KR101279470B1 - A cliche for printing ink and a method of fabricating thereof - Google Patents

Abstract

In the manufacturing process of the printing plate according to the present invention, the first photosensitive resin is coated and exposed on a substrate to form a lower pattern of the first pattern, and the second photosensitive resin is coated and exposed on the first photosensitive resin to expose the first pattern. Forming an upper pattern and a second pattern of the pattern, and developing the first and second photosensitive resins simultaneously to form the first and second patterns.
According to the present invention, it is possible to efficiently implement a fine pattern by forming a printing pattern through the patterning process of the photosensitive resin, and the number of processes can be shortened to reduce the manufacturing cost, furthermore, the line width of the pattern Therefore, the ratio of the depth can be easily adjusted, and the uniformity of the depth can be increased. Accordingly, the collapse of the printing plate can be removed in the micropattern area, thereby providing a printing plate having improved durability.

Description

Printing plate and manufacturing method thereof {A CLICHE FOR PRINTING INK AND A METHOD OF FABRICATING THEREOF}

The present invention relates to a printing plate for manufacturing an electromagnetic plate and a display device.

In order to print circuits and various patterns of electronic components using printing, direct printing methods such as inkjets are used, or indirect printing methods such as gravure printing or offset printing using printing plates on which patterns are printed. Conventionally, a method of making a printing plate includes a method of corroding a substrate to form a pattern, or a method of forming a plate on which a photosensitive resin is first attached using photolithography.

In a flat panel display device such as a liquid crystal display device, each pixel is provided with a device such as a thin film transistor to drive the flat panel display device. However, in a flat panel display device such as a liquid crystal display device, the PR pattern forming process is an important process that greatly affects the performance of the manufactured device. In recent years, studies have been made to improve the performance of a device. In particular, various attempts have been made to improve the performance of a device by forming a fine metal pattern. Until now, the most common PR pattern forming process is to apply photoresist (PR), which is a photosensitive material, and to expose and develop the photoresist using a mask. In the case of the formed electrical element, since the photoresist process must be performed separately to form each pattern, the manufacturing cost increases, which is not preferable. Therefore, in recent years, a method of forming a PR pattern using a printing method has been proposed.

Referring to FIG. 1A, the printing method of the photoresist according to the above-described printing method may include a second transparent material which is a printed object directly on the first transparent insulating substrate 110 on which a printing pattern P 1 is formed and used as a printing plate. Without transferring the photoresist pattern P2 onto the insulating substrate 120, the photoresist pattern P2 is once transferred to the blanket 100, which is a surface of which is made of silicon rubber or the like, and serves as a medium. The photoresist pattern P2 is transferred again using the insulating substrate 120 as a transfer target.

Specifically, as shown in FIG. 1B, (a) depositing a metal film 111 on the first transparent insulating substrate 110, and (b) photoresist 112 to pattern the metal film 111. ), (C) etching the metal film 111 through wet etching, (d) stripping the photoresist 112, (e) first transparent insulating substrate 110 Etching to form the print pattern (P1), (f) etching and removing the metal film 111.

However, since the wet etching used in the above-described manufacturing process has an isotropic etching characteristic showing a uniform etching characteristic regardless of the crystal plane direction, the minimum line width (CD; The loss of critical dimension is large, which makes it difficult to manufacture a precise printed plate having a fine pattern. That is, the printing pattern P 1 on the first transparent insulating substrate 110 is ideally formed to have the correct width of a1. However, when the printing plate is manufactured by wet etching, the loss of a2 is generated on both sides. .

Specifically, in the case of conventional wet etching, the loss width a2 on the left and right sides increases in accordance with the etching depth due to the characteristics of the isotropic etching, so that the depth d1 of the recessed portion of the printing plate is set to "1". The upper width d2 has a limit that can only be formed at a ratio of at least “2”. That is, it encounters the limit which can be made only in the range of d1: d2 = (1 or less): 2.

This is because the printing pattern P 1 etched on the printing plate has a narrower width and a deeper depth, and a greater ratio of depth and width results in better printing characteristics. However, in the conventional wet etching method, the width becomes wider as the depth is deeper. Therefore, it is disadvantageous to manufacture a printing plate having a fine pattern, which results in a problem that it is difficult to improve pattern resolution and transfer characteristics.

In addition, to solve this problem, as shown in Figure 1c, (a) in the method of using a dry etching to form a dry etching material film 210 on a transparent substrate, a support film is formed on the lower portion of the transparent substrate. Thereafter, a photoresist is applied on the dry etching material layer 210 and patterned.

(b) Thereafter, dry etching is performed to etch the dry etching material film, and as shown in (c), the photoresist (PR) except for the dry etching material film 210 is removed on the substrate to remove the printed pattern. Implemented by way of forming.

That is, the problem of the minimum line width in the conventional wet etching has been attempted to solve this problem by forming a dry etching material film separately, and then forming a transfer material film, but this method is a process of forming a dry etching material film. Expensive cost is generated in the equipment of the expensive vacuum equipment used in the dry etching process, and the manufacturing cost is further increased because the printing plate must be manufactured separately. In addition, when the target of the printing plate is used for the color filter, wet etching is possible because the pitch is 20 μm or more, but in the case of isotropic etching, a pitch of 20 μm or less is impossible to implement.

The present invention has been made to solve the above-mentioned problems, an object of the present invention is to form a printed pattern through the patterning process of the photosensitive resin, it is possible to efficiently implement the fine pattern, can shorten the number of processes, manufacturing cost In addition, it is possible to control the depth ratio according to the line width of the pattern, and to increase the uniformity of the depth, thereby eliminating the collapse of the printing plate in the fine pattern area. The present invention provides an improved printing plate and its manufacturing process.

As a means for solving the above problems, the present invention comprises the steps of: a1) forming a lower pattern of the first pattern by applying and exposing the first photosensitive resin on the substrate; a2) forming a top pattern and a second pattern of the first pattern by applying and exposing a second photosensitive resin on the first photosensitive resin; a3) simultaneously developing the first and second photosensitive resins to form the first and second patterns, thereby providing a manufacturing process of a printing plate.

Alternatively, as another process, b1) applying a first photosensitive resin on the substrate and forming a lower pattern of the first pattern through exposure and development; b2) coating, exposing and developing a second photosensitive resin on the first photosensitive resin to form an upper pattern and a second pattern of the first pattern.

In this case, after the steps a3) and b2), the method may further include forming a functional layer on the first pattern and the second pattern.

In particular, in the above-described manufacturing process of the printing plate, the exposure process may be performed by an exposure process using a photomask or a process using a laser writer.

In particular, in the case of using the first and second exposure processes using the photomask, the width of the lower pattern of the first pattern may be smaller than the width of the upper pattern of the first pattern.

In addition, the process of forming the first pattern or the second pattern may be formed by a process of implementing a ratio of the line width and the depth of each pattern to satisfy a range of 1: (0.5 to 1.4).

In addition, the functional layer, using a metal material selected from Cr, Mo, Ta, Ni, or an organic material selected from Parylene, Teflon, any one inorganic material selected from SiO _x , SiN _x , Diamon liked Carbon Forming, but may be implemented using any one method selected from spin coating, spray coating, sputtering, chemical vapor deposition (CVD).

The printing plate according to the present invention manufactured by the above-described manufacturing process may be implemented in the following structure.

Specifically, a printed pattern formed by patterning a photosensitive resin layer laminated on a substrate; The print pattern may be formed of a plurality of patterns having different depths or different widths. In particular, the print pattern may include a first pattern as a reference pattern and a second pattern as a minimum pattern, Depth and width may be formed more than the second pattern.

In addition, the ratio of the line width and depth of the printed pattern may be formed of a printing plate implemented in the range of 1: (0.5 to 4).

In addition, the first pattern is preferably implemented such that the upper width W1 of the first pattern is greater than the lower width W1 ', in which case the upper width W1 of the first pattern is the lower width ( The difference of W1 ') can be controlled in the range of 5-20 탆.

In addition, the upper portion of the substrate and the printed pattern is a metal material selected from Cr, Mo, Ta, Ni, or an organic material selected from Parylene, Teflon, any one inorganic material selected from SiO _x , SiN _x , Diamon liked Carbon It may be implemented by further comprising a functional layer formed using.

According to the present invention, it is possible to efficiently implement a fine pattern by forming a printing pattern through the patterning process of the photosensitive resin, and the number of processes can be shortened to reduce the manufacturing cost, furthermore, the line width of the pattern Therefore, the ratio of the depth can be easily adjusted, and the uniformity of the depth can be increased. Accordingly, the collapse of the printing plate can be removed in the micropattern area, thereby providing a printing plate having improved durability.

1A to 1C are views illustrating a manufacturing method of a printing plate according to the prior art.
2 and 3 is a process chart showing a manufacturing process of the printing plate according to the present invention.
4A and 4B are conceptual views illustrating the structure of a printing plate manufactured by the manufacturing process according to the present invention.
Figure 5 shows the actual implementation image of the printing plate according to the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following description with reference to the accompanying drawings, the same reference numerals denote the same elements regardless of the reference numerals, and redundant description thereof will be omitted. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The present invention relates to a printing plate for manufacturing an electromagnetic plate and a liquid crystal display device, and to provide a method of manufacturing a printing plate capable of adjusting the ratio of the depth according to the pattern line width by the multilayer coating of the photosensitive resin and a printing plate accordingly.

2 and 3 show the manufacturing process of the printing plate according to the present invention.

Looking at the manufacturing process of the printing plate according to the present invention with reference to the drawings as follows.

In the manufacturing process of the printing plate according to the present invention, the photosensitive resin layer may be formed on a substrate, and manufacturing may be performed in various forms according to a method of forming a printing pattern thereon.

Referring to FIG. 2, the manufacturing process may include forming a lower pattern of a first pattern by coating and exposing a first photosensitive resin on a substrate and applying and exposing a second photosensitive resin on the first photosensitive resin to expose the first pattern. Forming an upper pattern and a second pattern of the pattern, and developing the first and second photosensitive resins simultaneously to form the first and second patterns. That is, the photosensitive resin may be coated and exposed at the same time, and after the second pattern is completed, the batch may be developed to complete the printing pattern. The illustrated figure shows an example of such a method, but alternatively, a method of implementing a printing pattern by stacking each photosensitive resin layer, and then performing exposure and development, respectively, is also possible.

First, in step S 1, the photosensitive resin is coated on the substrate 110 to form the first photosensitive resin layer 120.

The substrate 110 may secure a flatness of the surface, may be enlarged, and may be applied to any one made of a material having a similar thermal expansion coefficient to that of the substrate after being transferred. For example, a glass substrate However, a polymer substrate such as PC, PMMA, PET, or a metal may be used.

In addition, the photosensitive resin may be formed through a conventional spin coating method or a slit coating method, and various materials such as photoresist, dry film resist, and ultraviolet curable resin may be used. Of course, both can be applied. For example, it can be formed by coating a resin layer of an epoxy type, a polyimide type, or a Novolak type.

Subsequently, in step S 2, the first photosensitive resin layer 120 is exposed to pattern a portion 120 where a printing pattern is to be formed, specifically, a lower pattern 121 of the first pattern later. In the present embodiment, a process of patterning using a laser writer (L) has been described as an example. Of course, in this case, after the exposure patterning, the lower pattern of the first pattern may be completed through development. However, the present embodiment will be described as an example that proceeds to the exposure process. (In this process, an example using a negative photosensitive material will be described. As a result, a pattern is formed in a portion where the laser is not irradiated. Will be formed in the opposite way)

Thereafter, in step S 3, the second photosensitive resin layer 130 is formed by coating the photosensitive material on the patterned first photosensitive resin layer 121 again.

Thereafter, as in step S4, the second photosensitive resin layer 130 is subjected to secondary exposure to pattern the portion 131 on which the secondary pattern is to be formed and the upper pattern 122 of the first pattern.

Thereafter, as in step S5, when the portions not exposed at the same time are removed (developed), a printing plate on which the first pattern 123 and the second pattern 132 are implemented is formed. As shown, the first pattern 123 may be implemented to have a greater width and depth than the second pattern 132. In this case, in particular, when the first pattern or the second pattern is formed, the ratio of the line width and the depth of each pattern is preferably implemented so that the range of 1: (0.5 to 1.4) is satisfied.

Subsequently, in operation S 6, the functional layer 140 may be coated on the region where the first and second patterns are formed. The functional layer 140 may be formed using a metal material selected from Cr, Mo, Ta, and Ni, an organic material selected from Parylene, and Teflon, and an inorganic material selected from SiO _x , SiN _x , and Diamon liked Carbon. , Spin coating, spray coating, sputtering, chemical vapor deposition (CVD) may be performed using any one method. The functional layer can improve the durability and printability of the printing pattern. In particular, more preferably Si-base material having good transfer characteristics, such as a-Si, SiN _x , SiO _x and the like may be used.

The manufacturing process according to the present invention as described above, by forming a pattern through the photolithography of the photosensitive resin compared to the conventional wet / dry etching method, it is advantageous to implement the micropattern and to produce a low-cost printing plate by reducing the number of processes It has advantages And compared to the method of controlling the pattern depth by the partial phenomenon of the conventional photosensitive resin, it is easier to control the depth ratio according to the pattern line width, increase the uniformity for the depth, and prevent the collapse of the printing plate in the fine pattern area. Can improve.

Figure 3 shows a manufacturing process diagram according to another embodiment according to the present invention.

Referring to the drawings, the process according to the present process is a detailed process, the process of implementing the patterning through exposure to the photosensitive material layer is different in that the exposure process is performed through a photomask.

That is, in step P 1, the first photosensitive material layer 120 is formed on the substrate 110, and in step P 2, the lower pattern 121 of the first pattern is formed through an photomask using an exposure machine (UV, etc.). ), The second photosensitive material layer 130 is formed thereon in step P3, and the upper pattern 122 portion and the second pattern of the first pattern are formed again using the photomask (M). The region 131 is patterned. However, in this case, when the exposure is performed again, the alignment between the patterns is very important. In the case of forming the lower pattern 121 of the first pattern, it is designed to be smaller than the upper pattern 122 of the first pattern. It is desirable to be able to improve the process margin for the alignment.

Subsequently, the first pattern 123 and the second pattern 132 are completed by simultaneously exposing the first and second photosensitive material layers in step P 5. As shown in the figure, when designing the lower pattern of the first pattern in step P4, when the narrower design than the upper pattern of the first pattern for the efficiency of the alignment, a predetermined inside of the first pattern 123 A stepped area Q is formed, and in this case, a difference occurs between the width of the upper pattern and the lower pattern of the first pattern. That is, the lower pattern is formed narrower than the upper pattern, the difference may be formed in the range of 5 ~ 20㎛.

Subsequently, the functional layer 140 may be formed in step P 6 to complete the printing plate.

In the present exemplary embodiment, the first pattern 123 may be implemented to have a larger width and depth than the second pattern 132. When the first pattern or the second pattern is formed, the first pattern 123 may have a width and a depth of each pattern. The ratio may be implemented to satisfy the range of 1: (0.5 to 1.4) is the same as the embodiment of FIG. , Additional descriptions will be omitted.

4A and 4B are conceptual views illustrating the structure of a printing plate manufactured by the manufacturing process according to the present invention.

Referring to FIG. 4A, a printing plate according to the present invention includes print patterns 123 and 132 formed by patterning a photosensitive resin layer stacked on a substrate 110. In particular, the printing patterns have different depths. Or it may be formed in a plurality of patterns having different widths. The printed pattern may be diversified into patterns having different widths and depths, and as shown in this preferred example, the first pattern 123 as the reference pattern and the second pattern 132 as the minimum pattern may be used. It can be implemented in a structure provided.

In this case, the ratio of the line width and the depth of the printed pattern is preferably implemented in the range of 1: (0.5 to 4).

In addition, the depth of the first pattern 123 may be the same as the thickness of the photosensitive resin layer 120, but is not necessarily limited thereto, and may be formed below. In addition, although the second pattern 132 may also be formed of photosensitive resin or less, the depth d ₁ and the width w ₁ of the first pattern may be the depth d ₂ and the width w ₂ of the second pattern. It can be formed larger than).

In addition, the substrate 110 and the printed patterns 123 and 132 may be formed on top of a metal material selected from Cr, Mo, Ta, and Ni, or an organic material selected from Parylene and Teflon, SiO _x , SiN _x , and Diamon liked Carbon. It can be configured to further include a functional layer 140 formed by using any one of the inorganic materials selected from the same as described above in the manufacturing process.

4B has the same structure of forming the material and the printed pattern as in FIG. 4A, but differs in that the structure of the first pattern 123 is slightly different. This corresponds to the characteristic constitution of the present invention as a result of the manufacturing process in FIG. 3.

That is, in the process of forming the lower portion of the first pattern first, and in the process of forming the second pattern, the specific characteristics of the process of narrowly forming the lower portion of the first pattern in order to maximize the efficiency of the alignment, resulting in the resulting The first pattern 123 is implemented such that the upper width W1 of the first pattern is larger than the lower width W1 ', in which case the upper width W1 of the first pattern is lower width W1'. The difference is preferably implemented in the range of 5 ~ 20㎛.

Figure 5 shows the actual implementation image of the printing plate according to the present invention.

The printing plate according to the present invention can implement a fine pattern, compared to the conventional wet etching printing plate, the high A / R (aspect ratio) is an advantage that can be implemented. That is, it is easy to implement a fine pattern by solving the problem of the loss of the minimum line width that occurred during the conventional wet etching process, and in particular, it is possible to improve the transfer characteristics of the pattern by greatly increasing the ratio of the depth and width of the fine pattern.

In addition, there is an advantage that the process is very simple compared to the process of forming the material layer for dry etching and implementing the printing plate by dry etching, and the manufacturing cost is also significantly lower, and because of the process of forming the printing pattern by lithography, the shape is high Precision can be achieved.

That is, by forming a printing pattern through the patterning process of the photosensitive resin, fine patterns can be efficiently implemented, and the number of processes can be shortened, thereby reducing the manufacturing cost, and furthermore, depending on the line width of the pattern, It is possible to easily control the ratio and increase the uniformity of the depth, thereby eliminating the collapse of the printing plate in the micropattern area, thereby providing a printing plate having improved durability.

In the foregoing detailed description of the present invention, specific examples have been described. However, various modifications are possible within the scope of the present invention. The technical idea of the present invention should not be limited to the embodiments of the present invention but should be determined by the equivalents of the claims and the claims.

110: substrate
120: first photosensitive material layer
121: lower pattern of the first pattern
122: upper pattern of the first pattern
123: first pattern
131: second pattern formation region
132: second pattern
130: second sensitizing material layer
140: functional layer

Claims (13)

a1) coating and exposing a first photosensitive resin on a substrate to form a lower pattern of a first pattern on the substrate;
a2) forming a top pattern and a second pattern of the first pattern by applying and exposing a second photosensitive resin on the first photosensitive resin;
a3) simultaneously developing the first and second photosensitive resins to form the first and second patterns;
Including;
The depth and width of the first pattern is formed more than the second pattern, the width of the lower pattern of the first pattern is formed smaller than the width of the upper pattern of the first pattern.
b1) coating a first photosensitive resin on a substrate and forming a lower pattern of the first pattern on the substrate through exposure and development;
b2) coating, exposing and developing a second photosensitive resin on the first photosensitive resin to form an upper pattern and a second pattern of the first pattern;
Including;
The depth and width of the first pattern is formed more than the second pattern, the width of the lower pattern of the first pattern is formed smaller than the width of the upper pattern of the first pattern.
The method according to claim 1 or 2,
After the steps a3) and b2),
At least one inorganic material selected from a metal material selected from Cr, Mo, Ta, and Ni, or an organic material selected from Parylene and Teflon, SiO _x , SiN _x , and Diamon liked Carbon on the first and second patterns. The method of manufacturing a printing plate further comprising the step of forming a functional layer using a material.
The method according to claim 3,
In the manufacturing method of the printing plate, the exposure step,
A method of manufacturing a printing plate performed by an exposure process using a photomask or a process using a laser writer.
delete The method according to claim 3,
The process of forming the first pattern or the second pattern,
The manufacturing method of the printing plate which is a process which implements the ratio of the line width and depth of each pattern so that the range of 1: (0.5-1.4) is satisfied,
delete The method according to claim 3,
At the time of formation of the functional layer,
A method of manufacturing a printing plate formed using any one method selected from among spin coating, spray coating, sputtering and chemical vapor deposition (CVD).
A printed pattern formed by patterning a photosensitive resin layer laminated on the substrate;
The printed pattern is formed of a plurality of patterns having different depths or different widths,
The print pattern,
A first pattern which is a reference pattern and a second pattern which is a minimum pattern,
The depth and width of the first pattern is formed to be greater than or equal to the second pattern, and the first pattern includes a lower pattern and an upper pattern so that the width of the lower pattern of the first pattern is greater than the width of the upper pattern of the first pattern. Printing plate narrowly formed.
The method according to claim 9,
The printing plate is implemented in a ratio of 1: (0.5 ~ 4) of the line width and depth of the printed pattern.
delete The method of claim 10,
The difference between the upper width (W1) and the lower width (W1 ') of the first pattern is a printing plate of 5 ~ 20㎛.
The method according to any one of claims 9, 10 and 12,
Above the substrate and the printed pattern is a metal material selected from Cr, Mo, Ta, Ni, or an organic material selected from Parylene, Teflon, SiO _x , SiN _x , Diamon liked Carbon
The printing plate further comprises a functional layer formed using any one inorganic material selected.

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