KR20110084307A - 광전 반도체 소자 - Google Patents

광전 반도체 소자 Download PDF

Info

Publication number
KR20110084307A
KR20110084307A KR1020117013299A KR20117013299A KR20110084307A KR 20110084307 A KR20110084307 A KR 20110084307A KR 1020117013299 A KR1020117013299 A KR 1020117013299A KR 20117013299 A KR20117013299 A KR 20117013299A KR 20110084307 A KR20110084307 A KR 20110084307A
Authority
KR
South Korea
Prior art keywords
semiconductor chip
conversion member
conversion
radiation
connection carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020117013299A
Other languages
English (en)
Korean (ko)
Inventor
랄프 빌쓰
Original Assignee
오스람 옵토 세미컨덕터스 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오스람 옵토 세미컨덕터스 게엠베하 filed Critical 오스람 옵토 세미컨덕터스 게엠베하
Publication of KR20110084307A publication Critical patent/KR20110084307A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means

Landscapes

  • Led Device Packages (AREA)
KR1020117013299A 2008-11-13 2009-11-02 광전 반도체 소자 Withdrawn KR20110084307A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008057140.7 2008-11-13
DE102008057140A DE102008057140A1 (de) 2008-11-13 2008-11-13 Optoelektronisches Bauelement

Publications (1)

Publication Number Publication Date
KR20110084307A true KR20110084307A (ko) 2011-07-21

Family

ID=42103012

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117013299A Withdrawn KR20110084307A (ko) 2008-11-13 2009-11-02 광전 반도체 소자

Country Status (7)

Country Link
US (1) US8558259B2 (https=)
EP (1) EP2316130A2 (https=)
JP (1) JP5544369B2 (https=)
KR (1) KR20110084307A (https=)
CN (1) CN102217065B (https=)
DE (1) DE102008057140A1 (https=)
WO (1) WO2010054622A2 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8319247B2 (en) 2010-03-25 2012-11-27 Koninklijke Philips Electronics N.V. Carrier for a light emitting device
US8486761B2 (en) * 2010-03-25 2013-07-16 Koninklijke Philips Electronics N.V. Hybrid combination of substrate and carrier mounted light emitting devices
DE102010038396B4 (de) 2010-07-26 2021-08-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Leuchtvorrichung damit
JP5612991B2 (ja) 2010-09-30 2014-10-22 シャープ株式会社 発光装置及びこれを備えた照明装置
CN103299422B (zh) * 2010-12-29 2016-11-02 3M创新有限公司 具有宽带输出和可控颜色的远程荧光粉led装置
WO2012100132A1 (en) * 2011-01-21 2012-07-26 Osram Sylvania Inc. Luminescent converter and led light source containing same
DE102011003989A1 (de) * 2011-02-11 2012-08-16 Osram Ag Leuchtvorrichtung
DE102011100710A1 (de) * 2011-05-06 2012-11-08 Osram Opto Semiconductors Gmbh Konversionselement für Leuchtdioden und Herstellungsverfahren
DE102012102859A1 (de) 2012-04-02 2013-11-14 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement umfassend eine Konverterträgerschicht, und Verfahren zur Herstellung eines optoelektronischen Bauelements umfassend eine Konverterträgerschicht
DE102012205469A1 (de) * 2012-04-03 2013-10-10 Osram Gmbh Leuchtvorrichtung und verfahren zum betreiben einer leuchtvorrichtung
DE102013211525A1 (de) 2013-06-19 2014-12-24 Osram Gmbh LED-Modul mit LED-Chips
JP2015115506A (ja) * 2013-12-12 2015-06-22 パナソニックＩｐマネジメント株式会社 照明光源
JP2014187392A (ja) * 2014-06-23 2014-10-02 Sharp Corp 発光装置及びこれを備えた照明装置
JP2016009761A (ja) * 2014-06-24 2016-01-18 株式会社小糸製作所 発光モジュール
JP2016051845A (ja) * 2014-09-01 2016-04-11 株式会社ジャパンディスプレイ 表示装置
WO2017104874A1 (ko) * 2015-12-18 2017-06-22 주식회사 트레이스 3차원 돔형 터치 패턴을 이용한 터치 스크린
JP6986698B2 (ja) * 2017-06-28 2021-12-22 パナソニックＩｐマネジメント株式会社 発光装置及びそれを備える光学分析システム
DE102018124751B4 (de) * 2018-10-08 2023-11-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5836676A (en) * 1996-05-07 1998-11-17 Koha Co., Ltd. Light emitting display apparatus
US6513949B1 (en) 1999-12-02 2003-02-04 Koninklijke Philips Electronics N.V. LED/phosphor-LED hybrid lighting systems
US6577073B2 (en) * 2000-05-31 2003-06-10 Matsushita Electric Industrial Co., Ltd. Led lamp
US6737801B2 (en) * 2000-06-28 2004-05-18 The Fox Group, Inc. Integrated color LED chip
US6635987B1 (en) * 2000-09-26 2003-10-21 General Electric Company High power white LED lamp structure using unique phosphor application for LED lighting products
US6639360B2 (en) * 2001-01-31 2003-10-28 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
KR100991830B1 (ko) * 2001-12-29 2010-11-04 항조우 후양 신잉 띠앤즈 리미티드 Ｌｅｄ 및 ｌｅｄ램프
US7800121B2 (en) * 2002-08-30 2010-09-21 Lumination Llc Light emitting diode component
US7554258B2 (en) 2002-10-22 2009-06-30 Osram Opto Semiconductors Gmbh Light source having an LED and a luminescence conversion body and method for producing the luminescence conversion body
US9142734B2 (en) 2003-02-26 2015-09-22 Cree, Inc. Composite white light source and method for fabricating
US7102152B2 (en) * 2004-10-14 2006-09-05 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Device and method for emitting output light using quantum dots and non-quantum fluorescent material
US7586127B2 (en) * 2004-03-29 2009-09-08 Stanley Electric Co., Ltd. Light emitting diode
JP3983793B2 (ja) * 2004-04-19 2007-09-26 松下電器産業株式会社 Ｌｅｄ照明光源の製造方法およびｌｅｄ照明光源
DE102004047640A1 (de) * 2004-09-30 2006-04-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Gehäuse für ein optoelektronisches Bauelement
US7858408B2 (en) 2004-11-15 2010-12-28 Koninklijke Philips Electronics N.V. LED with phosphor tile and overmolded phosphor in lens
US7344902B2 (en) * 2004-11-15 2008-03-18 Philips Lumileds Lighting Company, Llc Overmolded lens over LED die
DE102005022832A1 (de) * 2005-05-11 2006-11-16 Arnold & Richter Cine Technik Gmbh & Co. Betriebs Kg Scheinwerfer für Film- und Videoaufnahmen
DE102005033005A1 (de) * 2005-07-14 2007-01-18 Osram Opto Semiconductors Gmbh Optoelektronischer Chip
JP3979424B2 (ja) * 2005-09-09 2007-09-19 松下電工株式会社 発光装置
CN1949507A (zh) 2005-10-12 2007-04-18 林志泽 可调整色温的发光二极管装置
TW200721526A (en) * 2005-11-16 2007-06-01 Iled Photoelectronics Inc LED structure with three wavelength
US8465175B2 (en) * 2005-11-29 2013-06-18 GE Lighting Solutions, LLC LED lighting assemblies with thermal overmolding
EP1965128B1 (en) * 2005-12-22 2016-08-17 Panasonic Intellectual Property Management Co., Ltd. Lighting apparatus with leds
FR2896944B1 (fr) 2006-01-31 2008-05-02 Commissariat Energie Atomique Dispositif d'emission de lumiere avec controle chromatique
US8998433B2 (en) * 2006-03-08 2015-04-07 Intematix Corporation Light emitting device utilizing remote wavelength conversion with improved color characteristics
US20070241661A1 (en) 2006-04-12 2007-10-18 Yin Chua B High light output lamps having a phosphor embedded glass/ceramic layer
DE102006027307B4 (de) 2006-06-06 2014-08-07 Schott Ag Verfahren zur Herstellung einer Sinterglaskeramik und deren Verwendung
JP5587601B2 (ja) 2006-06-21 2014-09-10 コーニンクレッカ フィリップス エヌ ヴェ 少なくとも一つのセラミック球状色変換材料を有する光放出デバイス
US7842960B2 (en) * 2006-09-06 2010-11-30 Lumination Llc Light emitting packages and methods of making same
EP2087530A1 (en) 2006-11-10 2009-08-12 Philips Intellectual Property & Standards GmbH Illumination system comprising monolithic ceramic luminescence converter
US7889421B2 (en) * 2006-11-17 2011-02-15 Rensselaer Polytechnic Institute High-power white LEDs and manufacturing method thereof
JP2008135459A (ja) * 2006-11-27 2008-06-12 M & S Fine Tec Kk Ｌｅｄ光源および液晶表示装置用バックライトシステム
KR20080048112A (ko) * 2006-11-28 2008-06-02 삼성전자주식회사 발광 다이오드와 이를 구비한 백라이트 유닛 및액정표시장치
US20080145960A1 (en) * 2006-12-15 2008-06-19 Gelcore, Llc Super thin LED package for the backlighting applications and fabrication method
US20080144322A1 (en) * 2006-12-15 2008-06-19 Aizar Abdul Karim Norfidathul LED Light Source Having Flexible Reflectors
US7781783B2 (en) * 2007-02-07 2010-08-24 SemiLEDs Optoelectronics Co., Ltd. White light LED device
KR101396588B1 (ko) * 2007-03-19 2014-05-20 서울반도체 주식회사 다양한 색온도를 갖는 발광 장치
US7777412B2 (en) * 2007-03-22 2010-08-17 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Phosphor converted LED with improved uniformity and having lower phosphor requirements
JP2007194675A (ja) * 2007-04-26 2007-08-02 Kyocera Corp 発光装置
TW200847469A (en) * 2007-05-23 2008-12-01 Tysun Inc Substrates of curved surface for light emitting diodes
CN101765923B (zh) * 2007-07-26 2013-01-16 松下电器产业株式会社 Led照明器件
US20090050910A1 (en) * 2007-08-21 2009-02-26 Edison Opto Corporation Flat panel based light emitting diode package structure
US9374876B2 (en) * 2007-08-24 2016-06-21 Martin A. Alpert Multi-chip light emitting diode light device
US8664674B2 (en) * 2007-08-28 2014-03-04 Panasonic Corporation Light emitting diode device preventing short circuiting between adjacent light emitting diode chips
US7802901B2 (en) * 2007-09-25 2010-09-28 Cree, Inc. LED multi-chip lighting units and related methods
DE102007049799A1 (de) * 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
KR100891810B1 (ko) * 2007-11-06 2009-04-07 삼성전기주식회사 백색 발광 소자
KR20090055272A (ko) * 2007-11-28 2009-06-02 삼성전자주식회사 Ｌｅｄ패키지, 이의 제조 방법 및 이를 포함하는 백라이트어셈블리
KR20110028307A (ko) * 2008-05-29 2011-03-17 크리 인코포레이티드 근거리장 영역 혼합을 갖는 광원
DE102008045331A1 (de) 2008-09-01 2010-03-04 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
US9425172B2 (en) * 2008-10-24 2016-08-23 Cree, Inc. Light emitter array

Also Published As

Publication number Publication date
DE102008057140A1 (de) 2010-05-20
US8558259B2 (en) 2013-10-15
WO2010054622A2 (de) 2010-05-20
JP2012508970A (ja) 2012-04-12
CN102217065B (zh) 2014-07-02
CN102217065A (zh) 2011-10-12
JP5544369B2 (ja) 2014-07-09
US20110272713A1 (en) 2011-11-10
WO2010054622A3 (de) 2010-07-08
EP2316130A2 (de) 2011-05-04

Similar Documents

Publication Publication Date Title
KR20110084307A (ko) 광전 반도체 소자
KR101591551B1 (ko) 광전 소자
KR101937643B1 (ko) 발광 모듈, 램프, 조명기구 및 디스플레이 장치
EP2684224B1 (en) A light emitting module, a lamp, a luminaire and a display device
EP3264542B1 (en) Light-emitting device
US7956372B2 (en) Light emitting device
ES2374927T3 (es) Dispositivo de emisión de luz.
EP3019790B1 (en) Self cooling light source
JP4698412B2 (ja) 発光装置および照明装置
US20100301353A1 (en) Led lighting device having a conversion reflector
JP2010272847A (ja) 発光装置
KR20130099210A (ko) 광전자 반도체 컴포넌트
JP2009302339A (ja) 半導体発光装置
JP2014060328A (ja) 発光装置
JP5330944B2 (ja) 発光装置
JP4747704B2 (ja) 蛍光体層付き発光装置の製造方法
JP2010087051A (ja) 発光装置
JP7001915B2 (ja) 発光装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PC1202 Submission of document of withdrawal before decision of registration

St.27 status event code: N-1-6-B10-B11-nap-PC1202

WITB Written withdrawal of application
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000