KR20110078874A - 방열 촉진 기구 및 그 기구가 장착된 전기-전자 장치 - Google Patents
방열 촉진 기구 및 그 기구가 장착된 전기-전자 장치 Download PDFInfo
- Publication number
- KR20110078874A KR20110078874A KR1020090135786A KR20090135786A KR20110078874A KR 20110078874 A KR20110078874 A KR 20110078874A KR 1020090135786 A KR1020090135786 A KR 1020090135786A KR 20090135786 A KR20090135786 A KR 20090135786A KR 20110078874 A KR20110078874 A KR 20110078874A
- Authority
- KR
- South Korea
- Prior art keywords
- heat
- heat dissipation
- micro
- led
- test
- Prior art date
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
구리 평판표면 |
마이크로 핀 표면(300㎛) | 마이크로 핀 표면(400㎛) | 마이크로 핀 표면(500㎛) | |
표면 온도 (℃) |
74.9 | 67.0 | 67.7 | 74.2 |
대기 온도 (℃) |
29.7 | 28.3 | 29.6 | 27.7 |
온도차(ΔT) (℃) |
45.2 | 38.7 | 38.1 | 46.5 |
열량 (W) |
1.41 | 1.46 | 1.46 | 1.44 |
열유속 (kW/m2) |
15.6 | 16.1 | 16.1 | 15.9 |
열전달계수 (W/m2·K) |
343.8 | 416.8 | 422.3 | 341.0 |
촉진율 (%) |
21.2 | 22.8 | -0.8 |
알루미늄 평판표면 |
마이크로 핀 표면(300㎛) | 마이크로 핀 표면(400㎛) | 마이크로 핀 표면(500㎛) | |
표면 온도 (℃) |
29.3 | 27.6 | 28.0 | 29.2 |
대기 온도 (℃) |
77.5 | 71.8 | 73.4 | 76.7 |
온도차(ΔT) (℃) |
48.2 | 44.2 | 45.4 | 47.5 |
열량 (W) |
1.44 | 1.43 | 1.44 | 1.44 |
열유속 (kW/m2) |
15.8 | 15.8 | 15.9 | 15.9 |
열전달계수 (W/m2·K) |
333.2 | 357.7 | 350.0 | 334.6 |
촉진율 (%) |
6.8 | 4.8 | 0.4 |
Claims (2)
- 핀의 너비가 250㎛ 내지 450㎛이고, 상기 핀들간의 간격이 각각 250㎛ 내지 450㎛인 핀들이 표면에 형성된 방열 촉진 기구.
- 제1항에 있어서,상기 핀의 단면은 사각형 형태인 것을 특징으로 하는 방열 촉진 기구.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090135786A KR101098877B1 (ko) | 2009-12-31 | 2009-12-31 | 방열 촉진 기구 및 그 기구가 장착된 전기-전자 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090135786A KR101098877B1 (ko) | 2009-12-31 | 2009-12-31 | 방열 촉진 기구 및 그 기구가 장착된 전기-전자 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110078874A true KR20110078874A (ko) | 2011-07-07 |
KR101098877B1 KR101098877B1 (ko) | 2011-12-26 |
Family
ID=44918298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090135786A KR101098877B1 (ko) | 2009-12-31 | 2009-12-31 | 방열 촉진 기구 및 그 기구가 장착된 전기-전자 장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101098877B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102818189A (zh) * | 2012-08-07 | 2012-12-12 | 苏州金科信汇光电科技有限公司 | 具有导热孔热流道的led路灯结构 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101971550B1 (ko) | 2017-07-26 | 2019-04-23 | 주식회사 오투마 | 섬모를 이용한 방열장치 |
KR102069966B1 (ko) | 2018-03-22 | 2020-01-23 | 홍동일 | 방열장치 제조방법 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002093961A (ja) | 2000-09-13 | 2002-03-29 | Nippon Inter Electronics Corp | ヒートシンク及び半導体装置 |
JP2006135120A (ja) * | 2004-11-08 | 2006-05-25 | Heat-Sink & Os Co Ltd | 放熱器およびそれを用いた基板 |
-
2009
- 2009-12-31 KR KR1020090135786A patent/KR101098877B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102818189A (zh) * | 2012-08-07 | 2012-12-12 | 苏州金科信汇光电科技有限公司 | 具有导热孔热流道的led路灯结构 |
Also Published As
Publication number | Publication date |
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KR101098877B1 (ko) | 2011-12-26 |
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