KR20120037999A - 기판홀더 시스템, 기판접합장치 및 디바이스의 제조방법 - Google Patents

기판홀더 시스템, 기판접합장치 및 디바이스의 제조방법 Download PDF

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Publication number
KR20120037999A
KR20120037999A KR1020127004356A KR20127004356A KR20120037999A KR 20120037999 A KR20120037999 A KR 20120037999A KR 1020127004356 A KR1020127004356 A KR 1020127004356A KR 20127004356 A KR20127004356 A KR 20127004356A KR 20120037999 A KR20120037999 A KR 20120037999A
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KR
South Korea
Prior art keywords
substrate
substrate holder
board
coupling member
holder
Prior art date
Application number
KR1020127004356A
Other languages
English (en)
Korean (ko)
Inventor
이사오 스가야
준이치 초난
히데히로 마에다
Original Assignee
가부시키가이샤 니콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 가부시키가이샤 니콘 filed Critical 가부시키가이샤 니콘
Publication of KR20120037999A publication Critical patent/KR20120037999A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
KR1020127004356A 2009-07-21 2010-07-21 기판홀더 시스템, 기판접합장치 및 디바이스의 제조방법 KR20120037999A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2009-170513 2009-07-21
JP2009170513 2009-07-21
JPJP-P-2009-253438 2009-11-04
JP2009253438 2009-11-04

Publications (1)

Publication Number Publication Date
KR20120037999A true KR20120037999A (ko) 2012-04-20

Family

ID=43498934

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127004356A KR20120037999A (ko) 2009-07-21 2010-07-21 기판홀더 시스템, 기판접합장치 및 디바이스의 제조방법

Country Status (8)

Country Link
US (1) US9054140B2 (ja)
EP (1) EP2458628A4 (ja)
JP (1) JP5810914B2 (ja)
KR (1) KR20120037999A (ja)
CN (1) CN102498559B (ja)
IN (1) IN2012DN01481A (ja)
TW (1) TW201131689A (ja)
WO (1) WO2011010452A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150136482A (ko) * 2013-03-27 2015-12-07 에베 그룹 에. 탈너 게엠베하 기판 스택을 취급하기 위한 장치 및 방법과 보유 장치
KR20170096938A (ko) * 2014-12-18 2017-08-25 에베 그룹 에. 탈너 게엠베하 기질을 접합시키기 위한 방법
KR20190093708A (ko) * 2014-02-03 2019-08-09 에베 그룹 에. 탈너 게엠베하 기질을 결합하기 위한 방법 및 장치

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* Cited by examiner, † Cited by third party
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DE102011115498A1 (de) * 2011-10-11 2012-12-20 Carl Zeiss Smt Gmbh Lagervorrichtung zur Lagerung eines Substrats und mikrolithographische Projektionsbelichtungsanlage mit einer solchen Lagervorrichtung
US10121760B2 (en) 2013-11-01 2018-11-06 Nikon Corporation Wafer bonding system and method
JP6378942B2 (ja) 2014-06-12 2018-08-22 東京エレクトロン株式会社 載置台及びプラズマ処理装置
US10964562B2 (en) 2016-09-29 2021-03-30 Ev Group E. Thallner Gmbh Device and method for bonding of two substrates
JP6516889B2 (ja) * 2018-01-29 2019-05-22 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板スタックを取り扱うための、収容システム及び装置及び方法

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US4038599A (en) 1974-12-30 1977-07-26 International Business Machines Corporation High density wafer contacting and test system
JP2673239B2 (ja) * 1988-11-07 1997-11-05 東京エレクトロン株式会社 処理装置
US5133491A (en) * 1990-12-20 1992-07-28 Die Tech, Inc. Substrate breaker
JP3296108B2 (ja) * 1994-08-08 2002-06-24 神鋼電機株式会社 電子基板用コンテナ
JPH11261000A (ja) 1998-03-13 1999-09-24 Japan Science & Technology Corp ３次元半導体集積回路装置の製造方法
JP3693972B2 (ja) * 2002-03-19 2005-09-14 富士通株式会社 貼合せ基板製造装置及び基板貼合せ方法
US7040525B2 (en) * 2002-03-20 2006-05-09 Lg.Philips Lcd Co., Ltd. Stage structure in bonding machine and method for controlling the same
CN1325981C (zh) * 2002-03-20 2007-07-11 Lg.菲利浦Lcd株式会社 粘合机中的工作台结构及其控制方法
KR20040073087A (ko) * 2003-02-13 2004-08-19 삼성전자주식회사 웨이퍼 홀더
JP4626160B2 (ja) * 2004-03-04 2011-02-02 株式会社ニコン ウェハ重ね合わせ方法及びウェハ重ね合わせ装置
JP4465225B2 (ja) * 2004-05-28 2010-05-19 有限会社都波岐精工 基板接合装置、基板接合方法および記録ディスク製造方法
JP4548239B2 (ja) * 2005-06-21 2010-09-22 パナソニック株式会社 基板接合方法および基板接合装置
JP4107316B2 (ja) 2005-09-02 2008-06-25 株式会社日立プラントテクノロジー 基板貼合装置
JP2007115978A (ja) 2005-10-21 2007-05-10 Nikon Corp 加圧装置及び半導体装置の製造方法
US7245350B2 (en) * 2005-11-11 2007-07-17 Canon Kabushiki Kaisha Exposure apparatus
JP2008087847A (ja) * 2006-10-05 2008-04-17 Clean Surface Gijutsu:Kk 基板収納ケース
JP2008140986A (ja) * 2006-12-01 2008-06-19 Murata Mach Ltd 枚葉搬送用トレイ
TWI471971B (zh) * 2007-10-30 2015-02-01 尼康股份有限公司 Substrate holding member, substrate bonding apparatus, laminated substrate manufacturing apparatus, substrate bonding method, laminated substrate manufacturing method, and laminated semiconductor device manufacturing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150136482A (ko) * 2013-03-27 2015-12-07 에베 그룹 에. 탈너 게엠베하 기판 스택을 취급하기 위한 장치 및 방법과 보유 장치
KR20190093708A (ko) * 2014-02-03 2019-08-09 에베 그룹 에. 탈너 게엠베하 기질을 결합하기 위한 방법 및 장치
KR20200138415A (ko) * 2014-02-03 2020-12-09 에베 그룹 에. 탈너 게엠베하 기질을 결합하기 위한 방법 및 장치
KR20170096938A (ko) * 2014-12-18 2017-08-25 에베 그룹 에. 탈너 게엠베하 기질을 접합시키기 위한 방법

Also Published As

Publication number Publication date
IN2012DN01481A (ja) 2015-06-05
CN102498559A (zh) 2012-06-13
US9054140B2 (en) 2015-06-09
JPWO2011010452A1 (ja) 2012-12-27
EP2458628A4 (en) 2016-12-21
CN102498559B (zh) 2016-03-02
US20120205024A1 (en) 2012-08-16
JP5810914B2 (ja) 2015-11-11
EP2458628A1 (en) 2012-05-30
TW201131689A (en) 2011-09-16
WO2011010452A1 (ja) 2011-01-27

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