiment, the productivity of the cleaning apparatus can be improved by performing the cleaning while the second set of wafers are sandwiched between the first set of wafers.

3 is an exemplary view illustrating a cleaning method according to a second embodiment in the wafer cleaning apparatus according to the embodiment, and FIG. 4 illustrates a transfer robot 220 for performing a cleaning method according to the second embodiment in the wafer cleaning apparatus according to the embodiment. ) Is an example of operation.

Embodiments provide a wafer cleaning apparatus and a wafer cleaning method capable of making uniform the cleaning quality between wafers.

To this end, the wafer cleaning apparatus according to the embodiment includes a cleaning bath (210); And a transfer robot 220 for loading a wafer into the cleaning bath 210. The transfer robot 220 includes: a first driver 222 moving the wafer cassette 230 in an axial direction; And a second driver 224 capable of rotating the wafer cassette 230.

The second driver 224 may rotate the wafer cassette 230 by 180 °.

According to the cleaning method according to the second embodiment, the back side of the wafer at the outermost of the first set of wafers 110 and the second set of wafers 120b is the cleaning bath 210. The cleaning of the wafer may be performed so as to face.

To this end, the step of sandwiching the second set of wafers between the respective wafers of the first set and loading them into the cleaning bath 210 may be performed by using a transfer robot to rotate the second set of wafer cassettes 120a by 180 °. After the rotating step, the second set of wafers 120b rotated 180 ° may be sandwiched between the first sets of wafers 110 and loaded into the cleaning bath.

Further, according to the embodiment, the cleaning quality between wafers can be made uniform by arranging the backside of the outermost wafer toward the cleaning bath.

According to the first embodiment, two cassettes are put in the cleaning bath 210 to increase the cleaning work efficiency.

On the other hand, the first set of wafers 110 work in the same manner as before, and inverting the second set of wafers when the wafer is placed, the wafer located at the outermost side of the cleaning bath 210 faces the existing front side. On the contrary, it faces the back side.

For example, as shown in FIG. 3, when the cleaning apparatus is configured, the outermost wafer can always be in the back side direction, thereby further improving the LLS quality of the cleaning apparatus.

4 is a view illustrating an operation of the transfer robot 220 for the progress of the cleaning method according to the second embodiment in the wafer cleaning apparatus according to the embodiment.

Type that transfers only the existing single-axis reciprocating motion (A) of the Transfer Robot 220 from the open cassette in the cleaner load to the cleaning bath 210 of the cleaner. In the case of changing to a robot which performs one axis reciprocating motion (A) and proceeds together with 180 ° rotation (B), the wafer can be introduced into the cleaning apparatus as shown in the improved concept of FIG. 3. If the cleaning apparatus is configured as in the embodiment, it is possible to ensure uniform particle quality in the entire slot of the wafer.

According to the wafer cleaning apparatus and the wafer cleaning method according to the embodiment, the productivity of the cleaning apparatus can be improved by performing the cleaning while the second set of wafers are sandwiched between the first set of wafers.

Further, according to the embodiment, the cleaning quality between wafers can be made uniform by arranging the backside of the outermost wafer toward the cleaning bath.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Accordingly, the contents of such combinations and modifications should be construed as being included in the scope of the embodiments.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. It can be seen that the modification and application of branches are possible. For example, each component specifically shown in the embodiment can be modified. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

Claims (5)

Loading a first set of wafers into a cleaning bath; And
And inserting a second set of wafers between each wafer of the first set and loading the wafer into the cleaning bath. The method according to claim 1,
And cleaning the wafer with the back side of the first outermost wafer of the first set of wafers and the second set of wafers facing the cleaning bath. The method of claim 2,
Sandwiching the second set of wafers between each wafer of the first set and loading them into the cleaning bath,
And rotating the second set of wafer cassettes by 180 ° using a transfer robot to insert the second set of wafers rotated by 180 ° between the first set of wafers and to load the wafers into the cleaning bath. Cleaning baths; And
A transfer robot for loading a wafer into the cleaning bath;
The transfer robot,
A first driver for moving the wafer cassette in the axial direction; And
And a second driving unit capable of rotating the wafer cassette. The method of claim 4, wherein
And the second driver is capable of rotating the wafer cassette 180 °.
KR1020100113239A 2010-11-15 2010-11-15 Wafer cleaning mechine and wafer cleaning method KR20120051895A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100113239A KR20120051895A (en) 2010-11-15 2010-11-15 Wafer cleaning mechine and wafer cleaning method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100113239A KR20120051895A (en) 2010-11-15 2010-11-15 Wafer cleaning mechine and wafer cleaning method

Publications (1)

Publication Number Publication Date
KR20120051895A true KR20120051895A (en) 2012-05-23

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