KR20110120163A - Optical package and manufacturing method of the same - Google Patents

Abstract

PURPOSE: An optical package and a manufacturing method thereof are provided to arrange a package following an existing lead frame method into a package using a tape substrate, thereby reducing the volume and thickness of a total package. CONSTITUTION: An insulating layer(110) including holes(115,116) is arranged on a metal layer(120). A metal reflective layer(130) is arranged on the surface of the insulating layer. A plating layer(140) is arranged on the metal layer exposed by the metal reflective layer and hole. An optical device(150) is mounted on the plating layer exposed by the hole. A connection part(160) electrically connects the optical device and a circuit pattern. A resin part(170) buries the optical device and connection part.

Description

Optical package and manufacturing method {OPTICAL PACKAGE AND MANUFACTURING METHOD OF THE SAME}

The present invention relates to an optical package and a method for manufacturing the same, and more particularly, to an optical package and a method for manufacturing the same, which reduce the volume and thickness of the package, increase the degree of integration, and increase the light efficiency.

Light Emitting Diodes (LEDs) produce a small number of carriers (electrons or holes) injected using the pn junction structure of a semiconductor, and intermetallic compound junctions that emit light by converting electrical energy into light energy by recombination. Refers to a diode. In other words, when a forward voltage is applied to a semiconductor of a specific element, electrons and holes move through the junction of the anode and the cathode and recombine with each other, which is less energy than when the electrons and holes are separated. Release. Such LEDs are applied to a wide range of applications, such as not only general display devices but also lighting devices or backlight devices of LCD displays. In particular, LED has the advantage of low heat generation and long life due to high energy efficiency while being able to drive at a relatively low voltage, and most of the currently used technologies have been developed to provide high brightness of white light, which was difficult to implement in the past. It is expected to replace the light source device.

1A shows a cross-sectional view of an LED package according to one embodiment of the prior art. Referring to FIG. 1A, the LED package is configured to conduct conductive wires through bonding a gold wire 102 to a light emitting GaN chemical chip and to form heat sinks 10 at a lower portion thereof to allow heat emission. In addition, the external support and the LED package portion of the metal lead 20 through the wire bonding to the electricity and the structure that can shine. This structure forms a package for each individual chip 60.

Such a conventional LED package is in the form of a lead frame type package. However, the lead frame type has a high package utilization area, making it difficult to integrate LED chips, and the package size is relatively large compared to the chip size.

In addition, in order to dissipate the heat generated by the LED chip, a separate heat sink is required, thereby increasing thickness and volume.

1B shows a cross-sectional view of an LED package according to another embodiment of the prior art. Referring to FIG. 1B, a plastic lens 25 is used to increase linearity and light efficiency to light after applying a phosphor and a resin composite in an encapsulation process to protect the bonding of the wire 102. This acts as a cause of the limitation of the miniaturization of the LED package described above, and causes a cost problem in the process.

Therefore, there is a need for a technology capable of manufacturing LED packages that can be miniaturized at a lower cost and simplify the process.

The present invention has been made to solve the above-described problems, the object of the present invention is to reduce the volume of the optical package itself and reduce the thickness and the outer volume of the final product at a lower cost, as well as miniaturization and integration The present invention provides an optical package and a method for manufacturing the same, which plate a metal layer serving as a heat sink and a support plate, and form a metal reflection layer and a plating layer on the surface of the insulating layer to reduce light absorption to the insulating layer and increase light efficiency.

The configuration of the present invention provided to solve the above problems is a metal layer formed circuit pattern; An insulating layer formed on the metal layer and including a hole; A metal reflection layer formed on a surface of the insulating layer; A plating layer formed on the metal reflection layer and the metal layer exposed by the hole; An optical device mounted by die bonding on the plating layer exposed by the hole, and a connection part electrically connecting the optical device to a circuit pattern; A resin part filling the optical element and the connection part; and miniaturizing and integrating the optical package by using a tape type insulating film without using a lead frame to provide an optical package. Through the formed metal reflection layer and the plating layer can increase the light efficiency.

In particular, the metal reflection layer may increase the reflectance of the light, characterized in that the inclined surface is present on the side of the insulating layer so that the light is reflected upward.

In addition, the metal reflection layer may include at least one of silver (Ag), nickel (Ni), copper (Cu), platinum (Pt), palladium (Pd), and gold (Au).

In addition, the plating layer may be formed on the back surface of the metal layer in which the insulating layer is laminated, the plating layer is silver (Ag), nickel (Ni), copper (Cu), platinum (Pt), palladium (Pd) ), Gold (Au) is preferably included.

In addition, the insulating layer may be a polyimide film.

The resin part may include a convex lens-shaped phosphor and a transparent resin, and the material of the transparent resin is silicon (Si).

Method for manufacturing an optical package according to the present invention, (a) forming a hole in the insulating layer; (b) laminating a metal layer under the insulating layer and forming a circuit pattern; (c) forming a metal reflection layer on the surface of the insulating layer; (d) forming a plating layer on the metal reflection layer and the metal layer exposed by the hole; (e) mounting an optical device on the plating layer exposed by the hole and electrically connecting the optical device and a circuit pattern through a connection part; (f) embedding the optical device and the connection part to form a resin part.

In particular, the step (c) includes at least one of silver (Ag), nickel (Ni), copper (Cu), platinum (Pt), palladium (Pd), and gold (Au) on the surface of the insulating layer. It may be characterized in that the step of forming a metal reflection layer.

In addition, the step (d) may further comprise the step of forming a plating layer on the back surface of the metal layer on which the insulating layer is laminated, the plating layer of the step (d) is silver (Ag), nickel ( Ni, copper (Cu), platinum (Pt), palladium (Pd), gold (Au) may be characterized by including at least one.

In addition, the insulating layer of step (a) may be characterized in that the polyimide film (polyimide film).

In addition, the step (e) may be characterized in that the step of mounting the LED chip as an optical device and electrically connecting the LED chip and the circuit pattern using the gold (Au) wire as a connecting portion.

In addition, the step (f) may be characterized in that the step of forming a convex lens-shaped resin portion by over-coating a phosphor and a transparent resin (Resin).

According to the present invention, the volume and thickness of the entire package can be reduced by forming the package according to the conventional lead frame method into a package using a tape substrate. In addition, it is possible to form a package of the surface emitting method in the point emission method it is possible to produce a package of high integration. Furthermore, by simultaneously producing the bag and the lens, the cost can be reduced and the process can be simplified to increase the productivity, and the light efficiency can be increased through the metal reflection layer and the plating layer formed on the surface of the insulating layer.

1A is a cross-sectional view of an LED package according to one embodiment of the prior art.
1B is a cross-sectional view of an LED package according to another embodiment of the prior art.
2A is a cross-sectional view of a LED package according to an embodiment of the conventional method and an optical package according to an embodiment of the present invention.
2B is a top view of the polyimide surface and the circuit pattern portion of the optical package according to the embodiment of the present invention.
2C is a cross-sectional view of an optical package manufacturing process according to one embodiment of the present invention.
3 is a cross-sectional view and a top view showing the integration degree of the optical package according to the present invention and one embodiment of the present invention in more detail.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, embodiments of the present invention may be modified in many different forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. Embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and the like of the elements in the drawings are exaggerated in order to emphasize a clearer description, and elements denoted by the same symbols in the drawings denote the same elements.

2A is a comparative cross-sectional view of an LED package according to an embodiment of the conventional method and an optical package according to an embodiment of the present invention. As shown in FIG. 2A, in the structure of the present invention, a metal layer 120 having a circuit pattern is formed under an insulating layer 110 on which holes 115 and 116 are formed, and a metal is formed on the surface of the insulating layer 110. The reflective layer 130 is formed, and the plating layer 140 is formed on the metal layer 120 exposed by the metal reflection layer 130 and the holes 115 and 116. In this case, the insulating layer 110 is preferably a polyimide film, and the metal layer 120 is preferably a copper (Cu) layer. In addition, according to the present invention, as described above, the metal reflection layer 130 is formed on the surface, that is, the upper surface and the side surface of the insulating layer 110, and the metal reflection layer 130 is formed of silver (Ag), nickel (Ni), copper ( It is preferable to apply | coat and print electrically conductive pastes, such as Cu), palladium (Pd), platinum (Pt), gold (Au), and carbon, among which silver paste is the most preferable. Since a general polyimide is brown or yellow based and absorbs light rather than reflecting light, there is a problem that the luminance is lowered, thereby forming the metal reflection layer 130 and the plating layer 140 not only on the upper surface of the polyimide 110 but also on the side thereof. It is possible to reduce the light absorption to the mead 110 and increase the light efficiency. At this time, the metal reflection layer 130 may be buried in the right angle shape of the partition layer 110, but as shown in the figure is formed so that the partition wall angle, that is, the inclined surface exists on the side of the insulating layer 110. Do. Thus, the light generated from the optical device 150 through the inclined surface of the metal reflective layer 130 is reflected upward by the inclined surface to increase the light efficiency. In addition, the plating layer 140 may be formed on the metal layer 120 exposed by the metal reflection layer 130 and the holes 115 and 116 as described above, and the insulating layer 110 may be formed as shown in the drawing. It is preferable to also plate the back surface of the stacked metal layer 120. The plating layer 140 is silver (Ag), nickel (Ni), copper (Cu), palladium (Pd), platinum (Pt), gold (Au) It is preferable that it is a plating layer. As such, by removing the gold (Au) plating for wire bonding and forming the silver, nickel, copper, palladium, platinum, or gold plating layers 140, luminance is improved and thermal conductivity is increased, thereby dissipating heat due to heat generated from the LED chip. The effect is increased and the reflectance is increased to prevent light absorption and maximize the light efficiency.

In addition, in the present invention, the LED chip is mounted as the optical device 150 on the plating layer 140 to bond the gold wire 160 for electrical connection between the chip 150 and the circuit pattern. It is preferable that the LED chip 150 and the wire 160 are formed in the form of a tape-type LED package that embeds the resin 170. In this case, the resin unit 170 is formed in a convex lens shape and includes a phosphor and a transparent resin (Resin), the transparent resin is preferably silicon (Si). Thus, the present invention can realize a miniaturized and integrated optical package through an insulating film in the form of a film and a lower circuit pattern layer without using a lower heat sink and a metal lead. In addition, the circuit pattern layer 120 is formed under the insulating layer 110 and the circuit pattern layer 120 serves as a heat sink as well as a circuit board. In addition, in the case of wire bonding, the bonding force is excellent due to the difference in RZ according to the roughness of the surface.

2B is a top view of a polyimide surface and a top view of a circuit pattern portion of the optical package according to the embodiment of the present invention. As shown in FIG. 2B, the top view of the conventional LED package (shown on the right side of FIG. 2A) shows much better integration.

2C is a cross-sectional view of an optical package manufacturing process according to an embodiment of the present invention. Referring to FIG. 2C, first, holes 115 and 116 are formed by punching the insulating film 110 (S2). In this case, the insulating film 110 is preferably a polyimide film, and the holes 115 and 116 supply power to the device hole 115 and the optical device 150, which are central holes in which the optical device is to be located. In order to include the via hole 116 to which the wire is to be bonded as the connection portion 160. In addition, the metal layer 120 is laminated, but the metal layer 120 is preferably a copper (Cu) layer (S3). Then, after activating the surface through various chemical treatments, a photoresist is applied, and an exposure and development process are performed. After the development process is completed, the circuit pattern layer 120 is formed by forming a necessary circuit through the etching process and peeling off the photoresist. In addition, the metal reflection layer 130 is formed on the side surface as well as the upper surface of the insulating layer 110 (S4). The metal reflective layer 130 is preferably coated by applying a conductive paste such as silver (Ag), nickel (Ni), copper (Cu), palladium (Pd), platinum (Pt), gold (Au), and carbon. Among them, the silver paste is most preferable, and the insulating layer 110 may be buried in a right-angled shape in the form of a partition wall, but as shown in the drawing, an inclined surface is formed on the side of the insulating layer 110 in the optical device 150. It is desirable to be able to reflect the light of the top. Subsequently, the plating layer 140 is formed on the metal layer 120 exposed by the metal reflection layer 130 and the holes 115 and 116, thereby performing surface treatment to enable bonding (S5). In this case, the plating layer 140 is preferably formed on the circuit surface that is the back surface of the metal layer 120 in which the insulating layer 110 is laminated as shown in the figure. In addition, the plating layer 140 is preferably silver (Ag), nickel (Ni), copper (Cu), palladium (Pd), platinum (Pt), gold (Au) plating layer. In general, the polyimide is electrically stable, but the color is brown or yellow series, and the reflectance is not good, so the light efficiency is low. When the silver paste is applied as in the present invention, the polyimide region 110 disappears and the plating layer as described above. Through 140, the glossiness is higher, and thus the light efficiency can be further increased. Next, the optical device 150 is mounted by performing die bonding on the plating layer 140 where the optical device 150 is to be located among the via holes formed in the insulating layer 110 (S6). ) Is preferably mounted to the chip 150 using an adhesive as an LED chip. Subsequently, a gold (Au) wire 160 is bonded on the plating layer 140 to electrically connect the circuit pattern layer 120 and the LED chip 150 (S7), and the LED chip 150 and the wire 160. ) To form a resin portion 170 (S8). In more detail, the optical package is completed by forming a convex lens-shaped resin part 170 by over-coating a white LED phosphor and a transparent resin in the silver paste 130 and the silver plating 140. In the case of over-coating the phosphor and the transparent resin, the resin portion 170 of the convex lens formation as shown is formed due to the surface tension. As a result, an existing encapsulation and a plastic lens can be simultaneously formed.

3 is a cross-sectional view and a top view illustrating the integration degree of the optical package according to the present invention and one embodiment of the present invention in more detail. Referring to FIG. 3, when the package is formed based on the same area, the present invention on the right side is much larger than the LED chip arrangement on the left side having the structure of the metal lead portion 20 and the lower heat sink 10. LED package is formed.

The best embodiments have been disclosed in the drawings and specification above. Although specific terms have been used herein, they are used only for the purpose of describing the present invention and are not used to limit the scope of the present invention as defined in the meaning or claims. Therefore, those skilled in the art will understand that various modifications and equivalent other embodiments are possible from this. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

10: heat sink 20: metal lead portion
30: stitch bond 40: silicon sub-mount
50: ball bond 60: LED chip
70: solder ball 90: electrically / thermally conductive epoxy
102: gold wire 110: insulating layer
115: device hole 116: via hole
120: metal layer 130: metal reflection layer
140: plating layer 150: optical element
160: gold wire 170: resin part

Claims (15)

A metal layer on which a circuit pattern is formed;
An insulating layer formed on the metal layer and including a hole;
A metal reflection layer formed on a surface of the insulating layer;
A plating layer formed on the metal reflection layer and the metal layer exposed by the hole;
An optical device mounted by die bonding on the plating layer exposed by the hole, and a connection part electrically connecting the optical device to a circuit pattern;
A resin part filling the optical element and the connection part;
Optical package comprising a.
The method according to claim 1,
The metal reflective layer,
And an inclined surface on the side of the insulating layer so that light is reflected upward.
The method according to claim 1 or 2,
The metal reflective layer,
An optical package comprising at least one of silver (Ag), nickel (Ni), copper (Cu), platinum (Pt), palladium (Pd), and gold (Au).
The method according to claim 1,
The plating layer,
And the insulating layer is formed on the rear surface of the stacked metal layer.
The method according to claim 1 or 4,
The plating layer,
An optical package comprising at least one of silver (Ag), nickel (Ni), copper (Cu), platinum (Pt), palladium (Pd), and gold (Au).
The method according to claim 1,
The insulating layer,
Optical package, characterized in that the polyimide film (polyimide film).
The method according to claim 1,
The resin portion,
An optical package comprising a convex lens-shaped phosphor and a transparent resin.
The method according to claim 7,
The transparent resin is a material of the optical package, characterized in that the silicon (Si).
(a) forming a hole in the insulating layer;
(b) laminating a metal layer under the insulating layer and forming a circuit pattern;
(c) forming a metal reflection layer on the surface of the insulating layer;
(d) forming a plating layer on the metal reflection layer and the metal layer exposed by the hole;
(e) mounting an optical device on the plating layer exposed by the hole and electrically connecting the optical device and a circuit pattern through a connection part;
(f) filling the optical device and the connection part to form a resin part;
Optical package manufacturing method comprising a.
The method according to claim 9,
In step (c),
Forming a metal reflection layer including at least one of silver (Ag), nickel (Ni), copper (Cu), platinum (Pt), palladium (Pd), and gold (Au) on the surface of the insulating layer. Optical package manufacturing method to use.
The method according to claim 9,
In step (d),
And forming a plating layer on a back surface of the metal layer on which the insulating layer is stacked.
The method according to claim 9 or 11,
The plating layer of the step (d),
An optical package comprising at least one of silver (Ag), nickel (Ni), copper (Cu), platinum (Pt), palladium (Pd), and gold (Au).
The method according to claim 9,
The insulating layer of step (a),
Method for producing an optical package, characterized in that the polyimide film (polyimide film).
The method according to claim 9,
In step (e),
Mounting an LED chip as an optical element and electrically connecting the LED chip and a circuit pattern using a gold (Au) wire as a connection part.
The method according to claim 9,
The step (f)
An optical package manufacturing method, characterized in that the step of forming a convex lens-shaped resin portion by over-coating a phosphor and a transparent resin (Resin).

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