KR20110019439A - Apparatus for reclaiming glass substrate - Google Patents

Abstract

The glass substrate regeneration device 10 of the present invention is a device that regenerates a substrate to be conveyed by a conveying device in a substantially horizontally supported state, the first alkaline liquid processing portion 12 in order in the conveying direction of a defective substrate. ), An acid liquid processing unit 14, and a second alkaline liquid processing unit 16, wherein the first alkaline liquid processing unit 12 sprays an alkaline liquid onto a defective substrate brought in from the substrate loading unit 11, The resin layer of the uppermost layer is peeled off. The acid solution processing unit 14 injects the acid solution to the defective substrate rinsed by the water rinsing unit 13 to peel off the metal layer of the intermediate layer. The 2nd alkaline liquid process part 16 injects alkaline liquid with respect to the defective board | substrate rinsed by the water rinse part 15, and peels the resin layer of a lowermost layer. According to the glass substrate regeneration apparatus 10, the regeneration process of the glass substrate 2 can be completed in a short time, and the damage of the glass substrate 2 is also suppressed.

Description

Glass substrate recycling apparatus {APPARATUS FOR RECLAIMING GLASS SUBSTRATE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass substrate reproducing apparatus for reproducing a glass substrate from a defective substrate (substrate that does not satisfy the quality standard) generated in the manufacturing process of a color filter used in a liquid crystal display device or the like.

It is sectional drawing which shows an example of the color filter used for a color liquid crystal display device.

The color filter 1 comprises a glass substrate 2, a black matrix (BM) 3 formed thereon, a red colored pixel (R pixel) 4R, and a green colored pixel (G pixel) (4G). And a blue colored pixel (B pixel) 4B (hereinafter referred to as “colored pixel 4” together with each pixel of RGB), a transparent electrode 5 such as indium tin oxide (ITO), and a photo The spacer PS and the vertical alignment VA 7 are provided. As a manufacturing method of the color filter 101 of such a structure, the photolithographic method, the printing method, and the inkjet method are known.

Fig. 16 is a flowchart showing each step of the photolithography method.

First, BM is formed on a glass substrate (S101). Next, after cleaning a glass substrate (S102), apply | coating any colored photoresist of RGB on a glass substrate, and predrying (S103), prebaking is performed in order to dry and harden a colored photoresist on a board | substrate. (S104). Next, the colored photoresist on a substrate is exposed using a photomask (S105), and after developing (S106), the patterned colored photoresist is hardened (S107). The above-described processes of (S102) to (S107) are repeated until the pixels of three colors of R, G, and B are formed on the glass substrate (S108). Thereafter, a transparent electrode is formed on the colored pixel (S109), and then PS and VA are formed on the transparent electrode (S110). Through the above process, the color filter shown in FIG. 15 is manufactured.

In addition, formation of BM on a glass substrate, for example, forms a metal thin film on a glass substrate, and after apply | coating photoresist on a metal thin film, exposure, development, and etching are performed by the photolithographic method, and BM shape The method of forming the pattern of can be employ | adopted. Or a black photoresist is apply | coated on a glass substrate, this black photoresist is exposed and developed by the photolithographic method, and the method of forming the pattern (so-called resin BM) which has a BM shape is employ | adopted.

Moreover, with the enlargement of the glass substrate for color filters, adoption of BM which consists of a metal thin film tends to be avoided. This is because the photolithography method using the black resin photoresist is advantageous in terms of price and environment rather than forming a metal thin film by a vacuum apparatus using a metal such as chromium.

Although the above-described color filter requires high reliability, as shown in FIG. 16, it is necessary to go through a number of processes for its manufacture, and in the meantime, adhesion or mixing of foreign matter such as dust or resin residue, pinholes, pattern distortion, etc. May cause defects. Such a defective substrate is a defective substrate that does not satisfy the quality standard, and lowers the yield. Moreover, with the recent spread of the big screen liquid crystal television, the glass substrate for color filters is enlarged, and the glass substrate whose length of one side is 1 to 2 m in thickness is 1 mm or less is used. Since such glass substrates are easy to break, there is a risk in the disposal of the defective substrate itself.

Therefore, there is a demand for a glass substrate regeneration apparatus capable of regenerating a glass substrate from a defective substrate that does not satisfy the quality standards. The glass substrate regenerated by the glass substrate regeneration apparatus can be reinserted into a manufacturing process.

It is a flowchart which shows the reproduction process of the glass substrate for color filters.

When reproducing a defective substrate (having the same laminated structure as the color filter of FIG. 15) generated after the PS / VA forming process, firstly, the first alkaline liquid treatment (S201), brush cleaning (S202), and water rinse (S203). Are carried out in order, and the PS and VA films in the uppermost layer of a glass substrate are peeled off. Next, an acid solution process (S204) and a water rinse (S205) are performed, and the transparent electrode which is an intermediate | middle layer is peeled off. Next, 2nd alkaline liquid process (S206), brush cleaning (S207), and water rinse (S208) are performed in order, and BM, R pixel, G pixel, and B pixel of the glass substrate surface are peeled. Thereafter, the cleaning residue remaining in a small amount on the glass substrate is removed by brush cleaning (S209), and the glass substrate is dried by dehydration (S210).

18 shows a conventional glass substrate recycling apparatus.

The glass substrate regeneration apparatus 90 performs alkali liquid treatment (S201, FIG. 17 (S206) of FIG. 17) for peeling the resin film (PS, VA, BM, colored pixel) of the defective substrate 1 surface, The storage tank 91, the pump 92, the nozzle 93, the alkaline liquid replenishment tank 94, the peeling liquid replenishment tank 95, and the recovery fan 96 are provided.

The storage tank 91 contains an alkali liquid and a stripping liquid, and stores a treatment liquid in which respective compositions and concentrations have been adjusted in advance. The processing liquid in the storage tank 91 is supplied to the discharge nozzle 93 through the pipe 97 by the pump 92, and is discharged from the discharge nozzle 93 to the defective substrate 1. In parallel with the discharge of the processing liquid, the defective substrate surface is cleaned by a cleaning brush (not shown), and resin films such as PS and VA are peeled off. The defective board | substrate 1 receives peeling process by a process liquid and a cleaning brush, conveying in a predetermined direction at a fixed speed by the conveyer which is not shown in figure.

The processing liquid discharged to the defective substrate 1 and the exfoliated resin (for example, the resin used to form PS and VA) are recovered from the recovery fan 96 to the storage tank 91 through the pipe 100. The recovered resin is discharged from the pipe 102 to the outside after being precipitated in the storage tank 91. Alternatively, a filter may be provided in the storage tank 91 to separate the resin.

The alkali liquid concentration and the peeling liquid concentration in the storage tank 91 are measured at regular time intervals. In the case where concentration deficiency occurs, the alkaline liquid and the stripping liquid are replenished to the storage tank 91 from the alkaline liquid replenishing tank 94 and the stripping liquid replenishing tank 95 through the pipe 98 and the pipe 99, respectively.

In addition to the glass substrate regeneration method shown in FIGS. 17 and 18 described above, several methods have been proposed. For example, Patent Document 1 describes a method of regenerating a glass substrate by immersing a defective substrate in an aqueous solution containing a water-soluble organic amine compound and an inorganic alkali metal compound. In Patent Literature 2, a poor substrate was dipped in concentrated sulfuric acid at a concentration of 98% for 10 minutes, washed with water, immersed in an aqueous alkali solution containing alkyldiol and glycol ether heated to 55 ° C, and rubbed with a sponge (hand rubbed if necessary). The method of performing a) is described. Patent Literature 2 describes a method of peeling an ITO film, an RGB pixel, and a BM by performing a primary acid solution treatment and a secondary acid solution treatment. Patent Document 4 discloses a method of peeling an RGB pixel and a BM by a two-step process comprising a step of pretreating a defective substrate with a pretreatment liquid containing an inorganic acid and a step of posttreating the defective substrate with a stripping solution containing an alkali. It is described.

Japanese Patent Laid-Open No. 2001-124916 Japanese Patent Publication No. 7-230081 Japanese Patent Laid-Open No. 2006-154752 Japanese Patent Laid-Open No. 2002-179438 Japanese Patent Laid-Open No. 2003-279915 Japanese Patent Laid-Open No. 2005-189679

In FIG. 17 mentioned above, PS-VA peeling process (1st alkaline liquid process), transparent electrode peeling process (acid solution process), and RGB pixel-BM peeling process (2nd alkaline liquid process) are described in series, for convenience of illustration. However, since the processing time of each of these processes is different, in reality, each process is performed by an independent batch process. For this reason, much time was spent on the regeneration process of a glass substrate.

Moreover, in the processing method of patent documents 1-4, since the bad substrate needs to be immersed in a processing liquid for 10 minutes-2 hours, there exists a problem that a glass substrate will be damaged. Moreover, since the resin film residue of the lowest layer (glass substrate surface) remains, it is common to perform a polishing process after peeling, and there also exists a problem that the number of process processes increases.

Therefore, an object of this invention is to provide the glass substrate regeneration apparatus which can peel the resin film and metal film on it in a short time, without damaging the glass substrate for color filters.

TECHNICAL FIELD This invention relates to the glass substrate regeneration device which regenerates a glass substrate from a defective substrate, conveying the defective substrate in which the 1 or more layer which consists of either of resin and a metal was formed on the glass substrate. The glass substrate reproducing apparatus is provided downstream of the first alkaline liquid processing unit and the first alkaline liquid processing unit for treating the defective substrate with an alkaline liquid to peel off the first resin layer on the surface of the defective substrate, and the defective substrate with an acid solution. And a first acid liquid treatment portion for separating the metal film on the surface of the defective substrate and downstream of the acid liquid treatment portion, and treating the defective substrate with an alkaline liquid to peel the second resin layer on the surface of the glass substrate. A second alkaline liquid treatment part is provided.

According to the glass substrate reproducing apparatus which concerns on this invention, since peeling process is performed in order, conveying a board | substrate, a glass substrate can be reproduced in a short time. Moreover, it becomes possible to prevent damage to a glass substrate by shortening processing time.

It is sectional drawing which shows an example of the defective board | substrate which arises in a color filter manufacturing process.
It is sectional drawing which shows another example of the defective board | substrate which arises at the color filter manufacturing process.
1C is a cross-sectional view showing another example of a defective substrate produced in a color filter manufacturing process.
1D is a cross-sectional view showing another example of the defective substrate produced in the color filter manufacturing process.
1E is a cross-sectional view showing another example of the defective substrate produced in the color filter manufacturing process.
It is a flowchart which shows the glass substrate regeneration method which concerns on the 1st Embodiment of this invention.
3 is a diagram showing a schematic configuration of a glass substrate reproducing apparatus according to the first embodiment of the present invention.
It is a flowchart which shows the glass substrate recycling method which concerns on 2nd Embodiment of this invention.
It is a figure which shows schematic structure of the glass substrate regeneration device which concerns on 2nd Embodiment of this invention.
FIG. 5B is a diagram showing another example of the glass substrate reproducing apparatus according to the second embodiment of the present invention. FIG.
6 is a diagram showing another example of the glass substrate reproducing apparatus according to the second embodiment of the present invention.
It is a figure which shows schematic structure of the alkaline liquid process part which concerns on 3rd Embodiment of this invention.
8 is a diagram showing another example of the alkaline liquid processing unit according to the third embodiment of the present invention.
It is a perspective view which shows a part of conveyance apparatus which concerns on 4th Embodiment of this invention.
FIG. 10 is a view seen along the line IX-IX of FIG. 9. FIG.
It is a figure which shows the glass substrate recycling apparatus which concerns on 5th Embodiment of this invention.
FIG. 12 is a diagram showing a schematic configuration of the transmissive optical sensor shown in FIG. 11.
It is a figure which shows the glass substrate regeneration device which concerns on 6th Embodiment of this invention.
It is a figure which shows another example of the etching liquid management part which concerns on 6th Embodiment of this invention.
It is sectional drawing which shows an example of the color filter used for a color liquid crystal display device.
Fig. 16 is a flowchart showing each step of the photolithography method.
It is a flowchart which shows the reproduction process of the glass substrate for color filters.
18 shows a conventional glass substrate recycling apparatus.

1A to 1E are cross-sectional views showing examples of defective substrates produced in the color filter manufacturing process.

Here, the defective substrate is a substrate that does not satisfy the quality standards generated in each step of the photolithography method, and includes a resin film (BM, R pixel, G pixel, B pixel, PS, VA) and a metal film (transparent electrode) on the glass substrate. The board | substrate of the state in which one or both sides of () were formed.

The defective substrate 1a shown in FIG. 1A was found by the inspection after the PS-VA formation process, and the BM 3, the RGB colored pixels 4, and metal films such as ITO were formed on the glass substrate 2. It consists of the transparent electrode 5 which consists of PS, the PS6, and VA7.

Moreover, in the manufacturing process of a color filter, film-forming conditions of the metal film for transparent electrodes are derived using the defective board | substrate discovered by the test | inspection.

The defective substrate 1b shown in FIG. 1B is a result of derivation of the film forming conditions of the metal film using the defective substrate shown in FIG. 1A. The defective substrate 1b is formed of a metal film (such as ITO) on the PS 6 and the VA 7. 8) have more.

The defective substrate 1c shown in FIG. 1C is a result of deriving the deposition conditions of the metal film using the defective substrate found after the metal film forming step and before the PS / VA forming step. The back surface of the glass substrate 2 ( The metal film 9, such as ITO, is provided in the BM 3 and the surface on the opposite side to the formation surface of the colored pixel 4).

The defective substrate 1d shown in FIG. 1D has an overcoat layer 33 formed on the colored pixel 4 and a transparent electrode 34 formed on the back surface of the glass substrate 2. The defective substrate 1e shown in FIG. 1E further has a PS 6 and a VA 7 on the overcoating layer 33 of the defective substrate 1d shown in FIG. 1D. The overcoat layer 33 is provided for the purpose of planarization on the colored pixel 4, prevention of the outflow of components in the colored pixel 4, and protection of the colored pixel 4.

Also, a defective substrate can be generated in any process shown in the photolithography method (Fig. 15). Therefore, in addition to the defective substrates shown in FIGS. 1A to 1E, a defective substrate or glass on which the at least one of the BM 3 and the colored pixels 4 (R pixel, G pixel, B pixel) is formed on the glass substrate 2. There is also a defective substrate on which only the BM 3, the colored pixel 4, and the transparent electrode 5 are formed on the substrate 2.

Hereinafter, the glass substrate regeneration device which concerns on each embodiment is demonstrated, referring FIGS. 1A-1E as needed.

(1st embodiment)

It is a flowchart which shows the glass substrate regeneration method which concerns on the 1st Embodiment of this invention.

The glass substrate regeneration method shown in FIG. 2 is suitable for regenerating the glass substrate in the defective substrate 1a having the structure of FIG. 1A. Specifically, the glass substrate regeneration method according to the present embodiment includes the first alkaline liquid treatment step (S11) for peeling the resin films (PS (6), VA (7)) of the uppermost layer, and the metal film (transparent electrode ( 5)) and acid solution processing process (S12) which peels off, and 2nd alkali liquid processing process (S13) which peels the resin film (BM (3) and colored pixel 4) of the lowest layer. Each of these steps (S11) to (S13) is not performed as an independent batch process, but is successively performed on the defective substrate to be conveyed by the conveying device. In addition, after the 2nd alkaline liquid process S13, the final washing process S14 is performed, and regeneration of a glass substrate is completed.

3 is a view showing a glass substrate reproducing apparatus according to the first embodiment of the present invention.

The glass substrate regeneration apparatus 10 is an apparatus which performs a regeneration process with respect to the board | substrate conveyed by a conveying apparatus in the state supported substantially horizontally, The 1st alkaline-liquid process part 12 and the order in the conveyance direction of a defective board | substrate, The acid liquid processing part 14 and the 2nd alkaline liquid processing part 16 are provided.

Moreover, the board | substrate loading part 11 is arrange | positioned upstream of the 1st alkaline liquid process part 12. Moreover, as shown in FIG. Immediately after the first alkaline liquid processing unit 12, the acid liquid processing unit 14, and the second alkaline liquid processing unit 16, the water rinsing rinsing units 13, 15, and 17 are disposed, respectively. Further, downstream of the water rinse portion 17, the final water treatment portion 18 and the glass substrate transporting portion 19 are arranged in this order.

The first alkaline liquid treatment part 12 injects the alkaline liquid onto the defective substrate carried in from the substrate carrying-in part 11 to peel off the resin layers (PS 6 and VA 7 in the uppermost layer). The water washing rinse section 13 removes the alkaline liquid adhered to the defective substrate surface by the first alkaline liquid processing section 12 by washing with water.

The acid solution processing unit 14 sprays the acid solution onto the defective substrate rinsed by the water rinsing unit 13 to peel off the metal layer (the transparent electrode 5 in FIG. 1A) of the intermediate layer. The water washing rinse section 15 removes the acid solution adhered to the defective substrate surface by washing with water in the acid solution treatment unit.

The second alkaline liquid processing unit 16 sprays the alkaline liquid onto the defective substrate rinsed by the water rinsing unit 15 to peel off the lowermost resin layer (BM 3 and colored pixel 4 in FIG. 1A). do. The water washing rinse section 17 removes the alkaline liquid adhering to the defective substrate surface by the second alkaline liquid processing section 16 by washing with water.

The glass substrate 2 rinsed by the water rinse portion 17 is washed again by the final water treatment portion 18, and then discharged from the glass substrate carry-out portion 19.

In the first alkaline liquid processing unit 12, the acid liquid processing unit 14, and the second alkaline liquid processing unit 16, the discharge pressure, the liquid temperature, the discharge time, and the conveyance speed of the substrate can be arbitrarily set. By making these items changeable, the material of each layer (PS (6), VA (7), transparent electrode (5), BM (3), colored pixel (4) on the glass substrate 2 by design change, etc.) Even when the thickness is changed, the optimum conditions for peeling of each layer can be set. Moreover, the brush, a sponge roll, etc. for peeling a layer on a board | substrate are provided in the 1st alkaline liquid processing part 12, the acid liquid processing part 14, and the 2nd alkaline liquid processing part 16 as needed. In addition, the acid solution processing unit 14 may discharge the acid solution to both surfaces of the substrate.

≪ Example 1 >

Hereinafter, the specific processing conditions at the time of using the glass substrate regeneration device 10 shown in FIG. 3 in Example 1 are shown.

An example of the composition of the alkaline liquid used at an alkali treatment process and the acid liquid used at an acid liquid treatment process is as follows.

(1) Alkaline liquid (used in the first alkaline liquid processing part 12 and the second alkaline liquid processing part 16):

8% by weight potassium hydroxide

12% by weight monoethanolamine

Butylcarbitol 15% by weight

Benzyl Alcohol 2% by weight

63% by weight of water

(2) Acid solution (used in acid solution processing unit 14):

Ferric Chloride 35 wt%

Nitric acid 3% by weight

62% by weight of water

Table 1 changes the discharge conditions (temperature, discharge time) of the chemical liquid, and shows the result of evaluating the presence or absence of residues in each layer after the peeling treatment as "(circle): no residue and x: residue". At this time, the discharge pressure of the alkaline liquid in the first and second alkaline liquid processing portions was all 0.1 MPa, and the discharge pressure of the acid liquid in the acid liquid processing portion was 0.15 MPa. In addition, the upward arrow "↑" in a table | surface shows the same thing as the value of an upper row.

As understood from the conditions 9 to 13, when the discharge pressure of the alkaline liquid in the first alkaline liquid treatment is 0.1 MPa, the resin layers PS and VA of the uppermost layer have a liquid temperature of 40 ° C. and a discharge time of 60 seconds or more. Or completely peeled off under a liquid temperature of 30 ° C. and a discharge time of 90 seconds or more, and no residue was generated. In addition, although an alkali liquid invades a glass substrate, in this embodiment, since peeling process is performed in a short time, the influence by an alkaline liquid on the glass base was not seen.

As understood from the conditions 5 to 8, when the discharge pressure of the acid solution is 0.15 MPa, the metal film (transparent electrode) of the intermediate layer has a liquid temperature of 55 ° C., a discharge time of 180 seconds or more, or a liquid temperature of 65 ° C., a discharge time of 150 seconds. It peeled completely on the above conditions, and no residue generate | occur | produced.

As understood from the conditions 1 to 4, when the discharge pressure of the alkaline liquid in the second alkaline liquid treatment is 0.1 MPa, the resin layer (BM, colored pixel) of the lowermost layer has a liquid temperature of 65 ° C. and a discharge time of 240 seconds or more. It peeled completely in conditions, and no residue generate | occur | produced. In addition, although an alkali liquid invades a glass substrate, in this embodiment, since peeling process is performed in a short time, the influence by an alkaline liquid on the glass base was not seen.

(2nd embodiment)

It is a flowchart which shows the glass substrate recycling method which concerns on 2nd Embodiment of this invention.

The method of regenerating the glass substrate shown in Fig. 4 makes the defective substrates 1b to 1e shown in Figs. 1B to 1E reproducible in addition to the defective substrate 1a shown in Fig. 1A. The first acid solution treatment step S21 is further added to the regeneration method (FIG. 2) according to the form.

More specifically, the glass substrate regeneration method according to the present embodiment includes the first acid solution treatment step S21 for peeling the metal film 8 formed by deriving the film forming conditions of the metal film, and the resin film PS (6) of the uppermost layer. 1st alkaline liquid processing process (S22) which peels off VA (7), and 2nd acid liquid processing process (S23) which peels the metal film (transparent electrode 5) of the intermediate | middle layer, and the metal film 9 of the back surface. And a 2nd alkali liquid processing process (S24) which peels off the resin film (BM (3), colored pixel 4) of a lowermost layer. Each of these steps (S21) to (S24) is not performed as an independent batch process, but is successively performed on the defective substrate to be conveyed by the conveying apparatus. In addition, after the 2nd alkaline liquid process S24, the final water washing process S25 is performed.

It is a figure which shows schematic structure of the glass substrate regeneration device which concerns on 2nd Embodiment of this invention.

The glass substrate regeneration apparatus 20a is an apparatus which performs a regeneration process with respect to the board | substrate conveyed by a conveying apparatus in the state supported substantially horizontally, The 1st acid-liquid process part 22a and the 1st acid-liquid process part in order in the conveyance direction of a defective substrate, The 1st alkaline liquid process part 24, the 2nd acid liquid process part 26, and the 2nd alkaline liquid process part 28 are provided. The glass substrate reproducing apparatus 20a is suitable for treating the defective substrates 1a and 1b having the laminated structure shown in Figs. 1A and 1B.

Moreover, the board | substrate carrying-in part 21 is arrange | positioned upstream of the 1st acid-liquid process part 22a. Immediately after the first acid liquid treatment unit 21, the first alkaline liquid processing unit 12, the second acid liquid processing unit 14, and the second alkaline liquid processing unit 16, the water rinse rinsing unit 23, 25, and 27 And (29) are disposed respectively. Moreover, downstream of the water rinse rinse part 29, the final water washing process part 30 and the glass substrate carrying-out part 31 are arrange | positioned in this order.

The first acid treatment unit 22a sprays the acid solution onto the defective substrate carried in from the substrate loading unit 21 to peel off the metal film 8 (FIG. 1B) formed by derivation of the film forming condition. The water washing rinse section 23 removes the acid solution adhering to the defective substrate surface by the first acid treatment unit 21 by washing with water.

The first alkaline liquid treatment part 24 peels off the resin layers PS 6 and VA 7 of the uppermost layer. The water washing rinse section 25 removes the alkaline liquid adhering to the defective substrate surface by the first alkaline liquid processing section 24 by washing with water.

The second acid treatment unit 26 sprays the acid solution on both sides of the defective substrate rinsed by the water rinsing unit 25, and the metal layers (transparent electrode 5 and metal film 9) on both sides of the glass substrate 2 are exposed. ) Peel off. The water washing rinse section 27 removes the acid solution adhered to the defective substrate surface by the second acid treatment unit 26 by washing with water.

The second alkaline liquid treatment unit 28 sprays the alkaline liquid onto the defective substrate rinsed by the water rinsing unit 27 to peel off the lowermost resin layer (BM 3, colored pixel 4). The water washing rinse portion 29 removes the alkaline liquid adhered to the defective substrate surface by the water washing in the second alkaline liquid processing portion 28.

The glass substrate 2 rinsed by the water washing rinse portion 29 is washed again by the final water washing treatment portion 30, and then discharged from the glass substrate carrying out portion 31.

In the above-described first acid liquid processing unit 22a, first alkaline liquid processing unit 24, second acid liquid processing unit 26 and second alkaline liquid processing unit 28, the discharge pressure, the liquid temperature, the discharge time of the processing liquid, the substrate The conveyance speed can be arbitrarily set. By making these items changeable, each layer (PS 6, VA 7, transparent electrode 5, BM 3, colored pixel 4, metal film) on the glass substrate 2 may be changed by design change or the like. Even when the material and thickness of 8) and (9)) are changed, the optimum conditions for peeling of each layer can be set. In addition, the 1st acid liquid processing part 22a, the 1st alkaline liquid processing part 24, the 2nd acid liquid processing part 26, and the 2nd alkaline liquid processing part 28 require a brush, a sponge roll, etc. to peel a layer on a board | substrate. It is installed along.

When the defective substrates 1a and 1b shown in Figs. 1A and 1B are treated in the glass substrate reproducing apparatus 20 according to the present embodiment, the peeling process of each layer varies depending on the laminated structure of the defective substrate.

In the case where the defective substrate 1a shown in FIG. 1A is introduced, the PS 6 and the VA 7 of the uppermost layer are not peeled off in the first acid treatment unit 22a, and a part of the exposed transparent electrode 5 is peeled off. do. Thereafter, as in the first embodiment, each layer is peeled off in order from the first alkaline liquid processing unit 24, the second acid liquid processing unit 26, and the second alkaline liquid processing unit 28, and the glass substrate 2 is regenerated. do.

When the defective substrate 1b shown in FIG. 1B is introduced, the metal layer 8 formed to derive the film forming conditions is peeled off in the first acid solution processing unit 22a. Thereafter, as in the first embodiment, each layer is peeled off in order to the first alkaline liquid processing unit 24, the second acid liquid processing unit 26, and the second alkaline liquid processing unit 28, and the glass substrate 2 is regenerated. .

In addition, although the chemical liquid is sprayed on the back surface of the defective substrate, the second acid liquid processing unit 26 does not provide damage to the defective substrate on which the glass substrate is exposed on the rear surface as shown in FIGS. 1A and 1B. .

FIG. 5B is a diagram showing another example of the glass substrate reproducing apparatus according to the second embodiment of the present invention. FIG.

The glass substrate regeneration apparatus 20b is provided with the first acid liquid treatment portion 22b instead of the first acid liquid treatment portion 22a of the glass substrate regeneration apparatus 20a (FIG. 5A). The first acid treatment unit 22b sprays the acid solution on both sides of the defective substrate 1 carried in from the substrate loading unit 21 to peel off the metal film. The glass substrate reproducing apparatus 20b is suitable for processing FIGS. 1C to 1E in addition to the defective substrates 1a and 1b having the laminated structure shown in FIGS. 1A and 1B.

When the defective substrate 1c shown in Fig. 1C is introduced, the acid solution is injected onto both surfaces of the defective substrate 1c in the first acid solution processing unit 22b, so that the transparent electrode 5 on the surface and the metal film on the back surface ( Both sides of 9) are peeled off. Thereafter, the resin layer of the lowest layer is peeled off from the first alkaline liquid processing unit 28 to regenerate the glass substrate 2.

In the case where the defective substrates 1d and 1e shown in FIGS. 1D and 1E are introduced, the acid solution is injected onto both surfaces of the defective substrate 1d by the first acid solution processing unit 22b, so that the transparent electrode 34 on the back surface thereof. Is peeled off. After that, the resin layer (PS 6, VA 7, overcoating layer 33, BM 3, colored pixel 4) on the glass substrate 2 is peeled off in the first alkaline liquid treatment part 28. The glass substrate 2 is regenerated.

In the structure shown in FIGS. 1C to 1E, a metal film (ITO film) is formed directly on the back surface of the glass substrate 2. When alkali treatment is performed for the first time in this state, the alkaline treatment liquid penetrates into the gap between the crystals of the porous phase of the metal film and the glass substrate 2 is eroded. Since the original glass surface part and the eroded part generate | occur | produce on the back surface of the glass substrate 2, the surface of the glass substrate 2 will become an abrasive glass phase, and the glass substrate 2 will not be reused as a base material. Therefore, in the apparatus of FIG. 5B, an acid-liquid process is performed initially and the metal film formed directly on the surface of the glass substrate 2 is peeled off. When the defective substrates 1c to 1e are introduced into the first acid solution processing unit 22a or 22b, the recycled glass substrate 2 (the state of the small glass) is the second alkaline liquid processing unit 28. ), But because the processing time is short, erosion of the glass substrate 2 is suppressed.

In addition, in the case of regenerating the defective substrates 1c to 1e having the structure shown in FIGS. 1C to 1E, the glass substrate 2 can be regenerated by one acid solution treatment and one alkaline solution treatment. Therefore, the defective substrates 1c to 1e may be introduced into the second acid processing unit 26 from the substrate loading unit 21 instead of being introduced into the first acid processing unit 22a or 22b. On the other hand, when the defective substrates 1c to 1e are directly put into the second acid solution processing unit 26, unnecessary alkaline liquid treatment is not performed, and thus erosion of the substrate can be minimized.

In addition, in the structural example of FIGS. 5A and 5B, although the 2nd acid liquid processing part 26 sprays acid liquid on both surfaces of a defective board | substrate, you may comprise a 2nd acid liquid processing part as follows.

6 is a diagram showing another example of the glass substrate reproducing apparatus according to the second embodiment of the present invention.

The glass substrate reproducing apparatus 20c shown in FIG. 6 is disposed between the first alkaline liquid processing unit 24 and the second alkaline liquid processing unit 28, and a pair of second spraying acid solutions only on one side of the defective substrate. And a pair of water rinsing rinses 27a and 27b disposed immediately after each of the liquid acid processing units 26a and 26b and the second liquid acid processing units 26a and 26b. Further, not shown for inverting the surface and the back surface of the defective substrate between the water rinsing portion 27a and the second acid liquid processing portion 26b and between the water rinsing portion 27b and the second alkaline liquid processing portion 28. Reverse mechanism is installed. Even if it is comprised in this way, like the apparatus of FIG. 4, the metal film 9 formed in the back surface of a glass substrate can be peeled. In addition, in the example of FIG. 6, instead of the first acid liquid processing unit 22a, a first acid liquid processing unit 22b (FIG. 5B) for discharging the acid liquid to both surfaces of the defective substrate may be employed.

As explained above, according to the glass substrate regeneration apparatus 20a and 20b which concerns on this embodiment, it becomes possible to reproduce | regenerate a glass substrate from various kinds of defective substrates, regardless of the laminated structure of a defective substrate.

<Example 2>

Hereinafter, as Example 2, the specific processing conditions at the time of processing the defective substrate which has the laminated structure of FIG. 1B using the glass substrate regeneration apparatus 20a of FIG. 5A are shown. In addition, the alkaline liquid used at the 1st and 2nd alkali treatment process and the acid liquid used at the 1st and 2nd acid liquid treatment process used the same thing as Example 1 mentioned above.

Table 2 changes the discharge conditions (temperature, discharge time) of the chemical liquid, and shows the result of evaluating the presence or absence of residue of each layer after the peeling treatment as "(circle): no residue and x: residue". At this time, the discharge pressure of the alkaline liquid in the first and second alkaline liquid processing portions was all 0.1 MPa, and the discharge pressure of the acid liquid in the first and second acid liquid processing portions was 0.15 MPa. In addition, the upward arrow "↑" in a table | surface shows the same thing as the value of an upper row.

As understood from the conditions 9 to 13, when the discharge pressure of the alkaline liquid in the first alkaline liquid processing unit is 0.1 MPa, the resin layers PS and VA of the uppermost layer are subjected to a liquid temperature of 40 ° C. and a discharge time of 60 seconds or more. Or completely peeled off under a liquid temperature of 30 ° C. and a discharge time of 90 seconds or more, and no residue was generated.

As understood from the conditions 5 to 8, when the discharge pressure of the acid solution in the first and second acid solution processing units is 0.15 MPa, the metal film for derivation of the transparent electrode and the film forming condition has a liquid temperature of 55 ° C. and a discharge time of 180 seconds or more. Or completely peeled off under a liquid temperature of 65 ° C. and a discharge time of 150 seconds or more, and no residue was generated.

As understood from the conditions 1 to 4, when the discharge pressure of the alkaline liquid in the second alkaline liquid treatment is 0.1 MPa, the resin layer (BM, colored pixel) of the lowermost layer has a liquid temperature of 65 ° C. and a discharge time of 240 seconds or more. It peeled completely in conditions, and no residue generate | occur | produced.

(Third embodiment)

It is a figure which shows schematic structure of the alkaline liquid processing unit which concerns on 3rd Embodiment of this invention.

The alkaline liquid processing unit 40a is an apparatus for peeling the resin layers PS 6, VA 7, BM 3, and colored pixels 4 on the glass substrate in order to regenerate the glass substrate from the defective substrate. to be. The alkaline liquid processing unit 40a can be used as one or both of the first and second alkaline liquid processing units included in the glass substrate reproducing apparatus according to the first and second embodiments described above.

The alkaline liquid processing unit 40a is disposed in series along the conveying direction of the defective substrate, and has a pair of processing portions 41a and 41b capable of independently peeling the defective substrate and the alkaline liquid replenishment tank 42 ), A peeling liquid replenishment tank 43, and recovery fans 44a and 44b.

The processing section 41a stores the processing liquid in the storage tank 45a through the storage tank 45a for storing the processing liquid, the nozzle 46a for discharging the processing liquid to the defective substrate, and the pipe 47a to the nozzle 46a. A pump 48a for supplying, and a cleaning brush (not shown) for scrubbing the substrate surface. The processing part 41b is arrange | positioned downstream of the processing part 41a, and supplies the processing liquid to the nozzle 46b through the same storage tank 45b, nozzle 46b, and piping 47b which are provided in the processing part 41a. A pump 48b to supply and a cleaning brush (not shown) are included.

In the processing section 41a, the processing liquid in the storage tank 45a is fed to the nozzle 46a by the pump 48a, and discharged from the nozzle 46a to the bad substrate 1 surface in a shower. Then, a part of the resin layer is peeled off by rubbing the surface of the defective substrate 1 with a cleaning brush (not shown). The processing liquid and the release resin used for cleaning the defective substrate 1 are recovered from the recovery fan 44a to the storage tank 45a through the pipe 49a. The release resin is precipitated in the storage tank 45a and then discharged from the pipe 50a to the outside. Alternatively, the resin in the treatment liquid may be removed by installing a filter mechanism in the middle of the pipe 49a or in the storage tank 45a.

Similarly, in the processing section 41b, the processing liquid in the storage tank 45b is fed from the pump 48b to the nozzle 46b, and discharged from the nozzle 46b to the surface of the defective substrate 1 in the form of a shower. The remaining resin layer is peeled off by rubbing the surface of the defective substrate 1 with a cleaning brush (not shown). The processing liquid and the peeling resin used for washing are recovered from the recovery fan 44b to the storage tank 45b through the pipe 49b. The release resin is precipitated in the storage tank 45b and then discharged from the pipe 50b to the outside. Alternatively, the resin in the treatment liquid may be removed by installing a filter mechanism in the middle of the pipe 49b or in the storage tank 45b.

In the storage tank 45a and 45b, the process liquid adjusted to the predetermined density | concentration is stored, and the process liquid density | concentration inside it is monitored by a measuring device not shown in every fixed time. When the concentration of the processing liquid in the storage tank 45a decreases, the alkaline liquid and the stripping liquid from the alkaline liquid replenishment tank 42 and the stripping liquid replenishment tank 43 to the storage tank 45a through the pipes 51a and 52. By supplementing this, the concentration of the treatment liquid in the storage tank 45a is adjusted. On the other hand, when the process liquid concentration in the storage tank 45b falls, the alkali liquid is replenished from the alkali liquid replenishment tank 42 to the storage tank 45b via the piping 51b, and the process liquid concentration in the storage tank 45b is adjusted. do.

In addition, the following structure may be employ | adopted instead of the alkali treatment unit 40a shown in FIG.

8 is a diagram showing another example of the alkaline liquid processing unit according to the third embodiment of the present invention.

The alkaline liquid processing unit 40b uses the alkaline liquid supplement tanks 42a and 42b and the peeling liquid supplement tanks 43a and 43b to the same treatment sections 41a and 41b as those shown in FIG. It is installed.

In the alkali treatment unit 41b of FIG. 8, when the concentration of the treatment liquid in the storage tanks 45a and 45b is lowered, from the alkali liquid replenishment tanks 42a and 42b, through the pipes 51a and 51b, An alkaline liquid is supplied to the storage tanks 45a and 45b. In addition, the peeling liquid is supplied to the storage tanks 45a and 45b through the piping 52a and 52b in the peeling liquid replenishment tank 43a and 43b.

In the alkali treatment units 40a and 40b shown in Figs. 7 and 8, at least one of the composition or the concentration of the treatment liquid differs between the treatment portion 41a and the treatment portion 41b. In the structure of FIG. 7, the composition of the process liquid used by the process part 41a and 41b changes by mixing a peeling solution only to the process liquid used by the process part 41a of an upstream. Moreover, the alkali liquid concentration contained in the process liquid used by the downstream process part 41b is made low compared with the process part 41a, (FIG. 7 and FIG. 8), or peeling liquid contained in the process liquid used by the process part downstream. The concentration may be lower than that of the processing section 41a (FIG. 8).

In this way, when the concentration of the processing liquid (alkaline liquid concentration, stripping liquid concentration) is lowered from the upstream to the downstream, an alkaline liquid or a stripping liquid can be used efficiently. That is, in the initial stage of the alkaline liquid treatment with the highest amount of resin to be peeled off, the peeling treatment is strongly performed with a relatively high concentration of the treatment liquid, and the peeling treatment is performed with the low concentration treatment liquid in the stage after the peeling treatment proceeds and the resin amount decreases. As a result, since the usage-amount of alkaline liquid and a peeling liquid can be reduced compared with the case of using the process liquid of a fixed density | concentration, the cost required for glass substrate regeneration can be reduced. Moreover, the time which a glass substrate is exposed to a high concentration process liquid can be shortened by gradually decreasing the density | concentration of a process liquid, As a result, the damage of a glass substrate by an alkali component can be prevented.

In addition, although the above description has described an example in which the defective substrate is processed by a combination of the ejection of the processing liquid from the nozzles 46a and 46 and the scrubbing with the cleaning brush, the processing units 41a and 41b are described. As the peeling treatment part of the resin layer, all the structures can be adopted. For example, after a process liquid is sprayed to a defective board | substrate by predetermined pressure, peeling a resin film to some extent, you may wash | clean by rubbing a surface with a sponge. It is also possible to use a sponge roll instead of the cleaning brush. Alternatively, the defective substrate may be conveyed in a state of being immersed in the processing liquid, and then the processing liquid may be sprayed onto the defective substrate at a high pressure to peel and remove the resin film.

In the example of FIGS. 7 and 8, an example in which an alkali treatment unit is configured using two treatment portions 41a and 41b has been described. However, a plurality of treatment portions may be arranged in series, and the number of treatment portions is two or more. Can be any.

<Examples 3 to 6>

Hereinafter, when the alkali liquid processing unit 40a of FIG. 7 is used as Examples 3-6 (more specifically, the 1st alkaline liquid process part 12 and the 2nd alkaline liquid of the glass substrate regeneration apparatus shown in FIG. 3). The specific process conditions of the alkaline liquid processing unit 40a of FIG. 7 to the process part 16 are shown. Moreover, as a comparative example, the processing conditions in the case of using the glass substrate regeneration device of the structure shown in FIG. 18 are shown. In addition, the nozzle shown in FIG. 18 connects the nozzle shown in FIG. 7 in series.

As the substrate to be treated, one having BM, a colored pixel, an ITO transparent electrode, PS, and VA formed on a glass substrate (size: 2160 mm x 2460 mm, thickness: 0.7 mm) made of alkali-free glass was used (Fig. 1a).

The composition of the alkaline liquid was as follows. The same treatment liquid was used in the first alkaline liquid treatment part 12 and the second alkaline liquid treatment part 16.

(1) Treatment liquid 1 (for upstream treatment portion 41a):

Inorganic alkali (potassium hydroxide) 11% by weight

20% by weight of organic alkali (monoethanolamine triethanolamine)

Glycol ether 28% by weight

Benzyl alcohol 8% by weight

33% by weight of water

(2) Processing liquid 2 (for downstream processing part 41b)

Inorganic alkali (potassium hydroxide) 11% by weight

89% by weight of water

The temperature of the process liquid in a 1st and 2nd alkaline liquid process part was as follows.

(1) Example 3: 55 degreeC

(2) Example 4: 45 degreeC

(3) Example 5: 60 ° C

(4) Example 6: 65 ° C

In addition, the process in the 1st alkaline liquid process part and the 2nd alkaline liquid process part was performed as follows. While discharging the processing liquid of the above temperature from the nozzle to the shower with a discharge pressure of 0.1 MPa, the substrate to be processed was cleaned with a brush, and the resin tanks (PS, VA, BM, colored pixels) were peeled off. The conveyance speed of the board | substrate was 1000 mm / min, and the processing time by the processing part of an upstream and downstream was made into 90 second (total processing time of 180 second).

(Comparative Example)

In the comparative example, the processing liquid of the same composition as the said processing liquid 1 was used. While discharging the treatment liquid at 55 ° C. from the nozzle to the shower at a discharge pressure of 0.1 MPa, the substrate to be treated was washed with a brush to remove and remove the PS and VA. The conveyance speed of the board | substrate was 1000 mm / min, and processing time was 180 second.

In addition, in the acid-liquid treatment process, the transparent electrode film was peeled and removed using the well-known processing apparatus or process liquid.

The glass substrates regenerated in Examples 3 to 6 and Comparative Examples were subjected to visual inspection to confirm the presence or absence of non-uniformity, to detect indium by elemental analysis, and to measure surface roughness. Also in the glass substrate reproduced anywhere in Examples 1-4 and a comparative example, the adhesion of a residue, the nonuniformity, and the detection of indium were not seen. The surface roughness of the glass substrate was 0.501 nm in Examples 3 to 6 and 0.544 nm in the comparative example, and all of them satisfied the quality standards of the glass substrate. As described above, in Examples 3 to 6, the alkaline liquid treatment part was divided into two parts, an upstream treatment part and a downstream treatment part, and a treatment liquid having a low alkali concentration was used in the downstream treatment part. It was confirmed that it could.

(4th embodiment)

FIG. 9 is a perspective view showing a part of the conveying apparatus according to the fourth embodiment of the present invention, and FIG. 10 is a view seen from the line IX-IX of FIG. 9.

The conveying apparatus 60 is equipped with the some roller 61 which supports the lower surface of the defective board | substrate 1 in each upper end part, and the drive mechanism (not shown) which rotates each of the rollers 61 around a central axis. do. Each of the rollers 61 is disposed at predetermined intervals such that the central axes are parallel to each other, and the defective substrate (in the direction in which the respective central axes are continuous by the rotation by the drive mechanism (left and right directions in FIGS. 9 and 10). Return 1).

Moreover, below the upper end of the roller 61, the squeegee 62 for scraping off the liquid 62 adhering to the roller 61 is provided. The squeegee 62 has an elongated plate shape extending in the axial direction of the roller 61, and is fixed in a state in which one of the squeegees 62 is in contact with the outer surface of the roller 61. Below the contact portion of the squeegee 62 and the roller 61, a liquid receiving portion 63 for receiving the liquid 67 scraped off by the squeegee 62 and falling down is provided as shown in FIG. . The liquid 67 picked up by the liquid receiving portion 63 is stored in the recovery tank 64.

In order to process the defective substrate 1 moving on the roller 61, the processing liquid 66 is discharged from the nozzle 65 to the defective substrate 1. The liquid containing the discharged processing liquid and the material of each of the layers to be peeled off is attached to the roller 61 while falling down to the lower surface of the defective substrate 1.

As described in the above-described first and second embodiments, the glass substrate regeneration apparatus according to the present invention is not an immersion method in which a plurality of defective substrates are integrated and immersed in the processing liquid, but sequentially processed while conveying the defective substrates one by one. The single sheet conveying system to be used is employ | adopted. In this single sheet conveying method, there is a problem in that a resist, ITO, or the like peeled off by the regeneration treatment is adhered to the roller 61, and then retransferred and adhered to the regenerated substrate to be foreign material. Therefore, in the conventional water washing step, in addition to necessitating washing by spraying water on both sides of the substrate, it is necessary to clean the conveying apparatus at short intervals, resulting in a problem of poor maintainability.

In the conveying apparatus 60 which concerns on this embodiment, since the squeegee 62 is in contact with the surface of the roller 61, the liquid adhering to the surface of the roller 61 with the rotation of the roller 61 is removed. As a result, reattachment of a remover to a glass substrate can be suppressed, and it can prevent that the remover in one process enters another process. In the glass substrate regeneration treatment by the sheet conveying method, since the acid treatment and the alkali treatment are alternately performed, mixing of the removed product in one step and the treatment liquid in the next step causes a decrease in peeling capacity and generation of precipitates. In some cases, according to the conveying apparatus 60 which concerns on this embodiment, such a problem can be prevented. Moreover, since the liquid 67 scraped off from the roller 61 can be collect | recovered efficiently, the maintenance property of the conveying apparatus 60 and the load on a filter can also be reduced. In addition, it becomes possible to significantly reduce the amount of water used at the time of washing with water.

The material of the squeegee 62 may be any material that does not react with the treatment liquid. An elastomer, ultra high molecular weight polyethylene, polyacetal, polytetrafluoroethylene, or the like may be used. In particular, since the squeegee 62 is fixed in the pressed state to the roller 61, it is preferable to use a material excellent in wear resistance.

In addition, although the squeegee 62 can also be provided with respect to all the rollers 61, it is efficient to provide it with respect to the some roller 61 centering on the part in which a lot of liquid protrusions generate | occur | produce.

In addition, in the conveying apparatus 60, the upper roller which presses the board | substrate to be conveyed from the top may be further provided in addition to the roller 61 which instruct | indicates the lower surface of a board | substrate. A squeegee can also be attached also to this upper roller. In this way, since the liquid adhered to the upper roller can be removed, the effect obtained when the squeegee 62 is attached to the roller 61 can be further improved.

(Fifth Embodiment)

FIG. 11 is a view showing a glass substrate reproducing apparatus according to a fifth embodiment of the present invention, and FIG. 12 is a diagram showing a schematic configuration of a transmissive optical sensor shown in FIG. 11. In addition, in FIG. 11, an arrow shows the conveyance direction of a board | substrate.

The glass substrate reproducing apparatus according to the present embodiment classifies the conveyance destination of the defective substrate on the basis of the determination unit 70 that determines whether or not there is a transparent electrode on the defective substrate and the determination result by the determination unit 70. A classification unit 71 is further provided.

The determination unit 70 includes a light transmissive sensor 72 that detects a transmittance of light of a predetermined wavelength at a plurality of points on the defective substrate. The light transmissive sensor 72 detects the light source 73a for emitting light of the first wavelength, the light source 73b for emitting light of a second wavelength different from the first wavelength, and the intensity of light of the first wavelength. The optical sensor 74a and the optical sensor 74b which detect the intensity of the light of a 2nd wavelength are provided. The determination part 70 senses the transmittance | permeability of several points on the small glass part (part not covered by BM and colored pixel) among the defective board | substrates 1 using the light transmissive sensor 72, and transparent electrode 5 ) Is determined.

Specifically, 450 nm in the blue region and 600 nm in the green region are used as the first wavelength and the second wavelength. When the transmittance of the light emitted from the light sources having these wavelengths and transmitted only through the glass substrate 2 is 100%, the transmittance of the light transmitted through both the transparent electrode 5 and the glass substrate 2 is 92 to 95%. Therefore, the presence or absence of a transparent electrode can be judged when the transmittance | permeability of these 2 wavelengths is detected in several points on the defective board | substrate 1.

When the determination unit 70 determines that a transparent electrode exists on the defective substrate, the classification unit 71 feeds the defective substrate into the first alkaline liquid processing unit 12. Therefore, in this case, each layer is peeled off in order through the first alkaline liquid processing part 12, the acid liquid processing part 14, and the 2nd alkaline liquid processing part 16, and the glass substrate is regenerated in this case. On the other hand, when the determination part 70 determines that a transparent electrode does not exist on a defective board | substrate, the classifying part 71 throws a defective board | substrate into the 2nd alkaline liquid process part 16. As shown in FIG. Therefore, in this case, the inserted defective substrate is subjected to the peeling treatment only on the second alkaline liquid treatment part 16, and the glass substrate is regenerated.

As described above, in the manufacturing process of the color filter, a defective substrate having various laminated structures occurs. On the other hand, the process of a glass substrate regeneration process is roughly divided into the alkali liquid process which peels a resin resist, and the acid process which peels a metal film (transparent electrode). A defective substrate having no metal film, i.e., a defective substrate in which part or all of the BM-colored pixels are formed on the glass substrate can be regenerated by simply performing a second alkaline liquid treatment. It is necessary to perform the first alkaline liquid treatment or the acid liquid treatment that are not originally necessary.

According to the glass substrate regeneration device according to the present embodiment, the retardation process of the retardation substrate which does not require acid treatment can be efficiently performed by dividing the retardation substrate by paying attention to the presence or absence of the transparent electrode on the retardation substrate. In addition, by not performing unnecessary acid treatment on the defective substrate without a transparent substrate, it is possible to suppress the acid solution from being unnecessarily introduced into the second alkaline liquid treatment unit. Therefore, the degradation rate of the process liquid of a 2nd alkaline liquid process part can be slowed down.

In addition, although this embodiment demonstrated the example which added the determination part 70 and the fractionation part 71 to the glass substrate regeneration apparatus which concerns on 1st Embodiment, it is similarly true about the glass substrate regeneration apparatus which concerns on 2nd Embodiment. It is also possible to add the determination unit 70 and the classification unit 71.

(6th Embodiment)

It is a figure which shows the glass substrate regeneration device which concerns on 6th Embodiment of this invention.

In addition to the glass substrate regeneration device 10 according to the first embodiment, the glass substrate regeneration device according to the present embodiment further includes an etching solution management portion 75a and an etching solution supply discharge portion 81.

The etching liquid management unit 75a includes a contact surface shape measuring unit 76 for measuring the film thickness of the transparent electrode on the defective substrate surface, and a cumulative calculation / determination unit 77 for calculating the total of the measured film thicknesses. .

The contact surface shape measuring unit 76 scans the transparent electrode film surface on the substrate to be treated with a contact needle, and measures the film thickness of the transparent electrode film based on the step between the glass substrate and the transparent electrode film surface. The needle pressure during this measurement is about 3 mg and the injection rate is about 50 μm / sec.

The cumulative calculation / determination unit 77 calculates the cumulative film thickness by integrating the film thickness of the transparent electrode film on each substrate measured by the contact surface shape measuring unit 76. The cumulative calculation / determination unit 77 compares the reference value (the preset value) indicating the cumulative film thickness serving as a reference for replenishment or replacement of the etching solution with the cumulative film thickness calculated, and the calculated cumulative film thickness exceeds the reference value. It is determined whether or not. If the calculated cumulative film thickness exceeds the reference value, the cumulative calculation / determination unit 77 instructs the acid liquid treatment unit 14 and the etching liquid supply and discharge unit 81 to replenish or replace the etching liquid via the transfer path 80. do.

The etching liquid supply discharge part 81 is provided with the filter 82, the pump 83, the relay tank 84, the solenoid valve 85, and the flowmeter 86 connected in this order through piping. The filter 82 is connected to the storage tank 79 in the acid solution processing unit 14 via a pipe 89. The etchant supply pipe 87 is connected to the flowmeter 86, and the waste tank discharge pipe 88 is connected to the relay tank 84.

When supplying etching liquid to the acid liquid processing unit 14, the etching liquid supplied through the pipe 87 is temporarily stored in the relay tank 84, and then the etching liquid in the relay tank 84 is stored using the pump 83. Send to (79). On the other hand, when the etching liquid of the acid solution processing unit 14 is discharged, the etching liquid in the storage tank 79 is once discharged to the relay tank 84, and then discharged from the relay tank 84 to the outside through the pipe 88.

As etching liquid for peeling transparent electrodes, such as ITO, the mixed liquid of hydrochloric acid and nitric acid, the mixed liquid of ferric chloride and hydrochloric acid, and acid solutions, such as dilute hydrochloric acid, are used, for example. Since the etching solution is immediately fatigued every time the peeling treatment is performed, it is necessary to replenish or replace at an appropriate time. The film thickness of the transparent electrode on the defective board | substrate which arose in the manufacturing process of a color filter is about 140 nm normally. Therefore, when the film thickness of the transparent electrode of all the defective board | substrates is substantially constant, the time of replenishment or update of this etching liquid can be calculated by counting the number of the defective board | substrate put into an acid-processing part.

However, in reality, some substrates to be processed have a film thickness of the transparent electrode that is much larger than the thickness formed in a normal manufacturing process.

In more detail, when the sputtering device for forming the transparent electrode film is temporarily stopped for maintenance or the like, and then restarted, the film forming conditions are set in advance by using a glass substrate for deriving film forming conditions (hereinafter referred to as a "dummy substrate"). Check it. This dummy substrate is repeatedly used for deriving film forming conditions, and is then subjected to the peeling treatment of the laminated transparent electrode films to regenerate the glass substrate.

The thickness of the transparent electrode film on the dummy substrate is several times to several tens of the usual film thickness. Therefore, when the dummy substrate is placed in the acid solution processing unit, the fatigue of the etching solution proceeds very quickly regardless of the number of sheets. As a result, the processing capability by the acid solution treatment unit may be lowered, which may cause a defective removal of the transparent electrode film.

Therefore, the glass substrate reproducing apparatus according to the present embodiment manages the degree of etching of the etching solution based on the actual thickness of the transparent electrode film formed on the substrate fed into the acid treatment unit by the etching solution management unit 75a, and at the appropriate timing. Replenish or replace.

The maximum amount (volume) of the transparent electrode film that can be peeled off with a certain amount of etching liquid (having a predetermined composition) is approximately constant. Therefore, when the area of the substrate to be processed and the transparent electrode film is constant, if the area of the transparent electrode film and the composition and amount of the etching solution are known, the etching ability (reference value) of the etching solution can be expressed by the thickness of the transparent electrode film. Therefore, the cumulative calculation / determination 77 accumulates the thickness measured using the contact surface shape measuring unit 76, so that the timing of replenishment and replacement of the appropriate etching solution can be grasped.

Moreover, even if the magnitude | size of a glass substrate is not fixed, the following structures can also be employ | adopted so that management of etching liquid can be carried out.

It is a figure which shows another example of the etching liquid management part which concerns on 6th Embodiment of this invention.

The etching liquid management unit 75b further includes an area measuring unit 78 in addition to the configuration of the etching liquid management unit 75a shown in FIG. 13. The area measuring unit 78 measures the area of the substrate to be introduced, and outputs the measured area to the cumulative calculation / determination unit 77. In addition, various well-known methods, such as a method of calculating an area by analyzing the image image | photographed with a camera, can be used for the measurement of the area by the area measuring part 78. FIG.

The cumulative calculation / determination unit 77 calculates a value obtained by multiplying the thickness of the transparent electrode film on any substrate measured by the contact surface shape measuring unit 76 by the area of the substrate of any corresponding substrate measured by the area measuring unit 78. do. The cumulative calculation / decision unit 77 calculates the cumulative value by integrating the value (corresponding to the volume) obtained by multiplication. In addition, the cumulative calculation / determination unit 77 uses a maximum amount (corresponding to a value obtained by multiplying the film thickness and area of the transparent electrode film) of the peelable transparent electrode film as a value indicating a reference for refilling or replacing the etching solution. When the cumulative calculation / determination unit 77 determines that the calculated cumulative value has exceeded this reference value, the etching liquid is replenished or replaced by the acid solution processing unit 14 and the etching liquid supply and discharge unit 81 through the transfer path 80. To indicate.

When the glass substrate regeneration device is configured by using the etching liquid management unit 75b of FIG. 14, even when the size of the defective or dummy substrate to be injected into the acid solution processing unit 14 changes, the timing of replenishing or replacing the etching liquid is assuredly. It can be determined.

In addition to the above-described configuration of FIGS. 13 and 14, it is preferable to configure the acid liquid treatment unit 14 as follows.

In general, the time required for etching increases with the fatigue of the etching solution. On the other hand, the reactivity of etching is improved by raising the temperature of etching liquid.

Therefore, a temperature raising device is provided at any one of the acid solution processing sections 14, and the liquid temperature is raised step by step in accordance with the degree of fatigue of the etching liquid. The fatigue degree of etching is defined by the quantity (volume) of the peeled transparent electrode film, and sets the liquid temperature corresponding to each of several threshold value and a threshold value in steps. Then, it is determined whether the cumulative value obtained by the cumulative calculation / determination unit 77 exceeds the set threshold value. When it is determined that the calculated cumulative value has exceeded a certain threshold value, the cumulative calculation / determination unit 77 instructs the acid solution processing unit 14 to raise the temperature of the etching liquid to the liquid temperature set to the predetermined threshold value.

As an example, when the etching liquid is managed at the cumulative film thickness as in the configuration of FIG. 13, as shown in Table 3 below, the values (critical values) of the cumulative cumulative film thicknesses and the liquid temperatures corresponding thereto are set. When the cumulative film thickness calculated by the cumulative calculation / determination unit 77 exceeds each threshold value, the processing time can be kept constant by increasing the liquid temperature, and the tired etching solution can be used efficiently.

In addition, when the etching liquid is managed based on the cumulative value of the value multiplied by the film thickness and the substrate area, as shown in the configuration of FIG. Corresponding to a value multiplied by thickness and area) may be set as a threshold value.

In addition, it is preferable that the etching liquid management parts 75a and 75b stop operation | movement of each processing part upstream and downstream of the acid liquid processing part 14, when the calculated total value exceeds the predetermined reference value. In this case, when replacing the etching liquid in the storage tank 79, it can prevent that a board | substrate is conveyed from the upstream apparatus, or the board | substrate which has not completed acid-liquid process is conveyed to a downstream apparatus.

In addition, the structure which concerns on each above-mentioned embodiment can be arbitrarily combined. That is, in the glass substrate regeneration apparatus according to the first and second embodiments, the alkaline liquid processing unit according to the third embodiment, the conveying apparatus according to the fourth embodiment, the sorting mechanism according to the fifth embodiment, and the sixth embodiment Any of several etching liquid (acid liquid) management mechanisms can be combined as possible.

INDUSTRIAL APPLICABILITY The present invention can be used for a glass substrate reproducing apparatus for reproducing a glass substrate from a defective substrate produced in a color filter manufacturing process such as a liquid crystal display device.

1: bad substrate
2: glass substrate
3: black matrix (BM)
4: coloring pixel
5: transparent electrode
6: Photo Spacer (PS)
7: vertical alignment
8: metal film
9: metal film
10: glass substrate regeneration device
12: first alkaline liquid treatment unit
14: acid processing unit
16: 2nd alkaline liquid processing part
20: glass substrate recycling apparatus
22: first acid solution processing unit
24: first alkaline liquid treatment unit
26: second acid processing unit
28: second alkaline liquid treatment unit
40: alkaline liquid processing unit
41: processing unit
60: conveying device
61: roller
62: squeegee
70: judgment unit
71: classification
75: etching solution management unit
76: surface shape measurement unit
77: Cumulative Output / Decision
81: etching liquid supply discharge part

Claims (6)

A glass substrate regeneration device for reproducing the glass substrate from the defective substrate while conveying a defective substrate having at least one layer made of any one of resin and metal on the glass substrate,
A first alkaline liquid processing unit for treating the defective substrate with an alkaline liquid to peel the first resin layer on the surface of the defective substrate;
A first acid liquid processing unit disposed downstream of the first alkaline liquid processing unit and treating the defective substrate with an acid solution to peel a metal film on the surface of the defective substrate;
It is provided downstream of the said acid-liquid treatment part, The glass substrate regeneration apparatus provided with at least the 2nd alkaline liquid process part which processes the said bad substrate with alkaline liquid, and peels off the 2nd resin layer on the surface of the said glass substrate. The glass substrate reproducing apparatus according to claim 1, further comprising a second acid liquid treatment portion provided upstream of the first alkaline liquid treatment portion to treat the defective substrate with an acid solution to peel a metal layer on the surface of the defective substrate. . The glass substrate regeneration device according to claim 1, wherein a plurality of processing means for treating the substrate with the alkaline liquid are provided in series on at least one of the first and second alkaline liquid processing portions. 2. A conveyance mechanism as set forth in claim 1, further comprising a conveying mechanism including a plurality of rollers supporting a lower surface of the defective substrate at each upper end portion, each conveying the defective substrate by rotating about a central axis,
And a squeegee disposed below the upper end of the roller and contacting an outer surface of the roller to remove liquid from the surface of the roller. The method according to claim 1, wherein before transmitting the defective substrate to the glass substrate reproducing apparatus, a transmittance of light having a predetermined wavelength at a plurality of points on the defective substrate is detected, and the metal layer is formed on the defective substrate based on a detection result. A judging section for judging whether there is any;
When it is determined by the determining unit that the metal layer is on the defective substrate, the defective substrate is put into the first alkaline liquid processing unit, and when it is determined by the determining unit that there is no metal layer on the defective substrate. And a fractionation unit for introducing the defective substrate into the second alkaline liquid processing unit. The contact surface shape measurement part of Claim 1 which measures the thickness of the said metal layer on a surface with respect to each of the said bad substrates put into a said 1st acid-liquid treatment part,
The cumulative film thickness is calculated by integrating the thickness of the metal layer measured by the contact surface shape measuring unit, and the treatment time and the treatment temperature by the first acid treatment unit are controlled according to the calculated cumulative film thickness, and the calculated cumulative total thickness is calculated. And a cumulative calculation / determination unit for stopping the upstream and downstream processing sections of the first acid-liquid treatment section when the film thickness exceeds a predetermined value.

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