CN1897790A - Separation of printing circuit board component - Google Patents

Separation of printing circuit board component Download PDF

Info

Publication number
CN1897790A
CN1897790A CN 200510027815 CN200510027815A CN1897790A CN 1897790 A CN1897790 A CN 1897790A CN 200510027815 CN200510027815 CN 200510027815 CN 200510027815 A CN200510027815 A CN 200510027815A CN 1897790 A CN1897790 A CN 1897790A
Authority
CN
China
Prior art keywords
circuit board
board component
printing circuit
liquid medium
liquid media
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 200510027815
Other languages
Chinese (zh)
Inventor
郑金标
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN 200510027815 priority Critical patent/CN1897790A/en
Publication of CN1897790A publication Critical patent/CN1897790A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The apparatus thereof comprises supporter, container, liquid media, thermocouple and heating unit. The U shaped heating wire is used to heat the liquid media up to a certain temperature, and then the one side of the PCB, which has solder, is placed on the surface of the liquid media but not immersed into the liquid media; when the solder is solved in the liquid media, namely the separation between the PCB and the components is completed, the PCB is taken out from the liquid media.

Description

The printing circuit board component separating technology
Affiliated technical field
The present invention relates to a kind of printed substrate and the separating technology that components and parts separate, especially can not produce the isolation technics of toxic gas and highly effective and safe.
Background technology
At present, printing circuit board component separates the general roasting plate separation of adopting, and be about to printed substrate and be placed on the stove, because the fusing point of scolding tin is lower, when temperature reaches certain, the scolding tin fusion, components and parts separate with printed substrate.But,, cause lead poisoning and air pollution easily owing to contain a certain amount of toxic metals lead in the scolding tin.
Summary of the invention
For fear of having the harm that printed substrate and components and parts isolation technics are caused now, the invention provides a kind of separating technology, this separating technology can not only separate printed substrate with components and parts fast, and can not cause environmental pollution.
The technical solution adopted for the present invention to solve the technical problems is: this printed wire panel element separator mainly is made up of outer casing stand, container, liquid medium, thermocouple and heater.Before using container is placed on the outer casing stand, then thermocouple and U type heating wire is fixed on the support together, in container, inject transmitting medium again.Use energized, setting can make the temperature of scolding tin fusion, when reaching, temperature sets that signal lamp brightens when requiring, the one side that at this moment printed substrate can be contained scolding tin is placed the liquid medium surface and is not immersed, by the time after the scolding tin fusion printed substrate is taken out, slightly beaing printed substrate can separate components and parts, reaches the purpose that printed substrate separates with components and parts.
The invention has the beneficial effects as follows, can when separating printed substrate and components and parts, only utilize the heat conduction of liquid medium, simple in structure, just with operation.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is the three-dimensional structure diagram of device therefor of the present invention.
1. outer casing stands among the figure, 2. container, 3. thermocouple, 4.U type heating wire, 5. signal lamp is 6. transferred knob.
Embodiment
In Fig. 1, in container (2), add liquid medium during use.Set the temperature of required heating by transferring knob (6), with U type heating wire (4) heating liquid medium, measure the temperature of liquid medium by thermocouple (3), when signal lamp when temperature reaches design temperature (5) is bright, the one side that the printed substrate that will separate contains scolding tin is put into container (2) to liquid surface, take out after heating a little time, slightly beat printed substrate.

Claims (4)

1. printing circuit board component separating technology, its equipment is made up of support, container, liquid medium, dividing plate and heater, it is characterized in that: by heater liquid medium is heated to more than the scolding tin melting temperature, printed substrate is placed on the liquid medium surface.
2. according to the said printing circuit board component separating technology of claim 1, it is characterized in that: liquid medium is one or more the liquid of boiling point between 150 ℃ and 350 ℃.
3. according to the said printing circuit board component separating technology of claim 1, it is characterized in that: heater is one group of heating wire.
4. according to the said printing circuit board component separating technology of claim 1, it is characterized in that: make the scolding tin fusion by liquid medium conduction heating.
CN 200510027815 2005-07-17 2005-07-17 Separation of printing circuit board component Pending CN1897790A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200510027815 CN1897790A (en) 2005-07-17 2005-07-17 Separation of printing circuit board component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200510027815 CN1897790A (en) 2005-07-17 2005-07-17 Separation of printing circuit board component

Publications (1)

Publication Number Publication Date
CN1897790A true CN1897790A (en) 2007-01-17

Family

ID=37610099

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200510027815 Pending CN1897790A (en) 2005-07-17 2005-07-17 Separation of printing circuit board component

Country Status (1)

Country Link
CN (1) CN1897790A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102138370A (en) * 2008-09-03 2011-07-27 新热工业株式会社 Electric appliance disassembling method, and electric appliance disassembling device
CN110395720A (en) * 2019-09-03 2019-11-01 王志朋 The method for preparing vertical graphene film as raw material using biomass

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102138370A (en) * 2008-09-03 2011-07-27 新热工业株式会社 Electric appliance disassembling method, and electric appliance disassembling device
CN110395720A (en) * 2019-09-03 2019-11-01 王志朋 The method for preparing vertical graphene film as raw material using biomass

Similar Documents

Publication Publication Date Title
CN100496192C (en) Method and device for desoldering and separating device in printed circuit board liquid state heat-conducting medium
TW200630005A (en) Thermal attach and detach methods and system for surface-mounted components
EP1925945A3 (en) Probe device with heating unit
CN105655264B (en) A kind of the plant column device and plant column method of CCGA devices
CN1897790A (en) Separation of printing circuit board component
CN108294950A (en) A kind of heating equipment for assembly line of boiling medicine
CN201312638Y (en) Heat-preservation dining table
CN214751193U (en) Liquid crystal display heating glass
DE502006008143D1 (en) PROCESS FOR SOLDERING SMD COMPONENTS ON A PCB AND REFLOW LIQUIDS THEREFOR
CN204422916U (en) A kind of ultra-thin wide temperature LCD MODULE
CN103690056A (en) Anti-dry heating device of electric rice cooker
CN105345421A (en) Screen disassembly device and screen disassembly system
CN202721906U (en) Heating device used for flexible circuit board
CN102582232A (en) PCB (printed circuit board) heat transfer printer with double heating boards
EP2648492A3 (en) A system provided with a solder joint
CN209433660U (en) A kind of boiling experimental demonstration device of water
CN203551909U (en) LCD (Liquid Crystal Display)
US20070181640A1 (en) Lead-free solder reworking system and method thereof
CN202253918U (en) Portable heater
CN204166731U (en) A kind of pocket-size multifunctional electronic experimental device
CN220283968U (en) High-temperature-resistant hot melt adhesive film
CN102873423A (en) Tool capable of automatically dismantling electronic components
CN205496728U (en) LED welding machine that flows back
CN203760001U (en) Orthobaric bonding device
CN103442524B (en) Patch module assembly and disassembly methods

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C57 Notification of unclear or unknown address
DD01 Delivery of document by public notice

Addressee: Zheng Jinbiao

Document name: the First Notification of an Office Action

DD01 Delivery of document by public notice

Addressee: Zheng Jinbiao

Document name: Notification that Application Deemed to be Withdrawn

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20070117