KR101253183B1 - Printed circuit board, light emitting apparatus having the same and method for manufacturing thereof - Google Patents

Abstract

The present invention relates to a printed circuit board, a light emitting device including the same, and a manufacturing method thereof. The light emitting device including the printed circuit board includes a printed circuit board stacked in the order of an aluminum layer, an aluminum oxide layer, and a copper wiring layer, at least one light emitting part formed on the printed circuit board, and each of the at least one light emitting part. Is characterized in that it comprises a lens. Therefore, the printed circuit board according to the present invention, a light emitting device including the same, and a manufacturing method thereof have high thermal conductivity and a low manufacturing cost due to the use of an aluminum oxide layer as an insulator of the printed circuit board, and light emission formed on the printed circuit board. By simultaneously forming a lens on the part, the number of processes and manufacturing time are saved, and the mass productivity is improved.

Light Emitting Diode, Printed Circuit Board, Aluminum Oxide, Compression Molding

Description

Printed circuit board, light emitting apparatus having the same and method for manufacturing according to the present invention

1A to 1C are views illustrating a manufacturing process of a conventional LED lighting module.

2 is a view showing an embodiment of a printed circuit board according to the present invention.

3A to 3E are views illustrating a manufacturing process of an embodiment of a method of manufacturing a printed circuit board according to the present invention.

4 (a) and 4 (b) are diagrams illustrating an embodiment of a light emitting device including a printed circuit board according to the present invention.

5A to 5E are diagrams illustrating a manufacturing process of an embodiment of a manufacturing method of a light emitting device including a printed circuit board according to the present invention shown in FIG.

6A to 6E are views illustrating a manufacturing process of an embodiment of a manufacturing method of a light emitting device including the printed circuit board according to the present invention shown in FIG. 4 (b).

<Explanation of symbols for the main parts of the drawings>

100: light emitting unit 200: printed circuit board

210: aluminum layer 230: aluminum oxide layer

250: circuit wiring layer 252: electrode pad

300: lens 400: protective film

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board, a light emitting device including the same, and a manufacturing method thereof, and more particularly, to a printed circuit board suitable for a light emitting diode, a light emitting device including the same, and a manufacturing method thereof.

Light emitting diodes (hereinafter referred to as LEDs) are devices that realize light emission by effecting electric field by depositing a compound semiconductor thin film on a substrate, and are recently being actively used as displays for lighting, communication, and various electronic devices.

Among various applications of LED, each researcher's efforts are very active in the field of back light unit (BLU) used in thin-film TV such as LCD and lighting field that can replace fluorescent lamp. In order to apply LEDs to these applications, studies on LED structures, materials, and packages are being actively conducted. The manifestation of the function of the LED is the process of injecting electrons and holes and emitting energy in the form of light when they are combined and dissociated. At this time, a large amount of energy is released as heat, and the heat generated can be alleviated by an appropriate heat sink in package manufacture.

1A to 1C show a manufacturing process of a conventional LED lighting module. As described above, when the LED is used in the lighting module, as the LED substrate, the aluminum layer 21, the insulating layer 23, and the copper layer 25 are used. In order to use a metal core printed circuit board (MCPCB) 20 having a multi-layer structure, the metal core printed circuit board 20 is expensive, which is a great burden for the development of lighting products employing LEDs. In addition, the lighting module is composed of a plurality of LED package 10, in this case, as many LED package 10 as necessary for the lighting module to be assembled and attached to the substrate, the lens 30 also LED package (10) Since it must be bonded to), this increases the number of processes, there is a problem in lowering the mass productivity.

SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a printed circuit board having a low cost and good productivity, a light emitting device including the same, and a method of manufacturing the same.

In order to achieve the above object, the printed circuit board according to the present invention comprises an aluminum layer, an aluminum oxide layer formed on the aluminum layer and a circuit wiring layer formed on the aluminum oxide layer.

In addition, to achieve the above object, a light emitting device including a printed circuit board according to the present invention is a printed circuit board laminated in the order of an aluminum layer, an aluminum oxide layer and a copper wiring layer, and at least one light emitting formed on the printed circuit board And a lens surrounding each of the at least one light emitting unit.

In addition, in order to achieve the above object, a light emitting device manufacturing method comprising a printed circuit board according to the present invention comprises the steps of preparing a printed circuit board laminated in the order of an aluminum layer, an aluminum oxide layer and a copper wiring layer, and on the printed circuit board Attaching at least one light emitting portion to the lens and forming a lens surrounding each of the at least one light emitting portion.

Hereinafter, embodiments of a printed circuit board, a light emitting device including the same, and a method of manufacturing the same according to the present invention will be described with reference to the accompanying drawings. At this time, the configuration and operation of the present invention shown in the drawings and described by it will be described as at least one embodiment, by which the technical spirit of the present invention and its core configuration and operation is not limited. Like reference numerals denote like elements throughout the description of the drawings. In the drawings the dimensions of layers and regions are exaggerated for clarity.

Figure 2 is a view showing an embodiment of a printed circuit board according to the present invention, in particular, Figure 2 (a) is a cross-sectional view of an embodiment of a printed circuit board according to the present invention, Figure 2 (b) is in accordance with the present invention Is a plan view of one embodiment of a printed circuit board.

As shown in FIG. 2, the printed circuit board 200 according to the present invention includes an aluminum layer 210, an aluminum oxide layer 230 formed on the aluminum layer 210, and an aluminum oxide layer 230. It is preferable that the circuit wiring layer 250 is formed.

Here, the circuit wiring layer 250 is preferably made of copper. In addition, an electrode pad 252 may be formed on the circuit wiring layer 250 so that the LED package or the LED chip is connected, and the electrode pad 252 is preferably made of gold.

As described above, the present invention uses the aluminum oxide layer 230 as the insulating layer, which allows the use of a printed circuit board having excellent thermal conductivity and low cost.

3A to 3E are views illustrating a manufacturing process of an embodiment of a method of manufacturing a printed circuit board according to the present invention.

First, as shown in FIG. 3A, an aluminum substrate 210 is prepared.

Next, as shown in FIG. 3B, an anti-oxidation film 212 is formed on one surface of the aluminum substrate 210. Here, the anti-oxidation film 212 may be a photoresist, and may be various materials for preventing oxidation of aluminum. As such, the reason for forming the anti-oxidation film 212 is to oxidize only one surface of the aluminum substrate 210 to the aluminum oxide layer 230.

Next, as shown in FIG. 3C, the aluminum oxide layer 230 is formed by anodizing the aluminum substrate 210 on which the anti-oxidation film 212 is formed. In other words, the surface on which the antioxidant film 212 is not formed is oxidized to become the aluminum oxide layer 230.

Here, anodizing (anodizing) refers to anodized film, a technique for improving the corrosion resistance and wear resistance by making a protective layer due to the oxide material on the surface of the metal.

Thus, in order to anodize aluminum, it is immersed in a suitable acid solution, and a strong electric field is applied to the metal to draw Al ions by the force and combine it with oxygen to make aluminum oxide. In this case, aluminum is advantageous Al ₃ ⁺ ions by the electric field, and this water of O ₂ ^- in combination with the ion to form an Al ₂ O _3. The formed oxide is called aluminum oxide (Al ₂ O ₃ ), and forms a film on the surface of aluminum, the film is thicker than the film formed in the natural state. In addition, aluminum oxide forms a kind of ceramic, called alumite, which is excellent in corrosion resistance, abrasion resistance, and electrical insulation, which helps overcome many of the disadvantages of aluminum.

Finally, as shown in FIGS. 3D and 3E, after removing the antioxidant layer 212, a circuit wiring layer 250 is formed to complete the printed circuit board 200 according to the present invention.

Here, the circuit wiring layer 250 is preferably copper having good electrical conductivity. In addition, an electrode pad may be formed on the circuit wiring layer 250.

4 (a) and 4 (b) are diagrams illustrating an embodiment of a light emitting device including a printed circuit board according to the present invention.

As illustrated, the light emitting device including the printed circuit board according to the present invention includes a printed circuit board 200 stacked in the order of the aluminum layer 210, the aluminum oxide layer 230, and the circuit wiring layer 250, and the printing. At least one light emitting unit 100 formed on the circuit board 200 and a lens 300 surrounding each of the at least one light emitting unit.

Here, the circuit wiring layer 250 is preferably a copper wiring layer having good electrical conductivity.

In addition, the light emitting unit 100 may be a light emitting diode package or a light emitting diode chip.

For example, as shown in FIG. 4A, the light emitting unit 100 may be a wafer level package (WLP) as a light emitting diode package, or a light emitting diode on which a lead frame is formed although not shown. It may be in various forms such as a package. In addition, as shown in FIG. 4B, the light emitting unit 100 may be a flip chip type as a light emitting diode chip.

In addition, in the light emitting device including the printed circuit board according to the present invention, a protective film 400 for protecting the circuit wiring layer 250 made of copper may be formed on the printed circuit board 200.

Here, the protective layer 400 is preferably thicker than the thickness of the circuit wiring layer 350 made of copper. In other words, in the light emitting device according to the present invention, the protective film 400 is formed on the printed circuit board 200 except for the lens 300 to protect the circuit wiring layer 350.

In addition, the protective film 400 is preferably 50 μm or more in thickness. This is because the thickness of the circuit wiring layer 250 is preferably thinner than 50 μm.

In the light emitting device including the printed circuit board according to the present invention, the lens and the protective film are preferably made of silicon.

Accordingly, the light emitting device according to the present invention is simple, because the protective film is formed of silicon, such as a lens, so that the protective film does not have to be formed of a separate material.

In addition, the material constituting the lens 300 may include a color conversion material such as phosphors to output various colors of light, and may emit white light according to a combination of lenses including red, green, and blue phosphors. have.

In addition, the shape of the lens 300, as shown in Figure 4 (a) and 4 (b), may be a hemispherical shape, although not shown, use of a light emitting device such as aspherical surface, dome shape, semi-elliptic shape It may vary depending on the purpose.

In addition, the light emitting unit 100 may be reduced in size according to the purpose of use of the light emitting device, and the lens 300 may also be a micro lens.

5A to 5E and 6A to 6E are views illustrating a manufacturing process of an embodiment of a method of manufacturing a light emitting device including a printed circuit board according to the present invention shown in FIGS. 4A and 4B. to be.

First, as shown in FIGS. 5A and 6A, the printed circuit board 200 stacked in the order of the aluminum layer 210, the aluminum oxide layer 230, and the circuit wiring layer 250 made of copper is prepared. Here, an electrode pad 252 may be formed on the circuit wiring layer 250.

Next, at least one light emitting unit 100 is attached to the printed circuit board 200. The light emitting unit 100 may be, for example, a wafer level package (WLP) as a light emitting diode package, as shown in FIG. 5A, or a light emitting diode chip as shown in FIG. 6A. It may be in the form of a flip chip.

Next, as shown in FIGS. 5B and 6B, the mold 500 in which the lens frame 520 is formed at a position corresponding to the at least one light emitting part 100 attached to the printed circuit board 200. Prepare.

Here, the lens-shaped frame 520 may be a hemispherical shape, as shown, or may have various shapes such as a semi-elliptic shape (not shown).

Next, as shown in FIGS. 5C and 6C, a release agent film 522 is formed on the mold 500.

Here, the release agent film 522 is preferably polyimide. Polyimide is a material excellent in resin heat resistance, abrasion resistance, self-lubrication, creep resistance, electrical insulation, etc. In the present invention, the polyimide is used to easily separate the lens molding material formed on the mold 500 from the mold after the molding process. .

In addition, the release agent film 522 is preferably 50 μm or less, and if too thin, the release agent film 522 may be torn, so preferably 10 μm to 50 μm.

Next, as shown in FIGS. 5D and 6D, the lens molding material 600 is coated on the release agent film 522. Here, the lens molding material 600 is preferably made of silicon.

Finally, as shown in FIGS. 5E and 6E, the mold 500 coated with the lens molding material 600 is pressed onto the printed circuit board 200 to which the at least one light emitting part 100 is attached. In other words, the circuit wiring layer protective film 400 made of the lens 300 and copper is formed by compression molding. In addition, the surface of the lens and the passivation layer may be smoothly treated with heat or light after the printed circuit board 200 is bonded to the mold 500.

As described above, in the method of manufacturing a light emitting device including the printed circuit board according to the present invention, the number of steps may be achieved by simultaneously forming the lens 300 on the at least one light emitting part 100 and simultaneously forming the protective film 400. This reduces manufacturing time, reduces manufacturing time, and reduces manufacturing costs.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined by the appended claims. , Substitution or addition, or the like.

As described above, the printed circuit board, the light emitting device including the same, and the manufacturing method thereof according to the present invention have high thermal conductivity and reduce manufacturing cost by using an aluminum oxide layer as an insulator of the printed circuit board. By simultaneously forming a lens on the light emitting portion formed on the surface, the number of steps and manufacturing time are saved, and the mass productivity is improved.

Claims (10)

An aluminum layer having a first surface and a second surface, an aluminum oxide layer on the first surface of the aluminum layer, a wiring layer on the aluminum oxide layer, and a pad located on at least a portion of the wiring layer Printed circuit board; At least one light emitting unit electrically connected to a pad of the printed circuit board; And A lens positioned on the light emitting unit; And Located on the wiring layer, and comprises a protective film made of the same material as the lens, At least a portion of the aluminum oxide layer of the printed circuit board is in contact with the protective film. The method of claim 1, wherein the aluminum oxide layer, Light emitting device, characterized in that provided only on the first surface of the aluminum layer. The light emitting device according to claim 1, wherein the protective film has a thickness of 50 µm or more. The method of claim 1, And the lens includes a color converting material. The method of claim 1, The thickness of the protective film is a light emitting device, characterized in that thicker than the wiring layer and thinner than the light emitting portion. The method of claim 1, And a second surface of the aluminum layer is exposed to air. An aluminum layer having a first surface and a second surface, an aluminum oxide layer on the first surface of the aluminum layer, a wiring layer on the aluminum oxide layer, and a pad located on at least a portion of the wiring layer Preparing a printed circuit board; Attaching at least one light emitting part electrically connected to the pad; And Forming a lens and a protective film on the printed circuit board to which the light emitting part is attached; Wherein the lens is positioned on the light emitting portion, and the protective film is positioned on the aluminum oxide layer and the wiring layer. The method of claim 7, wherein the forming of the lens and the protective film, Preparing a mold having a lens-shaped frame formed at a position corresponding to at least one light emitting part attached to the printed circuit board; Placing a release agent film on the mold; Applying a lens molding material onto the release agent film; And And pressing the mold to which the lens molding material is applied to the printed circuit board to which the at least one light emitting part is attached, to form the lens and the protective film. The method of claim 7, wherein And smoothly treating the surfaces of the lens and the protective film. The method of claim 7, wherein The thickness of the protective film is a light emitting device manufacturing method, characterized in that thicker than the wiring layer and thinner than the light emitting portion.

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