TW200726549A - Paste metal particle composition, process for solidifying the same, process for jointing metal substrates, and process for preparing circuit board - Google Patents
Paste metal particle composition, process for solidifying the same, process for jointing metal substrates, and process for preparing circuit boardInfo
- Publication number
- TW200726549A TW200726549A TW095135080A TW95135080A TW200726549A TW 200726549 A TW200726549 A TW 200726549A TW 095135080 A TW095135080 A TW 095135080A TW 95135080 A TW95135080 A TW 95135080A TW 200726549 A TW200726549 A TW 200726549A
- Authority
- TW
- Taiwan
- Prior art keywords
- metal
- pressure
- paste
- particle composition
- solidifying
- Prior art date
Links
Landscapes
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
To provide a paste metal particle composition of which metal particles sinter when heated to form solid metal with excellent strength, electrical conductivity and thermal conductivity, a process for solidifying silver particles, and so on. Paste metal particle composition comprising metal particles with an average diameter of 0.1 to 30μm and a carbon content of 2.0% by weight or less and a volatile disperse medium. Method for solidifying said paste metal particle composition comprising applying supersonic vibrations onto said composition with pressure or pressure and heat to evaporate said volatile disperse medium and to sinter said metal particles. Method for jointing metal substrates comprising interposing said paste metal particle composition between metal substrates and applying supersonic vibrations onto said composition with pressure or pressure and heat to sinter said metal particles. Process for the preparation of a printed circuit board comprising applying supersonic vibrations onto said composition on a board with pressure or pressure and heat to sinter said metal particles and to form metal wirings.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005272779 | 2005-09-20 | ||
| JP2005274240 | 2005-09-21 | ||
| JP2005276484 | 2005-09-22 | ||
| JP2005309128 | 2005-10-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200726549A true TW200726549A (en) | 2007-07-16 |
Family
ID=57912667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095135080A TW200726549A (en) | 2005-09-20 | 2006-09-22 | Paste metal particle composition, process for solidifying the same, process for jointing metal substrates, and process for preparing circuit board |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200726549A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102131353A (en) * | 2009-10-05 | 2011-07-20 | Abb研究有限公司 | Method of joining components, composite of components of an electrical circuit and electrical circuit |
| TWI501716B (en) * | 2013-06-12 | 2015-09-21 | 名幸電子股份有限公司 | Method of fabricating heat dissipating board |
| CN107249787A (en) * | 2014-09-01 | 2017-10-13 | 同和电子科技有限公司 | Jointing material and the adhesive bonding method using the jointing material |
| CN110278653A (en) * | 2018-03-16 | 2019-09-24 | 惠州市超频三全周光智能照明科技有限公司 | Printed circuit board and preparation method thereof |
-
2006
- 2006-09-22 TW TW095135080A patent/TW200726549A/en unknown
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102131353A (en) * | 2009-10-05 | 2011-07-20 | Abb研究有限公司 | Method of joining components, composite of components of an electrical circuit and electrical circuit |
| CN102131353B (en) * | 2009-10-05 | 2015-11-25 | Abb研究有限公司 | The method of coupling assembling, the assembly of circuit unit and circuit |
| TWI501716B (en) * | 2013-06-12 | 2015-09-21 | 名幸電子股份有限公司 | Method of fabricating heat dissipating board |
| CN107249787A (en) * | 2014-09-01 | 2017-10-13 | 同和电子科技有限公司 | Jointing material and the adhesive bonding method using the jointing material |
| CN107249787B (en) * | 2014-09-01 | 2020-12-01 | 同和电子科技有限公司 | Adhesive material and adhesion method using the same |
| CN110278653A (en) * | 2018-03-16 | 2019-09-24 | 惠州市超频三全周光智能照明科技有限公司 | Printed circuit board and preparation method thereof |
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