KR20120003153A - Semiconductor package carrier - Google Patents

Semiconductor package carrier Download PDF

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Publication number
KR20120003153A
KR20120003153A KR1020100063843A KR20100063843A KR20120003153A KR 20120003153 A KR20120003153 A KR 20120003153A KR 1020100063843 A KR1020100063843 A KR 1020100063843A KR 20100063843 A KR20100063843 A KR 20100063843A KR 20120003153 A KR20120003153 A KR 20120003153A
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KR
South Korea
Prior art keywords
semiconductor package
latch
package carrier
mounting chamber
horizontal locking
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KR1020100063843A
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Korean (ko)
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KR101184026B1 (en
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전진국
박성규
김무준
유상규
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주식회사 오킨스전자
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Priority to KR1020100063843A priority Critical patent/KR101184026B1/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

PURPOSE: A semiconductor package carrier is provided to prevent damage of a latch when a package is touched on the latch by a loading fault, thereby safely inducing the latch to the inside of a mounting chamber. CONSTITUTION: A pair of latch parts(130) is arranged by facing a corner of a mounting chamber(100) arranged in a base. A latch part is comprised of a rotary member(110) and a horizontal locking member(120). The rotary member rotates in an upper part by a cover. The horizontal locking member is touched with a package(300) loaded in the mounting chamber and horizontally moved by being connected to the rotary member.

Description

반도체 패키지 캐리어{SEMICONDUCTOR PACKAGE CARRIER}Semiconductor Package Carrier {SEMICONDUCTOR PACKAGE CARRIER}

본 발명은 반도체 패키지의 성능을 테스트하기 위해 패키지를 테스트 소켓에 안내하는 반도체 패키지 캐리어에 관한 것으로, 보다 상세하게는 래치의 회전축을 하부에서 상부로 이동시킴으로써 테스트 소켓 스트로크를 포함한 하부에서 외력이 발생되더라도 패키지가 이탈되는 일이 없고, 패키지가 로딩 불량으로 인해 래치위에 접촉하더라도 래치가 파손되는 일이 없이 안전하게 탑재실내로 유도하여 탑재할 수 있는 반도체 패키지 캐리어에 관한 것이다.
The present invention relates to a semiconductor package carrier for guiding a package to a test socket for testing the performance of the semiconductor package, and more particularly, even if an external force is generated at the bottom including the test socket stroke by moving the rotation axis of the latch from the bottom to the top. The present invention relates to a semiconductor package carrier which can be guided safely into a mounting room without the package being detached and the latch not being damaged even if the package contacts the latch due to a poor loading.

반도체 패키지는 다양한 형태로 제조되며, 그 외부에는 외부회로와의 전기적 연결을 위한 외부연결단자를 갖고 있고, 이러한 반도체 패키지의 외부연결단자의 형식으로는 리드형, 볼형 등이 적용되고 있다. 또한, 이러한 반도체 패키지는 소비자에게 출하되기 전에 제품의 신뢰성을 확보하기 위하여 정상조건이나 고온, 고전압 등 스트레스 조건에서 소정의 테스트 신호발생회로와 연결하여 성능이나 수명 등을 테스트하고, 그 테스트결과에 따라 양품과 불량품으로 분류하게 된다.The semiconductor package is manufactured in various forms, the outside of which has an external connection terminal for electrical connection with an external circuit, the type of the external connection terminal of the semiconductor package has been applied to the lead type, ball type. In addition, in order to ensure the reliability of the product, such a semiconductor package is connected to a predetermined test signal generating circuit under normal conditions, stress conditions such as high temperature and high voltage, and tested for performance or lifespan according to the test result. It is classified as good or bad.

이러한 반도체 패키지의 테스트를 위하여 반도체 패키지를 고정하여 이송하고, 반도체 패키지의 외부연결단자에 신호를 전달하기 위하여 반도체 패키지 캐리어가 사용되어진다.For testing the semiconductor package, a semiconductor package carrier is used to fix and transport the semiconductor package and to transmit a signal to an external connection terminal of the semiconductor package.

종래 일반적인 QFP(Quad Flat Package)용 반도체 패키지 캐리어의 예가 도 1a에 제시되어 있다. 도면에 도시된 바와 같이, 종래 일반적인 QFP용 반도체 패키지 캐리어는 중앙영역에 테스트대상 반도체 패키지를 탑재하기 위한 탑재실(10)의 대향하는 귀퉁이에 한 쌍의 래치(12)를 갖고 있다. An example of a conventional general semiconductor package carrier for a quad flat package (QFP) is shown in FIG. 1A. As shown in the figure, a conventional QFP semiconductor package carrier has a pair of latches 12 at opposite corners of the mounting chamber 10 for mounting a semiconductor package under test in a central region.

이러한 구조의 반도체 패키지 캐리어의 경우 도 1b에 도시된 바와 같이 상부에서 커버(20)가 내려오면서 버튼(11)을 가압하면 버튼(11)이 하강하면서, 하부에 고정된 래치(12)의 일단부(12a)를 눌러 회전시키고, 이에 의해 래치의 타단부(12b)가 상부로 회전하면서 패키지에 대한 잠금을 해제하도록 하는 구성이다. 하지만, 이러한 구성에 의하면 도 1c에 도시된 바와 같이 래치의 회전축이 하부에 위치함으로써 테스트 소켓 스트로크를 포함한 하부에서 외력이 발생하면 래치가 열리면서 패키지가 이탈하는 사고가 발생하고, 또 패키지가 로딩 불량 등의 이유로 인해 래치위에 접촉하여 가압하는 경우 래치가 파손되는 일이 발생하는 문제가 있다.
In the case of the semiconductor package carrier having such a structure, as shown in FIG. 1B, when the cover 20 is pushed down and the button 11 is pressed, the button 11 is lowered and one end of the latch 12 fixed to the bottom is pressed. 12a is pressed to rotate, whereby the other end portion 12b of the latch is rotated upward to release the lock on the package. However, according to such a configuration, as shown in FIG. 1C, when an external force is generated at the lower part of the latch including the test socket stroke due to the rotation axis of the latch located at the lower part, the latch may be opened and the package may be released. For this reason, there is a problem that the latch breaks when the contact is applied on the latch and pressurized.

본 발명은 상기한 바와 같이 종래기술이 가지는 문제를 해결하기 위해 안출된 것으로, 그 목적은 래치의 회전축을 하부에서 상부로 이동시킴으로써 테스트 소켓 스트로크를 포함한 하부에서 외력이 발생되더라도 패키지가 이탈되는 일이 없고, 패키지가 로딩 불량으로 인해 래치위에 접촉하더라도 래치가 파손되는 일이 없이 안전하게 탑재실내로 유도하여 탑재할 수 있는 반도체 패키지 캐리어를 제공함에 있다.
The present invention has been made to solve the problems of the prior art as described above, the object is that even if the external force is generated at the bottom including the test socket stroke by moving the axis of rotation of the latch from the bottom to the top, the package is separated The present invention provides a semiconductor package carrier that can be safely guided and mounted into a mounting chamber without damaging the latch even if the package contacts the latch due to a poor loading.

상기한 바와 같은 본 발명의 기술적 과제는 다음과 같은 수단에 의해 달성되어진다.The technical problem of the present invention as described above is achieved by the following means.

(1) 반도체 패키지를 테스트하기 위해 패키지를 테스트 소켓에 안내하는 반도체 패키지 캐리어에 있어서,(1) A semiconductor package carrier for guiding a package to a test socket for testing a semiconductor package,

반도체 패키지 탑재실 상단에 회전가능하게 고정되며, 상부 커버의 상단부 가압에 의해 회동하는 회전부재; 상기 회전부재의 하단부에 결합되어 상기 회전부재가 회동함에 따라 연동하여 수평으로 운동하는 수평잠금부재로 이루어지는 래치부를 포함하는 반도체 패키지 캐리어.
A rotating member rotatably fixed to an upper end of the semiconductor package mounting chamber and rotated by pressing an upper end of the upper cover; And a latch unit coupled to a lower end of the rotating member, the latch unit including a horizontal locking member moving horizontally in linkage with the rotating member.

(2) 제 1항에 있어서,(2) The method according to claim 1,

상기 수평잠금부재의 일단에 압축스프링이 결합되어진 것을 특징으로 하는 반도체 패키지 캐리어.
The semiconductor package carrier, characterized in that the compression spring is coupled to one end of the horizontal locking member.

(3) 제 1항에 있어서,(3) The method according to claim 1,

상기 회전부재의 회전축에 토션스프링이 결합되어 회전시 복원력을 제공하는 것을 특징으로 하는 반도체 패키지 캐리어.
And a torsion spring coupled to a rotation shaft of the rotation member to provide a restoring force during rotation.

본 발명에 의하면 래치의 회전축을 하부에서 상부로 이동시킴으로써 테스트 소켓 스트로크를 포함한 하부에서 외력이 발생되더라도 패키지가 이탈되는 일이 없고, 패키지가 로딩 불량으로 인해 래치위에 접촉하더라도 래치가 파손되는 일이 없이 안전하게 탑재실내로 유도하여 탑재할 수 있는 반도체 패키지 캐리어를 제공한다.
According to the present invention, by moving the axis of rotation of the latch from the bottom to the top, even if an external force is generated at the bottom including the test socket stroke, the package is not detached and the latch is not damaged even if the package contacts the latch due to the loading failure. Provided is a semiconductor package carrier that can be safely guided into a mounting room.

도 1은 종래 QFP용 반도체 패키지 캐리어의 구성도(a), 래치의 동작과정의 설명도(b), 및 래치에 외력이 작용할 경우의 예시도(c)이다.
도 2는 제1실시예에 따른 본 발명의 QFP용 반도체 패키지 캐리어의 구성도(a), 래치의 동작과정의 설명도(b), 및 래치에 외력이 작용할 경우의 예시도(c)이다.
도 3은 제2실시예에 따른 본 발명의 QFP용 반도체 패키지 캐리어의 래치의 구성도이다.
1 is a configuration diagram (a) of a conventional QFP semiconductor package carrier, an explanatory diagram (b) of an operation process of a latch, and an exemplary diagram (c) when an external force acts on the latch.
2 is a configuration diagram (a) of the QFP semiconductor package carrier according to the first embodiment, an explanatory diagram (b) of an operation process of the latch, and an exemplary diagram (c) when an external force acts on the latch.
3 is a configuration diagram of a latch of the QFP semiconductor package carrier of the present invention according to the second embodiment.

본 발명은 반도체 패키지를 테스트하기 위해 패키지를 테스트 소켓에 안내하는 반도체 패키지 캐리어에 있어서,The present invention provides a semiconductor package carrier for guiding a package to a test socket for testing a semiconductor package.

반도체 패키지 탑재실 상단에 회전가능하게 고정되며, 상부 커버의 상단부 가압에 의해 회동하는 회전부재; 상기 회전부재의 하단부에 결합되어 상기 회전부재가 회동함에 따라 연동하여 수평으로 운동하는 수평잠금부재로 이루어지는 래치부를 포함하는 반도체 패키지 캐리어를 제공한다.
A rotating member rotatably fixed to an upper end of the semiconductor package mounting chamber and rotated by pressing an upper end of the upper cover; A semiconductor package carrier is coupled to a lower end of the rotating member and includes a latch unit including a horizontal locking member that moves horizontally in association with a rotation of the rotating member.

이하 본 발명의 내용을 실시예로서 도면을 참조하여 보다 상세하게 설명하면 다음과 같다.
Hereinafter, the content of the present invention will be described in detail with reference to the accompanying drawings.

본 발명은 상기 도 2a 및 2b의 종래 일반적인 반도체 패키지 캐리어 구성에, 베이스에 형성된 탑재실(100)의 귀퉁이에 대향하도록 한 쌍의 래치부(130)가 형성되며, 상기 래치부(130)는 상부에서 커버(예를 들어, SUS 커버)(200)에 의해 회동하는 회전부재(110), 및 탑재실에 탑재된 패키지(300)와 접촉가압하며 상기 회전부재(110)와 연동하여 수평으로 이동하는 수평잠금부재(120)로 이루어진다.
2A and 2B, in the conventional general semiconductor package carrier configuration of FIG. 2A and 2B, a pair of latch portions 130 are formed to face corners of a mounting chamber 100 formed in a base, and the latch portions 130 are formed at an upper portion thereof. Contact pressure with the rotating member 110 rotated by the cover (for example, SUS cover) 200, and the package 300 mounted in the mounting chamber, and moves horizontally in conjunction with the rotating member 110 It consists of a horizontal locking member (120).

도 2b에 도시된 바와 같이, 본 발명의 반도체 패키지 캐리어에 장착된 래치부(130)의 회전부재(110)는 베이스 상면으로 돌출되어 SUS 커버(200)가 하강할 때 가압되어지는 상단부(110a)와 수평잠금부재(120)와 결합되어 연동되는 하단부(110b)로 이루어진다.As shown in FIG. 2B, the rotating member 110 of the latch unit 130 mounted on the semiconductor package carrier of the present invention protrudes to the upper surface of the base and is pressurized when the SUS cover 200 descends. And the lower portion 110b coupled with the horizontal locking member 120 to be interlocked.

따라서, SUS 커버가 하강할 때, 회전부재의 상단부(110a)가 가압되어 회전축을 중심으로 하단부(110b)가 시계방향으로 회전운동하게 되고, 이에 결합된 수평잠금부재(120)는 상기 하단부(110b)에 연동하여 좌측으로 수평이동되어진다.Therefore, when the SUS cover is lowered, the upper end portion 110a of the rotating member is pressed to rotate the lower end portion 110b clockwise about the rotating shaft, and the horizontal locking member 120 coupled thereto is the lower portion 110b. It moves horizontally to the left in conjunction with).

수평잠금부재(120)의 좌측에는 압축스프링(121)이 결합되어 수평잠금부재가 좌측으로 이동시 압축되어 SUS 커버의 상향이동시 수평잠금부재가 우측으로 이동하여 원상태로 복원할 수 있도록 하는 것이 바람직하다.
Compression spring 121 is coupled to the left side of the horizontal locking member 120 is preferably compressed when the horizontal locking member is moved to the left side so that the horizontal locking member is moved to the right to restore the original state when the SUS cover is moved upward.

상기와 같은 구성에 의하면 도 2c에 도시된 바와 같이, 래치부(130)의 회전축을 하부에서 상부로 이동시킴으로써 (A)에서와 같이 테스트 소켓 스트로크를 포함한 하부에서 외력이 발생되더라도 패키지가 이탈되는 일이 없고, 뿐만 아니라, (B)에서와 같이 패키지(300)가 로딩 불량으로 인해 래치위에 접촉하더라도 래치가 파손되는 일이 없이 안전하게 탑재실내로 유도하여 탑재할 수 있는 효과를 제공한다.
According to the above configuration, as shown in Figure 2c, by moving the axis of rotation of the latch unit 130 from the bottom to the top, even if the external force is generated in the lower portion including the test socket stroke as in (A), the package is separated In addition, as shown in (B), even if the package 300 comes in contact with the latch due to a poor loading, the latch does not break and provides an effect that can be safely guided into the mounting chamber and mounted.

도 3은 제2실시예에 따른 본 발명의 반도체 패키지 캐리어의 래치의 구성도로서, 본 발명의 제1실시예에 따른 캐리어의 구성에서 상기 수평잠금부재(120)의 단부와 연결된 압축스프링(121)을 대신하여 또는 이와 함께 회전부재(110)의 회전축상에 텐션스프링(111)을 장착하여 회전부재(110)의 회전과 함께 텐션스프링(111)이 압축되고 SUS 커버(200)의 해제로 복원력에 의해 회전부재(110)를 반대방향으로 회전시켜 원상태로 복귀하도록 하는 것도 가능하다.
3 is a configuration diagram of a latch of the semiconductor package carrier of the present invention according to the second embodiment, the compression spring 121 connected to the end of the horizontal locking member 120 in the configuration of the carrier according to the first embodiment of the present invention. The tension spring 111 is compressed with the rotation of the rotation member 110 by replacing the tension spring 111 on the rotation axis of the rotation member 110 in place of or together with the restoring force by releasing the SUS cover 200. It is also possible to return to the original state by rotating the rotating member 110 in the opposite direction.

반도체 패키지가 안정적으로 탑재실내에 고정되면 종래의 일반적인 검사프로세스에 따라 아래로부터 테스트소켓과 안정적인 접속이 이루어진 다음에 테스트 제어장치로부터 테스트보드와 테스트소켓의 접촉핀을 통해 탑재실(100)에 탑재된 반도체 패키지(300)에 테스트신호를 전송하여 테스트를 실시한다. 테스트 제어장치는 탑재실(100)에 탑재된 반도체 패키지(300)로부터의 테스트 응답신호에 기초하여 반도체 패키지의 양품여부를 판단한다. 테스트가 완료되면 탑재실(100)에 탑재된 반도체 패키지(300)의 상면에 인가된 푸셔의 압력을 해제한다. 다음에 트레이와 테스트소켓을 분리시킨 후, 트레이를 언로딩영역으로 이동시킨다. 언로딩영역에서는 테스트결과에 따라 탑재실(100)에 탑재된 반도체 패키지를 양품트레이 또는 불량품트레이로 언로딩시킨다.
When the semiconductor package is stably fixed in the mounting chamber, a stable connection is made with the test socket from below according to a conventional general inspection process, and then mounted in the mounting chamber 100 through the contact pins of the test board and the test socket from the test controller. The test signal is transmitted to the semiconductor package 300. The test control device determines whether the semiconductor package is good or not, based on a test response signal from the semiconductor package 300 mounted in the mounting chamber 100. When the test is completed, the pressure of the pusher applied to the upper surface of the semiconductor package 300 mounted in the mounting chamber 100 is released. After separating the tray and the test socket, move the tray to the unloading area. In the unloading area, the semiconductor package mounted in the mounting chamber 100 is unloaded into the good or bad tray according to the test result.

상기와 같이, 본 발명의 바람직한 실시 예를 참조하여 설명하였지만 해당 기술 분야의 숙련된 당업자라면 하기의 특허청구범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It can be understood that

100: 탑재부
110: 회전부재
120: 수평잠금부재
130: 래치
200: SUS 커버
300: 반도체 패키지100: mounting part
110: rotating member
120: horizontal locking member
130: latch
200: SUS cover
300: semiconductor package

Claims (3)

반도체 패키지를 테스트하기 위해 패키지를 테스트 소켓에 안내하는 반도체 패키지 캐리어에 있어서,
반도체 패키지 탑재실 상단에 회전가능하게 고정되며, 상부 커버의 상단부 가압에 의해 회동하는 회전부재; 상기 회전부재의 하단부에 결합되어 상기 회전부재가 회동함에 따라 연동하여 수평으로 운동하는 수평잠금부재로 이루어지는 래치부를 포함하는 반도체 패키지 캐리어.A semiconductor package carrier for guiding a package to a test socket for testing a semiconductor package,
A rotating member rotatably fixed to an upper end of the semiconductor package mounting chamber and rotated by pressing an upper end of the upper cover; And a latch unit coupled to a lower end of the rotating member, the latch unit including a horizontal locking member moving horizontally in linkage with the rotating member. 제 1항에 있어서,
상기 수평잠금부재의 일단에 압축스프링이 결합되어진 것을 특징으로 하는 반도체 패키지 캐리어.The method of claim 1,
The semiconductor package carrier, characterized in that the compression spring is coupled to one end of the horizontal locking member. 제 1항에 있어서,
상기 회전부재의 회전축에 토션스프링이 결합되어 회전시 복원력을 제공하는 것을 특징으로 하는 반도체 패키지 캐리어.The method of claim 1,
And a torsion spring coupled to a rotation shaft of the rotation member to provide a restoring force during rotation.
KR1020100063843A 2010-07-02 2010-07-02 Semiconductor package carrier KR101184026B1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108109947A (en) * 2016-11-25 2018-06-01 沈阳芯源微电子设备有限公司 It can keep the loading device of air-tightness
KR102139738B1 (en) * 2019-01-30 2020-07-31 (주)마이크로컨텍솔루션 Test socket for testing of semiconductor
KR102193725B1 (en) * 2019-12-31 2020-12-21 (주)마이크로컨텍솔루션 Test socket
KR102213076B1 (en) * 2020-01-07 2021-02-08 (주)마이크로컨텍솔루션 Test socket

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100577756B1 (en) * 2004-12-03 2006-05-10 미래산업 주식회사 Carrier module for semiconductor test handler

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108109947A (en) * 2016-11-25 2018-06-01 沈阳芯源微电子设备有限公司 It can keep the loading device of air-tightness
CN108109947B (en) * 2016-11-25 2020-03-10 沈阳芯源微电子设备股份有限公司 Slide glass device capable of keeping air tightness
KR102139738B1 (en) * 2019-01-30 2020-07-31 (주)마이크로컨텍솔루션 Test socket for testing of semiconductor
KR102193725B1 (en) * 2019-12-31 2020-12-21 (주)마이크로컨텍솔루션 Test socket
KR102213076B1 (en) * 2020-01-07 2021-02-08 (주)마이크로컨텍솔루션 Test socket

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