KR20100128527A - Apparatus for processing substrate - Google Patents

Apparatus for processing substrate Download PDF

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Publication number
KR20100128527A
KR20100128527A KR1020090046967A KR20090046967A KR20100128527A KR 20100128527 A KR20100128527 A KR 20100128527A KR 1020090046967 A KR1020090046967 A KR 1020090046967A KR 20090046967 A KR20090046967 A KR 20090046967A KR 20100128527 A KR20100128527 A KR 20100128527A
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KR
South Korea
Prior art keywords
substrate
processing
loading
unloading
unit
Prior art date
Application number
KR1020090046967A
Other languages
Korean (ko)
Inventor
윤근식
Original Assignee
주식회사 케이씨텍
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Filing date
Publication date
Application filed by 주식회사 케이씨텍 filed Critical 주식회사 케이씨텍
Priority to KR1020090046967A priority Critical patent/KR20100128527A/en
Publication of KR20100128527A publication Critical patent/KR20100128527A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/52—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices
    • B65G47/68—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices adapted to receive articles arriving in one layer from one conveyor lane and to transfer them in individual layers to more than one conveyor lane or to one broader conveyor lane, or vice versa, e.g. combining the flows of articles conveyed by more than one conveyor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus, comprising: a processing unit for transferring and processing a first substrate in a first direction; and a first substrate provided on the processing unit and supplied from the outside in a direction opposite to the first direction A loading and unloading unit which is transferred in a second direction and positioned to take out the processed first substrate to the outside, and moves the first substrate which is transferred through the loading and unloading unit downward to supply the processing unit A first vertical transfer portion having a lifting portion, and a buffer portion for processing the second substrate to be processed next to the first substrate on the upper side of the first vertical transfer portion. The present invention having such a configuration has a loading and unloading portion on top of the processing portion where the substrate is processed, and includes a first vertical transfer portion for supplying the substrate loaded on the loading and unloading portion to the processing portion, and the first vertical In the sending section, when the substrate is supplied to the processing section, a buffer section is provided to allow the substrate to be processed next to be waited on the upper side of the first vertical transfer section. have.

Description

Apparatus for processing substrate

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus that can reduce the process waiting time by using a simple structure of the substrate processing apparatus having the same loading position and unloading position of the substrate.

In general, a flat panel display manufacturing process, such as the deposition of a thin film, the formation of a mask, the etching, etc. are selectively repeated on a large glass substrate to manufacture the devices required. In the process of such a process, a cleaning process is performed to remove foreign substances from the substrate before, after, or before and after the process.

In order to shorten the overall manufacturing process time, it is necessary to minimize the moving distance of the substrate. For this purpose, a device is used to withdraw a substrate from a cassette including a plurality of substrates using a single transfer robot, and then perform a specific process again. There is a need to load and unload substrates in sequence over and over.

That is, the substrate taken out from the cassette is supplied to the first processing apparatus using a single transfer robot, the substrate which has been processed by the first processing apparatus is again supplied to the second processing apparatus, and then the process is performed at the second processing apparatus. A method of storing the finished substrate back in the cassette has been proposed.

In such a manufacturing method, the following items are required for each process equipment.

First, the substrate loading position and the unloading position of each processing apparatus should be the same. This is because the processing of the loading and unloading positions is very difficult because the loading and unloading of the substrate has to be repeated using a single transfer robot with the cassette and the multiple processing equipment.

In addition, it is necessary to shorten the residence time of the substrate in each processing apparatus.

This is because the process of repeating the loading and unloading of the substrate into the cassette and the multiple processing apparatuses using a single transfer robot is a shortening of the process waiting time. This can be done to prevent the process waiting time from increasing.

In addition, it is necessary to reduce the volume of each process unit and simplify the configuration.

This is to solve the problem that the size of the equipment is increased by increasing the size of the assembly of the transfer robot, cassette, and a plurality of processing devices forming a system when using a complex and large equipment.

In order to satisfy all of these conditions, development of an apparatus for processing a substrate is required. Until now, substrate processing apparatuses have a process waiting substrate and a substrate waiting for processing in order to reduce the process waiting time. To use complex devices,

In the case of using a simple structure, it is difficult to develop a substrate processing apparatus that satisfies all of the above requirements, such as a relatively longer process waiting time.

The problem to be solved by the present invention in view of the above problems is to provide a substrate processing apparatus that can reduce the waiting time for substrate processing while using a simple structure in a substrate processing apparatus having the same loading and unloading positions.

In addition, another object of the present invention is to provide a substrate processing apparatus that can reduce the process waiting time by introducing a buffer structure of a simple structure, the substrate in the process standby state can be maintained in a stable state.

According to an aspect of the present invention, there is provided a substrate processing apparatus including a processing unit configured to transfer and process a first substrate in a first direction, and the first substrate positioned at an upper portion of the processing unit and supplied from the outside to the first direction. A loading and unloading unit for transferring the processed first substrate to the outside and a downward movement of the first substrate transferred through the loading and unloading unit. And a first vertical transfer portion having a lifting portion to be supplied to the processing portion, and a buffer portion for processing the second substrate to be processed next to the first substrate on the upper side of the first vertical transfer portion.

The present invention has a first vertical transfer portion for placing a loading and unloading portion on top of a processing portion in which a substrate is processed, and for supplying a substrate loaded in the loading and unloading portion to a processing portion, wherein the substrate is disposed at the first vertical transfer portion. When the substrate to be supplied to the processing unit is supplied with a buffer to wait for the next processing on the upper side of the first vertical transfer portion, there is an effect that can reduce the process waiting time of the substrate while using a simple structure.

In addition, when the substrate is waiting in the buffer unit to prevent the deflection on the substrate to have a more stable standby state, there is an effect that can improve the reliability of the device.

Hereinafter, the configuration and operation of the preferred embodiment of the present invention configured as described above in detail.

1 is a configuration diagram of a preferred embodiment of the substrate processing apparatus of the present invention.

Referring to FIG. 1, a preferred embodiment of the substrate processing apparatus of the present invention includes a processing unit 10 which performs a process such as cleaning while transferring the substrate 1 in one direction, and a substrate disposed on an upper side of the processing unit 10. A loading and unloading portion 20 which provides a loading or unloading position of (1) and conveys the substrate 1 loaded or unloaded using a plurality of roller shafts 21, and the loading and unloading portion 20 A first vertical transfer unit 30 positioned at one end of the unit 20 and the processing unit 10 to move the substrate loaded through the loading and unloading unit 20 downward to supply the processing unit 10 to the processing unit 10; Located on the upper side of the first vertical transfer section 30 and when the substrate 1 of the first vertical transfer section 30 is supplied to the processing section 10, the substrate 1 'to be processed next waits. The substrate 50 processed by the buffer unit 50 and the substrate 1 processed by the processing unit 10 are supplied to the loading and unloading unit 20 to process the substrate ( 1) is configured to include a second vertical transfer portion 40 to be unloaded.

Hereinafter, the configuration and operation of a preferred embodiment of the substrate processing apparatus of the present invention configured as described above will be described in more detail.

First, the processing unit 10 may be an apparatus for performing all manufacturing processes capable of processing while transferring the substrate 1 in one direction, and in particular, may be an apparatus for cleaning and drying the substrate 1.

The processing unit 10 may include a plurality of roller shafts 11 for transporting the substrate 1 in one direction, and transfer means applying not only the roller shaft 11 but also the substrate floating means by the air pressure injected upward. It can also be configured to have.

That is, the processing part 10 can apply any structure as long as it is an apparatus which processes the board | substrate 1 supplied to one side, and transfers it to the opposite side to the supply direction.

The loading and unloading unit 20 in which the substrate 1 is loaded and unloaded is positioned on the upper side of the processing unit 10. The loading and unloading unit 20 is provided with a roller shaft 21 which is a conveying means for transferring the substrate 1 in a direction opposite to the substrate conveying direction of the processing unit 10.

In addition, the door part 22 for enclosing the substrate 1 from the outside into the loading and unloading part 20 or withdrawing the processed substrate 1 located in the loading and unloading part 20 to the outside. A plurality of roller shafts 21 or the substrate 1, which is introduced into the loading and unloading portion 20 through the door portion 22, or the unloading of the substrate 1, It comprises a lift pin 23 for supporting a portion of the bottom surface of the substrate 1 transferred by the roller shaft 21 to the position of the door portion 22 in order to.

In this way, the loading and unloading unit 20 is horizontal and vertical while maintaining the direction of the substrate 1 introduced by an external transfer robot without performing a direction control to specifically rotate or rotate the substrate 1. The substrate 1 is processed through the transfer.

When the substrate enters the loading and unloading portion 20 through the door portion 22 of the loading and unloading portion 20 by an external transfer robot, the lift pin 23 is raised to raise the substrate 1. ) And the transfer robot moves to the outside of the loading and unloading unit 20 while the substrate 1 is supported by the lift pins 23.

After the transfer robot moves, the lift pins 23 descend to seat the substrate 1 on top of the lift pins 23, and a plurality of rollers rotated at constant speed by a motor (not shown). The shafts 21 cause the substrate 1 to move toward the first vertical transfer part 30.

The first vertical transfer part 30, the lifting part including a plurality of roller shafts 31 which move downward in the state in which the substrate 1 is seated, and move upward again for mounting the next substrate 1 '. It comprises a 32.

In addition, the lifting section 32 includes a motor (not shown) for driving a plurality of roller shafts 31.

After the lifting unit 32 supplies the seated substrate 1 to the processing unit 10, the lifting unit 32 moves upward to seat the substrate 1 ′ to be processed next, and the lifting unit 32 moves up and down the buffer unit 50. The substrate 1 'to be processed next is supplied from the loading and unloading section 20 before the section 32 is raised.

2 is a side configuration diagram showing an embodiment of the buffer unit 50 and the lifting unit 32, and FIG. 3 is a detailed configuration diagram of the buffer unit 50. As shown in FIG.

Referring to FIGS. 2 and 3, the buffer unit 50 is separated from the left and right sides with respect to the traveling direction of the substrate 1, and includes rollers supporting the bottom left and right sides of the substrate 1, respectively. And first and second support parts 51 and 52 which can be moved horizontally, respectively, in order to avoid interference during the downward movement of the substrate 1.

That is, when the elevator 32 moves downward to supply the processor 10 with the previous substrate 1 seated, the substrate 1 ′ to be processed next is loaded and unloaded 20. The substrate 1 'is supplied to the buffer portion 50 located at the upper side of the first vertical transfer portion 30 by the roller shaft 21, and the left side of the bottom surface of the substrate 1' is supplied. And the right edge are supported by the first and second support parts 51 and 52.

At this time, when the edge is supported by the first and second support parts 51 and 52 in the standby position for the next process, the center part may sag downward due to the load of the substrate 1 '. In addition, when such deflection occurs, an accident may occur in which the substrate 1 'falls downward, and the reliability of the device may be degraded.

In view of this, when the substrate 1 'is supported by the first and second support portions 51 and 52 of the buffer portion, the center portion of the substrate 1' is sag. The third supporting portion 53 is provided to prevent the substrate 1 'from sagging.

4 is a configuration diagram of one embodiment of the third support part 53.

Referring to FIG. 4, one embodiment of the third support part 53 includes a servo cylinder 54 capable of vertical movement and a horizontal reciprocating motion by driving the servo cylinder 54 to support the first and second support parts. A sliding support shaft 55 which is located at the bottom center side of the substrate 1 'supported by the 51 and 52, or which does not interfere with the downward transfer of the substrate 1', and the sliding support shaft ( One end of the substrate 55 includes a flexible contact portion 56 that protrudes toward the substrate 1 'side and supports the bottom center portion of the substrate 1'.

That is, when the substrate 1 'is supplied to the buffer part 50, the third support part 53 supports the first and second support parts 51 and 52 supporting both left and right ends of the bottom surface of the substrate 1'. It can support the center of the bottom portion that is not supported by the), and when the lifting portion 32 is moved upward to the buffer portion 50, the substrate 1 'is seated and moved downward toward the processing portion 10 again. The sliding support shaft 55 is retracted so as not to interfere when the substrate 1 'is moved downward.

In the above configuration, the rollers provided on the first support part 51 and the second support part 52 of the buffer part 50 and the axes for fixing the rollers do not interfere with the roller shaft 31 of the lifting part 32. When the substrate 1 'is moved downward, the first supporting portion 51 and the second supporting portion 52 are also horizontally moved away from the substrate 1' so as not to interfere with the substrate 1 '.

The flexible contact portion 56 is preferably made of a flexible material that does not damage the substrate 1 ', and preferably has a form that can reduce the contact area with the substrate as much as possible.

It is also possible to use a roller instead of the flexible contact portion 56.

5 is another exemplary configuration diagram of the third support part 53.

Referring to FIG. 5, another embodiment of the third support part 53 includes a rotation shaft 57 that rotates a predetermined angle about one end and a bottom surface of the substrate 1 ′ provided at one end of the rotation shaft 57. It includes a flexible contact portion 56 in contact with the central portion to prevent sagging of the substrate 1 '.

The flexible contact portion 56 may be replaced by a roller.

The rotating shaft 57 may rotate at an angle of upward or downward relative to one end, and when moved upward, the substrate 1 ′ may be moved by the first and second support parts 51 and 52. When supported, it supports to prevent deflection in the center of the bottom surface of the substrate 1 ',

When moved downward, interference is prevented when the substrate 1 'is moved downward by the elevating portion 32.

Thus, according to the present invention, the substrate 1 supplied to the loading and unloading unit 20 is moved to the inlet end side of the processing unit 10 by using the lifting unit 32 of the first vertical transfer unit 30. In addition, the process waiting time can be reduced by waiting the substrate 1 'to be processed next in the buffer unit 50 provided on the upper side of the first vertical transfer unit 30.

In addition, the buffer portion 50 may be configured in a simple structure, and the third support portion 53 which prevents the central portion of the substrate 1 'from sagging by the simple structure may be used to improve the reliability of the substrate processing apparatus. do.

Subsequently, the substrates 1 and 1 ′ processed through the processing unit 10 are moved upward from the processing unit 10 side to the loading and unloading unit 40 through the second vertical transfer unit 40 and then loaded. And it moves horizontally to the position of the lift pin 23 of the unloading portion 40, and after moving to the loading and unloading position in accordance with the lift pin 23 is lifted out by the transport robot. A plurality of roller shafts 41 driven by a motor may also be provided in the second vertical transfer part 40 to supply the substrate to the loading and unloading part 20.

1 is a configuration diagram of a preferred embodiment of the substrate processing apparatus of the present invention.

FIG. 2 is a side view illustrating an exemplary configuration of the buffer unit and the lifting unit in FIG. 1.

3 is a detailed configuration diagram of the buffer unit in FIG. 1.

FIG. 4 is a diagram illustrating an embodiment of the third support unit of FIG. 3.

5 is another embodiment of the third support in FIG.

* Description of the symbols for the main parts of the drawings *

10: processing unit 11, 21, 31, 41: roller shaft

20: loading and unloading part 22: door part

23: lift pin 30: The first vertical conveying part

32: lift 40: second vertical transfer section

50: buffer part 51: first support part

52: second support 53: third support

54: servo cylinder 55: sliding support shaft

56: flexible contact 57: rotary shaft

Claims (6)

A processing unit which transfers and processes the first substrate in a first direction; Located in the upper portion of the processing unit and the first substrate supplied from the outside to transfer in a second direction opposite to the first direction, and loading and unloading to position the processed first substrate to be drawn out part; A first vertical transfer part including a lifting part which moves the first substrate transferred through the loading and unloading part downward and supplies the processing part; And And a buffer unit for processing the second substrate to be processed next to the first substrate on the upper side of the first vertical transfer portion. The method of claim 1, The buffer unit, A substrate processing apparatus comprising a first support portion and a second support portion, each having a plurality of rollers supporting left and right sides of the bottom portion of the first substrate or the second substrate. The method of claim 2, The first support portion and the second support portion of the buffer portion, Substrate processing apparatus, characterized in that it is avoided so that interference does not occur when the first substrate or the second substrate is lowered. The method according to any one of claims 1 to 3, The buffer unit, And a third support part which supports a central part of the first substrate or the second substrate when the first substrate or the second substrate is supplied to the buffer part. The method of claim 4, wherein The third support portion, Servo cylinder; A sliding support shaft that is moved forward or backward by the servo cylinder; And When the first substrate or the second substrate is in the standby state, the first substrate or the second substrate is in contact with the center of the bottom surface of the first substrate or the second substrate, when the first substrate or the second substrate is downward A substrate processing apparatus comprising a flexible contact portion that does not interfere with the substrate or the second substrate. The method of claim 4, wherein The third support portion, A rotating shaft rotating the other side at a predetermined angle about one side; And When the first substrate or the second substrate is in the standby state, the first substrate or the second substrate is in contact with the central portion of the bottom surface of the first substrate or the second substrate, when the first substrate or the second substrate is downward, A substrate processing apparatus comprising a flexible contact portion that does not interfere with the second substrate.
KR1020090046967A 2009-05-28 2009-05-28 Apparatus for processing substrate KR20100128527A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020090046967A KR20100128527A (en) 2009-05-28 2009-05-28 Apparatus for processing substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090046967A KR20100128527A (en) 2009-05-28 2009-05-28 Apparatus for processing substrate

Publications (1)

Publication Number Publication Date
KR20100128527A true KR20100128527A (en) 2010-12-08

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KR1020090046967A KR20100128527A (en) 2009-05-28 2009-05-28 Apparatus for processing substrate

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