KR20110052659A - Electric appliance disassembling method, and electric appliance disassembling device - Google Patents
Electric appliance disassembling method, and electric appliance disassembling device Download PDFInfo
- Publication number
- KR20110052659A KR20110052659A KR1020117004346A KR20117004346A KR20110052659A KR 20110052659 A KR20110052659 A KR 20110052659A KR 1020117004346 A KR1020117004346 A KR 1020117004346A KR 20117004346 A KR20117004346 A KR 20117004346A KR 20110052659 A KR20110052659 A KR 20110052659A
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- substrate
- superheated steam
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- cylindrical body
- component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/088—Using a vapour or mist, e.g. cleaning using water vapor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
Abstract
A disassembly method and disassembly apparatus for an electric machine for easily separating a component from a substrate are provided. A method of disassembling an electric device that separates a component fixed on a substrate from a substrate by a bonding material having a melting point lower than that of the member to be joined, or a superheated steam having a temperature above the melting point of the bonding material. Exposed to melt the bonding material and allow the part to be separated from the substrate.
Description
TECHNICAL FIELD This invention relates to the disassembly method and disassembly apparatus of the electric apparatus which have a component fixed by soldering, wax solder, varnish, etc., on base materials, such as a board | substrate. In particular, it relates to a heating method for decomposing such electric equipment.
For example, an electrical device such as a circuit board mounted on a used mobile phone or a computer, such as a computer (including electronic devices in the present specification and claims) includes precious metals and rare metals (rare metals). Since useful materials of the present invention, components such as reusable chips, coils, and the like are included, it is desired to separate them from the resin part or other metal parts, recover them, and reuse them.
For example,
For example,
In addition,
The disassembly of the electrical equipment as described above is mainly performed by manual or mechanical separation of metal parts or resin parts, or by melting a single piece of equipment in a furnace and performing separation in a molten state. Is adopted.
In addition, there is a limit in the range of the heat utilization concentration because the heating medium of high boiling point is heated and the substrate is immersed in the medium (liquid) or the latent heat of condensation of these saturated steams is used for heating.
In the case of manual or mechanical separation, mechanical forces such as cutting force and peeling force are removed from the substrate by providing various kinds of parts and the like to the parts, so that automation is difficult and workability is very low.
On the other hand, when performing melt recovery, since the metal to be recovered is mixed, the separation operation after melting takes a lot of time, and the separation recovery efficiency is low. In addition, since materials other than the material to be recovered need to be melted, a large amount of energy is used for melting unnecessary materials.
In addition, in the method using heat, toxic gases may be generated due to combustion of resin or oxidation of insulating oil or the like from a condenser, and there is also a problem of oxidative alteration such as separated and recovered metal, which is not preferable.
The present invention was devised to solve the above problems, and an object of the present invention is to provide a disassembly method and an apparatus for disassembling an electric device for easily separating components from a substrate. In particular, it is an object of the present invention to provide a method of heating an electric device for separating a component from a substrate.
The present invention solves the above problems by the following solving means.
The invention described in
Here, the reason for using superheated steam other than saturated steam is that the melting point of empty lead (used in the tin-copper system), which is widely used in electric boards, is about 240 ° C, so that only the latent heat of condensation of saturated steam melts. This is because it is difficult and superheated steam above the dry steam point where saturated steam is further heated is required.
The invention described in
The invention described in
In particular, when the atmosphere in which the electric equipment is treated is filled with superheated steam, it is preferable that the oxygen concentration be a low oxygen atmosphere of about 1 / 20th of the air.
The invention described in
Since only the sensible heat of superheated steam, or sensible heat and latent heat of condensation are used, it is possible to heat to a higher temperature region than when only latent heat of condensation is used. The means for obtaining superheated steam is not limited to the heating steam generating means of the present invention.
In addition to the superheated steam, the heating medium may be a superheated steam of a high boiling point heat medium such as hydrogen fluoride hydrocarbon or silicon oil, but it is preferable to use superheated steam from the viewpoint of safety, heating performance and cost.
The invention described in
The invention as set forth in
In the invention described in
The invention according to
The invention described in
Invention as described in
The invention according to
The invention described in claim 12 is characterized in that the superheated steam generator is arranged in the preheating chamber.
The invention described in claim 13 is characterized in that a preheating heater is provided in the heating vessel section.
The invention according to claim 14 is provided with an air curtain which prevents leakage of outside air into the heating vessel section at an inlet through which the substrate is introduced, and an outlet through which the substrate is taken out. It features.
The invention described in
The invention described in claim 16 is characterized in that a superheated steam recovery means is provided in the heating vessel.
The invention as set forth in claim 17 is a method for disassembling an electric device that separates a component fixed on a substrate from the substrate by a bonding material having a melting point lower than that of the member to be joined, and the component and the component fixed on the substrate. Is exposed to superheated steam having a temperature equal to or higher than the melting point of the bonding material to melt the bonding material, and the component is separated from the substrate.
The invention described in claim 18 is an apparatus for disassembling an electric device for separating a component fixed on a substrate from the substrate by a bonding material having a melting point lower than that of the member to be joined, wherein the substrate and the component fixed on the substrate. And a superheated steam generator for introducing superheated steam having a temperature equal to or higher than the melting point of the bonding material into the vessel.
According to the invention described in claim 19, the superheated steam generator includes a first cylindrical body, an introduction pipe through which steam is introduced into the first cylindrical body from one end of the first cylindrical body, and the first cylindrical body. A second cylindrical body inserted into the interior of the second tubular body, the second cylindrical body communicating with the first cylindrical body at an end opposite to the introduction pipe side, and inserted into the second cylindrical body, wherein the first cylindrical body and the second cylinder are connected; A third cylindrical body communicating with the second cylindrical body at an end opposite to the side in which the shaped body communicates, a discharge pipe for discharging superheated steam from the third cylindrical body, and a gas flow passage from the introduction pipe to the discharge pipe And a heating means for heating the steam.
According to the present invention, the following effects can be obtained.
(1) By melting the bonding material with a superheated steam having a temperature equal to or higher than the melting point of the bonding material such as lead or beeswax, for example, components such as electronic parts, electrical parts, and wiring can be easily peeled from the substrate. Electrical equipment can be easily disassembled.
(2) Even when the parts are fixed by resin materials such as varnish, the parts can be easily peeled off by heating and softening the resin materials with superheated steam.
(3) By letting out air by superheated steam and reducing the atmosphere at high temperature and low oxygen, it is possible to suppress the generation of harmful gases due to combustion (oxidation) and carbonization of the resin.
(4) By using superheated steam as superheated steam, 539 kcal / kg of latent heat can be used for heating in the state where the workpiece is 100 ° C. or lower. Thus, for example, the decomposed product is shorter than in the case of using hot air of heated air. It can be heated up and high speed processing is possible. Moreover, even if it leaks from an apparatus, it is not toxic and since it is nonflammable, high safety is obtained.
(5) By having a substrate while exposing the decomposed product to superheated steam, the component which can be easily peeled off can be dropped by gravity and recovered.
BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the structure in 1st Embodiment of the decomposition apparatus of the electric machine to which this invention is applied.
FIG. 2 is a diagram illustrating a superheated steam generator in the decomposition apparatus of the electric machine of FIG. 1.
3 is a cross-sectional view illustrating a III-III cross section of FIG. 2.
FIG. 4 is an enlarged view of part IV of FIG. 2.
It is a figure which shows the structure in 2nd Embodiment of the decomposition apparatus of the electric machine to which this invention is applied.
FIG. 6 is a view for explaining the structure of a shower head in the decomposition apparatus of the electric machine of FIG. 5, FIG. 6A is a plan view, and FIG. 6B is a side view.
FIG. 7 is a block diagram illustrating a superheated steam supply system of the decomposition apparatus of the electric device of FIG. 5.
Fig. 8 is a view showing the structure of the bottom plate of the holder of the disassembly device of the electric machine of Fig. 5, (a) is a plan view, and (b) is a front view.
9 is a view for explaining the loader mechanism of the disassembly apparatus of the electric machine of FIG.
10 is a view for explaining the rotational motion of the link arm of the loader mechanism of FIG.
FIG. 11 is a graph showing the relationship between the processing temperature and the separation yield in the decomposition apparatus of the electric machine of FIG. 5.
FIG. 12 is a graph showing a relationship between heating time and separation yield in the decomposition apparatus of the electric machine of FIG. 5.
FIG. 13 is a graph showing the relationship between the steam flow rate and the separation yield in the decomposition apparatus of the electric machine of FIG.
FIG. 14 is a graph showing the distribution of oxygen concentration in the decomposition apparatus of the electric apparatus of FIG. 5.
15 is a table showing a measurement result of the separation yield of the decomposition apparatus of the electric machine of FIG.
EMBODIMENT OF THE INVENTION Embodiment of the disassembly apparatus (henceforth only a "disassembly apparatus") of the electric apparatus which applied this invention is described based on drawing. This disassembly apparatus disassembles circuit boards (decomposition | disassembly products), such as a mobile telephone and a computer, for example, and performs the disassembly method of the electric apparatus of this invention. In the circuit board, for example, various components such as an IC chip (element), a coil, a capacitor, and the like are fixed on a board such as a printed board. Connection terminals of various components are fixed to the printed board by soldering. The IC chip may also be fixed to the printed board by varnish.
BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the structure of the decomposition | disassembly apparatus of 1st Embodiment of this invention.
The decomposing device includes a boiler (1), a superheated steam generator (2), a shower head (3), a conveyor (4), a vibrator (5), a heating vessel (6), and the like.
The decomposed | disassembled material (electrical apparatus) decomposed | disassembled by a decomposition apparatus is comprised, for example with the board |
The
The superheated steam generator (2) generates superheated steam by reheating the saturated steam supplied from the boiler (1). The
The
The
The
The
In the decomposition apparatus of the electric machine of the present embodiment, the temperature of the superheated steam is controlled by the output of the
When the decomposition product is exposed to the superheated steam when the decomposition product is conveyed by the
Then, when the
Hereinafter, the configuration of the
2 is a side view including a partial cross section of the
The appearance of the
Since the steam of high temperature flows inside the
The
The supply-
In the central portions of the supply
The
The
An
In addition, the
4 is an enlarged view of the vicinity of the
The
The
The
The
The saturated
The superheated
This superheated
The
The
The
By the above-described configuration, the saturated steam introduced into the gas
That is, the saturated steam blown into the gas
In addition, the saturated water vapor is heated by the
In this embodiment, in order to ensure maximum thermal efficiency without reducing the generated superheated steam temperature, the interval between the inlet of the saturated
Here, in the present embodiment, if the flow rate of the saturated steam supplied from the saturated
According to embodiment described above, the following effects can be acquired.
(1) By melting this lead with superheated steam having a temperature equal to or higher than the melting point of lead, the
(2) Even if the
(3) By generating the air in the
(4) By using superheated steam as the superheated steam, 539 kcal / kg of latent heat can be used for heating in the state where the decomposed product is 100 ° C. or lower, so that, for example, the decomposed product can be heated in a shorter time than in the case of using hot air of heated air. High-speed processing is possible.
(5) By vibrating the
Next, with reference to FIG. 5, the decomposition | disassembly apparatus of the electric apparatus which concerns on 2nd Embodiment of this invention is demonstrated.
The
The
On the upstream side of the
The
An
Above the
As shown in FIG. 7, the superheated
In addition, a
In the lower part of the
In addition,
The
On the upper path of the
The
Next, with reference to FIG. 8, the holder which a decomposition product is accommodated is demonstrated.
A
Moreover, the
In addition, a plurality of
The cover (not shown) covers the four sides of the
Next, the
The
The
Near the center of the
The
The
In addition, as shown in FIGS. 9 and 10, the
In the unloaded state shown by the solid line in FIG. 10, the
When the
The
Next, with reference to Fig. 5, the decomposition operation of the decomposition product using this decomposition apparatus will be described.
First, the
In addition, the
In addition, in the
In addition, since the
The
When the
The
Thereafter, the
In addition, during operation, superheated steam which is excessively present from the waste superheated
In addition, after the operation is completed, the condensate drain generated in the
Next, the experimental results of obtaining the optimum operating conditions (temperature, time, oxygen concentration) of the apparatus will be described with reference to FIGS. 11 to 15.
First, the relationship between the temperature in the process chamber and the separation yield of the decomposed product will be described with reference to the graph of FIG. 11. The vertical axis of the graph represents the separation yield (%), and the horizontal axis represents the temperature (° C) in the processing chamber. The separation yield is the ratio of the number of parts separated to the total number of parts.
Since the melting point of lead as the joining material was at most about 240 ° C, the separation yield when the temperature was 250 ° C or more was determined. As shown in the graph, the separation yield was 70 to 75% when the temperature was around 250 ° C, but a high separation yield of 90% or more was obtained when the temperature was 270 ° C or higher.
As a result, the optimum temperature condition can be set to 270 ° C.
Next, the relationship between the heating time and the separation yield of the decomposed product will be described with reference to the graph of FIG. 12. The vertical axis of the graph represents the separation yield (%), and the horizontal axis represents the heating time (minute). The temperature in the processing chamber was 270 ° C.
As shown in the graph, when the heating time is 3 minutes, the separation yield is about 88%, but when it is 4 minutes or more, it is slightly increased to about 90%.
As a result, the optimum heating time was 5 minutes.
Next, the relationship between the steam flow rate in the processing chamber and the separation yield of the decomposed product will be described with reference to the graph of FIG. 13. The vertical axis of the graph represents the separation yield (%), and the horizontal axis represents the steam flow rate (kg / h).
As shown in the graph, the separation yield is about 80% at a steam flow rate of 6 kg / h, but is about 90% at 8 kg / h or more.
As a result, the steam flow rate was 8 kg / h.
Next, the distribution of oxygen concentration in the processing chamber will be described with reference to the graph of FIG. 14. The vertical axis of the graph is the oxygen concentration (%), and the horizontal axis is the measuring point. The measurement point was made into 20 places in the space of a process chamber.
As shown in the graph, the oxygen concentration is 0.5 to 1.4%, which is very low. For this reason, it is thought that the oxidation effect with respect to a heating object (decomposition product) and the combustibility of an object can be reduced significantly.
Finally, the separation yield in the optimum operating conditions based on the above results is shown.
15 is a table showing experimental results under optimum operating conditions.
As a result of conducting four experiments under the optimum operating conditions (temperature: 270 DEG C, heating time: 5 minutes, steam flow rate: 8 kg / h), a high yield of separation yield of 89 to 92% was obtained.
According to 2nd Embodiment demonstrated above, the following effects can be acquired in addition to the effect obtained by 1st Embodiment.
(1) As a result of determining the optimum operating conditions of the superheated steam generator, a high separation yield of about 90% can be obtained.
(2) Since the treatment can be performed at a high temperature of about 280 ° C. required for melting the bonding member under atmospheric pressure, high pressure resistance measures are unnecessary and safety is high. In addition, since the temperature range of the superheated steam can be freely set in a wide range, the melting temperature range can be widened, so that most of the bonding materials generally used can be melted.
(3) Since high boiling point heat medium or organic solvent is used as the heating means, and superheated steam at atmospheric pressure is used, safety is high and environmental problems are not generated, and running costs are low.
(4) By removing the air by superheated steam and treating the oxygen concentration in a low oxygen concentration atmosphere of about 1 / 20th of the air, generation of organic gas accompanying the thermal decomposition of the component or the resin-based joining member can be suppressed.
(5) Since the preheating chamber is provided in the heating vessel and the superheating steam generator is arranged in the preheating chamber, the inside of the preheating chamber can be heated by the heat generated from the superheating steam generating apparatus, and no other heating source is required.
(6) Since a precooling chamber is installed in the heating vessel section and the decomposed product is cooled to some extent and then taken out, it is possible to prevent the occurrence of odor or accidental contact with the heated decomposed product.
(7) Since the header which sucks lung superheat steam is provided, waste superheat steam can be reused.
(8) Since the condensate drain is collected and reused, it is safe for the environment.
(Variation)
The present invention is not limited to the embodiments described above, and various modifications and changes are possible, and they are also within the technical scope of the present invention.
(1) In the embodiment, the electric device to be disassembled is a printed circuit board on which various parts are mounted by, for example, soldering and varnish, but the electric device to be disassembled is not limited to this.
(2) While the decomposition apparatus of the embodiment emits superheated steam while transporting the decomposition products to the conveyor, the present invention is not limited to this, but can also be applied to performing a discharge treatment.
(3) The superheated steam generator of the embodiment has a triple pipe structure composed of, for example, a gas body, a pipe, and a superheated steam discharge pipe, but the present invention is not limited thereto, and has a multi-pipe structure of four or more. Superheated steam generators are also applicable. In this case, it can be set as the structure which inserted the 1st cylindrical body inside the other cylindrical body, and inserted the other cylindrical body inside the 3rd cylindrical body. In this case, the gas flow path has a configuration of two passes or more. In the present invention, a superheated steam generator other than having such a multi-pipe may be used.
(4) Although the superheated steam generator according to the embodiment applies a sheath heater as the heating means, for example, the heating means is not limited to this, and for example, heating means other than a sheath heater such as IH may be used. .
(5) In the embodiment, steam for melting lead or the like was, for example, water vapor, but the present invention is not particularly limited thereto, and the superheated vapor made of another material may be used to decompose the electric device.
1: boiler 2: superheated steam generator
3: shower head 4: conveyor
5: vibrator 6: heating vessel
7: substrate 8: device
9: recovery vessel 10: saturated steam supply pipe
11: end 20: body
21, 22: end 23: flat portion
24, 25: projection 30: supply side end plate
31: opening 40: discharge side end plate
41: opening 50: clearance
51: stay 52, 53: end
54: veneer 60: sheath heater
61: heating section 70: superheated steam discharge pipe
71: tip 100: support
110: heat shield S1: outer space
S2: Internal space 200: Decomposition device of electrical equipment
210: heating vessel 203: roller conveyor
205: roller conveyor 211: entrance
212: exit 215: preheating chamber
216: treatment chamber 217: precooling chamber
221, 225, 226: suction header 223: preheat heater
227: drain
232, 242:
234, 244: Blower 250: Superheated steam generator
251: ejector 253: boiler
255: superheated steam supply pipe 257: temperature sensor
258: controller 260: shower head
261: main body 262: superheated steam introduction tube
263: steam outlet 270: chain conveyor
271: attachment 272: pin
275
290: impact imparting means (block) 300: holder
310: base plate 320: inner plate
321: grip 323: slit
330: outer shell 331: side plate
332: upper part 335: spring
336: Pin 339: Guide
341: shear 343: roller
345: slit 500: loader mechanism
510: link arm 511: long arm
515: short arm 512: counterweight
516: stopper piece 520: guide arm
521: pin 525: wire
Claims (19)
A method for decomposing an electric machine, characterized in that for heating the joining material using superheated steam.
The component is fixed on the substrate by a resin-based material,
And said superheated steam is at least substantially atmospheric pressure at the heating location of said component and at a temperature equal to or more than the softening point of said resin-based material.
And overheating the substrate and the component in a low oxygen atmosphere.
The superheated steam is a decomposition method of an electric device, characterized in that the superheated steam.
And dissociating the substrate and the component fixed on the substrate when the substrate is exposed to superheated steam.
A heating vessel portion accommodating the substrate and the components fixed on the substrate;
And a superheated steam generator for introducing superheated steam having a temperature equal to or higher than the melting point of the joining material into the heating vessel.
The component is fixed on the substrate by a resin-based material,
The superheated steam is at least atmospheric pressure at a heating point of the component and at a temperature equal to or more than the softening point of the resin-based material.
The inside of the heating vessel is a decomposition device of an electric machine, characterized in that the low oxygen atmosphere by the introduction of the superheated steam.
The superheated steam is a decomposition apparatus of an electric machine, characterized in that the superheated steam.
And a vibrating means having the substrate in the vicinity of the heating vessel.
And at least one of a preheating chamber for sequencing the substrate or a precooling chamber for slow cooling the substrate in the heating vessel portion.
And the superheated steam generator is arranged in the preheating chamber.
And a preheating heater is installed in the heating vessel.
And an air curtain for preventing leakage of outside air to the heating vessel portion is provided at an inlet through which the substrate is introduced and at an outlet through which the substrate is taken out.
And an impact imparting mechanism for mechanically impacting the substrate in the heating vessel.
And a superheated steam recovery means is installed in the heating vessel.
Exposing the substrate and the component fixed on the substrate to superheated steam having a temperature equal to or higher than the melting point of the bonding material to melt the bonding material and separating the component from the substrate. .
A container portion for receiving the substrate and the components fixed on the substrate;
And a superheated steam generator for introducing superheated steam having a temperature equal to or higher than the melting point of the joining material in the container portion.
The superheated steam generator is inserted into a first cylindrical body, an introduction pipe through which steam is introduced into the first cylindrical body from one end of the first cylindrical body, and is inserted into the first cylindrical body. The second cylindrical body communicating with the said 1st cylindrical body at the edge part on the opposite side to a conduit side, and inserted in the said 2nd cylindrical body, On the opposite side to the side which the said 1st cylindrical body and the said 2nd cylindrical body communicated with, A third cylindrical body communicating at the end with the second cylindrical body, a discharge pipe for discharging superheated steam from the third cylindrical body, and a gas flow path from the introduction pipe to the discharge pipe, and heats the steam. Decomposition apparatus of an electric machine, characterized in that it comprises a heating means.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2008-225390 | 2008-09-03 | ||
JP2008225390 | 2008-09-03 |
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KR20110052659A true KR20110052659A (en) | 2011-05-18 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020117004346A KR20110052659A (en) | 2008-09-03 | 2009-06-19 | Electric appliance disassembling method, and electric appliance disassembling device |
Country Status (4)
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JP (2) | JP4393576B1 (en) |
KR (1) | KR20110052659A (en) |
CN (1) | CN102138370A (en) |
WO (1) | WO2010026822A1 (en) |
Families Citing this family (16)
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JP2012138397A (en) * | 2010-12-24 | 2012-07-19 | Fuji Denki Thermosystems Kk | Method and device for separating electronic components of printed circuit board |
JP5759653B2 (en) * | 2011-03-11 | 2015-08-05 | 株式会社ブラウニー | Superheated steam generator and method, superheated steam processing method |
JP2012236337A (en) * | 2011-05-12 | 2012-12-06 | Nippon Telegr & Teleph Corp <Ntt> | Method for dismantling article |
JP2012236149A (en) * | 2011-05-12 | 2012-12-06 | Nippon Telegr & Teleph Corp <Ntt> | Method of disassembling cellular phone |
CN102319723A (en) * | 2011-08-16 | 2012-01-18 | 西南科技大学 | The discarded printed circuit boards electronic devices and components are dismantled reclaimer automatically |
CN102284471B (en) * | 2011-08-16 | 2014-10-01 | 西南科技大学 | Method for automatically dismantling and recovering waste printed circuit board by using industrial exhaust heat |
JP2013172029A (en) * | 2012-02-21 | 2013-09-02 | Koki Tec Corp | Repairing device and repairing method |
JP2013223822A (en) * | 2012-04-20 | 2013-10-31 | Nippon Telegr & Teleph Corp <Ntt> | Method and apparatus for recycling optical fiber cable |
JP5843289B2 (en) * | 2012-04-27 | 2016-01-13 | 株式会社アステック入江 | Printed circuit board processing method |
CN103599921A (en) * | 2013-11-19 | 2014-02-26 | 西南科技大学 | Automatic lossless dismounting recovery method and automatic lossless dismounting recovery device of discarded printed circuit board |
CN103962672A (en) * | 2014-05-05 | 2014-08-06 | 苏玉琴 | Soldering tin separator |
CN106672622B (en) * | 2016-12-25 | 2018-10-26 | 中山市恒辉自动化科技有限公司 | A kind of flow-type electronic product recycling consersion unit |
JP7115673B2 (en) * | 2018-02-19 | 2022-08-09 | トヨタ自動車株式会社 | Work manufacturing method |
EP3960314A4 (en) * | 2019-04-26 | 2022-12-21 | Niimi-Solar Co., Ltd. | Pyrolysis apparatus |
JP6876308B1 (en) * | 2020-02-27 | 2021-05-26 | 株式会社セレア | Separation method and separation device |
JP7443122B2 (en) | 2020-03-27 | 2024-03-05 | 株式会社ジェイテクトサーモシステム | heat treatment equipment |
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JPS63318133A (en) * | 1987-06-22 | 1988-12-27 | Hitachi Ltd | Device for detaching electronic circuit element |
JP2755225B2 (en) * | 1995-02-10 | 1998-05-20 | 日本電気株式会社 | Separation and disassembly of printed wiring boards with components |
JPH1017948A (en) * | 1996-06-27 | 1998-01-20 | Senju Metal Ind Co Ltd | Method for removing solder of printed circuit board and device for removing solder |
JPH10202362A (en) * | 1997-01-17 | 1998-08-04 | Toyota Motor Corp | Soldering method and soldering apparatus |
JP3480570B2 (en) * | 2001-05-14 | 2003-12-22 | 日本電気株式会社 | Semiconductor chip, method of removing the same, and semiconductor device |
JP2003152327A (en) * | 2001-11-19 | 2003-05-23 | Fuji Electric Co Ltd | Method and device for soldering |
CN1897790A (en) * | 2005-07-17 | 2007-01-17 | 郑金标 | Separation of printing circuit board component |
-
2009
- 2009-03-30 JP JP2009082294A patent/JP4393576B1/en active Active
- 2009-06-19 WO PCT/JP2009/061197 patent/WO2010026822A1/en active Application Filing
- 2009-06-19 CN CN2009801337630A patent/CN102138370A/en active Pending
- 2009-06-19 KR KR1020117004346A patent/KR20110052659A/en not_active Application Discontinuation
- 2009-10-13 JP JP2009236145A patent/JP2010087522A/en active Pending
Also Published As
Publication number | Publication date |
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JP4393576B1 (en) | 2010-01-06 |
JP2010087522A (en) | 2010-04-15 |
CN102138370A (en) | 2011-07-27 |
JP2010087464A (en) | 2010-04-15 |
WO2010026822A1 (en) | 2010-03-11 |
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