KR20120037999A - 기판홀더 시스템, 기판접합장치 및 디바이스의 제조방법 - Google Patents

기판홀더 시스템, 기판접합장치 및 디바이스의 제조방법 Download PDF

Info

Publication number
KR20120037999A
KR20120037999A KR1020127004356A KR20127004356A KR20120037999A KR 20120037999 A KR20120037999 A KR 20120037999A KR 1020127004356 A KR1020127004356 A KR 1020127004356A KR 20127004356 A KR20127004356 A KR 20127004356A KR 20120037999 A KR20120037999 A KR 20120037999A
Authority
KR
South Korea
Prior art keywords
substrate
substrate holder
board
coupling member
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020127004356A
Other languages
English (en)
Korean (ko)
Inventor
이사오 스가야
준이치 초난
히데히로 마에다
Original Assignee
가부시키가이샤 니콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 니콘 filed Critical 가부시키가이샤 니콘
Publication of KR20120037999A publication Critical patent/KR20120037999A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P10/00—Bonding of wafers, substrates or parts of devices
    • H10P10/12—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates
    • H10P10/128—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates by direct semiconductor to semiconductor bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
KR1020127004356A 2009-07-21 2010-07-21 기판홀더 시스템, 기판접합장치 및 디바이스의 제조방법 Ceased KR20120037999A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2009-170513 2009-07-21
JP2009170513 2009-07-21
JPJP-P-2009-253438 2009-11-04
JP2009253438 2009-11-04

Publications (1)

Publication Number Publication Date
KR20120037999A true KR20120037999A (ko) 2012-04-20

Family

ID=43498934

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127004356A Ceased KR20120037999A (ko) 2009-07-21 2010-07-21 기판홀더 시스템, 기판접합장치 및 디바이스의 제조방법

Country Status (8)

Country Link
US (1) US9054140B2 (https=)
EP (1) EP2458628A4 (https=)
JP (1) JP5810914B2 (https=)
KR (1) KR20120037999A (https=)
CN (1) CN102498559B (https=)
IN (1) IN2012DN01481A (https=)
TW (1) TW201131689A (https=)
WO (1) WO2011010452A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150136482A (ko) * 2013-03-27 2015-12-07 에베 그룹 에. 탈너 게엠베하 기판 스택을 취급하기 위한 장치 및 방법과 보유 장치
KR20170096938A (ko) * 2014-12-18 2017-08-25 에베 그룹 에. 탈너 게엠베하 기질을 접합시키기 위한 방법
KR20190093708A (ko) * 2014-02-03 2019-08-09 에베 그룹 에. 탈너 게엠베하 기질을 결합하기 위한 방법 및 장치

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011115498A1 (de) * 2011-10-11 2012-12-20 Carl Zeiss Smt Gmbh Lagervorrichtung zur Lagerung eines Substrats und mikrolithographische Projektionsbelichtungsanlage mit einer solchen Lagervorrichtung
US10121760B2 (en) 2013-11-01 2018-11-06 Nikon Corporation Wafer bonding system and method
JP6378942B2 (ja) 2014-06-12 2018-08-22 東京エレクトロン株式会社 載置台及びプラズマ処理装置
CN115954300A (zh) 2016-09-29 2023-04-11 Ev 集团 E·索尔纳有限责任公司 用于结合两个基板的装置和方法
JP6516889B2 (ja) * 2018-01-29 2019-05-22 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板スタックを取り扱うための、収容システム及び装置及び方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038599A (en) 1974-12-30 1977-07-26 International Business Machines Corporation High density wafer contacting and test system
JP2673239B2 (ja) * 1988-11-07 1997-11-05 東京エレクトロン株式会社 処理装置
US5133491A (en) * 1990-12-20 1992-07-28 Die Tech, Inc. Substrate breaker
JP3296108B2 (ja) * 1994-08-08 2002-06-24 神鋼電機株式会社 電子基板用コンテナ
JPH11261000A (ja) 1998-03-13 1999-09-24 Japan Science & Technology Corp ３次元半導体集積回路装置の製造方法
JP3693972B2 (ja) * 2002-03-19 2005-09-14 富士通株式会社 貼合せ基板製造装置及び基板貼合せ方法
CN1325981C (zh) * 2002-03-20 2007-07-11 Lg.菲利浦Lcd株式会社 粘合机中的工作台结构及其控制方法
US7040525B2 (en) * 2002-03-20 2006-05-09 Lg.Philips Lcd Co., Ltd. Stage structure in bonding machine and method for controlling the same
KR20040073087A (ko) * 2003-02-13 2004-08-19 삼성전자주식회사 웨이퍼 홀더
JP4626160B2 (ja) 2004-03-04 2011-02-02 株式会社ニコン ウェハ重ね合わせ方法及びウェハ重ね合わせ装置
JP4465225B2 (ja) * 2004-05-28 2010-05-19 有限会社都波岐精工 基板接合装置、基板接合方法および記録ディスク製造方法
JP4548239B2 (ja) * 2005-06-21 2010-09-22 パナソニック株式会社 基板接合方法および基板接合装置
JP4107316B2 (ja) 2005-09-02 2008-06-25 株式会社日立プラントテクノロジー 基板貼合装置
JP2007115978A (ja) 2005-10-21 2007-05-10 Nikon Corp 加圧装置及び半導体装置の製造方法
US7245350B2 (en) * 2005-11-11 2007-07-17 Canon Kabushiki Kaisha Exposure apparatus
JP2008087847A (ja) * 2006-10-05 2008-04-17 Clean Surface Gijutsu:Kk 基板収納ケース
JP2008140986A (ja) * 2006-12-01 2008-06-19 Murata Mach Ltd 枚葉搬送用トレイ
TWI471971B (zh) * 2007-10-30 2015-02-01 尼康股份有限公司 Substrate holding member, substrate bonding apparatus, laminated substrate manufacturing apparatus, substrate bonding method, laminated substrate manufacturing method, and laminated semiconductor device manufacturing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150136482A (ko) * 2013-03-27 2015-12-07 에베 그룹 에. 탈너 게엠베하 기판 스택을 취급하기 위한 장치 및 방법과 보유 장치
KR20190093708A (ko) * 2014-02-03 2019-08-09 에베 그룹 에. 탈너 게엠베하 기질을 결합하기 위한 방법 및 장치
KR20200138415A (ko) * 2014-02-03 2020-12-09 에베 그룹 에. 탈너 게엠베하 기질을 결합하기 위한 방법 및 장치
KR20170096938A (ko) * 2014-12-18 2017-08-25 에베 그룹 에. 탈너 게엠베하 기질을 접합시키기 위한 방법

Also Published As

Publication number Publication date
US20120205024A1 (en) 2012-08-16
TW201131689A (en) 2011-09-16
US9054140B2 (en) 2015-06-09
JPWO2011010452A1 (ja) 2012-12-27
IN2012DN01481A (https=) 2015-06-05
WO2011010452A1 (ja) 2011-01-27
CN102498559B (zh) 2016-03-02
EP2458628A1 (en) 2012-05-30
JP5810914B2 (ja) 2015-11-11
CN102498559A (zh) 2012-06-13
EP2458628A4 (en) 2016-12-21

Similar Documents

Publication Publication Date Title
KR20120037999A (ko) 기판홀더 시스템, 기판접합장치 및 디바이스의 제조방법
US10714351B2 (en) Multi-layered substrate manufacturing method
KR101746241B1 (ko) 기판처리 시스템, 기판홀더, 기판홀더쌍, 기판접합장치 및 디바이스의 제조방법
KR102637642B1 (ko) 접합 방법, 접합 장치, 및 유지 부재
CN111566782B (zh) 基板处理装置和基板处理方法
KR102012692B1 (ko) 마이크로 소자 전사장치 및 마이크로 소자 전사방법
JP6742551B2 (ja) 基板処理装置
JP2006339191A (ja) ウェハホルダ、ウェハ積層方法及び積層型半導体装置製造方法
JPH09283392A (ja) 基板の重ね合わせ方法及び装置
JP2010153645A (ja) 積層半導体装置の製造方法
KR100715725B1 (ko) 칩 실장장치
KR102781855B1 (ko) 마그네틱 콜렛
JP5560590B2 (ja) 基板貼り合わせ装置
EP1811828A1 (en) Micromechanical placement system, and corresponding device
JP2013026555A (ja) 管理装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000