TWI381523B - 具有多邊形晶片載置器的顯示裝置 - Google Patents

具有多邊形晶片載置器的顯示裝置 Download PDF

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Publication number
TWI381523B
TWI381523B TW099111698A TW99111698A TWI381523B TW I381523 B TWI381523 B TW I381523B TW 099111698 A TW099111698 A TW 099111698A TW 99111698 A TW99111698 A TW 99111698A TW I381523 B TWI381523 B TW I381523B
Authority
TW
Taiwan
Prior art keywords
display device
wafer carrier
substrate
wafer
axes
Prior art date
Application number
TW099111698A
Other languages
English (en)
Chinese (zh)
Other versions
TW201119026A (en
Inventor
羅納德Ｓ 寇克
Original Assignee
全球Ｏｌｅｄ科技公司
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Filing date
Publication date
Application filed by 全球Ｏｌｅｄ科技公司 filed Critical 全球Ｏｌｅｄ科技公司
Publication of TW201119026A publication Critical patent/TW201119026A/zh
Application granted granted Critical
Publication of TWI381523B publication Critical patent/TWI381523B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/129—Chiplets

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
TW099111698A 2009-04-15 2010-04-14 具有多邊形晶片載置器的顯示裝置 TWI381523B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/424,060 US7973472B2 (en) 2009-04-15 2009-04-15 Display device with polygonal chiplets

Publications (2)

Publication Number Publication Date
TW201119026A TW201119026A (en) 2011-06-01
TWI381523B true TWI381523B (zh) 2013-01-01

Family

ID=42396962

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099111698A TWI381523B (zh) 2009-04-15 2010-04-14 具有多邊形晶片載置器的顯示裝置

Country Status (7)

Country Link
US (1) US7973472B2 (enExample)
EP (1) EP2419934B1 (enExample)
JP (1) JP5275510B2 (enExample)
KR (1) KR20120020109A (enExample)
CN (1) CN102396067A (enExample)
TW (1) TWI381523B (enExample)
WO (1) WO2010120742A1 (enExample)

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US8610155B2 (en) 2008-11-18 2013-12-17 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, method for manufacturing the same, and cellular phone
US8125472B2 (en) * 2009-06-09 2012-02-28 Global Oled Technology Llc Display device with parallel data distribution
US8072437B2 (en) * 2009-08-26 2011-12-06 Global Oled Technology Llc Flexible multitouch electroluminescent display
US9899329B2 (en) 2010-11-23 2018-02-20 X-Celeprint Limited Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
US8934259B2 (en) 2011-06-08 2015-01-13 Semprius, Inc. Substrates with transferable chiplets
GB2500579B (en) * 2012-03-23 2015-10-14 Cambridge Display Tech Ltd Semiconductor Application Method and Product
US10141378B2 (en) * 2013-10-30 2018-11-27 Industrial Technology Research Institute Light emitting device free of TFT and chiplet
TWI586012B (zh) * 2014-01-02 2017-06-01 財團法人工業技術研究院 發光元件
US9799719B2 (en) 2014-09-25 2017-10-24 X-Celeprint Limited Active-matrix touchscreen
US20160093600A1 (en) * 2014-09-25 2016-03-31 X-Celeprint Limited Compound micro-assembly strategies and devices
US10217730B2 (en) 2016-02-25 2019-02-26 X-Celeprint Limited Efficiently micro-transfer printing micro-scale devices onto large-format substrates
TWI739949B (zh) 2016-11-15 2021-09-21 愛爾蘭商艾克斯展示公司技術有限公司 微轉印可印刷覆晶結構及方法
US10600671B2 (en) 2016-11-15 2020-03-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
US10395966B2 (en) 2016-11-15 2019-08-27 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
US11024608B2 (en) 2017-03-28 2021-06-01 X Display Company Technology Limited Structures and methods for electrical connection of micro-devices and substrates
US10468397B2 (en) * 2017-05-05 2019-11-05 X-Celeprint Limited Matrix addressed tiles and arrays
CN110226229B (zh) * 2018-01-02 2024-08-27 刘宏宇 一种显示器件结构
CN110827676A (zh) * 2018-08-14 2020-02-21 上海和辉光电有限公司 一种柔性有机发光显示基板、显示面板及显示装置
CN111710312B (zh) * 2020-07-06 2021-08-27 北京显芯科技有限公司 驱动电路、lcd显示屏以及电子设备
CN115312508B (zh) * 2020-11-30 2024-12-17 湖北长江新型显示产业创新中心有限公司 一种显示面板及显示装置
US11599484B2 (en) * 2020-12-01 2023-03-07 Micron Technology, Inc. Semiconductor device having plural signal buses for multiple purposes
KR20230038359A (ko) * 2021-09-10 2023-03-20 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조방법
CN119002102A (zh) * 2023-05-17 2024-11-22 华为技术有限公司 一种芯片、光电模块及光通信设备

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US20070057263A1 (en) * 2005-09-14 2007-03-15 Eastman Kodak Company Quantum dot light emitting layer

Also Published As

Publication number Publication date
JP2012524298A (ja) 2012-10-11
US20100264816A1 (en) 2010-10-21
TW201119026A (en) 2011-06-01
JP5275510B2 (ja) 2013-08-28
WO2010120742A1 (en) 2010-10-21
KR20120020109A (ko) 2012-03-07
EP2419934B1 (en) 2018-02-14
EP2419934A1 (en) 2012-02-22
CN102396067A (zh) 2012-03-28
US7973472B2 (en) 2011-07-05

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