KR20120020109A - 다각형 칩렛을 갖는 디스플레이 디바이스 - Google Patents

다각형 칩렛을 갖는 디스플레이 디바이스 Download PDF

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Publication number
KR20120020109A
KR20120020109A KR1020117026202A KR20117026202A KR20120020109A KR 20120020109 A KR20120020109 A KR 20120020109A KR 1020117026202 A KR1020117026202 A KR 1020117026202A KR 20117026202 A KR20117026202 A KR 20117026202A KR 20120020109 A KR20120020109 A KR 20120020109A
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KR
South Korea
Prior art keywords
chiplet
substrate
chiplets
display device
bus wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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KR1020117026202A
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English (en)
Korean (ko)
Inventor
로널드 에스 코크
Original Assignee
글로벌 오엘이디 테크놀러지 엘엘씨
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Application filed by 글로벌 오엘이디 테크놀러지 엘엘씨 filed Critical 글로벌 오엘이디 테크놀러지 엘엘씨
Publication of KR20120020109A publication Critical patent/KR20120020109A/ko
Ceased legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/129Chiplets

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020117026202A 2009-04-15 2010-04-13 다각형 칩렛을 갖는 디스플레이 디바이스 Ceased KR20120020109A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/424,060 2009-04-15
US12/424,060 US7973472B2 (en) 2009-04-15 2009-04-15 Display device with polygonal chiplets

Publications (1)

Publication Number Publication Date
KR20120020109A true KR20120020109A (ko) 2012-03-07

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ID=42396962

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117026202A Ceased KR20120020109A (ko) 2009-04-15 2010-04-13 다각형 칩렛을 갖는 디스플레이 디바이스

Country Status (7)

Country Link
US (1) US7973472B2 (enExample)
EP (1) EP2419934B1 (enExample)
JP (1) JP5275510B2 (enExample)
KR (1) KR20120020109A (enExample)
CN (1) CN102396067A (enExample)
TW (1) TWI381523B (enExample)
WO (1) WO2010120742A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010153813A (ja) 2008-11-18 2010-07-08 Semiconductor Energy Lab Co Ltd 発光装置及びその作製方法、並びに、携帯電話機
US8125472B2 (en) * 2009-06-09 2012-02-28 Global Oled Technology Llc Display device with parallel data distribution
US8072437B2 (en) * 2009-08-26 2011-12-06 Global Oled Technology Llc Flexible multitouch electroluminescent display
US9899329B2 (en) 2010-11-23 2018-02-20 X-Celeprint Limited Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
US8934259B2 (en) 2011-06-08 2015-01-13 Semprius, Inc. Substrates with transferable chiplets
GB2500579B (en) * 2012-03-23 2015-10-14 Cambridge Display Tech Ltd Semiconductor Application Method and Product
US10141378B2 (en) * 2013-10-30 2018-11-27 Industrial Technology Research Institute Light emitting device free of TFT and chiplet
TWI586012B (zh) * 2014-01-02 2017-06-01 財團法人工業技術研究院 發光元件
US9799719B2 (en) 2014-09-25 2017-10-24 X-Celeprint Limited Active-matrix touchscreen
US20160093600A1 (en) * 2014-09-25 2016-03-31 X-Celeprint Limited Compound micro-assembly strategies and devices
WO2017144573A1 (en) 2016-02-25 2017-08-31 X-Celeprint Limited Efficiently micro-transfer printing micro-scale devices onto large-format substrates
US10600671B2 (en) 2016-11-15 2020-03-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
US10395966B2 (en) 2016-11-15 2019-08-27 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
TWI762428B (zh) 2016-11-15 2022-04-21 愛爾蘭商艾克斯展示公司技術有限公司 微轉印可印刷覆晶結構及方法
US11024608B2 (en) 2017-03-28 2021-06-01 X Display Company Technology Limited Structures and methods for electrical connection of micro-devices and substrates
US10468397B2 (en) * 2017-05-05 2019-11-05 X-Celeprint Limited Matrix addressed tiles and arrays
CN110226229B (zh) * 2018-01-02 2024-08-27 刘宏宇 一种显示器件结构
CN110827676A (zh) * 2018-08-14 2020-02-21 上海和辉光电有限公司 一种柔性有机发光显示基板、显示面板及显示装置
CN111710312B (zh) * 2020-07-06 2021-08-27 北京显芯科技有限公司 驱动电路、lcd显示屏以及电子设备
CN115662981A (zh) 2020-11-30 2023-01-31 湖北长江新型显示产业创新中心有限公司 一种显示面板及显示装置
US11599484B2 (en) * 2020-12-01 2023-03-07 Micron Technology, Inc. Semiconductor device having plural signal buses for multiple purposes
KR20230038359A (ko) * 2021-09-10 2023-03-20 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조방법
CN119002102A (zh) * 2023-05-17 2024-11-22 华为技术有限公司 一种芯片、光电模块及光通信设备

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61158369A (ja) * 1984-12-29 1986-07-18 タキロン株式会社 ドツトマトリクス発光表示体におけるマトリクス複合基板及びその製造方法
US4769292A (en) 1987-03-02 1988-09-06 Eastman Kodak Company Electroluminescent device with modified thin film luminescent zone
US5061569A (en) 1990-07-26 1991-10-29 Eastman Kodak Company Electroluminescent device with organic electroluminescent medium
US5495397A (en) 1993-04-27 1996-02-27 International Business Machines Corporation Three dimensional package and architecture for high performance computer
US6127245A (en) 1997-02-04 2000-10-03 Micron Technology, Inc. Grinding technique for integrated circuits
US6384529B2 (en) 1998-11-18 2002-05-07 Eastman Kodak Company Full color active matrix organic electroluminescent display panel having an integrated shadow mask
DE19950839A1 (de) 1999-10-21 2001-05-23 Fraunhofer Ges Forschung Vorrichtung zur Ansteuerung der Anzeigeelemente eines Anzeigeelementenarrays und Verfahren zur Herstellung derselben
JP4360015B2 (ja) * 2000-03-17 2009-11-11 セイコーエプソン株式会社 有機el表示体の製造方法、半導体素子の配置方法、半導体装置の製造方法
US6723576B2 (en) 2000-06-30 2004-04-20 Seiko Epson Corporation Disposing method for semiconductor elements
US20020149107A1 (en) * 2001-02-02 2002-10-17 Avery Dennison Corporation Method of making a flexible substrate containing self-assembling microstructures
US7183582B2 (en) 2002-05-29 2007-02-27 Seiko Epson Coporation Electro-optical device and method of manufacturing the same, element driving device and method of manufacturing the same, element substrate, and electronic apparatus
US6825556B2 (en) 2002-10-15 2004-11-30 Lsi Logic Corporation Integrated circuit package design with non-orthogonal die cut out
KR20050075280A (ko) 2002-11-19 2005-07-20 가부시키가이샤 이시카와 세이사쿠쇼 화소제어 소자의 선택 전사 방법, 화소제어 소자의 선택전사 방법에 사용되는 화소제어 소자의 실장 장치,화소제어 소자 전사후의 배선 형성 방법, 및, 평면디스플레이 기판
JP2004281424A (ja) * 2003-01-28 2004-10-07 Seiko Epson Corp 薄膜素子の製造方法、薄膜トランジスタ回路、アクティブマトリクス型表示装置、電気光学装置、電子機器
US7341887B2 (en) 2004-10-29 2008-03-11 Intel Corporation Integrated circuit die configuration for packaging
TWI304500B (en) * 2005-01-21 2008-12-21 Au Optronics Corp Display panel
US7615800B2 (en) 2005-09-14 2009-11-10 Eastman Kodak Company Quantum dot light emitting layer
US20070079571A1 (en) * 2005-10-07 2007-04-12 Schatz Kenneth D Methods and apparatuses relating to block receptor configurations and block assembly processes
US7816856B2 (en) * 2009-02-25 2010-10-19 Global Oled Technology Llc Flexible oled display with chiplets

Also Published As

Publication number Publication date
US7973472B2 (en) 2011-07-05
TW201119026A (en) 2011-06-01
CN102396067A (zh) 2012-03-28
WO2010120742A1 (en) 2010-10-21
EP2419934A1 (en) 2012-02-22
TWI381523B (zh) 2013-01-01
US20100264816A1 (en) 2010-10-21
JP5275510B2 (ja) 2013-08-28
EP2419934B1 (en) 2018-02-14
JP2012524298A (ja) 2012-10-11

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