KR102213076B1 - Test socket - Google Patents

Abstract

The present invention relates to a semiconductor chip package test socket. More specifically, the present invention relates to the semiconductor chip package test socket wherein by being able to select a position in which a contact member is coupled on a board, a test corresponding to the semiconductor chip package having various electrical terminal structures is capable of being performed. The semiconductor chip package test socket includes a board, a contact member, and a plurality of latch modules.

Description

Semiconductor chip package test socket {TEST SOCKET}

The present invention relates to a semiconductor chip package test socket, and more particularly, a semiconductor capable of performing a test corresponding to a semiconductor chip package having various electrical terminal structures by selecting a position at which a contact member is coupled on a board. It relates to the chip package test socket.

A semiconductor device undergoes a manufacturing process and then performs an inspection to determine its electrical performance. The performance test of a semiconductor device is performed in a state in which a semiconductor chip package test socket formed to be electrically contacted with a terminal of the semiconductor device is inserted between the semiconductor device and the inspection circuit board. In addition, the semiconductor chip package test socket is used in a burn-in test process in the manufacturing process of semiconductor devices in addition to inspection of semiconductor devices.

In general, a semiconductor chip package test socket for inspecting a semiconductor chip package may perform a test only on a semiconductor chip package having a predetermined standard. That is, since the semiconductor chip package mounting region of the semiconductor chip package test socket is fixed, the test can be performed only on a semiconductor chip package suitable for the structure, size, and shape of the electrical terminals of the semiconductor chip package mounting region.

Accordingly, in order to perform tests on different semiconductor chip packages, separate semiconductor chip package test sockets are required, so that test cost and operation cost increase.

Accordingly, there is a need to develop a semiconductor chip package test socket capable of performing a test corresponding to a semiconductor chip package having various electrical terminal structures by being able to vary the position where the contact member is provided.

In addition, there is a need to develop a semiconductor chip package test socket capable of performing tests on semiconductor chip packages having different sizes and shapes.

Publication Patent No. 2009-0068645

The present invention was conceived to solve the above-described problem, and by selecting a position where the contact member is coupled on the board, it is possible to perform tests on semiconductor chip packages having various sizes and shapes, or various electrical connection structures. Its purpose is to provide a semiconductor chip package test socket.

A semiconductor chip package test socket according to an embodiment of the present invention includes: a board; A contact member coupled to the board; And a plurality of latch modules coupled to the board, wherein a semiconductor chip package mounting region is provided between a plurality of latch modules coupled on the board, and the board includes contact fixing holes formed at different positions, respectively. And the contact member is detachably inserted into the contact fixing hole.

According to an embodiment, the contact member includes a contact body, an upper contact provided on the contact body and protruding upward, a lower contact provided under the contact body and protruding downward, and the contact body It has a fitting protrusion protruding in at least one side direction of.

According to an embodiment, the contact body has a larger width than the upper contact in at least one direction on a horizontal plane, and the contact fixing hole is fitted with the contact member from below, and the upper end surface of the contact body is engaged. It has a support step in which a support surface is formed downward to be supported.

According to an embodiment, the board includes first coupling means formed at different positions, respectively, and each of the latch modules is selectively coupled to any one of the first coupling means, so that the semiconductor chip package mounting region The size of is variable.

According to an embodiment, the first coupling means is configured as a coupling hole penetrating the board.

According to an embodiment, the latch module includes a coupling hook inserted into the coupling hole and coupled through the coupling hole.

According to an embodiment, the latch module includes a latch base, a support body standing on the latch base, and a latch finger rotatably connected to the support body and open/closed.

According to an embodiment, the support body includes a first support wall and a second support wall spaced apart from each other, and the latch finger is positioned between the first support wall and the second support wall.

According to an embodiment, one side of the first support wall and one side of the second support wall are orthogonal to each other.

According to an embodiment, an elastic spring is provided between the latch base and the latch finger to elastically bias the latch finger.

In the semiconductor chip package test socket according to an embodiment of the present invention, a contact member can be selectively detached from the board simply. Accordingly, it is possible to implement a semiconductor chip package test socket having a connection structure that can correspond to a semiconductor chip package having various structures of electrical terminals.

In addition, in the semiconductor chip package test socket according to an embodiment of the present invention, by selecting the coupling position of the latch module, a test on semiconductor chip packages of various sizes and shapes is performed using a single semiconductor chip package test socket. can do.

In addition, in the semiconductor chip package test socket according to an embodiment of the present invention, user convenience can be improved by simply selecting, disassembling, and reassembling the latch module.

1 is a diagram showing the structure of a semiconductor chip package test socket according to an embodiment of the present invention.
2 is a diagram showing the structure of a board of a semiconductor chip package test socket according to an embodiment of the present invention.
FIG. 3 is an enlarged view of a cross section XX of FIG. 2.
4 is a diagram illustrating a structure of a contact member of a test socket for a semiconductor chip package according to an embodiment of the present invention.
5 to 7 are diagrams showing the structure of a latch module of a semiconductor chip package test socket according to an embodiment of the present invention.
8 is a diagram illustrating a coupling relationship between a contact member and a latch module and a board of a semiconductor chip package test socket according to an embodiment of the present invention.
9 is a diagram illustrating a test of a semiconductor chip package using a semiconductor chip package test socket according to an embodiment of the present invention.

Hereinafter, a preferred embodiment according to the present invention will be described with reference to the accompanying drawings.

1 is a diagram showing the structure of a semiconductor chip package test socket 1 according to an embodiment of the present invention.

The semiconductor chip package test socket 1 according to the exemplary embodiment of the present invention includes a board 100, a contact member 200, and a latch module 300.

<Board (100)>

2 is a diagram showing the structure of the board 100 of the semiconductor chip package test socket 1 according to an embodiment of the present invention. 3 is an enlarged view illustrating a cross section of X-X of FIG. 2.

The board 100 may be composed of a PCB having a predetermined area and thickness.

The board 100 may include a contact fixing hole 110 and a coupling means 120.

The contact fixing hole 110 is configured as a hole that can be fixed by inserting a contact member 200 to be described later. Each contact fixing hole 110 is composed of a hole penetrated up and down. In addition, a predetermined fitting fixing structure may be provided in the contact fixing hole 110 to allow a contact member 200 to be described later to be inserted. The contact fixing hole 110 may have a predetermined mesh structure.

The coupling means 120 is a means capable of inserting and fixing a latch module 300 to be described later.

The coupling means 120 may be, for example, a coupling hole penetrating in the vertical direction. A plurality of coupling holes may be provided, and each may be formed at different positions.

For example, the coupling hole may include a first coupling hole set 120A positioned at a first edge of the board 100, and a second coupling hole set positioned at a second edge positioned diagonally opposite the first edge. (120B) may be included. In addition, a plurality of coupling holes may be formed at each corner position of the board 100. For example, the first coupling hole set 120A and the second coupling hole set 120B include a first hole 122, a second hole 124, and a third hole 126 formed at different positions, respectively. can do.

Accordingly, a distance between a hole constituting the first coupling hole set 120A and a hole constituting the second coupling hole set 120B may be plural.

Meanwhile, in the drawing, it is shown that the first coupling hole set 120A and the second coupling hole set 120B are respectively provided at two opposite corners of the board 100, but the present invention is not limited thereto.

For example, a wall fixed on the board may be provided, and a plurality of coupling hole sets having different separation distances from the wall may be provided. In addition, a plurality of coupling hole sets may be provided at an arbitrary position of the board 100.

Referring to FIG. 3, the structure of the contact fixing hole 110 will be described below.

The contact fixing hole 110 is configured as a hole penetrated in the vertical direction. The contact fixing hole 110 may have a lower space part 112 and an upper space part 114. The lower space part 112 may have a larger width in at least one direction on a horizontal plane than the upper space part 114.

Accordingly, between the upper space part 114 and the lower space part 112, a support step 116 with a support surface formed in a downward direction may be formed. The support step 116 may form part of the above-described fitting fixing structure.

<Contact member (200)>

4 is a diagram showing a structure of a contact member 200 of a semiconductor chip package test socket 1 according to an exemplary embodiment of the present invention. 4A and 4B illustrate contact members 200 of the semiconductor chip package test socket 1 according to an embodiment of the present invention from different directions.

The contact member 200 is a member having electrical conductivity. The contact member 200 may be a member such as a pin extending vertically with a predetermined length.

For example, the contact member 200 may include a contact body 210, an upper contact 220, and a lower contact 230.

The contact body 210 may be configured in the form of an upright panel having a predetermined width in the horizontal direction. The upper contact 220 is provided above the contact body 210 and may protrude upward. At least a portion of the upper contact 220 may be bent to have a bent portion. The lower contact 230 is provided under the contact body 210 and may protrude downward.

According to an embodiment, the contact body 210 may have a larger width than the upper contact 220 and the lower contact 230 in at least one direction on a horizontal plane.

Further, at least one side of the contact body 210 may be provided with a fitting protrusion 240 protruding in one direction.

The contact member 200 may be fitted into the contact fixing hole 110 provided in the board 100. The contact member 200 may include a fitting fixing means that can be fitted into a fitting fixing structure provided in the contact fixing hole 110.

The configuration of the fitting protrusion 240 described above, and the configuration in which the contact body 210 has a wide width in the horizontal direction may constitute the fitting fixing means.

When the contact member 200 is inserted into the contact fixing hole 110, the upper contact 220 protrudes above the board 100, and the lower contact 230 protrudes below the board 100.

In addition, the upper end surface of the contact body 210 may be caught and supported by the support step 116 of the board 100.

<Latch module (300)>

5 to 7 are views showing the structure of the latch module 300 of the semiconductor chip package test socket 1 according to an embodiment of the present invention.

The latch module 300 is detachably coupled to the board 100. The latch module 300 may support and fix a semiconductor chip package mounted on the board 100.

The latch module 300 includes a latch base 310, a support body 320, a coupling hook 330, and a latch finger 340.

The latch base 310 constitutes the base of the latch module 300. The latch base 310 may be configured in a panel shape having a predetermined area and thickness. One side of the latch base 310 may be provided with a spring fixing part 312 that enables a latch spring (not shown) to be fixed.

The support body 320 may be a predetermined wall-shaped structure erected on the latch base 310.

The support body 320 may include a first support wall 320A and a second support wall 320B. The first support wall 320A and the second support wall 320B may be spaced apart from each other to have a predetermined separation distance 320C. With the separation distance 320C therebetween, one surface of the first support wall 320A and one surface of the second support wall 320B may face each other. A connection groove 322 to which a latch finger 340 is connected may be provided on one surface of the first support wall 320A and one surface of the second support wall 320B facing each other.

The first support wall 320A and the second support wall 320B may have any arrangement structure.

According to an embodiment, as shown in FIG. 6, one side of the first support wall 320A and one side of the second support wall 320B may have a predetermined intervening angle θ. According to an example, the angle θ may be 90°. That is, one side of the first support wall 320A and one side of the second support wall 320B may be orthogonal to each other. The side surfaces orthogonal to each other may be a support surface 324 supporting one side surface of the semiconductor chip package.

The coupling hook 330 may be a hook provided on the bottom surface of the latch base 310 and protruding downward. The coupling hook 330 may be inserted into the coupling hole of the board 100 and fixed.

The latch finger 340 is positioned between the first support wall 320A and the second support wall 320B.

The latch finger 340 includes a latch shaft protruding in the lateral direction. As the latch shaft is connected to the connection groove 322, the latch finger 340 may rotate around the latch shaft.

The front end of the latch finger 340 (the end positioned in the inner direction of the semiconductor chip package test socket 1 when the latch module 300 is coupled to the board 100) is configured as a support end, and the latch finger ( The rear end of the 340 (when the latch module 300 is coupled to the board 100, the end positioned in the outer direction of the semiconductor chip package chest socket) is configured as an operating end.

A spring fixing part (not shown) to which a latch spring (not shown) can be connected may be provided at the operating end.

The latch finger 340 is connected to the support body 320 and has an open/closed state. In the open state, the front end of the latch finger 340 is inclined downward. In addition, in the closed state, the rear end of the latch finger 340 is inclined downward.

Although not shown, the latch module 300 may further include a latch spring (not shown).

A latch spring (not shown) is disposed between the spring fixing part 312 of the latch base 310 and the spring fixing part (not shown) of the latch finger 340. Accordingly, the latch spring (not shown) elastically biases the rear end of the latch finger 340. Accordingly, when there is no other external force, the latch spring (not shown) applies an elastic force that causes the latch finger 340 to be in a closed state.

Meanwhile, the latch module 300 may further include a predetermined operation means for fixing the latch finger 340 in an open/closed state.

<Coupling relationship between the board 100 and the contact member 200>

FIG. 8 is a diagram illustrating a coupling relationship between the board 100 of the semiconductor chip package test socket 1, the contact member 200, and the latch module 300 according to an embodiment of the present invention.

The contact member 200 is selectively detachably coupled to the board 100. The contact member 200 is inserted into and fixed to the contact fixing hole 110 provided in the board 100.

In addition, the latch module 300 is detachably coupled to the board 100. A plurality of latch modules 300 may be coupled to the board 100. Accordingly, the first latch module 300A and the second latch module 300B may be provided on the board 100.

The latch module 300 is fixed at a position on the board 100 by inserting and fixing the coupling hook 330 of the latch module 300 into the coupling means 120 (combination hole) provided on the board 100 Can be.

At this time, as described above, the board 100 has a plurality of coupling holes as coupling means 120. In addition, the coupling holes are formed at different positions, respectively. Accordingly, by selecting a coupling hole into which the coupling hook 330 is inserted, a position where the latch module 300 is fixed may be selected.

A plurality of latch modules 300 are fixed on the board 100. The space between the plurality of latch modules 300 becomes a semiconductor chip package mounting area in which a semiconductor chip package can be mounted.

In addition, corresponding to the mounting area, the contact member 200 may be inserted into and fixed to the contact fixing hole 110 provided in the board 100.

<Effects of the semiconductor chip package test socket 1 according to the embodiment of the present invention>

9 is a diagram illustrating a test of a semiconductor chip package using the semiconductor chip package test socket 1 according to an embodiment of the present invention.

In the semiconductor chip package test socket 1 according to the embodiment of the present invention, a position at which the contact member 200 and the latch module 300 are fixed on the board 100 can be selected. The size and shape of the mounting area of the semiconductor chip package provided in the device may be varied. Accordingly, tests can be performed on semiconductor chip packages having different sizes and shapes.

For example, in the case of performing a test on a semiconductor chip package having a small size as shown in (a) of FIG. 9, the gap between the latch modules 300 coupled to the board 100 is reduced. That is, the latch module 300 is fixed by selecting a coupling hole located relatively close. Of course, the contact member 200 is disposed within the semiconductor chip package mounting area.

As another example, as shown in (b) of FIG. 9, when a test is performed on a semiconductor chip package having a large size, the gap between the latch modules 300 coupled to the board 100 is increased. That is, the latch module 300 is fixed by selecting coupling holes spaced apart from each other.

In addition, as shown in (c) of FIG. 9, by selecting the coupling position of the latch module 300, a square or rectangular semiconductor chip package mounting region can be configured. Accordingly, a test can be performed on a square semiconductor chip package or a rectangular semiconductor chip package.

In addition, in response to this, the contact member 200 may also be selectively coupled to the board 100. That is, while the contact member 200 is fitted and fixed to the contact fixing hole 110, the contact fixing hole 110 to which the contact member 200 is fitted may be appropriately selected. Accordingly, the arrangement of the contact member 200 provided on the board 100 may correspond to the arrangement of the terminals of the semiconductor chip package on which the test is performed.

In the semiconductor chip package test socket 1 according to the embodiment of the present invention, the contact member 200 can be selectively detached from the board 100 simply.

Accordingly, the semiconductor chip package test socket 1 according to the embodiment of the present invention can implement a semiconductor chip package test socket having a connection structure that can correspond to a semiconductor chip package having various structures of electrical terminals.

In addition, the semiconductor chip package test socket 1 according to the embodiment of the present invention is capable of selecting a coupling position of the latch module 300, and thus various sizes and shapes using a single semiconductor chip package test socket 1 You can perform a test on the semiconductor chip package of

In addition, in the semiconductor chip package test socket 1 according to an embodiment of the present invention, the user's convenience may be improved by simply selecting, disassembling, and reassembling the latch module 300.

In addition, even if some members constituting the semiconductor chip package test socket 1 are damaged or damaged, it is possible to simply disassemble and reassemble them, thereby reducing operating costs. For example, when some of the contact members 200 are damaged, the contact members 200 can be easily replaced.

In the above, preferred embodiments have been illustrated and described, but the present invention is not limited to the specific embodiments described above, and common knowledge in the technical field to which the present invention pertains without departing from the gist of the present invention claimed in the claims. Of course, various modifications may be made by the operator, and these modifications should not be understood individually from the technical spirit or prospect of the present invention.

1: semiconductor chip test socket
100: board
110: contact fixing hole
112: lower space portion
114: upper space portion
116: support step
120: coupling means
120A: first mating hole set
120B: second mating hole set
122: first hole
124: second hall
126: third hall
200: contact absence
210: contact body
220: upper contact
230: lower contact
240: fitting protrusion
300: latch module
310: latch base
312: spring fixing part
320: support body
320A: first support wall
320B: second support wall
320C: separation interval
322: connection groove
324: support surface
330: coupling hook
340: latch finger

Claims (10)

In the semiconductor chip package test socket,
board;
A contact member coupled to the board; And
Includes; a plurality of latch modules coupled to the board,
A semiconductor chip package mounting region is provided between a plurality of latch modules coupled on the board,
The board,
Each includes contact fixing holes formed at different positions,
The contact member is detachably inserted into the contact fixing hole,
The contact member,
Contact Body,
An upper contact provided on the upper part of the contact body and protruding upward,
A lower contact provided under the contact body and protruding downward, and
A semiconductor chip package test socket having a fitting protrusion protruding in at least one side direction of the contact body. delete The method of claim 1,
The contact body,
Has a width greater than that of the upper contact in at least one direction on a horizontal plane,
The contact fixing hole,
A semiconductor chip package test socket having a support step in which the contact member is fitted from below and a support surface is formed in a downward direction so that an upper end surface of the contact body is supported. The method of claim 1,
The board, each comprising a first coupling means formed at a different position,
Each of the latch modules is selectively coupled to any one of the first coupling means,
A semiconductor chip package test socket having a variable size of the semiconductor chip package mounting area. The method of claim 4,
The first coupling means,
A semiconductor chip package test socket which is a coupling hole penetrating the board. The method of claim 5,
The latch module,
A semiconductor chip package test socket comprising a coupling hook inserted into the coupling hole and coupled through the coupling hole. The method according to claim 1,
The latch module,
Latch base,
A support body erected on the latch base, and
A semiconductor chip package test socket comprising a latch finger rotatably connected to the support body and opened/closed. The method of claim 7,
The support body,
It includes a first support wall and a second support wall spaced apart from each other,
The latch finger is a semiconductor chip package test socket positioned between the first support wall and the second support wall. The method of claim 8,
A test socket for a semiconductor chip package wherein one side of the first support wall and one side of the second support wall are orthogonal to each other. The method of claim 7,
Between the latch base and the latch finger,
A semiconductor chip package test socket provided with an elastic spring for elastically biasing the latch finger.

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