KR20120022292A - A cliche for printing ink and a method of fabricating thereof - Google Patents

Abstract

PURPOSE: A printing plate and a manufacturing method thereof are provided to form micro-patterns which have different widths or depths since a printing plate is manufactured by imprinting a photosensitive resin and a thermosetting resin using a metal mold. CONSTITUTION: A resin layer(120) is formed on a substrate(110)(S1). The resin layer is imprinted by using a mold(130) with a mold pattern(S2). The mold is separated from the resin layer(S3). A functional layer(140) is formed on an upper side of the resin layer(S4).

Description

Printing plate and manufacturing method thereof {A CLICHE FOR PRINTING INK AND A METHOD OF FABRICATING THEREOF}

The present invention relates to a printing plate for manufacturing an electromagnetic plate and a display device.

In order to print circuits and various patterns of electronic components using printing, direct printing methods such as inkjets are used, or indirect printing methods such as gravure printing or offset printing using printing plates on which patterns are printed. Conventionally, a method of making a printing plate includes a method of corroding a substrate to form a pattern, or a method of forming a plate on which a photosensitive resin is first attached using photolithography.

In a flat panel display device such as a liquid crystal display device, a device such as a thin film transistor is provided in each pixel to drive the flat panel display device. However, in a flat panel display device such as a liquid crystal display device, the PR pattern forming process is an important process that greatly affects the performance of the manufactured device. Accordingly, researches to improve the performance of devices have been recently conducted. In particular, various attempts have been made to improve the performance of devices by forming fine metal patterns. Until now, the most common PR pattern forming process is to apply photoresist (PR), which is a photosensitive material, and to expose and develop the photoresist using a mask. In the case of the formed electrical element, since the photoresist process must be performed separately to form each pattern, the manufacturing cost increases, which is not preferable. Therefore, in recent years, a method of forming a PR pattern using a printing method has been proposed.

Referring to FIG. 1A, the printing method of the photoresist according to the above-described printing method may include a second transparent material which is a printed object directly on the first transparent insulating substrate 110 on which a printing pattern P 1 is formed and used as a printing plate. Without transferring the photoresist pattern P2 onto the insulating substrate 120, the photoresist pattern P2 is once transferred to the blanket 100, which is a surface of which is made of silicon rubber or the like, and serves as a medium. The photoresist pattern P2 is transferred again using the insulating substrate 120 as a transfer target.

Specifically, as shown in FIG. 1B, (a) depositing a metal film 111 on the first transparent insulating substrate 110, and (b) photoresist 112 to pattern the metal film 111. ), (C) etching the metal film 111 through wet etching, (d) stripping the photoresist 112, (e) first transparent insulating substrate 110 Etching to form the print pattern (P1), (f) etching and removing the metal film 111.

However, since the wet etching used in the above-described manufacturing process has an isotropic etching characteristic showing a uniform etching characteristic regardless of the crystal plane direction, the minimum line width (CD; The loss of critical dimension is large, which makes it difficult to manufacture a precise printed plate having a fine pattern. That is, the printing pattern P 1 on the first transparent insulating substrate 110 is ideally formed to have the correct width of a1. However, when the printing plate is manufactured by wet etching, the loss of a2 is generated on both sides. .

Specifically, in the case of conventional wet etching, the loss width a2 on the left and right sides increases in accordance with the etching depth due to the characteristics of the isotropic etching, so that the depth d1 of the recessed portion of the printing plate is set to "1". The upper width d2 has a limit that can only be formed at a ratio of at least “2”. That is, it encounters the limit which can be made only in the range of d1: d2 = (1 or less): 2.

This is because the printing pattern P 1 etched on the printing plate has a narrower width and a deeper depth, and a greater ratio of depth and width results in better printing characteristics. However, in the conventional wet etching method, the width becomes wider as the depth is deeper. Therefore, it is disadvantageous to manufacture a printing plate having a fine pattern, which results in a problem that it is difficult to improve pattern resolution and transfer characteristics.

In addition, to solve this problem, as shown in Figure 1c, (a) in the method of using a dry etching to form a dry etching material film 210 on a transparent substrate, a support film is formed on the lower portion of the transparent substrate. Thereafter, a photoresist is applied on the dry etching material layer 210 and patterned.

(b) Thereafter, dry etching is performed to etch the dry etching material film, and as shown in (c), the photoresist (PR) except for the dry etching material film 210 is removed on the substrate to remove the printed pattern. Implemented by way of forming.

That is, the problem of the minimum line width in the conventional wet etching has been attempted to solve this problem by forming a dry etching material film separately, and then forming a transfer material film, but this method is a process of forming a dry etching material film. Expensive cost is generated in the equipment of the expensive vacuum equipment used in the dry etching process, and the manufacturing cost is further increased because the printing plate must be manufactured separately.

The present invention has been made to solve the above problems, an object of the present invention by imprinting the photosensitive resin and thermosetting resin using a metal or glass mold to produce a printing plate, different width or depth It is possible to implement a fine pattern having a simplified manufacturing process to provide a low-cost printing plate.

As a means for solving the above problems, the present invention comprises the steps of forming a resin layer on a substrate; It is possible to provide a method for manufacturing a printing plate comprising a; step 2 of forming a printing pattern by imprinting the mold layer using a mold having a different depth.

In addition, in the above-described manufacturing process, the resin layer of the first step, it may be implemented using any one of epoxy, photosensitive resin, ultraviolet curable resin, thermosetting resin.

In addition, the first step may be formed by using a glass mold or a metal mold having at least one mold pattern having a different pattern depth.

In the above-described manufacturing process, in the second step, the print pattern is provided with at least one pattern having a different pattern depth, the base resin portion 1 ~ 30 which is the lower surface of the resin layer is not formed the print pattern It can be implemented by the step to implement to be a μm.

In addition, after the second step in the manufacturing process according to the present invention, the upper surface of the resin layer on which the printed pattern is formed is a metal material selected from Cr, Mo, Ta, Ni, Au, or an organic material selected from Parylene, Teflon Or three steps of forming a functional layer made of any one inorganic material selected from SiOx, SiNx, and Diamon liked Carbon.

In this case, the process of forming the functional layer in the third step may be performed using any one method selected from spin coating, spray coating, sputtering, and chemical vapor deposition (CVD).

The printing plate according to the present invention manufactured according to the above-described manufacturing process may be implemented in the following structure.

Specifically, it may be implemented as a printing plate including a resin layer stacked on a substrate and having at least one printed pattern having a different pattern depth. In particular, the lower surface of the resin layer may not implement the printed pattern. It may be implemented in a structure having a base resin layer.

In this case, the base resin layer may be implemented in the range of 1 ~ 30㎛.

In addition, the resin layer may be formed of any one material of epoxy, photosensitive resin, ultraviolet curing resin, thermosetting resin.

Furthermore, the upper surface of the resin layer on which the printed pattern is formed may be selected from a metal material selected from Cr, Mo, Ta, Ni, Au, or an organic material selected from Parylene, Teflon, or SiO _x , SiN _x , or Diamon liked Carbon. It can be implemented in a structure that is further provided with a functional layer made of any one inorganic material.

According to the present invention, by imprinting the photosensitive resin and the thermosetting resin using a metal or glass mold to manufacture a printing plate, it is possible to implement a fine pattern having a different width or depth and simplify the manufacturing process. In this case, there is an effect of manufacturing a low cost printing plate.

In particular, since the imprinting process is used, it has the advantage of manufacturing a printing plate having a different depth according to the pattern width in one process, and the base resin layer layer formed during the imprinting process and the substrate. Has the advantage of improving the adhesion.

1A to 1C are views illustrating a manufacturing method of a printing plate according to the prior art.
2a and 2b is a process chart showing a manufacturing process of the printing plate according to the present invention.
3 is a conceptual diagram showing the structure of a printing plate manufactured by the manufacturing process according to the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation according to the present invention. In the description with reference to the accompanying drawings, the same components are given the same reference numerals regardless of the reference numerals, and duplicate description thereof will be omitted. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The present invention relates to a printing plate for manufacturing an electromagnetic plate and a liquid crystal display device, and in particular, to provide a manufacturing method and a structure for implementing at least one pattern having a different depth by patterning a resin layer on the substrate by imprinting. Make a point.

2A and 2B are process diagrams illustrating a manufacturing process of a printing plate according to the present invention.

Referring to the drawings, the manufacturing process of the printing plate according to the present invention is to form a printing pattern by imprinting using a mold having a different depth of mold pattern on the resin layer and a step of forming a resin layer on the substrate; It can be configured to include two steps.

Specifically, as shown in FIG. 2A, a process of forming the resin layer 120 on the substrate 110 is performed in step S 1.

In this case, the substrate 110 may have a flatness of the surface, may be enlarged, and may be applied to any one if the substrate 110 is made of a material having a similar thermal expansion coefficient to the substrate after being transferred. ) Substrates, polymer substrates such as PC, PMMA, PET, metals and the like can be used.

The resin layer 120 is epoxy, photosensitive resin, polyimide photosensitive resin, UV curable resin (urethane acrylate, epoxy acrylate, silicone acrylate, polyester acrylate, epoxy, vinyl ether), heat Any one of cured resin can be used. 2A illustrates an example of forming a thermosetting resin, and FIG. 2B illustrates a process of forming a resin layer by applying an ultraviolet curable resin or a photosensitive resin solution by a coating method. In addition, when the resin layer is formed of a liquid material such as the photosensitive resin liquid, it may be formed through a conventional spin coating method or a slit coating method, and various materials such as photoresist, dry film resist, and ultraviolet curing resin may be used. Of course, it can be used, especially those having photosensitive properties can be applied, of course. For example, it may be formed by coating a resin layer of epoxy, polyimide, and Novolak-based resin layers. The following processes are all the same, and will be described with reference to FIG. 2A.

Thereafter, in step S 2, a process of imprinting the resin layer 120 using a mold 130 having a mold pattern having a different depth is performed. The mold 130 may use a glass mold or a metal mold, and the metal mold may use a mold made of a material such as Ni, Cr, or Au.

In particular, in this process, it is preferable to use a mold having a depth of a mold pattern formed on the bottom surface of the resin layer 120 so that the base layer 120A remains. That is, the mold pattern 131 that forms the deepest depth among the mold patterns having different depths is imprinted to such a degree that they do not penetrate the resin layer 120 so that the lower layer of the resin layer (hereinafter, referred to as a 'base resin layer'). It is preferable that the process proceeds so that) remains. The presence of the base resin layer 120A is to perform a function to improve the adhesion to the substrate 110, preferably the thickness of the base resin layer 120A is formed in the range of 1 ~ 30㎛. This is preferred.

Thereafter, in the process of step S 3, a step of separating the mold 130 from the resin layer 130 may be performed.

In addition, a process of forming a functional layer 140 may be further performed on the upper surface of the resin layer as an additional step S4. The functional layer 140 is a metal material selected from Cr, Mo, Ta, Ni, Au, or an organic material selected from Parylene, Teflon, any one inorganic material selected from SiO _x , SiN _x , Diamon liked Carbon Can be performed using any one of spin coating, spray coating, sputtering, chemical vapor deposition (CVD). The functional layer can improve the durability and printability of the printing pattern. Therefore, it is more preferable to include a material having the same surface energy characteristics as the substrate to be printed. For example, a material of Si-base having good transfer characteristics, such as a-Si, SiN _x , SiO _x, or the like may be used.

The manufacturing process according to the present invention as described above, compared to the conventional wet / dry etching method through the implementation of the printing pattern of the imprinting method, it is advantageous to implement a fine pattern and to simplify the process to produce a low-cost printing plate has the advantage Have. And compared to the method of controlling the pattern depth by the partial phenomenon of the conventional photosensitive resin, it is easier to control the depth ratio according to the pattern line width, increase the uniformity for the depth, and prevent the collapse of the printing plate in the fine pattern area. Can improve. Furthermore, the advantage of producing a printing plate having a different depth according to the pattern width is realized by a single imprinting process, and in particular, it may be formed as a lower layer base resin layer of the resin layer on which the printing pattern is formed, thereby improving adhesion to the substrate.

3 is a conceptual diagram showing the structure of a printing plate manufactured by the manufacturing process according to the present invention.

Referring to FIG. 3, the printing plate according to the present invention may include a resin layer 120 stacked on the substrate 110 and provided with at least one printed pattern having a different pattern depth. In particular, the resin layer 120 is provided with a plurality of printing patterns having different depths (T ₁ , T ₂ ), so that even the depth (T ₁ ) of the deepest pattern (P ₁ ) to be formed below the thickness of the resin layer The resin layer 120 may have a structure including a base resin layer 120A on which the printing pattern is not implemented. This is to significantly improve the adhesion between the substrate and the resin layer through the base resin layer 120A. In addition, the thickness (T ₃ ) of the base resin layer is preferably formed in the range of 1 ~ 30㎛.

In addition, the resin layer 120 may be formed of any one of an epoxy, a photosensitive resin, an ultraviolet curable resin, and a thermosetting resin. Although not shown above, the resin layer 120 is illustrated in FIGS. 2A and FIG. As shown in step S4 of FIG. 2B, a metal material selected from Cr, Mo, Ta, Ni, and Au, or an organic material selected from Parylene and Teflon, or any one selected from SiOx, SiNx, and Diamon liked Carbon. It is more preferable to further include a functional layer made of an inorganic material so as to enhance durability of the printing pattern.

In the foregoing detailed description of the present invention, specific examples have been described. However, various modifications are possible within the scope of the present invention. The technical idea of the present invention should not be limited to the embodiments of the present invention but should be determined by the equivalents of the claims and the claims.

110: substrate
120: resin layer
120A: base resin layer
130: mold
140: functional layer

Claims (10)

Forming a resin layer on the substrate;
Forming a printed pattern by imprinting the resin layer using a mold having a different depth from the mold pattern;
Method of manufacturing a printing plate comprising a.
The method according to claim 1,
The resin layer of the first step,
The manufacturing method of the printing plate using any one of an epoxy, a photosensitive resin, an ultraviolet curing resin, and a thermosetting resin.
The method according to claim 1,
The first step,
The method of manufacturing a printing plate using a glass mold or a metal mold having at least one mold pattern having a different pattern depth.
The method according to any one of claims 1 to 3,
In the second step,
The print pattern is provided with at least one pattern having a different pattern depth,
And a base resin portion, which is a lower surface of the resin layer, on which the printing pattern is not formed, so as to have a thickness of 1 to 30 μm.
The method of claim 4,
After step 2,
The upper surface of the resin layer having the printed pattern is formed of a metal material selected from Cr, Mo, Ta, Ni, Au, or an organic material selected from Parylene, Teflon, or any one selected from SiO _x , SiN _x , and Diamon liked Carbon. Forming a functional layer made of one inorganic material;
Method of manufacturing a printing plate further comprises a.
The method of claim 4,
The step of forming the functional layer of the three steps,
A method of manufacturing a printing plate which is carried out using any one method selected from among spin coating, spray coating, sputtering and chemical vapor deposition (CVD).
And a resin layer laminated on the substrate and having at least one printed pattern having a different pattern depth.
The method according to claim 7,
The bottom surface of the resin layer is provided with a base resin layer that does not implement the printing pattern,
The base resin layer is a printing plate of 1 ~ 30㎛.
The method according to claim 8,
The resin layer,
A printing plate formed of any one of epoxy, photosensitive resin, ultraviolet curable resin, and thermosetting resin.
The method according to any one of claims 7 to 9,
The upper surface of the resin layer having the printed pattern is formed of a metal material selected from Cr, Mo, Ta, Ni, Au, or an organic material selected from Parylene, Teflon, or any one selected from SiO _x , SiN _x , and Diamon liked Carbon. A printing plate further comprising a functional layer made of one inorganic material.

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