GR1008100B - Stencil για εξαρτηματα τυπου bga (ball grid array) μονιμης τοποθετησης απο ελαστομερη υλικα και μεθοδος εφαρμογης τους για επεξεργασια εξαρτηματων bga - Google Patents
Stencil για εξαρτηματα τυπου bga (ball grid array) μονιμης τοποθετησης απο ελαστομερη υλικα και μεθοδος εφαρμογης τους για επεξεργασια εξαρτηματων bgaInfo
- Publication number
- GR1008100B GR1008100B GR20120100613A GR20120100613A GR1008100B GR 1008100 B GR1008100 B GR 1008100B GR 20120100613 A GR20120100613 A GR 20120100613A GR 20120100613 A GR20120100613 A GR 20120100613A GR 1008100 B GR1008100 B GR 1008100B
- Authority
- GR
- Greece
- Prior art keywords
- bga
- stencil
- balls
- pcb
- flux
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/14—Forme preparation for stencil-printing or silk-screen printing
- B41C1/145—Forme preparation for stencil-printing or silk-screen printing by perforation using an energetic radiation beam, e.g. a laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/14—Forme preparation for stencil-printing or silk-screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
Abstract
Νέα BGA stencil για εξαρτήματα τύπου ball grid array τα οποία παράγονται από μεμβράνες από ελαστομερή υλικά και τα οποία stencil κόβονται διατρυπώνται με τη χρήση ακτινών laser και τα οποία stencil είναι μόνιμα προσαρτημένα μεταξύ των συγκολλημένων σφαιριδίων (3), του εξαρτήματος BGA (2), και του PCB (5). Η θερμοκρασία τήξης του ελαστομερούς υλικού μπορεί να είναι μεγαλύτερη ή μικρότερη από 250 βαθμούς Κελσίου. Τα νέα stencil (1) μπορεί να περιλαμβάνουν μέχρι και 43 τοις εκατό σωματίδια (ή τρίμματα) από ελαστικά αυτοκινήτων τα οποία έφθασαν στο τέλος του κύκλου ζωής των (με 0,2 mm μέγιστο μέγεθος σωματιδίων). Το πάχος του κάθε stencil (1) είναι κατά τουλάχιστον 0,1 mm μικρότερο από τη διάμετρο των σφαιριδίων τα οποία παράγονται από το υλικό συγκόλλησης μετάλλων (3). Τα νέα stencils (1) τοποθετούνται σε επίπεδη επιφάνεια και ένα νέο σύνολο από σφαιρίδια (3) τοποθετείται (με το χέρι) εντός των ανοιγμάτων (4) του stencil.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GR20120100613A GR1008100B (el) | 2012-12-06 | 2012-12-06 | Stencil για εξαρτηματα τυπου bga (ball grid array) μονιμης τοποθετησης απο ελαστομερη υλικα και μεθοδος εφαρμογης τους για επεξεργασια εξαρτηματων bga |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GR20120100613A GR1008100B (el) | 2012-12-06 | 2012-12-06 | Stencil για εξαρτηματα τυπου bga (ball grid array) μονιμης τοποθετησης απο ελαστομερη υλικα και μεθοδος εφαρμογης τους για επεξεργασια εξαρτηματων bga |
Publications (1)
Publication Number | Publication Date |
---|---|
GR1008100B true GR1008100B (el) | 2014-02-04 |
Family
ID=48536932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GR20120100613A GR1008100B (el) | 2012-12-06 | 2012-12-06 | Stencil για εξαρτηματα τυπου bga (ball grid array) μονιμης τοποθετησης απο ελαστομερη υλικα και μεθοδος εφαρμογης τους για επεξεργασια εξαρτηματων bga |
Country Status (1)
Country | Link |
---|---|
GR (1) | GR1008100B (el) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113276535A (zh) * | 2021-05-13 | 2021-08-20 | 浪潮商用机器有限公司 | 0.4pitch BGA元件的钢网加工方法、钢网结构 |
Citations (12)
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---|---|---|---|---|
EP0719638A2 (en) * | 1994-12-28 | 1996-07-03 | Ricoh Microelectronics Co., Ltd. | Method of fabricating plastic mask for paste printing, plastic mask for paste printing, and paste printing method |
US5560531A (en) * | 1994-12-14 | 1996-10-01 | O.K. Industries, Inc. | Reflow minioven for electrical component |
US5861323A (en) * | 1994-06-06 | 1999-01-19 | Microfab Technologies, Inc. | Process for manufacturing metal ball electrodes for a semiconductor device |
US6228678B1 (en) * | 1998-04-27 | 2001-05-08 | Fry's Metals, Inc. | Flip chip with integrated mask and underfill |
US6253675B1 (en) * | 1999-06-29 | 2001-07-03 | Carl P. Mayer | Solder paste stenciling apparatus and method of use for rework |
US6426564B1 (en) * | 1999-02-24 | 2002-07-30 | Micron Technology, Inc. | Recessed tape and method for forming a BGA assembly |
US20040005770A1 (en) * | 2002-07-08 | 2004-01-08 | Farnworth Warren M. | Semiconductor devices with permanent polymer stencil and method for manufacturing the same |
CH694697A5 (de) * | 2004-01-29 | 2005-06-15 | Koelbl Engineering Und Consult | Gummimehl-enthaltende Elastomerlegierungen. |
US20050150936A1 (en) * | 1997-05-27 | 2005-07-14 | Mackay John | Bumping electronic components using transfer substrates |
US20050189402A1 (en) * | 2004-02-11 | 2005-09-01 | Bandjwet Enterprises | Area array and leaded SMT component stenciling apparatus and area array reballing method |
GB2446592A (en) * | 2007-02-16 | 2008-08-20 | Polymer Recyclers Ltd | Rubber recycling |
US20090197054A1 (en) * | 2008-02-06 | 2009-08-06 | Nano Terra Inc. | Stencils With Removable Backings for Forming Micron-Sized Features on Surfaces and Methods of Making and Using the Same |
-
2012
- 2012-12-06 GR GR20120100613A patent/GR1008100B/el not_active IP Right Cessation
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5861323A (en) * | 1994-06-06 | 1999-01-19 | Microfab Technologies, Inc. | Process for manufacturing metal ball electrodes for a semiconductor device |
US5560531A (en) * | 1994-12-14 | 1996-10-01 | O.K. Industries, Inc. | Reflow minioven for electrical component |
EP0719638A2 (en) * | 1994-12-28 | 1996-07-03 | Ricoh Microelectronics Co., Ltd. | Method of fabricating plastic mask for paste printing, plastic mask for paste printing, and paste printing method |
US20050150936A1 (en) * | 1997-05-27 | 2005-07-14 | Mackay John | Bumping electronic components using transfer substrates |
US6228678B1 (en) * | 1998-04-27 | 2001-05-08 | Fry's Metals, Inc. | Flip chip with integrated mask and underfill |
US6426564B1 (en) * | 1999-02-24 | 2002-07-30 | Micron Technology, Inc. | Recessed tape and method for forming a BGA assembly |
US6253675B1 (en) * | 1999-06-29 | 2001-07-03 | Carl P. Mayer | Solder paste stenciling apparatus and method of use for rework |
US20040005770A1 (en) * | 2002-07-08 | 2004-01-08 | Farnworth Warren M. | Semiconductor devices with permanent polymer stencil and method for manufacturing the same |
CH694697A5 (de) * | 2004-01-29 | 2005-06-15 | Koelbl Engineering Und Consult | Gummimehl-enthaltende Elastomerlegierungen. |
US20050189402A1 (en) * | 2004-02-11 | 2005-09-01 | Bandjwet Enterprises | Area array and leaded SMT component stenciling apparatus and area array reballing method |
GB2446592A (en) * | 2007-02-16 | 2008-08-20 | Polymer Recyclers Ltd | Rubber recycling |
US20090197054A1 (en) * | 2008-02-06 | 2009-08-06 | Nano Terra Inc. | Stencils With Removable Backings for Forming Micron-Sized Features on Surfaces and Methods of Making and Using the Same |
Non-Patent Citations (1)
Title |
---|
ANONYMOUS: "BGA reballing instructions", 31 December 2002 (2002-12-31), XP055081455, Retrieved from the Internet <URL:http://www.emulation.com/pdf/102003BGA_Reballing_Instruction_Manual.pdf> [retrieved on 20130927] * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113276535A (zh) * | 2021-05-13 | 2021-08-20 | 浪潮商用机器有限公司 | 0.4pitch BGA元件的钢网加工方法、钢网结构 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PG | Patent granted |
Effective date: 20140317 |
|
ML | Lapse due to non-payment of fees |
Effective date: 20160707 |