KR20120038338A - Light emitting device, method for fabricating the light emitting device, light emitting device package and lighting system - Google Patents

Abstract

PURPOSE: A light emitting device, a light emitting device manufacturing method, a light emitting device package, and a lighting system are provided to increase a beam angle using a protrusion of a light guide layer, thereby improving light extraction efficiency. CONSTITUTION: A first conductivity type semiconductor layer(110) includes recesses. A second conductivity type semiconductor layer is arranged. An active layer(120) is arranged between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer. A light guide layer is arranged inside of the recess. A part of the light guide layer is projected to the outside of the recess. The thickness of the recess is 500Å to 3μm. The light guide layer(117) is formed with a material which has a refractive index in a range of 1.4 to 2.4.

Description

LIGHT EMITTING DEVICE, METHOD FOR FABRICATING THE LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM}

The present invention relates to a light emitting device, a light emitting device manufacturing method, a light emitting device package and an illumination system.

Group III-V nitride semiconductors have been spotlighted as core materials of light emitting devices such as light emitting diodes (LEDs) or laser diodes (LDs) due to their physical and chemical properties. The III-V conductive semiconductors are usually made of a semiconductor material having a composition formula of In _x Al _y Ga _{1 -x- y} N (0≤x≤1, 0≤y≤1, 0≤x + y≤1). .

Light emitting diodes (LEDs) are a type of semiconductor device that transmits and receives signals by converting electricity into infrared rays or light using characteristics of a compound semiconductor.

It is widely used in light emitting devices for obtaining light of LEDs or LDs using such conductive semiconductor materials, and has been applied to light sources of various products such as keypad light emitting units, electronic displays, and lighting devices of mobile phones.

The embodiment provides a light emitting device having a new structure, a method of manufacturing the same, a light emitting device package, and an illumination system.

The embodiment provides a semiconductor light emitting device having improved light extraction efficiency, a method of manufacturing the same, a light emitting device package, and an illumination system.

A light emitting device according to the embodiment includes a first conductivity type semiconductor layer including a recess in a plurality of regions; A second conductivity type semiconductor layer; An active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer; And a light guide layer disposed in the recess and a portion of which protrudes out of the recess.

In the method of manufacturing a light emitting device according to the embodiment, a first conductive semiconductor layer including a recess in a plurality of regions, a second conductive semiconductor layer, disposed between the first conductive semiconductor layer and the second conductive semiconductor layer. Forming an active layer; And forming a light guide layer disposed in the recess and a portion of which protrudes out of the recess.

The light emitting device package according to the embodiment includes a package body; A first electrode layer and a second electrode layer provided on the package body; And a light emitting device electrically connected to the first electrode layer and the second electrode layer, wherein the light emitting device includes: a first conductivity type semiconductor layer including recesses in a plurality of regions; A second conductivity type semiconductor layer; An active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer; And a light guide layer disposed in the recess and a portion of which protrudes out of the recess.

According to an embodiment, there is provided a lighting system, wherein the lighting system includes a light emitting module including a substrate and a light emitting device package installed on the substrate, wherein the light emitting device package includes a package body and a package body. A first conductive semiconductor layer comprising a first electrode layer and a second electrode layer, and a light emitting device electrically connected to the first electrode layer and the second electrode layer, wherein the light emitting device includes a recess in a plurality of regions; A second conductivity type semiconductor layer; An active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer; And a light guide layer disposed in the recess and a portion of which protrudes out of the recess.

The embodiment can provide a light emitting device having a new structure, a method of manufacturing the same, a light emitting device package, and an illumination system.

The embodiment provides a semiconductor light emitting device having improved light extraction efficiency, a method of manufacturing the same, a light emitting device package, and an illumination system.

1 is a side cross-sectional view of a light emitting device according to an embodiment
2 is a top view of a light emitting device according to the embodiment;
3 to 16 illustrate a method of manufacturing a light emitting device according to an embodiment.
17 is a cross-sectional view of a light emitting device package including a light emitting device according to the embodiment
18 illustrates a backlight unit including a light emitting device package according to embodiments.
19 is a perspective view of a lighting unit including a light emitting device or a light emitting device package according to embodiments.

In the description of the embodiments, each layer (film), region, pattern or structure layer is formed on or "under" the substrate, each layer (film), region, pad or pattern. In the case where it is described as "to", "on" and "under" include both "directly" or "indirectly" formed. In addition, the criteria for the top or bottom of each layer will be described with reference to the drawings.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.

Hereinafter, a light emitting device, a light emitting device manufacturing method, a light emitting device package, and a lighting system according to an embodiment will be described with reference to the accompanying drawings.

1 and 2 are side cross-sectional and top views, respectively, of a light emitting device 100 according to an embodiment of the present invention.

Referring to FIG. 1, the light emitting device 100 according to the embodiment is formed on the conductive support member 175 and the conductive support member 175, and has a light guide layer 117 formed thereon. A light emitting structure layer 135 including a semiconductor layer 110, an active layer 120, and a second conductivity type semiconductor layer 130, an electrode 115 on the light emitting structure layer 135, and the light emitting structure layer A protective film 180 formed on the top and side surfaces of the 135 may be included.

In addition, a protective member 140, an ohmic layer 150, a reflective layer 160, a bonding layer 170, and a current blocking layer 145 are formed between the conductive support member 175 and the light emitting structure layer 135. Can be.

The light emitting structure layer 135 includes a first conductive semiconductor layer 110, an active layer 120, and a second conductive semiconductor layer 130, and is provided from the first and second conductive semiconductor layers 110 and 130. The electrons and holes may be recombined in the active layer 120 to generate light.

The conductive support member 175 may support the light emitting structure layer 135 and provide power to the light emitting structure layer 135 together with the electrode 115. The conductive support member 175 may be, for example, copper (Cu), gold (Au), nickel (Ni), molybdenum (Mo), copper-tungsten (Cu-W), or a carrier wafer (eg, Si, Ge). , GaAs, ZnO, SiC, SiGe, etc.). The thickness of the conductive support member 175 may vary depending on the design of the light emitting device 100, but may have, for example, a thickness of 30 μm to 500 μm.

The bonding layer 170 may be formed on the conductive support member 175. The bonding layer 170 is a bonding layer, and is formed under the reflective layer 160 and the protective member 140. An outer surface of the bonding layer 170 may be exposed, and the bonding layer 170 may be in contact with the reflective layer 160, an end of the ohmic layer 150, and the protective member 140 to enhance adhesion between the layers.

The bonding layer 170 includes at least one of a barrier metal or a bonding metal, and includes at least one of Ti, Au, Sn, Ni, Cr, Ga, In, Bi, Cu, Ag, or Ta. can do.

The reflective layer 160 may be formed on the bonding layer 170. The reflective layer 160 may reflect light incident from the light emitting structure layer 135 to improve the light emitting efficiency of the light emitting device 100.

The reflective layer 160 may be formed of, for example, a metal or an alloy including at least one of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, or Hf. Alternatively, the metal or alloy may be formed in a multilayer using a light transmitting conductive material such as ITO, IZO, IZTO, IAZO, IGZO, IGTO, AZO, or ATO. Specifically, IZO / Ni, AZO / Ag, It may be laminated to at least one of IZO / Ag / Ni, or AZO / Ag / Ni.

The ohmic layer 150 may be formed on the reflective layer 160. The ohmic layer 150 is in ohmic contact with the second conductive semiconductor layer 130 to smoothly supply power to the light emitting structure layer 135, and may include ITO, IZO, IZTO, IAZO, IGZO, IGTO, AZO, Or at least one of ATO.

That is, the ohmic layer 150 may selectively use a translucent conductive layer and a metal, and may include indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), and indium aluminum zinc oxide (IZO). , Indium gallium zinc oxide (IGZO), indium gallium tin oxide (IGTO), aluminum zinc oxide (AZO), antimony tin oxide (ATO), gallium zinc oxide (GZO), IrO _x , RuO _x , RuO _x / ITO, Ni , Ag, Ni / IrO _x / Au, or Ni / IrO _x / Au / ITO can be implemented in a single layer or multiple layers.

A current blocking layer (CBL) 145 may be formed in the ohmic layer 150 to contact the second conductive semiconductor layer 130. The current blocking layer 145 may be formed such that at least a portion of the current blocking layer 145 overlaps with the electrode 115 in a vertical direction, thereby concentrating current to the shortest distance between the electrode 115 and the conductive support member 175. The light emitting efficiency of the light emitting device 100 may be improved by alleviating the phenomenon.

The current blocking layer 145 may be formed of a Schottky contact with a material having electrical insulation, a material having a lower electrical conductivity than the reflective layer 160 or the bonding layer 170, and the second conductive semiconductor layer 130. It may be formed using at least one of the materials, for example, ITO, IZO, IZTO, IAZO, IGZO, IGTO, AZO, ATO, ZnO, SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , At least one of Al ₂ O ₃ , TiO _x , Ti, Al, or Cr.

The current blocking layer 145 may be formed between the ohmic layer 150 and the second conductive semiconductor layer 130, or may be formed between the reflective layer 160 and the ohmic layer 150. It does not limit to this.

The protective member 140 may be formed in a circumferential region of the upper surface of the bonding layer 170. That is, the protection member 140 may be formed in the peripheral region between the light emitting structure layer 135 and the bonding layer 170.

The protection member 140 may minimize the electrical short between the light emitting structure layer 135 and the conductive support member 175, and between the light emitting structure layer 135 and the conductive support member 175. The penetration of moisture and the like can be prevented.

The protection member 140 is a material having electrical insulation, a material having a lower electrical conductivity than the reflective layer 160 or the bonding layer 170, and a material forming a schottky contact with the second conductive semiconductor layer 130. It may be formed using at least one of, for example, ITO, IZO, IZTO, IAZO, IGZO, IGTO, AZO, ATO, ZnO, SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , Al It may include at least one of ₂ O ₃ , TiO _x , Ti, Al, or Cr.

The light emitting structure layer 135 may be formed on the ohmic layer 150 and the protection member 140.

The light emitting structure layer 135 may include a plurality of group III-V compound semiconductor layers. For example, the first conductive semiconductor layer 110 and the first conductive semiconductor layer 110 may be disposed under the light emitting structure layer 135. The second conductive semiconductor layer 130 may be included in the active layer 120 and under the active layer 120.

The first conductive semiconductor layer 110 is a first conductive type dopant is doped Ⅲ? Ⅴ group compound semiconductor elements of _{In x Al y Ga 1 -x- y} N (0≤x≤1, 0≤y≤ 1, 0 ≦ x + y ≦ 1), and may be selected from, for example, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP, or the like. When the first conductivity type semiconductor layer 110 is an N type semiconductor layer, the first conductivity type dopant includes an N type dopant such as Si, Ge, Sn, Se, or Te. The first conductivity type semiconductor layer 110 may be formed as a single layer or a multilayer, but is not limited thereto.

The active layer 120 is formed under the first conductivity type semiconductor layer 110 and may include any one of a single quantum well structure, a multi quantum well structure (MQW), a quantum dot structure, or a quantum line structure. The active layer 120 may be formed using a compound semiconductor material of a group III-V element in a cycle of a well layer and a barrier layer, for example, an InGaN well layer / GaN barrier layer or an InGaN well layer / AlGaN barrier layer. .

A conductive clad layer may be formed on or under the active layer 120, and the conductive clad layer may be formed of an AlGaN-based semiconductor.

The second conductivity-type semiconductor layer 130 is formed under the active layer 120 and is a compound semiconductor of a group III-V element doped with a second conductivity-type dopant. In _x Al _y Ga _{1 -x- y} N ( 0≤x≤1, 0≤y≤1, 0≤x + y≤1), for example, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, or AlGaInP And the like. When the second conductivity type semiconductor layer 130 is a P type semiconductor layer, the second conductivity type dopant may include a P type dopant such as Mg and Zn.

Meanwhile, the light emitting structure layer 135 may include a semiconductor layer having a polarity opposite to that of the second conductive semiconductor layer under the second conductive semiconductor layer 130. In addition, the first conductivity type semiconductor layer 110 may be a P type semiconductor layer, and the second conductivity type semiconductor layer 130 may be implemented as an N type semiconductor layer. Accordingly, the light emitting structure layer 135 may include at least one of an N-P junction, a P-N junction, an N-P-N junction, or a P-N-P junction structure.

The side surface of the light emitting structure layer 135 may be inclined by an isolation etching for dividing a plurality of chips into individual chip units, and a part of the upper surface of the protective member 140 is exposed by the isolation etching. May be

A portion of the first conductivity type semiconductor layer 110 may be etched to form a recess 113. The width of the recess 113 may increase or decrease toward the active layer 120 in the first conductivity type semiconductor layer 110.

The light guide layer 117 may be formed to fill the recess 113 formed in the first conductivity-type semiconductor layer 110 and have a height greater than or equal to the recess 113. The light guide layer 117 may be formed of a material different from that of the passivation layer 180, and may be formed of Al ₂ O _{3 ,} SiO _{2 ,} or TiO _2. It may be formed of at least one. The protrusions of the light guide layer 117 may be formed to be separated from each other, and the protrusions may be formed in the shape of a hemisphere, a polygon, or the like, but is not limited thereto. The light guide layer 117 may be formed to have a width of 50 to 1000 Å.

The electrode 115 may be formed on an upper surface of the light emitting structure layer 135. The electrode 115 may be branched in a predetermined pattern shape, but is not limited thereto.

The electrode 115 may be in contact with an upper surface of the first conductive semiconductor layer 110, that is, an N-face surface. In addition, the electrode 115 may have at least one pad and an electrode pattern having at least one shape connected to the pad in the same or different stacked structure, but is not limited thereto.

The passivation layer 180 may be formed on the top and side surfaces of the light emitting structure layer 135. In detail, one end 184 of the passivation layer 180 is disposed on the top surface of the first conductivity-type semiconductor layer 110, and the other end 182 is formed along the side surface of the light emitting structure layer 135. It may be formed to be disposed on the upper surface of 140, but is not limited thereto.

The passivation layer 180 may prevent the light emitting structure layer 135 from causing an electrical short such as an external electrode, and may have a material having electrical insulation and light transmissivity, for example, SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , or Al ₂ O ₃ To be formed into at least one of Can be.

Referring to FIG. 2, an electrode 115 may be formed in the center of the light emitting device 100, and a light guide layer 117 may be formed in the first conductive semiconductor layer 110. In FIG. 2, the light guide layer 117 is disposed at regular intervals and formed in the same size, but is not limited thereto. In addition, the light guide layer 117 may be formed in a circular shape, but may be formed in any shape such as a rectangle or a triangle, and may be formed of a material having a refractive index in the range of 1.4 to 2.4.

The light guide layer 117 minimizes scattering of light inside the first conductive semiconductor layer 110 and light generated in the active layer 120 is emitted to the outside through the first conductive semiconductor layer 110. In this case, since the directivity is enlarged by the protrusion, there is an effect of improving light diffusion and light extraction efficiency.

Hereinafter, a method of manufacturing the light emitting device 100 according to the embodiment will be described in detail. However, the description overlapping with the above description will be omitted or briefly described.

3 to 16 illustrate a method of manufacturing the light emitting device 100 according to the embodiment.

Referring to FIG. 3, the light emitting structure layer 135 may be formed on the growth substrate 101.

The growth substrate 101 may be formed of, for example, at least one of sapphire (Al ₂ O ₃ ), SiC, GaAs, GaN, ZnO, Si, GaP, InP, or Ge, but is not limited thereto.

The light emitting structure layer 135 may be formed by sequentially growing the first conductive semiconductor layer 110, the active layer 120, and the second conductive semiconductor layer 130 on the growth substrate 101. .

The light emitting structure layer 135 may include, for example, Metal Organic Chemical Vapor Deposition (MOCVD), Chemical Vapor Deposition (CVD), Plasma-Enhanced Chemical Vapor Deposition (PECVD), Molecular Beam Epitaxy (MBE) or Hydride Vapor Phase Epitaxy (HVPE) may be formed using a method such as, but is not limited thereto.

Meanwhile, a buffer layer (not shown) may be formed between the light emitting structure layer 135 and the growth substrate 101 to alleviate the lattice constant difference between the light emitting structure layer 135 and the growth substrate 101.

Referring to FIG. 4, the protection member 140 may be formed on the light emitting structure layer 135 along the chip boundary region.

The protection member 140 may be formed around the individual chip area using a patterned mask, and may be formed in a ring shape, a loop shape, a frame shape, or the like. The protection member 140 may be formed using, for example, a method such as electron beam (E-beam) deposition, sputtering, or plasma enhanced chemical vapor deposition (PECVD).

Referring to FIG. 5, the current blocking layer 145 may be formed on the second conductive semiconductor layer 130. The current blocking layer 145 may be formed using a patterned mask.

The current blocking layer 145 may be formed at a position overlapping at least a portion of the electrode 115 in the vertical direction, thereby alleviating a phenomenon in which the current is biased to a specific region in the light emitting structure layer 135.

6 and 7, the ohmic layer 150 is formed on the second conductivity-type semiconductor layer 130 and the current blocking layer 145, and the reflective layer is formed on the ohmic layer 150. 160).

The ohmic layer 150 and the reflective layer 160 may be formed by, for example, any one of an electron beam (E-beam) deposition, sputtering, and plasma enhanced chemical vapor deposition (PECVD).

Referring to FIG. 8, the bonding layer 170 may be formed on the reflective layer 160 and the protection member 140, and the conductive support member 175 may be formed on the bonding layer 170. .

The bonding layer 170 may be in contact with the reflective layer 160, the end of the ohmic layer 150, and the protective member 140 to strengthen the adhesive force between the layers.

The conductive support member 175 may be formed by a bonding method attached to the bonding layer 170 by preparing a separate sheet, or may be formed by a plating method or a deposition method, and the like. It doesn't.

8 and 9, after inverting the light emitting device of FIG. 8 by 180 degrees, the growth substrate 101 may be removed.

The growth substrate 101 may be removed by at least one of laser lift off or etching.

As the growth substrate 101 is removed, the surface of the first conductivity type semiconductor layer 110 may be exposed.

Referring to FIG. 10, a first mask 148 may be formed in a chip boundary region on the exposed first conductive semiconductor layer 110.

For example, the first mask 148 may be formed of any one of a photo resist and a metal material, but is not limited thereto.

Referring to FIG. 11, the recess 113 is formed on an upper surface of the first conductivity type semiconductor layer 110. In this case, the recess 113 may be formed except for an area of the upper surface of the first conductivity-type semiconductor layer 110 that is covered by the first mask 148.

The recess 113 may be formed using wet etching using an etchant such as dry etching KOH, H ₂ SO ₄ , or H ₃ PO ₄ such as inductively coupled plasma (ICP), but is not limited thereto. .

The recess 113 may have a random shape and an arrangement, or may be formed to have a desired shape and an arrangement, and the width of the recess 113 is the active layer 120 in the first conductive semiconductor layer 110. It may increase or decrease toward.

The recess 113 may be formed to have a thickness of 500 μm to 3 μm, and may be formed so as not to pass through the active layer 120 to secure the light emitting area.

The length of the recess disposed in the first conductivity type semiconductor layer 110 may be greater than the length protruding above the first conductivity type semiconductor layer.

After the recess 113 is formed, the first mask 148 may be removed.

Referring to FIG. 12, a light guide layer 117 may be formed to fill the recess 113. The light guide layer 117 may be formed of a material different from that of the passivation layer 180, and may be formed of Al ₂ O _{3 ,} SiO _{2 ,} or TiO _2. It may be formed of at least one of. The protrusions of the light guide layer 117 may be formed to be separated from each other, and the protrusions may be formed in the shape of a hemisphere, a polygon, or the like, but is not limited thereto. The protrusion may be formed at a height of 50 nm to 100 μm.

Referring to FIG. 13, a second mask 149 may be formed on the top surface of the first conductivity type semiconductor layer 110 and the light guide layer 117.

The second mask 149 may be formed to perform isolation etching for dividing the plurality of light emitting devices into individual light emitting device units. For example, the second mask 149 may be formed of any one of a photo resist or a metal material. It may be formed as one, but is not limited thereto.

Referring to FIG. 14, isolation etching may be performed on the chip boundary region 105 of the light emitting structure layer 135 through the second mask 149 to divide the plurality of light emitting devices into individual light emitting device units.

The isolation etching may be performed using, for example, wet etching using an etchant such as dry etching KOH, H ₂ SO ₄ , or H ₃ PO ₄ such as inductively coupled plasma (ICP), but is not limited thereto. Do not.

The side surface of the light emitting structure layer 135 may have an inclined side surface as shown by the isolation etching. In addition, the upper surface of the protective member 140 may be partially exposed by the isolation etching.

Referring to FIG. 15, the electrode 115 may be formed on the light emitting structure layer 135, and the passivation layer 180 may be formed on the top and side surfaces of the light emitting structure layer 135.

Although the electrode 115 is formed at a position where the light guide layer 117 is not formed, it is sufficient if the electrode 115 is formed to be in contact with the first conductive semiconductor layer 110 in a partial region. It may be formed to partially overlap the upper portion of the light guide layer 117 protruding from the semiconductor layer 110.

One end 184 of the passivation layer 180 is disposed on an upper surface of the first conductivity type semiconductor layer 110, and the other end 182 is formed along the side surface of the light emitting structure layer 135. It may be disposed on the upper surface.

Referring to FIG. 16, the light emitting device 100 according to the embodiment may be provided by performing a chip separation process of separating the light emitting devices of FIG. 15 into individual light emitting device units.

The chip separation process includes, for example, a breaking process of separating a chip by applying a physical force using a blade, a laser scrubbing process of separating a chip by irradiating a laser to a chip boundary, and a wet or dry etching process. An etching process may be included, but is not limited thereto.

17 is a cross-sectional view of a light emitting device package including a light emitting device according to the embodiment.

Referring to FIG. 17, the light emitting device package according to the embodiment may be installed on the body 20, the first electrode layer 31 and the second electrode layer 32 installed on the body 20, and the body 20. The light emitting device 100 according to the embodiment electrically connected to the first electrode layer 31 and the second electrode layer 32, and a molding member 40 surrounding the light emitting device 100.

The body 20 may include a silicon material, a synthetic resin material, or a metal material, and an inclined surface may be formed around the light emitting device 100.

The first electrode layer 31 and the second electrode layer 32 are electrically separated from each other, and provide power to the light emitting device 100. In addition, the first electrode layer 31 and the second electrode layer 32 may increase light efficiency by reflecting the light generated from the light emitting device 100, and externally generate heat generated from the light emitting device 100. May also act as a drain.

The light emitting device 100 may be installed on the body 20 or on the first electrode layer 31 or the second electrode layer 32.

The light emitting device 100 may be electrically connected to the first electrode layer 31 and the second electrode layer 32 by any one of a wire method, a flip chip method, or a die bonding method.

The molding member 40 may surround the light emitting device 100 to protect the light emitting device 100. In addition, the molding member 40 may include a phosphor to change the wavelength of the light emitted from the light emitting device 100.

A plurality of light emitting device packages according to the embodiment may be arranged on a substrate, and a light guide plate, a prism sheet, a diffusion sheet, a fluorescent sheet, or the like, which is an optical member, may be disposed on a path of light emitted from the light emitting device package. The light emitting device package, the substrate, and the optical member may function as a backlight unit or as a lighting unit. For example, the lighting system may include a backlight unit, a lighting unit, an indicator device, a lamp, and a street lamp.

18 is a diagram illustrating a backlight unit using a light emitting device package according to an embodiment. However, the backlight unit 1100 of FIG. 18 is an example of a lighting system, but is not limited thereto.

Referring to FIG. 18, the backlight unit 1100 may include a bottom frame 1140, an optical guide member 1120 disposed in the bottom frame 1140, and at least one side or a bottom surface of the optical guide member 1120. It may include a light emitting module 1110 disposed in. In addition, a reflective sheet 1130 may be disposed under the light guide member 1120.

The bottom frame 1140 may be formed in a box shape having an upper surface open to accommodate the light guide member 1120, the light emitting module 1110, and the reflective sheet 1130. Or it may be formed of a resin material but is not limited thereto.

The light emitting module 1110 may include a substrate and a light emitting device package according to a plurality of embodiments mounted on the substrate. The plurality of light emitting device packages may provide light to the light guide member 1120.

As shown, the light emitting module 1110 may be disposed on at least one of the inner surfaces of the bottom frame 1140, thereby providing light toward at least one side of the light guide member 1120. can do.

However, the light emitting module 1110 may be disposed under the bottom frame 1140 to provide light toward the bottom surface of the light guide member 1120, which is according to the design of the backlight unit 1100. Since various modifications are possible, the present invention is not limited thereto.

The light guide member 1120 may be disposed in the bottom frame 1140. The light guide member 1120 may guide the light provided from the light emitting module 1110 to a display panel by surface light source.

The light guide member 1120 may be, for example, a light guide panel (LGP). The light guide plate may be formed of, for example, one of an acrylic resin series such as polymethyl metaacrylate (PMMA), polyethylene terephthlate (PET), polycarbonate (PC), COC, or polyethylene naphthalate (PEN) resin.

The optical sheet 1150 may be disposed above the light guide member 1120.

The optical sheet 1150 may include at least one of, for example, a diffusion sheet, a light collecting sheet, a luminance rising sheet, and a fluorescent sheet. For example, the optical sheet 1150 may be formed by stacking the diffusion sheet, the light collecting sheet, the luminance increasing sheet, and the fluorescent sheet. In this case, the diffusion sheet 1150 may evenly diffuse the light emitted from the light emitting module 1110, and the diffused light may be focused onto a display panel (not shown) by the light collecting sheet. In this case, the light emitted from the light collecting sheet is randomly polarized light, and the luminance increasing sheet may increase the degree of polarization of the light emitted from the light collecting sheet. The light collecting sheet may be, for example, a horizontal or / and vertical prism sheet. In addition, the luminance increase sheet may be, for example, a roughness enhancement film. In addition, the fluorescent sheet may be a translucent plate or film containing a phosphor.

The reflective sheet 1130 may be disposed under the light guide member 1120. The reflective sheet 1130 may reflect light emitted through the bottom surface of the light guide member 1120 toward the exit surface of the light guide member 1120.

The reflective sheet 1130 may be formed of at least one of a resin material having good reflectance, for example, PET, PC, or PVC resin, but is not limited thereto.

19 is a perspective view of a lighting unit using a light emitting device package according to the embodiments. However, the lighting unit 1200 of FIG. 19 is an example of a lighting system, but is not limited thereto.

Referring to FIG. 19, the lighting unit 1200 is installed in the case body 1210, the light emitting module 1230 installed in the case body 1210, and the case body 1210, and provides power from an external power source. It may include a receiving connection terminal 1220.

The case body 1210 is preferably formed of a material having good heat dissipation characteristics, for example, may be formed of a metal material or a resin material.

The light emitting module 1230 may include a substrate 300 and a light emitting device package 200 according to at least one embodiment mounted on the substrate 300.

The substrate 300 may have a circuit pattern printed on an insulator, and for example, a general printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, and the like. It may include.

In addition, the substrate 300 may be formed of a material that reflects light efficiently, or the surface may be formed of a color that reflects light efficiently, for example, white, silver, or the like.

The light emitting device package 200 according to the at least one embodiment may be mounted on the substrate 300. Each of the light emitting device packages 200 may include at least one light emitting diode (LED). The light emitting diodes may include colored light emitting diodes emitting red, green, blue, or white colored light, and UV light emitting diodes emitting ultraviolet (UV) light.

The light emitting module 1230 may be arranged to have a combination of various light emitting diodes in order to obtain color and brightness. For example, a white light emitting diode, a red light emitting diode, and a green light emitting diode may be combined to secure high color rendering (CRI). In addition, a fluorescent sheet may be further disposed on a path of the light emitted from the light emitting module 1230, and the fluorescent sheet changes the wavelength of light emitted from the light emitting module 1230. For example, when the light emitted from the light emitting module 1230 has a blue wavelength band, the fluorescent sheet may include a yellow phosphor, and the light emitted from the light emitting module 1230 finally passes white light through the fluorescent sheet. Will be shown.

The connection terminal 1220 may be electrically connected to the light emitting module 1230 to supply power. According to FIG. 19, the connection terminal 1220 is inserted into and coupled to an external power source in a socket manner, but is not limited thereto. For example, the connection terminal 1220 may be formed in a pin shape and inserted into an external power source, or may be connected to the external power source by a wire.

In the lighting system as described above, at least one of a light guide member, a diffusion sheet, a light collecting sheet, a luminance rising sheet, and a fluorescent sheet may be disposed on a propagation path of light emitted from the light emitting module to obtain a desired optical effect.

As described above, the lighting system according to the embodiments may be improved reliability by including the light emitting device package according to the embodiments.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

Claims (9)

A first conductivity type semiconductor layer including recesses in the plurality of regions;
A second conductivity type semiconductor layer;
An active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer; And
And a light guide layer disposed in the recess and partially protruding out of the recess. The method of claim 1,
The recess is light emitting device is formed to a thickness of 500 ~ 3μm. The method of claim 1,
The light guide layer is formed of a material having a refractive index of 1.4 or more and 2.4 or less. The method of claim 1,
The light guide layer includes at least one of Al ₂ O ₃ , SiO ₂ , TiO ₂ . The method of claim 1,
The light guide layer is a light emitting device formed to a width of 50 to 1000 50. The method of claim 1,
The light guide layer has a height inside the recess greater than a height outside the recess. The method of claim 1,
The height of the light guide layer protruding out of the recess is formed of 50nm to 100μm. Package body;
A first conductive layer layer and a second conductive layer layer provided on the package body; And
A light emitting device package comprising the light emitting device according to any one of claims 1 to 7 electrically connected to the first conductive layer layer and the second conductive layer layer. In the lighting system,
The lighting system includes a light emitting module including a substrate and a light emitting device package installed on the substrate,
The light emitting device package may include a package body, a first conductive layer layer and a second conductive layer layer provided on the package body, and any one of claims 1 to 7 electrically connected to the first conductive layer layer and the second conductive layer layer. An illumination system comprising the light emitting element of claim.

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