KR20100126114A - Emc 레이저 가공 장치 및 방법 - Google Patents
Emc 레이저 가공 장치 및 방법 Download PDFInfo
- Publication number
- KR20100126114A KR20100126114A KR1020090045185A KR20090045185A KR20100126114A KR 20100126114 A KR20100126114 A KR 20100126114A KR 1020090045185 A KR1020090045185 A KR 1020090045185A KR 20090045185 A KR20090045185 A KR 20090045185A KR 20100126114 A KR20100126114 A KR 20100126114A
- Authority
- KR
- South Korea
- Prior art keywords
- laser
- emc
- hole
- laser processing
- substrate
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims (7)
- 기판에 코팅된 EMC에 레이저를 조사하여 그 기판에 마련된 칩과 전기적으로 연결될 접속단자용 홀을 형성하는 레이저 가공유닛; 및,상기 홀에 고상의 CO2 입자를 분사하여 상기 레이저 가공 시 생성된 잔여물을 제거해내는 CO2 클리닝유닛;을 포함한 EMC 레이저 가공 장치.
- 제1항에 있어서,상기 레이저는 자외선 레이저, 그린 레이저, 적외선 레이저, CO2 레이저 중 어느 하나가 사용되며, 상기 레이저들의 주요 파장은 각각 355nm, 532nm, 1064nm, 9.0~10.8㎛인 것을 특징으로 하는 핸드폰 키패드 레이저 마킹 장치.
- 제1항에 있어서,상기 CO2 클리닝유닛은, 상기 CO2 가스를 저장하는 CO2 저장부와, 상기 CO2를 고상으로 냉각시키는 냉각부와, 캐리어인 질소가스를 저장하는 질소저장부와, 상기 냉각된 CO2 입자를 상기 질소가스에 실어서 분사하는 노즐부를 포함하는 것을 특징 으로 하는 EMC 레이저 가공 장치.
- 제1항에 있어서,상기 기판은 상기 홀을 통해 전기적으로 접속되며 다단으로 적층된 적층식 집적소자를 형성하는 것을 특징으로 하는 EMC 레이저 가공 장치.
- 기판에 코팅된 EMC에 레이저를 조사하여 그 기판에 마련된 칩과 전기적으로 연결될 접속단자용 홀을 형성하는 레이저 가공 단계; 및,상기 홀에 고상의 CO2 입자를 분사하여 상기 레이저 가공 시 생성된 잔여물을 제거해내는 CO2 클리닝 단계;를 포함한 EMC 레이저 가공 방법.
- 제5항에 있어서,상기 CO2 클리닝 단계는, 상기 CO2를 고상으로 냉각시켜서 공급하는 단계와, 캐리어인 질소가스를 공급하는 단계 및, 상기 냉각된 CO2 입자를 상기 질소가스에 실어서 상기 홀에 분사하는 단계를 포함하는 것을 특징으로 하는 EMC 레이저 가공 방법.
- 제5항에 있어서,상기 기판은 상기 홀을 통해 전기적으로 접속되며 다단으로 적층된 적층식 집적소자를 형성하는 것을 특징으로 하는 EMC 레이저 가공 방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090045185A KR101094262B1 (ko) | 2009-05-22 | 2009-05-22 | Emc 레이저 가공 장치 및 방법 |
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KR1020090045185A KR101094262B1 (ko) | 2009-05-22 | 2009-05-22 | Emc 레이저 가공 장치 및 방법 |
Publications (2)
Publication Number | Publication Date |
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KR20100126114A true KR20100126114A (ko) | 2010-12-01 |
KR101094262B1 KR101094262B1 (ko) | 2011-12-19 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107309768A (zh) * | 2017-06-14 | 2017-11-03 | 伯恩光学(惠州)有限公司 | 陶瓷面板孔位的加工方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101487159B1 (ko) * | 2014-05-13 | 2015-01-29 | 아진산업(주) | 그을음 제거용 이산화탄소 분사장치 |
Family Cites Families (1)
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JPH11320171A (ja) * | 1998-05-13 | 1999-11-24 | Matsushita Electric Ind Co Ltd | レーザ照射による穿孔方法および穿孔装置 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107309768A (zh) * | 2017-06-14 | 2017-11-03 | 伯恩光学(惠州)有限公司 | 陶瓷面板孔位的加工方法 |
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