JP2011517058A - 表面上にミクロンサイズの特徴を形成するための取り外し可能なバッキングを有するステンシルおよびそれを作成し使用する方法 - Google Patents

表面上にミクロンサイズの特徴を形成するための取り外し可能なバッキングを有するステンシルおよびそれを作成し使用する方法 Download PDF

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Publication number
JP2011517058A
JP2011517058A JP2010545836A JP2010545836A JP2011517058A JP 2011517058 A JP2011517058 A JP 2011517058A JP 2010545836 A JP2010545836 A JP 2010545836A JP 2010545836 A JP2010545836 A JP 2010545836A JP 2011517058 A JP2011517058 A JP 2011517058A
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JP
Japan
Prior art keywords
rubber elastic
substrate
stencil
elastic material
backing layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2010545836A
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English (en)
Japanese (ja)
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JP2011517058A5 (enExample
Inventor
カラン ショーハン，
ジョセフ エム． マクレラン，
サンディップ アガーワル，
ブライアン ティー． メイヤーズ，
ジェフリー カーベック
ラルフ クーグラー，
モニカ クールサヴ，
Original Assignee
ナノ テラ インコーポレイテッド
メルク パテント ゲーエムベーハー
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Application filed by ナノ テラ インコーポレイテッド, メルク パテント ゲーエムベーハー filed Critical ナノ テラ インコーポレイテッド
Publication of JP2011517058A publication Critical patent/JP2011517058A/ja
Publication of JP2011517058A5 publication Critical patent/JP2011517058A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/003—Printing processes to produce particular kinds of printed work, e.g. patterns on optical devices, e.g. lens elements; for the production of optical devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Weting (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP2010545836A 2008-02-06 2008-09-25 表面上にミクロンサイズの特徴を形成するための取り外し可能なバッキングを有するステンシルおよびそれを作成し使用する方法 Pending JP2011517058A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US2659108P 2008-02-06 2008-02-06
US61/026,591 2008-02-06
PCT/US2008/011096 WO2009099417A1 (en) 2008-02-06 2008-09-25 Stencils with removable backings for forming micron-sized features on surfaces and methods of making and using the same

Publications (2)

Publication Number Publication Date
JP2011517058A true JP2011517058A (ja) 2011-05-26
JP2011517058A5 JP2011517058A5 (enExample) 2011-11-10

Family

ID=40139579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010545836A Pending JP2011517058A (ja) 2008-02-06 2008-09-25 表面上にミクロンサイズの特徴を形成するための取り外し可能なバッキングを有するステンシルおよびそれを作成し使用する方法

Country Status (7)

Country Link
US (1) US20090197054A1 (enExample)
EP (1) EP2252467A1 (enExample)
JP (1) JP2011517058A (enExample)
KR (1) KR20100124268A (enExample)
CN (1) CN101983131B (enExample)
TW (1) TW200934635A (enExample)
WO (1) WO2009099417A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008091571A2 (en) * 2007-01-22 2008-07-31 Nano Terra Inc. High-throughput apparatus for patterning flexible substrates and method of using the same
US9493022B2 (en) * 2009-08-05 2016-11-15 Cornell University Methods and apparatus for high-throughput formation of nano-scale arrays
TW201128301A (en) * 2009-08-21 2011-08-16 Nano Terra Inc Methods for patterning substrates using heterogeneous stamps and stencils and methods of making the stamps and stencils
US20120097329A1 (en) * 2010-05-21 2012-04-26 Merck Patent Gesellschaft Stencils for High-Throughput Micron-Scale Etching of Substrates and Processes of Making and Using the Same
US20120048133A1 (en) * 2010-08-25 2012-03-01 Burberry Mitchell S Flexographic printing members
GR1008100B (el) * 2012-12-06 2014-02-04 Παναγιωτης Ανδρεα Καρυδοπουλος Stencil για εξαρτηματα τυπου bga (ball grid array) μονιμης τοποθετησης απο ελαστομερη υλικα και μεθοδος εφαρμογης τους για επεξεργασια εξαρτηματων bga
US10824072B2 (en) * 2015-12-21 2020-11-03 Flint Group Germany Gmbh Method for generative production of relief printing plates by monomer diffusion through an integral mask layer
CN109844638B (zh) 2016-09-27 2024-03-15 伊鲁米那股份有限公司 压印基板
CN106994817B (zh) * 2017-03-30 2019-03-15 绍兴青运激光制版有限公司 一种版辊的制作方法
US11399618B2 (en) * 2018-04-27 2022-08-02 L'oreal Methods and applicators for applying skin-tightening film products
WO2020021884A1 (ja) * 2018-07-26 2020-01-30 富士フイルム株式会社 画像記録方法及び画像記録システム
CA3128178A1 (en) 2019-01-29 2020-08-06 Henkel IP & Holding GmbH Controlled printing surface and method of forming topographical features on a controlled printing surface
US20230271445A1 (en) * 2022-02-25 2023-08-31 Intel Corporation Reusable composite stencil for spray processes

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52148305A (en) * 1976-06-04 1977-12-09 Tanazawa Hakkosha Kk Etching method
JPS5363573A (en) * 1976-11-19 1978-06-07 Toray Industries Method of forming resist pattern
JPS5848988A (ja) * 1981-09-18 1983-03-23 住友電気工業株式会社 印刷配線板の製造方法
JPH04202677A (ja) * 1990-11-30 1992-07-23 Dainippon Printing Co Ltd レジストパターンの形成方法
JP2005537141A (ja) * 2002-08-28 2005-12-08 ザ ボード オブ トラスティーズ オブ ザ ユニバーシティ オブ イリノイ 転写微細加工
WO2006121906A1 (en) * 2005-05-10 2006-11-16 Dow Corning Corporation Sub-micron decal transfer lithography

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4378953A (en) * 1981-12-02 1983-04-05 Advanced Semiconductor Products Thin, optical membranes and methods and apparatus for making them
US4802945A (en) * 1986-10-09 1989-02-07 Hughes Aircraft Company Via filling of green ceramic tape
US5147397A (en) * 1990-07-03 1992-09-15 Allergan, Inc. Intraocular lens and method for making same
CA2090579A1 (en) * 1992-02-27 1993-08-28 John T. Jarvie Stencil for use in the application of a viscous substance to a printed circuit board or the like
US5900160A (en) * 1993-10-04 1999-05-04 President And Fellows Of Harvard College Methods of etching articles via microcontact printing
US5512131A (en) 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
US6776094B1 (en) * 1993-10-04 2004-08-17 President & Fellows Of Harvard College Kit For Microcontact Printing
US7282240B1 (en) * 1998-04-21 2007-10-16 President And Fellows Of Harvard College Elastomeric mask and use in fabrication of devices
JP2002512124A (ja) 1998-04-21 2002-04-23 プレジデント・アンド・フェローズ・オブ・ハーバード・カレッジ エラストマ・マスク、およびピクセル化されたエレクトロルミネセンス・ディスプレイを含む装置の製造における使用
US6250219B1 (en) * 1999-08-09 2001-06-26 Glenn Garvin System for applying embossed patterns on textured ceilings
DE10104726A1 (de) * 2001-02-02 2002-08-08 Siemens Solar Gmbh Verfahren zur Strukturierung einer auf einem Trägermaterial aufgebrachten Oxidschicht
KR100442413B1 (ko) * 2001-08-04 2004-07-30 학교법인 포항공과대학교 표면에 금속 미세 패턴을 가진 플라스틱 기판의 제조방법
US20030070569A1 (en) * 2001-10-11 2003-04-17 Colin Bulthaup Micro-stencil
US6833040B2 (en) * 2001-12-19 2004-12-21 Surface Logix Inc. Apparatus and method for handling membranes
US20080152835A1 (en) * 2006-12-05 2008-06-26 Nano Terra Inc. Method for Patterning a Surface
US20120097329A1 (en) * 2010-05-21 2012-04-26 Merck Patent Gesellschaft Stencils for High-Throughput Micron-Scale Etching of Substrates and Processes of Making and Using the Same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52148305A (en) * 1976-06-04 1977-12-09 Tanazawa Hakkosha Kk Etching method
JPS5363573A (en) * 1976-11-19 1978-06-07 Toray Industries Method of forming resist pattern
JPS5848988A (ja) * 1981-09-18 1983-03-23 住友電気工業株式会社 印刷配線板の製造方法
JPH04202677A (ja) * 1990-11-30 1992-07-23 Dainippon Printing Co Ltd レジストパターンの形成方法
JP2005537141A (ja) * 2002-08-28 2005-12-08 ザ ボード オブ トラスティーズ オブ ザ ユニバーシティ オブ イリノイ 転写微細加工
WO2006121906A1 (en) * 2005-05-10 2006-11-16 Dow Corning Corporation Sub-micron decal transfer lithography

Also Published As

Publication number Publication date
EP2252467A1 (en) 2010-11-24
US20090197054A1 (en) 2009-08-06
CN101983131A (zh) 2011-03-02
KR20100124268A (ko) 2010-11-26
CN101983131B (zh) 2013-05-01
TW200934635A (en) 2009-08-16
WO2009099417A1 (en) 2009-08-13

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