KR20110040173A - Smart card - Google Patents

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Publication number
KR20110040173A
KR20110040173A KR1020090097343A KR20090097343A KR20110040173A KR 20110040173 A KR20110040173 A KR 20110040173A KR 1020090097343 A KR1020090097343 A KR 1020090097343A KR 20090097343 A KR20090097343 A KR 20090097343A KR 20110040173 A KR20110040173 A KR 20110040173A
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KR
South Korea
Prior art keywords
protective film
compensation layer
height compensation
pcb
attached
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KR1020090097343A
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Korean (ko)
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KR101169988B1 (en
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권성규
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주식회사 아이비테크
권성규
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Priority to KR1020090097343A priority Critical patent/KR101169988B1/en
Publication of KR20110040173A publication Critical patent/KR20110040173A/en
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets

Abstract

PURPOSE: A smart card is provided to prevent the bending of a protection film by flattening the surface of a height compensating layer. CONSTITUTION: A PCB(Printed Circuit Board)(100) comprises devices such as IC(Integrated Chip). A height compensating layer(200) is attached to an upper surface of the PCB, has the thickness over the maximum height of the devices, and includes an insertion hole into which the devices are inserted. A first protection film(310) is attached to the height compensating layer, and a second protection film(320) is attached to the lower surface of the PCB and has a through-hole for exposing the detected surface of the IC to the outside. The height compensating layer and the first and second protection films have a light-transmittance structure and are bonded with each other by a UV(UltraViolet) curable adhesive.

Description

스마트카드{SMART CARD} Smart card {SMART CARD}

본 발명은 구체적으로는 보호필름이 PCB기판 상에 부착된 형태의 스마트카드에 있어서,The present invention specifically in the smart card of the form the protective film is attached to the PCB substrate,

PCB기판 상면과 각 소자들 간의 높이차를 메우기 위한 높이보상층을 PCB기판과 보호필름 사이에 형성시키되, 상기 높이보상층을 필름형태로 구현하고 각 소자가 위치되는 지점에 관통구를 형성시켜 소자들이 삽입된 상태가 되도록 함에 따라, 보호필름의 굴곡을 방지함은 물론 기존에 비해 높이보상층의 구조 및 형성과정이 간소해질 수 있는 기술에 관한 것이다.A height compensation layer is formed between the PCB substrate and the protective film to fill the height difference between the upper surface of the PCB and each device, and the height compensation layer is formed in a film form, and a through hole is formed at a point where each device is positioned. As they are inserted into the inserted state, as well as preventing the bending of the protective film as compared to the conventional structure and the formation process of the height compensation layer is related to a technology that can be simplified.

최근들어 많이 사용되고 있는 스마트카드(SMART CARD)는 내부에 IC(Integrated Circuit ; 직접회로)기억소자를 장착하여 각종 신분데이터를 저장한 전자식 신분카드로, 높은 보안성과 메모리의 대용량과 같은 장점으로 인해 최근에는 신용카드나 교통카드 및 출입증 등으로 적용범위가 넓어지고 있다.Smart card (SMART CARD), which is widely used in recent years, is an electronic identity card that stores various identification data by mounting IC (Integrated Circuit) memory device inside. Due to advantages such as high security and large capacity of memory, Credit card, transportation card, pass, etc. are expanding the scope of application.

이러한 일반적인 스마트카드는 [도 1c]에 도시된 바와 같이 F-PCB(flexble PCB)(100)상에 IC칩(110)과 센서판(120)등의 각종 소자들 형성되고, 이러한 PCB기 판(100) 외부에 보호필름(300)이 부착되며 다시 그 위에 인쇄필름(400)이 부착된 구조로 이루어진다.Such a general smart card is formed on the F-PCB (flexible PCB) 100 as shown in the various elements such as the IC chip 110 and the sensor plate 120, such a PCB substrate ( 100) The protective film 300 is attached to the outside and made of a structure that is attached to the printing film 400 again.

이때 각종 소자들은 [도 1a]처럼 PCB기판(100) 상에 돌출된 형태로 형성되기 때문에 각 소자(110)(120)와 PCB기판(100) 상면 간에 단차(a)가 형성되는데, 이 상태에서 보호필름(300)을 부착한 후 융착 시킬 경우 상기 단차로 인해 보호필름(300)이 굴곡진 형태가 됨으로 제품 불량이 초래된다.At this time, because the various elements are formed in a form protruding on the PCB substrate 100 as shown in Figure 1a, a step (a) is formed between each element 110, 120 and the upper surface of the PCB substrate 100, in this state When the protective film 300 is attached and then fused, the protection film 300 is curved due to the step, resulting in product defects.

따라서 [도 1b] 및 [도 1c]와 같이 PCB기판(100)상에 일정두께의 높이보상층(200)을 형성시켜 소자(110)(120)와의 단차(a)를 메운 상태에서 보호필름(300)을 부착시키는데,Accordingly, as shown in FIGS. 1B and 1C, a height compensation layer 200 having a predetermined thickness is formed on the PCB 100 to fill the step a with the elements 110 and 120. 300)

이러한 높이보상층(200)은 PVC 등의 수지를 소자의 최대 높이 이상의 두께가 되도록 PCB기판(100) 상에 도포시킨 후 경화한 형태로 이루어진다.The height compensation layer 200 is made of a cured form after applying a resin such as PVC on the PCB substrate 100 to have a thickness of at least the maximum height of the device.

하지만 이렇게 수지형태로 도포됨에 따라 경화과정에서 높이보상층(200)의 표면에 굴곡이 형성될 수밖에 없어, 결국 보호필름(300)도 어느 정도 굴곡질 수밖에 없다.However, as the resin is applied in this manner, the curvature may not only be formed on the surface of the height compensation layer 200 in the curing process, and thus the protective film 300 may also be bent to some extent.

또한 수지도포 후 일정 경화시간이 소요되기 때문에 전체 공정이 길어지는 문제점도 있다.In addition, there is a problem that the entire process is long because a certain curing time is required after the resin coating.

그리고 높이보상층(200)과 보호필름(300) 간 접착은 열융착 방식을 통해 이루어지는데, 융착과정에서 열에 의해 필름이 높이보상층(200)이 녹는 현상으로 인해 보호필름(300)도 함께 우그러지는 현상이 발생된다.And the adhesion between the height compensation layer 200 and the protective film 300 is made through a thermal fusion method, the protective film 300 is also curled together due to the phenomenon that the height compensation layer 200 is melted by heat during the fusion process. Losing phenomenon occurs.

본 발명은 상기와 같은 종래기술의 문제점을 해결하기 위하여 제안된 것으로,The present invention is proposed to solve the problems of the prior art as described above,

높이보상층의 표면이 완벽하게 평평한 상태를 이루도록 하여 보호필름의 굴곡을 방지할 수 있는 스마트카드에 관한 것이다.It relates to a smart card that can prevent the bending of the protective film to achieve a perfectly flat surface of the height compensation layer.

또한 높이보상층의 형성과정에 따른 시간이 최소화 되도록 하여 전체 제작공정 시간을 단축할 수 있는 스마트카드에 관한 것이다.The present invention also relates to a smart card that can shorten the entire manufacturing process time by minimizing the time according to the formation process of the height compensation layer.

그리고 융착과정에서 보호필름의 변형을 방지할 수 있는 스마트카드에 관한 것이다.And it relates to a smart card that can prevent the deformation of the protective film in the fusion process.

상기와 같은 목적을 달성하기 위한 본 발명은,The present invention for achieving the above object,

상면에 IC칩을 비롯한 각 소자들이 돌출 형성된 PCB기판과,PCB board with each element including the IC chip protruded on the upper surface,

상기 PCB기판 상면에 부착되되 소자들의 최대 높이 이상의 두께로 이루어지고 각 소자들이 삽입되는 삽입구가 형성된 높이보상층과,A height compensation layer attached to an upper surface of the PCB and having a thickness greater than or equal to the maximum height of the elements, and having an insertion hole into which each element is inserted;

상기 높이보상층 상에 부착되는 제1보호필름과,A first protective film attached on the height compensation layer;

상기 PCB기판의 하면에 부착되되 IC칩의 인식면이 노출되도록 하기 위한 관통공이 형성된 제2보호필름으로 구성된 것을 특징으로 한다.It is attached to the lower surface of the PCB substrate, characterized in that consisting of a second protective film formed through holes for exposing the recognition surface of the IC chip.

그리고 상기 제1, 2보상필름과 보호필름은 투광성구조로 이루어지고 자외선 경화형 접착제를 통해 부착되는 점도 특징으로 한다.In addition, the first and second compensation films and the protective film are made of a light-transmissive structure and are characterized by being attached through an ultraviolet curable adhesive.

상기와 같은 특징적 구성으로 이루어진 본 발명은,The present invention consisting of the above characteristic configuration,

먼저 높이보상층이 필름형태로 이루어짐과 동시에 각 삽입구에 소자들이 삽입된 상태가 됨에 따라 높이보상층 표면이 거의 완벽하게 평평한 상태를 이룰 수 있음으로 보호필름의 굴곡 현상을 방지할 수 있는 장점이 있다.First, as the height compensating layer is formed in a film form and the elements are inserted into each insertion hole, the surface of the height compensating layer can be almost completely flat, thereby preventing the bending of the protective film. .

또한 높이보상층이 필름형태이므로 기존 수지몰딩구조와 달리 별도의 경화시간 등이 필요 없으므로 전제 제작 공정이 단축되는 장점도 있다.In addition, since the height compensation layer is in the form of a film, unlike the existing resin molding structure, it does not need a separate curing time, there is an advantage that the entire manufacturing process is shortened.

더불어 보호필름과 높이보상층을 투광성 필름형태로 구현함에 따라 PCB기판과 보호필름 및 높이보상층 간의 접착과정에서 열융착이 아닌 UV접착제를 사용해 자외선에 의한 경화가 이루어짐으로, 기존 열융착과정에서 발생되던 PCB기판과 높이보상층, 보호필름의 변형을 방지할 수 있는 장점이 있다.In addition, as the protective film and the height compensation layer are implemented in the form of a light-transmitting film, the bonding between the PCB substrate and the protection film and the height compensation layer is performed by UV curing using a UV adhesive instead of heat fusion. The PCB substrate, the height compensation layer, there is an advantage that can prevent the deformation of the protective film.

이하에서는 도면에 예시된 구성을 참조하여 본 발명의 구체적인 구성 및 그 작용에 대한 실시예를 설명하도록 한다.Hereinafter, with reference to the configuration illustrated in the drawings will be described embodiments of the specific configuration and its operation of the present invention.

본 발명 스마트카드는 [도 5]에 도시된 바와 같이, 크게 PCB기판(100)과 높이보상층(200) 보호필름(300) 및 인쇄필름(400)으로 구성된다.As shown in FIG. 5, the smart card of the present invention is composed of a PCB substrate 100, a height compensation layer 200, a protective film 300, and a printing film 400. As shown in FIG.

먼저 상기 PCB기판(printed circuit board)(100)은 스마트카드의 각종 전기적 부품들이 설치되는 핵심 구성요소로, 자유롭게 구부려지로 휘어질 수 있는 플렉시블PCB(flexble PCB) 형태를 사용하여 휴대과정에서 스마트카드에 휨응력이 작용되더라도 파손의 우려가 없도록 한다.First, the printed circuit board (100) is a key component in which various electrical components of the smart card are installed, and uses a flexible PCB (flexible PCB) form that can be bent and bent freely. Even if bending stress is applied, there is no fear of breakage.

이러한 PCB기판(100)의 구조 및 제작방법은 주지관용의 기술이므로 구체적인 설명은 생략한다.Since the structure and manufacturing method of the PCB substrate 100 is a technology for the main pipe, a detailed description thereof will be omitted.

이러한 PCB기판(100) 상면에는 [도 2]와 같이 핵심부품인 IC칩(110)이 구비되는데, IC칩(110)은 PCB기판 상면에 위치된 상태에서 인식면(112)이 PCB기판(100) 하면을 통해 외부로 노출된 상태가 된다.The upper surface of the PCB substrate 100 is provided with the IC chip 110, which is a core component as shown in FIG. 2, the IC chip 110 in the state that the recognition surface 112 is located on the upper surface of the PCB substrate PCB 100 ) Is exposed to the outside through the lower surface.

그리고 PCB기판(100)에는 필요에 따라 지문인식판(120) 등이 추가로 설치될 수도 있는데, 이러한 지문인식판(120)도 상기 IC칩(110)처럼 PCB기판(100) 상면에 위치된 상태에서 인식면(112)이 하면을 통해 외부로 노출된 상태가 된다.In addition, the fingerprint recognition plate 120 may be additionally installed on the PCB substrate 100 as necessary. Such a fingerprint recognition plate 120 is also located on the upper surface of the PCB substrate 100 like the IC chip 110. In the recognition surface 112 is exposed to the outside through the lower surface.

이러한 IC칩(110)과 지문인식판(120)은 PCB기판(100) 상면으로부터 자체 두께만큼 돌출된 상태로 설치되고 그 주변에는 각종 저항이나 콘덴서 등의 소자(130)들이 돌출된 상태로 구비된다.The IC chip 110 and the fingerprint recognition plate 120 are installed so as to protrude from the upper surface of the PCB substrate 100 by the thickness thereof, and the elements 130 such as various resistors and capacitors are protruded from the periphery thereof. .

따라서 PCB기판(100) 상면과 IC칩(110), 지문인식판(120), 소자(130)들 간에는 단차(a)가 형성된다.Therefore, a step (a) is formed between the upper surface of the PCB substrate 100, the IC chip 110, the fingerprint recognition plate 120, the device 130.

이러한 PCB기판(100)의 상면에는 [도 3] 및 [도 4]에 도시된 것처럼 후술하는 보호필름(300)이 PCB기판 상에 적층되었을 때 상기 단차(a)로 인한 보호필름(300)의 일그러짐을 방지하기 위한 높이보상층(200)이 형성된다.On the upper surface of the PCB substrate 100, the protective film 300 to be described later, as shown in the [Fig. 3] and [Fig. 4] is laminated on the PCB substrate of the protective film 300 due to the step (a) The height compensation layer 200 is formed to prevent distortion.

상기 높이보상층(200)은 합성수지재로 이루어진 얇은 필름형태로 특히 타 재질에 비해 내열성, 내식성 및 전기절연성이 우수한 CPVC(Chlorinated Viniyl Chloride; 염소화 염화비닐수지)재를 사용하는 것이 바람직하며, 자외선이 투과될 수 있도록 투명 또는 반투명 상태로 제작된다.The height compensation layer 200 is a thin film form made of a synthetic resin material, in particular, it is preferable to use a CPVC (Chlorinated Viniyl Chloride (chlorinated vinyl chloride) material) excellent in heat resistance, corrosion resistance and electrical insulation compared to other materials, It is manufactured in a transparent or translucent state so that it can be transmitted.

이러한 높이보상층(200)은 PCB기판(100) 상면에 적층 부착되는데, 이때 높이보상층(200) 중 IC칩(110)과 지문인식판(120) 및 각 소자(130)들이 위치하는 지점마다 해당 부품 면적만큼의 삽입구(210)가 형성된다.The height compensation layer 200 is attached to the upper surface of the PCB substrate 100, wherein the IC chip 110, the fingerprint recognition plate 120 and each element 130 is located in each of the height compensation layer 200. Insertion holes 210 corresponding to the area of the component are formed.

따라서 높이보상층(200)이 적층되었을 때 PCB기판(100)으로부터 돌출된 각 부품들(110)(120)(130)이 높이보상층(200)의 각 삽입구(210)에 삽입되는데,Therefore, when the height compensation layer 200 is stacked, each component 110, 120, 130 protruding from the PCB substrate 100 is inserted into each insertion hole 210 of the height compensation layer 200.

이때 높이보상층(200)의 두께는 PCB기판(100)의 각 부품 중 가장 높은 돌출높이 이상이 되도록 함에 따라 각 부품들(110)(120)(130)이 높이보상층(200) 상면보다 높게 돌출되지 않게 된다.At this time, the thickness of the height compensation layer 200 is higher than the highest protrusion height of each component of the PCB substrate 100, so that each component 110, 120, 130 is higher than the top surface of the height compensation layer 200 It will not protrude.

따라서 이러한 형태로 높이보상층(200)이 구비됨에 따라 각 부품들과 PCB기판(100) 간의 단차(a)가 메워진 상태가 되고, 높이보상층(200)의 상면은 거의 완벽하게 평평한 상태를 이루게 된다.Therefore, as the height compensation layer 200 is provided in this form, a step (a) between each component and the PCB substrate 100 is filled, and the top surface of the height compensation layer 200 is almost completely flat. do.

이러한 높이보상층(200)과 PCB기판(100) 사이에는 자외선이 경화제로 사용되는 UV접착제가 도포되고, 이 상태에서 자외선을 조사하면 높이보상층(200)을 투과하여 UV접착제를 경화시킨다.Between the height compensation layer 200 and the PCB substrate 100 is applied a UV adhesive that is used as a curing agent ultraviolet rays, and when irradiated with ultraviolet rays in this state passes through the height compensation layer 200 to cure the UV adhesive.

이렇게 PCB기판(100) 상에 높이보상층(200)이 적층된 상태에서 [도 4] 및 [도 5]와 같이 높이보상층(200) 상면에는 보호필름(300)이 적층되는데,The protective film 300 is laminated on the upper surface of the height compensation layer 200 as shown in FIGS. 4 and 5 in the state in which the height compensation layer 200 is stacked on the PCB substrate 100.

상기 보호필름(300)은 스마트카드의 외형을 이루는 부분으로, 높이보상층(200) 상면에 위치되는 제1보호필름(310)과 PCB기판(100) 하면 상에 위치되는 제2보호필름(320)으로 구성된다.The protective film 300 is a part forming the external shape of the smart card, the first protective film 310 located on the top surface of the height compensation layer 200 and the second protective film 320 located on the bottom surface of the PCB substrate 100. It is composed of

상기 제1보호필름(310)과 제2보호필름(320)은 높이보상층(200)처럼 얇은 필름형태로, 역시 빛의 투과가 가능하도록 투명이나 반투명을 이루도록 제작되며 역시 UV접착제를 통해 높이보상층(200)과 PCB기판(100) 저면 상에 부착된다.The first protective film 310 and the second protective film 320 in the form of a thin film, such as the height compensation layer 200, also made to form a transparent or translucent so as to allow the transmission of light, and also the height compensation through the UV adhesive The layer 200 and the PCB substrate 100 are attached on the bottom surface.

이렇게 높이보상층(200)과 각 보호필름(300)들이 자외선을 통해 접착되기 때문에, 기존과 같이 열융착 시 가열온도에 의해 수지층표면이나 보호필름 및 PCB기판의 변형이 초래되던 문제점을 해결할 수 있게 된다.Since the height compensation layer 200 and each protective film 300 is bonded through the ultraviolet light, the problem that the deformation of the resin layer surface, the protective film and the PCB substrate may be solved by the heating temperature during heat fusion as before. Will be.

또한 앞에서 설명한 것처럼 높이보상층(200)이 필름형태이고 각 삽입구(210)마다 소자들이 삽입된 상태로 표면이 평평한 상태이기 때문에 결국 제1보호필름(310)도 굴곡지지 않게 된다.In addition, as described above, since the height compensation layer 200 is in the form of a film and the surface is flat with the elements inserted in each insertion hole 210, the first protective film 310 is also not bent in the end.

그리고 앞에서 설명한 것처럼 PCB기판(100)의 저면에는 IC칩(110)과 지문인식판(120)의 인식면(112)이 노출된 상태이고 스마트카드가 완성된 상태에서도 인식을 위해 외부로 노출되어야 하기 때문에, 제2보호필름(320) 중 상기 각 인식면(112)이 위치되는 지점에 관통구(322)를 형성시켜 각 인식면(112)이 외부로 노출될 수 있도록 한다.And as described above, the IC chip 110 and the recognition surface 112 of the fingerprint recognition plate 120 is exposed on the bottom surface of the PCB 100 and should be exposed to the outside for recognition even when the smart card is completed. Therefore, the through holes 322 are formed at the points where the recognition faces 112 are positioned in the second protective film 320 so that the recognition faces 112 can be exposed to the outside.

참고로 강제적이지는 않지만 일반적인 스마트카드의 두께규격이 0.76~0.8mm이기 때문에 이를 감안하여 높이보상층(200)과 각 보호필름(310)(320)의 두께를 설정해야 한다.For reference, it is not mandatory, but the thickness standard of the general smart card is 0.76 ~ 0.8mm, so in consideration of this, the thickness of the height compensation layer 200 and each protective film 310, 320 should be set.

이렇게 상하부에 보호필름(300)이 부착된 상태에서 제1, 2보호필름(310)(320) 상에는 [도 5]와 같이 각종 로고등이 인쇄된 인쇄필름(400)이 부착되며, 인쇄필름(400)도 UV접착제를 통해 보호필름과 접착되어 완성된다.In the state in which the protective film 300 is attached to the upper and lower portions, the printing film 400 printed with various logos is attached to the first and second protective films 310 and 320 as shown in FIG. 400) is also completed by adhering to the protective film through a UV adhesive.

이상 설명한 본 발명의 각 특징들은 당업자에 의해 다양하게 변형되고 조합되어 실시될 수 있으나, 이러한 변형 및 조합이 PCB기판 상에 소자로 인한 단차를 메울 수 있는 높이보상층을 형성시키되, 높이보상층을 필름형태로 구현함과 동시에 각 소자가 내부에 삽입되도록 한 상태에서 보호필름이 부착되고, 더불어 PCB기판 하면의 보호필름에도 IC칩의 인식면이 노출될 수 있는 관통구가 형성되도록 함에 따라, 보호필름의 굴곡현상을 방지함과 더불어 높이보상층의 제작이 손쉬워지도록 한 구성 및 목적과 관련이 있을 경우에는 본 발명의 보호범위에 속하는 것으로 판단되어야 한다.Each of the features of the present invention described above may be variously modified and combined by those skilled in the art, but such modifications and combinations form a height compensation layer that can fill a step caused by a device on the PCB, The protective film is attached while the elements are inserted inside the film and the through holes through which the recognition surface of the IC chip can be exposed are formed on the protective film on the bottom of the PCB. In addition to preventing the bending phenomenon of the film, it should be determined that it is within the protection scope of the present invention when it is related to the configuration and the purpose of making the height compensation layer easy to manufacture.

도 1a 내지 도 1c 는 종래 스마트카드 구조를 나타낸 개략도1A to 1C are schematic diagrams showing a conventional smart card structure

도 2는 본 발명 중 pcb기판과 각 소자 간의 단차형성 상태를 나타낸 개략도Figure 2 is a schematic diagram showing the step formation state between the pcb substrate and each device in the present invention

도 3 은 pcb기판 상에 높이보상층이 적층된 상태를 나타낸 개략도3 is a schematic view showing a state in which a height compensation layer is stacked on a pcb substrate;

도 4 는 높이보상층 상면 및 pcb기판 하면 상에 보호필름이 적층된 상태를 나타낸 개략도Figure 4 is a schematic diagram showing a state in which the protective film is laminated on the upper surface of the height compensation layer and the PCB substrate

도 5 는 각 보호필름 상에 인쇄필름이 적층된 상태를 나타낸 개략도5 is a schematic view showing a state in which a print film is laminated on each protective film;

<도면의 주요부분에 대한 설명><Description of main parts of drawing>

100 : PCB기판 110 : IC칩100: PCB substrate 110: IC chip

120 : 지문감지판 130 : 소자120: fingerprint detection plate 130: device

200 : 높이보상층 210 : 삽입구200: height compensation layer 210: insertion hole

300 : 보호필름 310 : 제1보호필름300: protective film 310: first protective film

320 : 제2보호필름 322 : 관통구320: second protective film 322: through hole

400 : 인쇄필름 400: printing film

Claims (2)

상면에 IC칩을 비롯한 각 소자들이 돌출 형성된 PCB기판과,PCB board with each element including the IC chip protruded on the upper surface, 상기 PCB기판 상면에 부착되되 소자들의 최대 높이 이상의 두께로 이루어지고 각 소자들이 삽입되는 삽입구가 형성된 높이보상층과,A height compensation layer attached to an upper surface of the PCB and having a thickness greater than or equal to the maximum height of the elements, and having an insertion hole into which each element is inserted; 상기 높이보상층 상에 부착되는 제1보호필름과,A first protective film attached on the height compensation layer; 상기 PCB기판의 하면에 부착되되 IC칩의 인식면이 노출되도록 하기 위한 관통공이 형성된 제2보호필름으로 구성된 것을 특징으로 하는 스마트카드.Smart card, characterized in that the second protective film is attached to the lower surface of the PCB substrate is formed with a through hole for exposing the recognition surface of the IC chip. 제 1항에 있어서,The method of claim 1, 상기 높이보상층과 제1, 2보호필름은 투광성구조로 이루어지고 자외선 경화형 접착제를 통해 부착되는 것을 특징으로 하는 스마트 카드.The height compensation layer and the first and the second protective film is made of a light-transmissive structure and a smart card, characterized in that attached via an ultraviolet curable adhesive.
KR1020090097343A 2009-10-13 2009-10-13 Smart card KR101169988B1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105760926A (en) * 2016-02-01 2016-07-13 上海哲山电子科技有限公司 Active smart card manufacturing method and active smart card
CN108491833A (en) * 2018-05-22 2018-09-04 昆山丘钛微电子科技有限公司 A kind of optical finger print module and mobile terminal
KR20190044188A (en) * 2017-10-20 2019-04-30 (주)바이오스마트 Method of Producing Ceramic Cards

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KR101683459B1 (en) 2016-07-26 2016-12-07 주식회사 이에이치아이 Multipurpose card with wireless communication using bluetooth low energy

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105760926A (en) * 2016-02-01 2016-07-13 上海哲山电子科技有限公司 Active smart card manufacturing method and active smart card
KR20190044188A (en) * 2017-10-20 2019-04-30 (주)바이오스마트 Method of Producing Ceramic Cards
CN108491833A (en) * 2018-05-22 2018-09-04 昆山丘钛微电子科技有限公司 A kind of optical finger print module and mobile terminal
CN108491833B (en) * 2018-05-22 2024-03-29 昆山丘钛生物识别科技有限公司 Optical fingerprint module and mobile terminal

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