KR20110014569A - 반도체 다이의 픽업 장치 및 픽업 방법 - Google Patents

반도체 다이의 픽업 장치 및 픽업 방법 Download PDF

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Publication number
KR20110014569A
KR20110014569A KR1020107023438A KR20107023438A KR20110014569A KR 20110014569 A KR20110014569 A KR 20110014569A KR 1020107023438 A KR1020107023438 A KR 1020107023438A KR 20107023438 A KR20107023438 A KR 20107023438A KR 20110014569 A KR20110014569 A KR 20110014569A
Authority
KR
South Korea
Prior art keywords
semiconductor die
holding sheet
lid
suction opening
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020107023438A
Other languages
English (en)
Korean (ko)
Inventor
오키토 우메하라
신이치 사사키
Original Assignee
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20110014569A publication Critical patent/KR20110014569A/ko
Withdrawn legal-status Critical Current

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    • H10P72/74—
    • H10P72/0442—
    • H10P72/7402—
    • H10P72/7414—
    • H10P72/7416—

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
KR1020107023438A 2008-05-07 2008-06-26 반도체 다이의 픽업 장치 및 픽업 방법 Withdrawn KR20110014569A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-121460 2008-05-07
JP2008121460A JP4198745B1 (ja) 2008-05-07 2008-05-07 半導体ダイのピックアップ装置及びピックアップ方法

Publications (1)

Publication Number Publication Date
KR20110014569A true KR20110014569A (ko) 2011-02-11

Family

ID=40239520

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107023438A Withdrawn KR20110014569A (ko) 2008-05-07 2008-06-26 반도체 다이의 픽업 장치 및 픽업 방법

Country Status (4)

Country Link
JP (1) JP4198745B1 (enExample)
KR (1) KR20110014569A (enExample)
TW (1) TW200946427A (enExample)
WO (1) WO2009136450A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG163493A1 (en) 2009-01-22 2010-08-30 Esec Ag Die ejector
JP4397429B1 (ja) 2009-03-05 2010-01-13 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
US9038264B2 (en) * 2011-02-28 2015-05-26 Sandisk Semiconductor (Shanghai) Co., Ltd. Non-uniform vacuum profile die attach tip
TWI485786B (zh) * 2012-04-16 2015-05-21 Gallant Micro Machining Co Ltd Grain Stripping Method and Device
CN108962807B (zh) * 2018-09-07 2024-08-30 先进光电器材（深圳）有限公司 自动抓取机构
CN113109357B (zh) * 2021-04-09 2021-11-23 徐州盛科半导体科技有限公司 一种可拆卸的半导体分析装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003264203A (ja) * 2002-03-11 2003-09-19 Hitachi Ltd 半導体装置の製造方法
JP4457715B2 (ja) * 2003-04-10 2010-04-28 パナソニック株式会社 チップのピックアップ装置およびピックアップ方法
JP3999744B2 (ja) * 2004-01-05 2007-10-31 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置

Also Published As

Publication number Publication date
TW200946427A (en) 2009-11-16
JP4198745B1 (ja) 2008-12-17
WO2009136450A1 (ja) 2009-11-12
JP2009272430A (ja) 2009-11-19
TWI353957B (enExample) 2011-12-11

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