KR20110097153A - Screen printer - Google Patents

Abstract

The present invention provides a screen printer. The screen printer is provided with a main body having a work area in which a screen printing process is performed on a substrate, an inner area consisting of a bypass area partitioned from the work area, and provided in the main body and disposed on both sides of the inner area, A transfer part for transferring the substrate and an electrical connection with the transfer part to form a work path through an area and a bypass path through the bypass area, and process conditions for the substrate in the screen printing process are preset, And a process control module configured to control the transfer part to form the work path when the substrate corresponds to a preset process condition and to form the bypass path when the substrate is out of the preset process condition. Therefore, when the substrates are sequentially introduced under the process conditions including the different size and different coating pattern formation, the present invention provides a substrate that meets the predetermined process conditions in the screen printing process among the incoming substrates. The process of selecting and forming a work path to the work area is performed, and substrates which deviate from the process conditions may be taken out to the outside by a bypass path to selectively perform screen printing on heterogeneous substrates.

Description

Screen Printer {SCREEN PRINTER}

The present invention relates to a screen printer, and more particularly, screen printing is performed by selecting substrates corresponding to process conditions with respect to heterogeneous substrates, and substrates other than process conditions are sequentially ordered to the outside through a bypass path. It relates to a screen printer that can be drawn out.

In general, a process of producing an electronic product by mounting an electronic component on a printed circuit board (hereinafter, referred to as a substrate) goes through a number of package processes.

Typically, the size of the substrate is variously formed depending on the electronic product to be manufactured, and a plurality of electronic components are mounted on the substrate of the various sizes.

A general electronics manufacturing process uses a screen printer to apply or print a solder cream having a predetermined pattern at a predetermined position on one surface of a substrate, and use a component mounter such as a chip mounter on the pattern of the printed substrate. A plurality of electronic components are mounted and a reflow process is performed on a board on which the electronic components are mounted to bond the substrate and the components together to complete the electronic component manufacturing process.

Here, referring to the screen printer as an example, a conventional screen printer is configured to perform a screen printing process of applying solder cream to a single substrate. In other words, one screen printer has a work area capable of proceeding a screen printing process for one type of substrate.

Therefore, the conventional screen printer has a substrate transfer device that forms a single lane structure. Accordingly, the screen printer may proceed with the screen printing process for one type of substrate.

That is, in the conventional screen printer having a single lane structure substrate transfer device, since a work or a process can be performed on one type of substrate, it is difficult to produce mixed flow by inputting different types of substrates in a process of producing small quantities of various kinds. There is a problem.

Conventional screen printers require homogeneous substrate transfer devices to produce mixed flow for heterogeneous substrates as described above. For example, in the conventional screen printer, a heterogeneous substrate other than the substrate is processed in another screen printer, and the substrate is directly injected into the chip mounter, thereby increasing the processing time due to the mixed production. In other words, the installation space of the apparatus is increased.

Accordingly, the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a substrate to which the process is sequentially performed under set process conditions including different sizes and different coating patterns. Among the screen printing process, the substrate that meets the predetermined process conditions is selected to form a work path to the work area, and the process proceeds, and the substrates that deviate from the process conditions are taken out to the outside by a bypass path to different substrates. An object of the present invention is to provide a screen printer capable of selectively performing a screen printing process.

In a preferred aspect, the present invention provides a screen printer.

The screen printer includes: a main body having an internal area including a work area where a screen printing process is performed on a substrate and a bypass area partitioned from the work area; A transfer unit provided at the main body and disposed at both sides of the inner region to transfer the substrate to form a work path through the work area and a bypass path through the bypass area; And a substrate electrically connected to the transfer unit, wherein a process condition for a substrate in the screen printing process is preset, and when the substrate corresponds to a preset process condition, the work path is achieved, and the substrate is configured to process the preset process condition. And a process control module for controlling the transfer unit to achieve the bypass path.

Here, it is preferable that the said process conditions contain the size of the said board | substrate and the pattern shape of the solder cream apply | coated to the said board | substrate.

Here, the transfer unit includes an inlet side transfer unit disposed on one side of the inner region and a drawer side transfer unit disposed on the other side of the inner region.

The inlet-side transfer unit and the outlet-side transfer unit each receive an electrical signal from the process control module to connect the outside of the main body to the work area or the bypass area to selectively select the work path or the bypass path. It is preferable to be connected to each of the forming mobile devices.

In addition, each of the inlet-side transfer unit and the outlet-side transfer unit is provided with a width adjusting unit for receiving an electrical signal from the process control module to support both sides of the substrate corresponding to the size of the substrate.

Here, the width adjusting unit is installed in each of the inlet-side transfer unit and the outlet-side transfer unit consisting of a pair of moving belts to receive an electrical signal from the process control module to vary the width of the pair of moving belts It is preferable that it is a drive part to adjust.

In addition, a stencil mask is positioned in the working area, and a lower position of the stencil mask is a standby position where the substrate transferred to the working area is waiting and a printing position in which the substrate is in close contact with the bottom surface of the stencil mask. An elevating unit for elevating the substrate may be disposed between the elevating substrates.

Here, it is preferable that the transfer path of the substrate in the transfer part is substantially the same level as the bypass path and the standby position, and the printing position is at a different level from the transfer path of the substrate.

In addition, the process control module may include a selection unit for selecting any one of various substrates, an electrical connection with the selection unit, and receiving the selection signal from the selection unit, when the selected substrate corresponds to the predetermined process condition. Forming the working path to transfer the incoming substrate along the working path and simultaneously adjusting the width of the pair of moving belts to correspond to the width of the selected substrate using the width adjusting part;

If the incoming substrate does not correspond to the predetermined process condition, the bypass path is formed to transfer a substrate not corresponding to the process condition along the bypass path, and at the same time, the pair of moving belts using the width adjusting part. It is preferable to include a control unit for adjusting the width of the to correspond to the width of the substrate that does not correspond to the process conditions.

According to the present invention, when substrates are processed sequentially under process conditions including different sizes and different coating patterns, the substrates may be selected to meet predetermined process conditions in the screen printing process. Processes are formed by forming a working path to the work area, and substrates which deviate from the process conditions are drawn out to the outside by a bypass path to selectively perform screen printing on heterogeneous substrates.

In addition, the present invention controls the movement of heterogeneous substrates in one screen printer, by selecting only the substrate in which the process proceeds to proceed with the process, there is an effect that can be mixed in one screen printer.

In addition, in the case of disposing a plurality of screen printers in an in-line type, the process is performed on the substrates corresponding to each screen printer, thereby enabling the production of small quantities of various types, and the process time in the process of dissimilar substrates. It has an effect to reduce.

In addition, the present invention has an effect that can easily reduce the size of the equipment during the heterogeneous substrate manufacturing process by allowing the process to proceed to one type of substrate and by bypassing the heterogeneous substrate.

1 to 3 are views showing that the first substrate is moved along the work path in the screen printer of the present invention.
4 is a view showing an example of the width adjusting unit according to the present invention.
5 and 6 are views showing that the second substrate is moved along the bypass path in the screen printer of the present invention.
7 and 8 are views illustrating an example of a screen printing process in the work area according to the present invention.
9 is a view showing the flow of the process for the first substrate in the first and second screen printer according to the present invention.
10 is a view showing a flow of a process for a second substrate in the first and second screen printers according to the present invention.
11 is a block diagram showing an electrical connection relationship between a process control module according to the present invention, and a width adjusting part and a lifting part.

Hereinafter, a screen printer of the present invention will be described with reference to the accompanying drawings.

Referring to Figure 1, the screen printer of the present invention has a main body (100). An inner region C is formed inside the main body 100. The inner region C is composed of a work area A in which a screen printing process is performed on a substrate 11 having a predetermined size, and a bypass area B partitioned from the work area A. FIG. Here, the substrate 11 will be described using an example of the first substrate 11 having the size of the first width W1.

And, the transfer unit 110 is formed on both sides of the inner region (C). The transfer unit 110 includes an inlet-side transfer unit 111 disposed on one side of the inner region C and a drawer-side transfer unit 112 disposed on the other side of the inner region C. Here, the inlet side transfer unit 111 and the outlet side transfer unit 112 may be a conveyor. In addition, an inlet side shuttle 131 may be connected to the inlet side transfer unit 111 and the substrate 11 is transferred to a front end of the body 100, and the outlet side is located at a rear end of the body 100. A withdrawal side shuttle 132, which may be connected to the transfer unit 112 and with which the substrate 11 is withdrawn, may be disposed.

Each of the inlet-side transfer unit 111 and the outlet-side transfer unit 112 is connected to a transfer device 141, 142 (see FIG. 11), and the arrow direction shown in FIG. 2 is operated by the operation of the transfer device 141, 142. It can be moved along. Therefore, according to the movement positions of the inlet-side transfer unit 111 and the takeout-side transfer unit 112, the substrate 11 forms a work path a passing through the work area A or bypasses the work path A. A bypass path b through the region B can be achieved. Here, the substrate 11 passing through the work area A is a substrate having a size in which a screen printing process is performed in the work area A, and a substrate drawn out to the outside through the bypass path b (eg, The substrate having the second width) is a substrate that is out of the size in which the process is performed.

In addition, the retracting side transfer unit 111 and the withdrawal side transfer unit 112 have a width adjusting part 300 capable of supporting the substrate 11 corresponding to the size of various substrates.

Here, referring to FIG. 4, each of the inlet-side transfer unit 111 and the outlet-side transfer unit 112 is a pair of moving belts 111a and 112a which are moved to allow the substrate 11 to be seated and transferred. And a pair of moving belts 111a and 112a are installed to guide the moving belts 111a and 112a.

The width adjusting part 300 variably adjusts the width of any one or both of the pair of guides 111b and 112b, so that the pair of movements can correspond to the width of the substrate 11 having various sizes. The widths of the belts 111a and 112a can be variably adjusted. Here, the width adjusting unit 300 is connected to one or both of the pair of guides (111b, 112b) and is driven by receiving an electrical signal from the following control unit 220 is the movement belts (111a, 112a) It may be a drive unit, such as a flexible cylinder to adjust the width of the variable.

Here, the transfer unit 110 is electrically connected to the process control module 200. In the process control module 200, process conditions (eg, a size of a substrate and a pattern applied on the substrate) to which the screen printing process is performed are preset.

When the process condition of the substrate 11 corresponds to a predetermined process condition, the process control module 200 forms the work path a, and the process condition of the substrate 11 sizes the preset process condition. When out of the control unit may be controlled to achieve the bypass path (b).

Here, the process conditions in the present invention may be the size of the substrate 11 and the pattern shape applied on the substrate 11. That is, the process conditions may be various conditions including the size of the predetermined substrate and the application pattern shape required when the screen printing process is performed on any one substrate.

The configuration of the process control module 200 will be described in detail.

Referring to FIG. 11, the process control module 200 electrically connects the selection unit 210 to select one of the substrates to generate a selection signal, the selection unit 210, and the transfer unit 110. And when the process condition for the selected substrate is received by receiving the selection signal, the process path (a) is formed to transfer the selected substrate along the work path (a). The width adjusting unit 300 is used to adjust the width of the pair of moving belts 111a and 112b to correspond to the width of the selected substrate, and the process condition for the selected substrate does not correspond to the preset process condition. Otherwise, the bypass path b may be formed to transfer a substrate that does not correspond to the predetermined process condition along the bypass path b, and the pair of movements may be performed using the width adjusting part 300. The controller 220 is configured to adjust the widths of the belts 111a and 112a to correspond to the widths of the substrates not corresponding to the predetermined process conditions.

In addition, referring to FIGS. 7 and 8, a stencil mask 500 is positioned in the work area A, and a substrate 11 transferred to the work area A below the stencil mask 500. ) Raises and lowers the substrate 11 between a standby position P1 at which is waited and a printing position P2 in which the substrate 11 is in close contact with the bottom surface of the stencil mask 500 from the standby position P1. Lift 400 may be disposed. The lifting unit 400 lifts the backup pins 410, the upper end of the backup pins 410 supports the lower end of the backup table 420, and the substrate 11 is on the backup table 420. Can be supported and lifted.

In addition, the transfer path of the substrate 11 in the transfer unit 110 in the present invention is substantially the same level as the bypass path (b) and the standby position (P1), the printing position (P2) is It is preferable to achieve a different level from the transfer path of the substrate 11.

Here, the work area (A) mentioned above is provided with a work conveyor (AT) for transporting the substrate is seated, the transfer area (BT) is also provided in the bypass area (B) is also seated and transported.

In the above, the apparatus according to the present invention has been described as a representative example of the screen printer, but the above configuration can be applied substantially to the apparatus in which the substrate is transferred and a series of unit processes are performed. For example, it can be easily adopted in a device such as a chip mounter.

Next, the operation of the screen printer of the present invention configured as described above will be described. Here, in describing the operation of the present invention, the process conditions according to the present invention will be described as a representative example of the size of the substrate.

1 and 11, heterogeneous substrates having various sizes may be introduced into the inlet-side transfer unit 111.

Here, the incoming substrate is referred to as a first substrate 11 having a substrate size of the first width W1. In addition, it is assumed that the process conditions preset by the controller 220 are substrate sizes, and the substrate size in this case is set to the first width W1.

In this case, the controller 220 determines whether the size, which is the process condition for the first substrate 11 to be inserted, is the size of the substrate having the first width W1, which is the preset process condition.

If the size of the incoming substrate is the size of the first width W1, since the process condition for the substrate corresponds to a predetermined air condition, the controller 220 may control the first substrate 11. Allows transfer to work area (A).

That is, the controller 220 operates the width adjusting unit 300 installed in the inlet-side transfer unit 111 to variably set the substrate seating width of the inlet-side transfer unit 111 to achieve the first width W1. Can be. That is, the width adjusting unit 300 may receive the electrical signal from the control unit 220 to achieve the first width W1 of the width of the pair of moving belts 111a of the inlet-side transfer unit 111. have.

Subsequently, the control unit 220 transmits an electrical signal to a transfer device 141 connected to an inlet-side transfer device 111, and the transfer device 141 sets the position of the inlet-side transfer unit 111 to a work area. It is moved along the direction of the arrow so as to be connected to the front end of (A).

In addition, the control unit 220 uses the width adjusting unit 300 installed in the withdrawal side transfer unit 112 to set the width of the substrate seating in the withdrawal side transfer unit 112 to the first width W1. Can be adjusted to achieve Here, the manner of width adjustment may be substantially the same as the manner mentioned above. In addition, the controller 220 may move the draw-out transfer unit 112 adjusted to the first width W1 along the direction of the arrow so as to be connected to the rear end of the work area A. FIG.

Accordingly, the control unit 220 may form a work path (a) connecting the inlet-side transfer unit 111 and the work area (A) and the outlet-side transfer unit (112). At this time, the inlet-side transfer unit 111 and the work area A and the outlet-side transfer unit 112 form the same level with each other.

Meanwhile, the control unit 220 is set in advance as the work area A is an area for performing a screen printing process on the substrates 11 forming the first width W1.

Therefore, the substrates 11 having the first width W1 are sequentially introduced through the inlet-side transfer unit 111, and the substrate 11 of the work region A is sheared through the front end of the work region A. FIG. It may be located sequentially inside.

When the substrate 11 having the first width W1 is positioned in the work area A as described above, the controller 220 drives the elevator 400 and a backup installed in the elevator 400. The pins 410 may upwardly push up the lower end of the backup table 420 positioned above the pins 410. Accordingly, the rising backup table 420 raises the first substrate 11 from the standby position to the printing position where the screen printing process is performed while supporting the bottom surface of the first substrate 11. Accordingly, the first substrate 11 may be in close contact with the bottom surface of the stencil mask 500 positioned on the first substrate 11. Here, the configuration of elevating the first substrate 11 may be a device such as a cylinder and a lift that can implement the lift in addition to the above configuration.

Subsequently, the solder cream supplied to the stencil mask 500 passes through a plurality of openings 510 formed in the stencil mask 500 by reciprocating movement of a squeegee (not shown) on the top surface of the stencil mask 500. Extruded may be printed on the upper surface of the first substrate (11).

When the screen printing process as described above is performed, the control unit 220 places the first substrate 11 located at the printing position P2 again to the standby position P1 using the lifting unit 400.

Therefore, the screen printing process may be performed on the first substrate 11. Subsequently, the controller 220 may draw the first substrate 11 on which the process is performed to the outside using the withdrawal-side transfer unit 112 connected to the rear end of the work area A. FIG.

 Here, the external device (not shown) connected to the lead path may be a chip mounter capable of mounting electronic components on the first substrate 11.

Accordingly, in the present invention, the first substrate 11 in which the process is performed may be moved along the work path a to proceed with the screen printing process and be discharged to the outside.

In addition, referring to FIGS. 5 and 6, when the process condition for the substrate does not correspond to a preset process condition, the controller 220 bypasses the substrate that does not correspond to the process condition. Can be discharged to outside.

That is, the substrate that does not correspond to the process condition may be a size of a substrate having a width different from the first width, which is a predetermined process condition.

In this case, when the substrates 12 having a width different in size from the first substrate 11 are introduced into the inlet-side transfer unit 111, the substrates 12 are moved in the working path ( It is possible to draw out to the outside through the bypass path (b) without drawing into a). That is, the controller 220 may discharge the substrate having the second width W2 (hereinafter referred to as the second substrate 12) to the outside through the bypass path b without passing through the work path a. The driving of the inlet-side transfer unit 111 and the outlet-side transfer unit 112 can be controlled so as to.

Here, since the width adjusting method using the width adjusting part 300 of the inlet-side transfer unit 111 and the draw-out side transfer unit 112 is the same as mentioned above, description thereof will be omitted.

Subsequently, the controller 220 may adjust the width of the inlet-side transfer unit 111 and the outlet-side transfer unit 112 to a second width W2.

Accordingly, the second substrate 12 may be transferred by the inlet-side transfer unit 111 adjusted to the second width (W2).

In addition, the control unit 220 moves along the direction of the arrow to connect the inlet-side transfer unit 111 with the front end of the bypass path b by using the transfer device 141 connected with the inlet-side transfer unit 111. And, the withdrawal side transfer unit 112 is moved to be connected to the rear end of the bypass path (b) by using the transfer device 142 connected with the withdrawal side transfer unit 112.

Accordingly, the controller 220 may form a bypass path b connecting the inlet side transfer unit 111, the bypass area B, and the outlet side transfer unit 112.

Accordingly, the second substrates 12 may be sequentially introduced through the inlet-side transfer unit 111 and discharged to the outside along the bypass path b. Here, the second substrate may be transferred to another working area of another screen printer, and the other working area may be an area for performing a screen printer process on the second substrate 12.

That is, the present invention is characterized in that the process can be discharged to the outside without performing the process when the process conditions for the substrate drawn into the inlet-side transfer unit 111 is different from the process conditions preset in the control unit 220.

Meanwhile, although the above-described process conditions have been described as representative examples of the size of the substrate, the process conditions according to the present invention may be a pattern shape applied on the substrate in the screen printing process.

In this case, when the pattern shape to be applied to the incoming substrate corresponds to the predetermined pattern shape, the present invention proceeds through the process through the work path (a) to discharge to the outside, the pattern to be applied to the substrate When the shape does not correspond to the predetermined pattern shape, it may be discharged to the outside without proceeding through the bypass path (b). Since the operation of the control unit 220 and the transfer unit is the same as described above, a description thereof will be omitted below.

Next, an example in which two screen printers of the present invention are connected inline will be described. Here, a representative example of the process conditions according to the present invention is a substrate size having a first width W1.

9 and 10, the first screen printer 10 and the second screen printer 20 may be arranged in-line. Here, the first and second screen printers 10 and 20 may be substantially the same as the configuration described above.

In addition, the first screen printer 10 includes a first work area A1 for performing a screen printing process on the first substrate 11 and a first bypass area partitioned from the first work area A1. B1) is formed, the second screen printer 20 is divided into a second working area (A2) and the second working area (A2) to perform a screen printing process for the second substrate 12 Two bypass areas B2 are formed.

Each of the first and second screen printers 10 and 20 is provided with first and second feed side transfer units 111 and 121 and first and second draw side transfer units 112 and 122. Here, the configuration and action of the 1,2 inlet side and 1,2 outlet side transfer units may be the same as mentioned above.

In addition, although not shown in the drawings, in the case where a plurality of devices such as a screen printer are connected inline as described above, a shuttle may be further installed to connect the entry and withdrawal paths of each of the devices. A first inlet side shuttle (not shown) is installed at a front end of the first screen printer 10, and a first outlet side shuttle (not shown) is installed at a rear end thereof, and a first inlet front side of the second screen printer 20 is provided. A two-inlet shuttle (not shown) is installed and a second outlet-side shuttle (not shown) is installed at the rear end.

First, the control unit 220 uses the transfer apparatuses 141 and 142 installed in the first inlet side and the first outlet side transfer units 111 and 112, so that the first substrates 11 are moved into the first working area A1. The first inlet side and the first outlet side transfer units 111 and 112 are moved to form a first work path a1 through which the process can be sequentially carried out and discharged.

In addition, the control unit 220 uses the transfer devices 141 'and 142' installed in the second inlet side and the second outlet side transfer units 121 and 122, and then the second bypass area B2 is followed by a second bypass. The second inlet side and the second outlet side transfer units 121, 122 are moved to form the path b2.

Therefore, the first substrates 11 are moved along the first work path a1 of the first screen printer 10 so as to pass through the first work area A1 where the corresponding process proceeds, and the first screen printer The first substrates 11 drawn out from the 10 may be drawn out through the second bypass path b2 formed in the second screen printer 20. Therefore, when the plurality of screen printers 10 and 20 are connected inline, the first substrates 11 pass through the first work path a1 and the process proceeds, and the second bypass path b2 is performed. It may be withdrawn to the outside through the) and may be introduced into the device after the process, such as a chip mounter.

On the other hand, referring to FIG. 10, when the second substrates 12 are selected by the selector 210, the controller 220 is installed on the first inlet side and the first outlet side transfer units 111 and 112. The first inlet side and the first to form a first bypass path b1 through which the second substrates 12 can be sequentially discharged into the first bypass area B1 using the transfer devices 141 and 142. The withdrawal side transfer units 111 and 112 are moved.

In addition, the control unit 220 is drawn out through the first bypass path b1 using the transfer devices 141 ′ and 142 ′ installed in the second inlet side and the second outlet side transfer units 121 and 122. The second inlet side and the second outboard side transfer units 121 and 122 are moved to form the second work path a2 following the second work area A2 to the second substrates 12.

Accordingly, the second substrates 12 are drawn out through the first bypass path b1 from the first screen printer 10 in which the corresponding process is not performed, and the second substrates 12 are drawn out. The second screen printer 20 may be drawn out of the movement along the second work path a2 of the second screen printer 20 so as to pass through the second work area A2. Accordingly, when the plurality of screen printers 10 and 20 are connected inline, the second substrates 12 may be connected to the first bypass path b1 in the first screen printer 10 in which the process is not performed. In the second screen printer 20 which is drawn out through the process, the process proceeds while passing through the second work path a2, and then is drawn out to be input to an apparatus in which a later process such as a chip mounter proceeds. Can be.

As described above, the present invention may proceed with the process through the work path when the process conditions corresponding to each of the substrates of various sizes, otherwise it can be withdrawn to the outside through the bypass path. Accordingly, the present invention can simplify the process line for heterogeneous substrates.

10: first screen printer
11: first substrate
12: second substrate
20: second screen printer
100: main body
110: transfer unit
111,121: Infeed side transfer unit
112,122: draw-out transfer unit
141,141 ', 142,142': transfer unit
200: process control module
220: control unit
300: width adjustment unit
400: lifting unit
A: work area
B: bypass area
a: work path
b: bypass path

Claims (7)

A main body having an internal area including a work area where a screen printing process is performed on a substrate and a bypass area partitioned from the work area;
A transfer unit provided at the main body and disposed at both sides of the inner region to transfer the substrate to form a work path through the work area and a bypass path through the bypass area; And
The substrate is electrically connected to the transfer unit, and process conditions for a substrate in the screen printing process are preset, and when the substrate corresponds to a preset process condition, the work path is formed, and the substrate is out of the preset process condition. And a process control module for controlling the transfer unit to form the bypass path. The method of claim 1,
And said process condition includes the size of said substrate and the pattern shape of solder cream applied to said substrate. The method of claim 1,
The transfer unit includes an inlet side transfer unit disposed on one side of the inner region and a drawer side transfer unit disposed on the other side of the inner region,
Each of the inlet-side transfer unit and the outlet-side transfer unit receives an electrical signal from the process control module to connect the outside of the main body with the work area or the bypass area to selectively form the work path or the bypass path. A screen printer, each connected with mobile devices. The method of claim 3, wherein
Each of the inlet-side transfer unit and the outlet-side transfer unit is provided with a width adjusting unit for receiving an electrical signal from the process control module to support both sides of the substrate corresponding to the size of the substrate,
The width adjusting unit is installed in each of the inlet-side transfer unit and the outlet-side transfer unit, which is composed of a pair of moving belts, and receives an electrical signal from the process control module to variably adjust the width of the pair of moving belts. A screen printer, characterized in that the drive unit. The method of claim 1,
A stencil mask is positioned in the working area, and a lower portion of the stencil mask is located between a standby position where the substrate transferred to the working area is waited and a printing position where the substrate is in close contact with the bottom surface of the stencil mask. And a lifting unit for lifting and lowering the substrate. 6. The method of claim 5,
The transfer path of the substrate in the transfer part is substantially the same level as the bypass path and the standby position,
And the printing position is at a different level from the transfer path of the substrate. The method of claim 4, wherein
The process control module,
A selection unit for selecting any one of the substrates, and electrically connected to the selection unit, and receiving the selection signal from the selection unit when the selected substrate corresponds to the predetermined process condition, forming the work path and drawing Transfer the substrate along the working path and simultaneously adjust the width of the pair of moving belts to correspond to the width of the selected substrate using the width adjusting part;
If the incoming substrate does not correspond to the predetermined process condition, the bypass path is formed to transfer a substrate not corresponding to the process condition along the bypass path, and at the same time, the pair of moving belts using the width adjusting part. And a controller for adjusting the width of the substrate to correspond to the width of the substrate not corresponding to the process conditions.

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