KR20100103284A - Led module using metal substrate and method thereof - Google Patents

Led module using metal substrate and method thereof Download PDF

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Publication number
KR20100103284A
KR20100103284A KR1020090021838A KR20090021838A KR20100103284A KR 20100103284 A KR20100103284 A KR 20100103284A KR 1020090021838 A KR1020090021838 A KR 1020090021838A KR 20090021838 A KR20090021838 A KR 20090021838A KR 20100103284 A KR20100103284 A KR 20100103284A
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KR
South Korea
Prior art keywords
metal substrate
upper metal
led module
leds
led
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KR1020090021838A
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Korean (ko)
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KR101055673B1 (en
Inventor
남충모
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한국산업기술대학교산학협력단
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Priority to KR1020090021838A priority Critical patent/KR101055673B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body

Abstract

The present invention relates to an LED module. The LED module, the lower metal substrate; A plurality of electrode layers formed of an insulating layer and an upper metal substrate sequentially formed, and repeatedly formed on the lower metal substrate; A mounting groove formed by etching a portion of the electrode layer to expose a surface of the lower metal substrate to mount a plurality of LEDs; And a plurality of LEDs mounted in the mounting groove, wherein the LEDs are wire bonded to each upper metal substrate of the electrode layer. The upper and lower metal substrates, which are used as electrodes for LEDs, are all made of aluminum, so that the heat dissipation effect is excellent and the low-cost Al wire can be used. It can be manufactured.

Description

LED module using metal substrate and method of manufacturing the same

The present invention relates to an LED module, and more particularly, to an LED module that can be manufactured by using metal substrates, which is excellent in heat dissipation characteristics and can be implemented at low cost.

LEDs have recently been applied in various fields such as display or lighting because of high brightness and long life. However, since LEDs emit a lot of heat, efficient heat dissipation is required. In particular, when the LED elements are formed in an array form, the light emitted from each light emitting element is efficiently extracted as light without converting the light into heat as much as possible, thereby maximizing luminescence availability, and the heat generated nevertheless can be quickly chipped. Emission to the outside of the substrate is one of the biggest problems.

Various methods have been proposed to solve the heat dissipation problem, but most of them have been described on the premise that the LED device is mounted on a PCB substrate or a metal PCB substrate. That is, the conventional LED module is mounted on the PCB substrate or completed on the metal PCB substrate to improve heat dissipation characteristics. However, a metal PCB is a PCB in which a flexible PCB is bonded onto an aluminum metal plate. Therefore, when manufacturing an LED module using a metal PCB, expensive Au wire or Cu wire should be used to wire-bond the LED elements and the PCB. In addition, in the case of using Au wire, the wire-bonded portion of the PCB should be plated for contact. For this reason, there is a problem that the manufacturing cost of the LED module increases.

In addition, when the LED module is completed by using a PCB or a metal PCB, since the heat dissipation is poor, the number of LED devices that can be mounted in one module in an array form is limited.

SUMMARY OF THE INVENTION An object of the present invention for solving the above problems is to provide an LED module that can be implemented at a low manufacturing cost with excellent heat dissipation effect using a metal substrate.

LED module according to the first aspect of the present invention for achieving the above technical problem, the lower metal substrate; A plurality of electrode layers formed of an insulating layer and an upper metal substrate sequentially formed, and repeatedly formed on the lower metal substrate; A mounting groove formed by etching a portion of the electrode layer to expose a surface of the lower metal substrate to mount a plurality of LEDs; And a plurality of LEDs mounted in the mounting groove, wherein the LEDs are wire bonded to each upper metal substrate of the electrode layer.

LED module according to a second aspect of the present invention, the lower metal substrate; A plurality of electrode layers formed of an insulating layer and an upper metal substrate sequentially formed, and repeatedly formed on the lower metal substrate; A plurality of mounting grooves formed by etching a portion of the electrode layer to expose a surface of the lower metal substrate for mounting a plurality of LEDs; A plurality of LEDs mounted on each of the mounting grooves; And an insulating groove formed by etching some regions of the electrode layers between the mounting grooves so that the LEDs mounted on the mounting grooves are electrically insulated from the LEDs mounted on the neighboring mounting grooves. Are wire bonded to each upper metal substrate of the electrode layer.

In the LED module according to the first and second features described above, the side surface of the mounting groove is formed to be inclined, and the bottom surface of the mounting groove is horizontal to the exposed surface of the upper metal substrate of each electrode layer of the side of the mounting groove. It is preferable to have a wire bonding portion formed so that the lead wires of the LEDs are bonded to each wire bonding portion.

In the LED module according to the first and second features described above, the lower metal substrate and the upper metal substrates of the electrode layer are formed of aluminum, and the exposed surfaces of the lower metal substrate and the plurality of electrode layers are anodized. desirable.

In the LED module according to the first and second features described above, the electrode layer is composed of three, the LED module is a first insulating layer, a first upper metal substrate, a second insulating layer, And a second upper metal substrate, a third insulating layer, and a third upper metal substrate, wherein the lower metal substrate is connected to the negative terminal of the LEDs and used as a common electrode, and the first upper metal substrate and the second upper metal substrate. The substrate and the third upper metal substrate are preferably wire-bonded with the (+) electrode of the LED and used as the electrode of the LED.

In the LED module according to the first and second features described above, it is preferable to further include a heat dissipation unit on the rear surface of the lower metal substrate.

In the LED module according to the first and second features described above, the LED is characterized in that consisting of a blue LED, or consisting of R, G, B LEDs.

In the LED module according to the first and second features described above, the lower metal substrate may be used as a heat dissipation layer instead of being used as an electrode of the LEDs.

In the LED module according to the above-described first and second features, the electrode layer is composed of two, the LED module is formed on the lower metal substrate sequentially the first insulating layer, the first upper metal substrate, the second insulating layer, 2 may include an upper metal substrate, or the electrode layer may include a single layer, and the LED module may include an insulating layer and an upper metal substrate sequentially formed on the lower metal substrate.

LED module manufacturing method according to a third aspect of the present invention, the lower metal substrate, the first insulating layer, the first upper metal substrate, the second insulating layer, the second upper metal substrate, the third insulating layer, the third upper metal substrate Stacking sequentially and then compressing at high pressure and high temperature to complete the metal substrate; Anodizing the metal substrate to form an insulating film on a surface thereof; Forming a mounting groove by etching a predetermined region of the metal substrate; Placing LED elements in the mounting groove, the (-) terminal of the LED elements is wire bonded with the lower metal substrate, and the (+) terminal of the LED elements is the first upper metal substrate, the second upper metal exposed by the mounting groove And wire bonding each of the substrate and the third upper metal substrate.

The LED module according to the present invention uses the aluminum plate having excellent thermal conductivity as a lower metal substrate, thereby enabling the most efficient release of heat emitted from the LED elements.

In addition, the LED module according to the present invention has a low thermal resistance, and does not need to use a ceramic package LED chip, compared to a metal PCB combined with a conventional ceramic packaged LED, thereby reducing the cost for the ceramic package. In addition, it can be implemented inexpensively compared to the manufacturing cost of the metal PCB. As a result, manufacturing costs can be significantly reduced than conventional LEDs manufactured using Metal PCBs.

By forming the electrode layer with an aluminum plate and using them as electrodes for LED devices, it is possible to use inexpensive Al (aluminum) -wire instead of the existing Au (gold)-or Cu (copper) wire. The result is a low cost implementation.

In addition, conventionally, in order to use Au (gold) -wire, a separate gold plating process was required on the part where the wire touched, but the LED module according to the present invention can use Al (aluminum) -wire, and separate gold plating process There is no process, so it can be implemented inexpensively.

Hereinafter, with reference to the accompanying drawings will be described in detail the structure and manufacturing method of the LED module according to an embodiment of the present invention.

1 is a cross-sectional view showing an LED module according to a first embodiment of the present invention. Referring to FIG. 1, the LED module 10 according to the present exemplary embodiment includes a lower metal substrate 100 and first, second and third electrode layers 110, 120, and 130 repeatedly formed on the lower metal substrate. And a mounting groove 140 for mounting the R, G, and B LEDs, a plurality of LEDs 150 mounted on the mounting groove, and a sealing unit 160.

The lower metal substrate 100 is made of an aluminum plate having high thermal conductivity and excellent heat dissipation characteristics. The lower metal substrate 100 is used as a common electrode of the R, G, and B LEDs 150.

The first, second, and third electrode layers 110, 120, and 130 are sequentially formed on the lower metal substrate, and each of the first, second, and third electrode layers 110, 120, and 130 is sequentially formed. The insulating layers 111, 121, and 131 and the upper metal substrates 112, 122, and 132 are formed. The upper metal substrates 112, 122, and 132 are preferably made of an aluminum plate having excellent heat dissipation characteristics.

The exposed upper and lower surfaces and side surfaces of the lower metal substrate 100 and the third electrode layers 11, 120, and 130 may be anodized to form an insulating layer on the surface.

The mounting groove 140 for mounting a plurality of LEDs is formed by etching some regions of the first, second and third electrode layers so that the surface of the lower metal substrate is exposed. The mounting groove 140 may be configured in various forms, such as a circle, a polygon. In addition, the side of the mounting groove is formed to be inclined, and then it is preferable to apply a reflective material to the surface of the side to form a reflecting plate 170, so that the light emitted from the LEDs are emitted to the front.

A plurality of LEDs 150 are mounted in the mounting groove, and the LEDs 150 may include a red LED 152, a green LED 151, and a blue LED 153. When the red LED 152 is a vertical LED, it is directly connected without a lead with a lower metal substrate serving as a common electrode. On the other hand, as shown in Figure 3, when the R, G, B LEDs are all vertical LED device, all the LEDs are directly connected on the lower metal substrate without a lead wire.

Wire bonding portions for connecting the lead wires of the LEDs to some regions of the surfaces of the first upper metal substrate 112, the second upper metal substrate 122, and the third upper metal substrate 132 exposed by the mounting grooves. Form 180. The wire bonding unit 180 is preferably formed to be parallel to the bottom surface of the mounting groove. Accordingly, the lead wires of the LEDs mounted in the mounting grooves are electrically coupled to the wire bonding portions 180 of the first upper metal substrate 112, the second upper metal substrate 122, and the third upper metal substrate 132. . In this case, the wire used as the lead wire may preferably use aluminum wire having the same material as the first upper metal substrate 112, the second upper metal substrate 122, and the third upper metal substrate 132. Therefore, the conventional LED module using a PCB or a metal PCB has a disadvantage in that the manufacturing cost is increased by using Au wire to improve the contactability, the LED module according to the present invention has a contactability while using Al wire This superiority enables good properties at low manufacturing costs.

 The sealing part 160 seals or covers the upper part of the mounting part in which the LEDs are mounted by using an epoxy or a lens cap, thereby protecting the LED module and the lead wires for each of them.

Meanwhile, as shown in FIG. 4, the LED module according to the present invention further includes a heat dissipation unit 490 under the lower metal substrate 400 to efficiently dissipate heat generated from the LEDs. The heat dissipation unit 490 is preferably made of an air-cooled or water-cooled heater sink, or a heater pipe.

Hereinafter, a method of manufacturing an LED module according to a preferred embodiment of the present invention will be described in detail with reference to FIG. 2. 2 is a cross-sectional view sequentially showing a manufacturing method of the LED module according to the present invention.

Referring to FIG. 2A, first, a lower metal substrate 100, a first insulating layer 111, a first upper metal substrate 112, a second insulating layer 121, and a second upper metal substrate 122. ), The third insulating layer 131 and the third upper metal substrate 132 are sequentially stacked and then compressed at a high pressure and a high temperature of about 200 ° C. to complete the metal substrate, and then anodized the entire surface. An aluminum oxide film is formed on the entire surface to insulate it.

Next, referring to Figure 2 (b), by etching the insulated metal substrate completed in the previous step to form a mounting groove 140 for mounting the LEDs. The bottom surface of the mounting groove 140 is formed on the lower metal substrate 100, the side of the mounting groove is formed to be inclined, and in order to improve the light emission efficiency of the LED, a reflective material is applied to the side of the mounting groove by applying a reflective material. It is preferable to form 170. In addition, it is preferable to form the wire bonding part 180 in a predetermined area of the exposed first, second and third upper substrates of the side surface of the mounting groove in parallel with the bottom surface.

Next, referring to FIG. 2C, the R, G, and B LEDs 151, 152, and 153 are mounted on the bottom surface of the mounting groove, and the (+) terminals of the R, G, and B LEDs are the first. The wire bonding portions of the second and third upper metal substrates are wire bonded, respectively, and the negative terminals of the R, G, and B LEDs wire bond with the lower metal substrate. In this case, when the LED is a vertical LED, the (-) terminal of the LEDs and the lower metal substrate are directly connected without separate wire bonding.

Next, by filling Epoxy in the upper portion of the mounting groove, the sealing unit 160 for protecting the LED elements and the lead wires is completed.

LED module according to the present invention having the above-described structure may be configured in the form of an array of N x M on one lower metal substrate. 5 is a front view exemplarily illustrating a state in which four LED modules are configured in a 2 × 2 form. On the other hand, by expanding the arrangement structure, it is possible to implement the LED module in the form of an array of 10000 x 10000, it can be used as a large area lighting device.

6 is a front view and a cross-sectional view showing an insulating groove formed to electrically insulate neighboring LED modules when the LED module according to the present invention is manufactured in an array form. As shown in FIG. 6, by forming the insulating grooves 600 and 602 by etching the electrode layers between the adjacent LED modules, the neighboring LED elements are electrically separated.

Although the present invention has been described with reference to preferred embodiments thereof, this is merely an example and is not intended to limit the present invention, and a person of ordinary skill in the art does not depart from the essential characteristics of the present invention. It will be appreciated that various modifications and applications are not possible. And differences relating to such modifications and applications should be construed as being included in the scope of the invention as defined in the appended claims.

The LED module according to the present invention can be widely used for lighting devices, LCD backlights, and the like.

1 is a cross-sectional view showing an LED module according to a preferred embodiment of the present invention.

2 is a cross-sectional view sequentially showing a method of manufacturing an LED module according to an embodiment of the present invention.

3 is a cross-sectional view showing an LED module according to another embodiment of the present invention.

4 is a cross-sectional view showing an LED module according to another embodiment of the present invention.

5 is a front view exemplarily illustrating a state in which four LED modules are configured in a 2 × 2 form.

6 is a front view and a cross-sectional view showing an insulating groove formed to electrically insulate neighboring LED modules when the LED module according to the present invention is manufactured in an array form.

<Explanation of symbols for main parts of the drawings>

10: LED module

100: lower metal substrate

110: first electrode layer

120: second electrode layer

130: third electrode layer

140: mounting groove

150: LED

160: sealing part

170: reflector

180: wire bonding portion

600, 602: insulation groove

Claims (14)

Bottom metal substrate; A plurality of electrode layers formed of an insulating layer and an upper metal substrate sequentially formed, and repeatedly formed on the lower metal substrate; A mounting groove formed by etching a portion of the electrode layer to expose a surface of the lower metal substrate to mount a plurality of LEDs; A plurality of LEDs mounted in the mounting groove; And the LEDs are wire bonded to each upper metal substrate of the electrode layer. Bottom metal substrate; A plurality of electrode layers formed of an insulating layer and an upper metal substrate sequentially formed, and repeatedly formed on the lower metal substrate; A plurality of mounting grooves formed by etching a portion of the electrode layer to expose a surface of the lower metal substrate for mounting a plurality of LEDs; A plurality of LEDs mounted on each of the mounting grooves; An insulating groove formed by etching some regions of the electrode layers between the mounting grooves so that the LEDs mounted on the mounting grooves are electrically insulated from the LEDs mounted on the neighboring mounting grooves; And the LEDs are wire bonded to each upper metal substrate of the electrode layer. The mounting groove of claim 1, wherein a side surface of the mounting groove is formed to be inclined, and horizontally with a bottom surface of the mounting groove on an exposed surface of the upper metal substrate of each electrode layer among the side surfaces of the mounting groove. And a wire bonding part formed, wherein lead wires of respective LEDs are bonded to each wire bonding part. The LED module according to claim 1, wherein the lower metal substrate and the upper metal substrates of the electrode layer are formed of aluminum. The LED module of claim 4, wherein the exposed surface of the lower metal substrate and the plurality of electrode layers is anodized. According to any one of claims 1 to 2, wherein the electrode layer is composed of three LED module is a first insulating layer, a first upper metal substrate, a second insulating layer, a second formed sequentially on the lower metal substrate An LED module comprising an upper metal substrate, a third insulating layer, and a third upper metal substrate. The method of claim 6, wherein the lower metal substrate is connected to the negative terminal of the LEDs and used as a common electrode, wherein the first upper metal substrate, the second upper metal substrate, and the third upper metal substrate are each (+) of the LED. ) LED module characterized in that the wire is bonded to the electrode used as the electrode of the LED. The LED module according to any one of claims 1 to 2, further comprising a heat dissipation unit on a rear surface of the lower metal substrate. The LED module of claim 2, wherein the mounting grooves are arranged in an array of 10000 × 10000, and each of the mounting grooves is equipped with R, G, and B LEDs. The LED module according to any one of claims 1 to 2, wherein the wire connecting the LEDs to the electrode layer is made of the same material as the upper metal substrate. The LED module according to any one of claims 1 to 2, wherein the LED is a blue LED. The LED module according to claim 1, wherein the lower metal substrate is used as a heat dissipation layer and not as an electrode of LEDs. According to any one of claims 1 to 2, wherein the electrode layer is composed of two LED module is a first insulating layer, a first upper metal substrate, a second insulating layer, a second formed sequentially on the lower metal substrate With an upper metal substrate, or The electrode layer is composed of a single layer, the LED module is an LED module, characterized in that it comprises an insulating layer, an upper metal substrate sequentially formed on the lower metal substrate. The lower metal substrate, the first insulating layer, the first upper metal substrate, the second insulating layer, the second upper metal substrate, the third insulating layer, and the third upper metal substrate are sequentially stacked, and then the metal is compressed under high pressure and high temperature. Completing the substrate; Anodizing the metal substrate to form an insulating film on a surface thereof; Forming a mounting groove by etching a predetermined region of the metal substrate; Placing LED elements in the mounting groove, the (-) terminal of the LED elements is wire bonded with the lower metal substrate, and the (+) terminal of the LED elements is the first upper metal substrate, the second upper metal exposed by the mounting groove Wire bonding each of the substrate and the third upper metal substrate; LED module manufacturing method comprising a.
KR1020090021838A 2009-03-13 2009-03-13 LED module using metal substrate and manufacturing method thereof KR101055673B1 (en)

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JP2007165735A (en) 2005-12-16 2007-06-28 Drill Center:Kk Led mounting substrate and its manufacturing method
JP2008060330A (en) 2006-08-31 2008-03-13 Toshiba Corp Element mounting circuit-board, and luminescent device using same
KR101253183B1 (en) * 2007-01-26 2013-04-10 엘지전자 주식회사 Printed circuit board, light emitting apparatus having the same and method for manufacturing thereof
JP2009054801A (en) 2007-08-27 2009-03-12 Sanyo Electric Co Ltd Heat radiation member, and light emitting module equipped with the same

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