KR20100124268A - 표면에 미크론 크기의 특징형상을 형성하기 위한 제거가능 뒷댐재를 가지는 스텐실 및 그의 제조 및 사용 방법 - Google Patents

표면에 미크론 크기의 특징형상을 형성하기 위한 제거가능 뒷댐재를 가지는 스텐실 및 그의 제조 및 사용 방법 Download PDF

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Publication number
KR20100124268A
KR20100124268A KR1020107019664A KR20107019664A KR20100124268A KR 20100124268 A KR20100124268 A KR 20100124268A KR 1020107019664 A KR1020107019664 A KR 1020107019664A KR 20107019664 A KR20107019664 A KR 20107019664A KR 20100124268 A KR20100124268 A KR 20100124268A
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KR
South Korea
Prior art keywords
substrate
stencil
elastomeric
elastomeric material
lateral dimension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020107019664A
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English (en)
Korean (ko)
Inventor
카란 차우한
조셉 엠. 멕렐란
산디프 아가왈
브라이언 티. 마이어스
제프리 카벡
랄프 쿠글러
모니카 쿠르자베
Original Assignee
나노 테라 인코포레이티드
메르크 파텐트 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나노 테라 인코포레이티드, 메르크 파텐트 게엠베하 filed Critical 나노 테라 인코포레이티드
Publication of KR20100124268A publication Critical patent/KR20100124268A/ko
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/003—Printing processes to produce particular kinds of printed work, e.g. patterns on optical devices, e.g. lens elements; for the production of optical devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Weting (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
KR1020107019664A 2008-02-06 2008-09-25 표면에 미크론 크기의 특징형상을 형성하기 위한 제거가능 뒷댐재를 가지는 스텐실 및 그의 제조 및 사용 방법 Ceased KR20100124268A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US2659108P 2008-02-06 2008-02-06
US61/026,591 2008-02-06

Publications (1)

Publication Number Publication Date
KR20100124268A true KR20100124268A (ko) 2010-11-26

Family

ID=40139579

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107019664A Ceased KR20100124268A (ko) 2008-02-06 2008-09-25 표면에 미크론 크기의 특징형상을 형성하기 위한 제거가능 뒷댐재를 가지는 스텐실 및 그의 제조 및 사용 방법

Country Status (7)

Country Link
US (1) US20090197054A1 (enExample)
EP (1) EP2252467A1 (enExample)
JP (1) JP2011517058A (enExample)
KR (1) KR20100124268A (enExample)
CN (1) CN101983131B (enExample)
TW (1) TW200934635A (enExample)
WO (1) WO2009099417A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008091571A2 (en) * 2007-01-22 2008-07-31 Nano Terra Inc. High-throughput apparatus for patterning flexible substrates and method of using the same
US9493022B2 (en) * 2009-08-05 2016-11-15 Cornell University Methods and apparatus for high-throughput formation of nano-scale arrays
TW201128301A (en) * 2009-08-21 2011-08-16 Nano Terra Inc Methods for patterning substrates using heterogeneous stamps and stencils and methods of making the stamps and stencils
US20120097329A1 (en) * 2010-05-21 2012-04-26 Merck Patent Gesellschaft Stencils for High-Throughput Micron-Scale Etching of Substrates and Processes of Making and Using the Same
US20120048133A1 (en) * 2010-08-25 2012-03-01 Burberry Mitchell S Flexographic printing members
GR1008100B (el) * 2012-12-06 2014-02-04 Παναγιωτης Ανδρεα Καρυδοπουλος Stencil για εξαρτηματα τυπου bga (ball grid array) μονιμης τοποθετησης απο ελαστομερη υλικα και μεθοδος εφαρμογης τους για επεξεργασια εξαρτηματων bga
US10824072B2 (en) * 2015-12-21 2020-11-03 Flint Group Germany Gmbh Method for generative production of relief printing plates by monomer diffusion through an integral mask layer
CN109844638B (zh) 2016-09-27 2024-03-15 伊鲁米那股份有限公司 压印基板
CN106994817B (zh) * 2017-03-30 2019-03-15 绍兴青运激光制版有限公司 一种版辊的制作方法
US11399618B2 (en) * 2018-04-27 2022-08-02 L'oreal Methods and applicators for applying skin-tightening film products
WO2020021884A1 (ja) * 2018-07-26 2020-01-30 富士フイルム株式会社 画像記録方法及び画像記録システム
CA3128178A1 (en) 2019-01-29 2020-08-06 Henkel IP & Holding GmbH Controlled printing surface and method of forming topographical features on a controlled printing surface
US20230271445A1 (en) * 2022-02-25 2023-08-31 Intel Corporation Reusable composite stencil for spray processes

Family Cites Families (22)

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Publication number Priority date Publication date Assignee Title
JPS52148305A (en) * 1976-06-04 1977-12-09 Tanazawa Hakkosha Kk Etching method
JPS5363573A (en) * 1976-11-19 1978-06-07 Toray Industries Method of forming resist pattern
JPS6020919B2 (ja) * 1981-09-18 1985-05-24 住友電気工業株式会社 印刷配線板の製造方法
US4378953A (en) * 1981-12-02 1983-04-05 Advanced Semiconductor Products Thin, optical membranes and methods and apparatus for making them
US4802945A (en) * 1986-10-09 1989-02-07 Hughes Aircraft Company Via filling of green ceramic tape
US5147397A (en) * 1990-07-03 1992-09-15 Allergan, Inc. Intraocular lens and method for making same
JPH04202677A (ja) * 1990-11-30 1992-07-23 Dainippon Printing Co Ltd レジストパターンの形成方法
CA2090579A1 (en) * 1992-02-27 1993-08-28 John T. Jarvie Stencil for use in the application of a viscous substance to a printed circuit board or the like
US5900160A (en) * 1993-10-04 1999-05-04 President And Fellows Of Harvard College Methods of etching articles via microcontact printing
US5512131A (en) 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
US6776094B1 (en) * 1993-10-04 2004-08-17 President & Fellows Of Harvard College Kit For Microcontact Printing
US7282240B1 (en) * 1998-04-21 2007-10-16 President And Fellows Of Harvard College Elastomeric mask and use in fabrication of devices
JP2002512124A (ja) 1998-04-21 2002-04-23 プレジデント・アンド・フェローズ・オブ・ハーバード・カレッジ エラストマ・マスク、およびピクセル化されたエレクトロルミネセンス・ディスプレイを含む装置の製造における使用
US6250219B1 (en) * 1999-08-09 2001-06-26 Glenn Garvin System for applying embossed patterns on textured ceilings
DE10104726A1 (de) * 2001-02-02 2002-08-08 Siemens Solar Gmbh Verfahren zur Strukturierung einer auf einem Trägermaterial aufgebrachten Oxidschicht
KR100442413B1 (ko) * 2001-08-04 2004-07-30 학교법인 포항공과대학교 표면에 금속 미세 패턴을 가진 플라스틱 기판의 제조방법
US20030070569A1 (en) * 2001-10-11 2003-04-17 Colin Bulthaup Micro-stencil
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US6805809B2 (en) * 2002-08-28 2004-10-19 Board Of Trustees Of University Of Illinois Decal transfer microfabrication
US8252191B2 (en) * 2005-05-10 2012-08-28 Dow Corning Corporation Sub-micron decal transfer lithography
US20080152835A1 (en) * 2006-12-05 2008-06-26 Nano Terra Inc. Method for Patterning a Surface
US20120097329A1 (en) * 2010-05-21 2012-04-26 Merck Patent Gesellschaft Stencils for High-Throughput Micron-Scale Etching of Substrates and Processes of Making and Using the Same

Also Published As

Publication number Publication date
JP2011517058A (ja) 2011-05-26
EP2252467A1 (en) 2010-11-24
US20090197054A1 (en) 2009-08-06
CN101983131A (zh) 2011-03-02
CN101983131B (zh) 2013-05-01
TW200934635A (en) 2009-08-16
WO2009099417A1 (en) 2009-08-13

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