KR20100102332A - Apparatus for probing light element array pannel - Google Patents

Apparatus for probing light element array pannel Download PDF

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Publication number
KR20100102332A
KR20100102332A KR1020090020657A KR20090020657A KR20100102332A KR 20100102332 A KR20100102332 A KR 20100102332A KR 1020090020657 A KR1020090020657 A KR 1020090020657A KR 20090020657 A KR20090020657 A KR 20090020657A KR 20100102332 A KR20100102332 A KR 20100102332A
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KR
South Korea
Prior art keywords
optical element
array panel
element array
optical device
axis
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Application number
KR1020090020657A
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Korean (ko)
Inventor
박금성
Original Assignee
주식회사 영우디에스피
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Priority to KR1020090020657A priority Critical patent/KR20100102332A/en
Publication of KR20100102332A publication Critical patent/KR20100102332A/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836—Fault-finding or characterising
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Liquid Crystal (AREA)

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical element array panel inspection apparatus for determining defects by irradiating light to an optical element array of a thin film type (organic thin film, silicon thin film) solar cell or an optical element array of a medical thin film transistor (TFT).

An optical device array panel inspection apparatus according to the present invention includes a base frame (110);

An exposure part 120 installed at an upper portion of the base frame to irradiate light downward;

An inspection stage (130) installed on the lower portion of the exposure unit (120) to place the optical element array panel (P) to be inspected;

An optical element array disposed around the inspection stage 130 and selectively connected to optical element array terminals disposed around the optical element array panel P to respond to light emitted from the exposure unit 120. A probe unit 140 for sensing an electrical signal from each optical element;

A motherboard (B) mounted at a lower portion of the inspection stage 130 in a state of being connected to the probe to receive an electrical signal of each optical device from the probe and perform arithmetic processing; And

And a central processing unit 150 connected to the motherboard B to determine an amount / defect by analyzing an electrical signal of each arithmetic optical element transmitted from the motherboard B.

Optical element, exposure part, array, medical use, TFT

Description

Apparatus for probing light element array pannel}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical element array panel inspection apparatus for determining defects by irradiating light to an optical element array of a thin film type (organic thin film, silicon thin film) solar panel or an optical element array of a medical thin film transistor (TFT).

Recently, various technologies have been developed using an optical element array of a thin film type (organic thin film, silicon thin film) solar cell or an optical element array of a medical thin film transistor (TFT).

The optical device array panels serve to convert the projected image into an electrical signal. An example of a technology to which the function is applied is an X-ray detector.

X-ray detector adopts the digital optical element array using TFT technology instead of the conventional analog X-ray photographing method to obtain a precise image in real time without the film phenomenon. It is a principle that the central processing unit outputs a specific image obtained from the optical device array in real time through a monitor when it is detected, converted into an electrical signal, and then transmitted to the central processing unit (PC).

Therefore, prior to assembling the product, inspection of each optical element in the optical element array panel in advance to check whether each optical element converts an electrical signal normally by pre-irradiating a light source of a specific frequency, and the method is as follows. .

Conventional optical device defect inspection is performed in the dark room, and the FPC connector (Flexible Printed Circuit Connector) connected to each optical device provided on the side of the optical device array panel is placed on the inspection stage to the optical device array panel to be inspected Connect to the connector on the probe motherboard located adjacent to the test stage. Then, when the light source is irradiated to the optical device array panel from the exposure unit installed at a certain distance on the upper portion of the optical device array panel, the central processing unit (PC) connected to the motherboard analyzes the electrical signal data output from each optical device The defect of each optical element is judged.

In the conventional optical device defect inspection, when the optical device array panel is placed on the inspection stage, the operator has to manually connect the connector of the optical device array panel and the connector of the probe motherboard.

In addition, the conventional optical element defect inspection has a problem that the light source irradiated from the exposure unit does not reach the optical element array panel mounted on the table uniformly.

That is, the light source to be irradiated is diffused in the process of reaching the optical element array, the conventional optical element defect inspection inspection apparatus can not control the irradiation range of the light source, so the light source that reaches the optical element array located at the edge of the optical element array panel It is scattered as its strength is weakened so that normal inspection is not performed.

The present invention has been made in consideration of the above-described conventional problems, and can be performed quickly and easily by automating the inspection process, and the light source irradiated from the exposure unit is uniformly irradiated to each optical element so that a highly reliable inspection can be made. An object of the present invention is to provide an optical device array panel inspection apparatus.

In order to achieve the above object, the optical device array panel inspection apparatus according to the present invention is installed on the base frame, the exposure unit for irradiating light to the lower portion of the base frame and the lower portion, and is installed to be elevated in the lower portion of the exposure unit; And an inspection stage on which the optical element array panel to be inspected is placed, and an optical element array terminal disposed around the inspection stage and selectively connected to the optical element array terminals disposed around the optical element array panel to irradiate light from the exposure unit. A probe unit for sensing an electrical signal from each optical element of the optical element array responsive to and a mother mounted on a lower portion of the inspection stage in connection with the probe to receive and process an electrical signal of each optical element from the probe Each light processed by the board and connected to the motherboard and transmitted from the motherboard It characterized in that it comprises a central processing unit for determining the good / bad by analyzing the electrical signal of the device.

According to the optical element array panel inspection apparatus according to the present invention configured as described above, by irradiating the optical element array by providing a diaphragm in the exposure unit with the lamp to limit the irradiation range of the light irradiated by the optical element array accurately By uniformly irradiating there is an effect that greatly improves the inspection reliability.

In addition, since the inspection is automatically performed through the probe unit disposed around the inspection stage, it is possible to prevent the user from having to connect the connector of the optical device array panel and the connector of the probe motherboard by hand as in the prior art. .

The features and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments with reference to the accompanying drawings. Prior to this, the terms or words used in the present specification and claims are defined in the technical spirit of the present invention on the basis of the principle that the inventor can appropriately define the concept of the term in order to explain his invention in the best way. It must be interpreted to mean meanings and concepts.

1 to 4, the optical device array panel inspection apparatus according to the present invention includes a base frame 110, an exposure unit 120 disposed on the base frame, and an exposure unit 120. It is installed on the lower side of the inspection stage 130, the optical device array panel (P) to be inspected, and the inspection stage 130 is disposed around the optical device array panel (P) A probe unit 140 for sensing an electrical signal from each optical element of the optical element array in response to light emitted from the exposure unit 120 by being selectively connected to the optical element array terminals disposed therein, and connected to the probe Motherboard (B) mounted in the lower portion of the inspection stage 130 to receive the electrical signal of each optical element from the probe and arithmetic processing, and is connected to the motherboard (B) from the motherboard (B) Delivered Is largely composed of a central processing unit 150 for analyzing the electrical signal of each optical element processed to determine the good / bad.

As shown in FIG. 3, the exposure part 120 is installed at a support plate 121 having a through hole formed at a center thereof and at a predetermined distance above the through hole of the support plate 121. The lamp 122 irradiates light downward, and the lens 123 uniformly distributes the light generated by the lamp 122. In addition, the lens 123 is vertically moved up and down through a vertical transfer part installed on the support plate 121.

The vertical conveying part is fastened to the vertical spiral bar 124 so that the vertical spiral bar 124 and the vertical spiral bar 124 installed on the support plate 121, the vertical spiral bar 124 in the direction of rotation and the other side is the lamp And a horizontal bracket 125 connected to the lens 122 and the lens 123, and a lifting handle (not shown) installed below the support plate 121 to impart rotational force to the vertical or vane 124.

The vertical spiral bar 124 may be supported through a separate vertical bracket 126 fixed to the upper support plate 121, in this case, the front and rear of the vertical bracket 126 to raise and lower the horizontal bracket 125 It is preferable to further provide a vertical guide rail (126a) for guiding.

Meanwhile, an aperture may be further provided below the lamp 122 to limit an irradiation range of light passing through the lamp 122. The diaphragm includes a pair of x-axis apertures 127 installed side by side on the support plate 121 and a pair of y-axis apertures 128 installed side by side on the support plate 121 so as to intersect the x-axis aperture 127. ) And first moving means for imparting a moving force to the upper apertures 127 and 128. The first moving means includes an x-axis rotary rod 127a that sequentially connects the ends of the x-axis apertures 127, a y-axis rotary rod 128a that sequentially connects the ends of the y-axis apertures 128, and the respective rotary rods. It may be configured as a handle (not shown) installed below the support plate 121 to impart the reverse rotation power to the (127a, 128a). Each of the rotating rods 127a and 128a has a forward screw portion and a reverse screw portion formed therein, and ends of the stops 127 and 128 are connected through the forward screw portion and the reverse screw portion.

As shown in FIG. 4, the probe units 140 are disposed around the test stage 130 and installed to approach the test stage 130 when the test starts. To this end, each of the probe units 140 includes a transfer rod 141 spirally coupled to the end of each probe unit 140, and a forward and reverse motor 142 for forward and reverse rotation of the transfer rod 141.

In addition, as shown in Figures 5 and 6, the inspection stage 130 is installed so as to be elevated through the vertical control unit. The vertical control unit includes a first base block 161 coupled to a lower portion of the inspection stage 130, a vertical spiral rod 162 fitted to a lower portion of the first base block 161, and a lower portion of the vertical spiral rod 162. The fastening block 163 connected to the through, and the stationary motor 163 is connected to the lower end of the vertical spiral bar 162 to impart rotational force to the vertical spiral bar 162.

Meanwhile, an alignment camera 170 for inspecting the position of the optical device array panel P may be further provided on the inspection stage 130. In this case, the alignment camera 170 is installed to inspect the position of the optical device array panel (P) while moving to both sides of the optical device array panel (P) through the transfer guide 171 installed on the base frame (110). do.

Inspection stage 130 according to the present invention is provided with a position control means to enable posture correction in accordance with the position signal of the optical element array panel (P) transmitted from the alignment camera 170.

As shown in FIG. 7, the position control means includes a second base block 171 positioned above the first base block 161 and a second base block fixed to the lower side of the inspection stage 130. Cross-rolling ring 172 penetrated at four edges of 171 and the x-axis LM guide 173 and the y-axis LM guide 174 laminated in the direction orthogonal to each other at the lower portion of each cross roller ring 172 ), A pair of x-axis LM guide drive motors 175 disposed side by side on the first base block 161, and y-axis LM guides installed in a direction orthogonal to the x-axis LM guide drive motor 175. The driving motor 176 may be configured.

Meanwhile, as shown in FIGS. 1 and 2, the optical device array panel (P) moves along the transfer guide 171 installed on the upper portion of the base frame 110 at an upper portion spaced apart from the inspection stage 130 by a predetermined distance. It is preferable that the microscope 180 is further installed to check the abnormality of the connection portion between the optical device array terminal and the probe pin.

The optical device array panel inspection apparatus according to the present invention configured as described above looks at the process of the inspection of the optical device array panel.

Prior to the detailed description, the optical device array panel P to be inspected is a state before the FPC connector is assembled, and the optical device array terminals are exposed to the outside along the edge of the panel body. Thus, the FPC connector is assembled after this inspection process.

The optical device array panel inspection is performed in a dark room, and the lamp 122 of the exposure unit 120 is in a state of irradiating light.

First, when the optical device array panel P to be inspected is placed on the inspection stage 130, the alignment camera 170 photographs the alignment mark previously displayed on the optical device array panel P and the optical device array panel ( Check that P) is in the correct position.

If the optical element array panel (P) is not in the correct position, the correction displacement is calculated to correct the position of the inspection stage 130 through the position correction means.

The inspection stage 130 is capable of horizontally moving and tilting through the x-axis LM guide drive motor 175 and the y-axis LM guide drive motor 176 constituting the position correction means, and cross-rolling ring 172. Rotation is also possible. That is, as shown in FIG. 8, the inspection stage 130 is moved in parallel in the x-axis when the pair of x-axis LM guide drive motors 175 are simultaneously driven in the same direction, and the y-axis LM guide drive motor 176. ) Drive only in parallel to the y-axis, while driving a pair of x-axis LM guide drive motor 175 in the same direction at the same time while driving the y-axis LM guide drive motor 176 is moved inclined, When the y-axis LM guide drive motor 176 is driven while simultaneously driving the x-axis LM guide drive motor 175 in the opposite direction, the rotation is moved by the action of the cross roller ring 172.

When the optical device array panel P is placed in the correct position through the position correction, x is transmitted so that the light passing through the lens 123 of the exposure unit 120 can be uniformly irradiated onto the optical device array panel P. The positions of the axial stop 127 and the y-axis stop 128 are adjusted. If necessary, the height of the lens 123 and the lamp 122 may be adjusted through the vertical transfer part. Position of each aperture 127, 128 is made through a handle connected to the corresponding rotary rods (127a, 128a), the height of the lamp 122 is also made through a handle connected to the bottom of the vertical spiral rod 124.

When the setting of the diaphragms 127 and 128 is completed, the probe unit 140 moves closer to the optical element array panel P. That is, when the rotation axis of the stationary motor 142 rotates in one direction, the probe unit 140 spirally coupled with the transfer rod 141 is rotated along the transfer rod 141 while the transfer rod 141 rotates along the rotation axis. It is conveyed to the element array panel P side.

When the position movement of the probe unit 140 is completed, the inspection stage 130 is raised. That is, the inspection stage 130 is the vertical helix rod 162 installed under the first base block 161 is rotated through the operation of the stationary motor 163 while pushing up the first base block 161 as described above. Ascending along the first base block 161.

When the rising of the inspection stage 130 is completed, the inspection is performed by the optical element array terminals of the optical element array panel (P) placed on the inspection stage 130 and each probe pin of the probe unit 140 in one-to-one contact.

Meanwhile, when the microscope 180 is further installed, the connection state between the optical device array terminals and the probe pin may be inspected through the microscope 180 before the optical device array panel P is inspected.

When the light of the lamp 122 is uniformly irradiated to the optical device array panel (P) through the above process, each optical device generates a different electrical signal according to its own characteristics according to the production process, such electrical signal The probe unit 140 is delivered to the motherboard (B). The motherboard B converts the received electrical signal into a digital signal and transmits it to the central processing unit 150. The central processing unit 150 determines whether there is a defect based on the digital signal.

1 is an external perspective view of an optical device array panel inspection apparatus according to the present invention.

2 is a front view of the optical device array panel inspection apparatus according to the present invention.

3 is an external perspective view of an exposure unit constituting the present invention;

Figure 4 is an external perspective view of the inspection stage constituting the present invention.

5 is a cross-sectional view of FIG. 4 showing a state before the inspection stage is raised.

FIG. 6 is a cross-sectional view of FIG. 4 showing a state where the test stage is raised; FIG.

Figure 7 is a perspective view of the position adjusting means provided in the inspection stage constituting the present invention.

8 is a plan view schematically showing a state in which the position of the inspection stage is adjusted through the position adjusting means of FIG.

<Explanation of symbols for main parts of the drawings>

110 Base frame 120 Exposed part

121.Support plate 122 ... Lamp

123 ... lens 124,162 ... vertical spiral rod

125 ... Horizontal bracket 127 ... X-axis aperture

127a ... x-axis rotating rod 128 ... y-axis aperture

128a ... y-axis rotary rod 130 ... Inspection stage

140 ... Probe unit 141 ... Transfer rod

142,164 ... Static motor 150 ... Central processing unit

161 ... 1st base block 163 ... fastening block

170 Alignment Camera 171 Transfer Guide

171 2nd Base Block 172 Cross Roller Ring

173 ... x Axis LM Guide 174 ... y Axis LM Guide

175 ... x-axis LM Guide Drive Motor 176 ... y-axis LM Guide Drive Motor

180 ... microscope P ... optical element array panel

B ... motherboard

Claims (12)

Base frame; An exposure unit installed on an upper portion of the base frame to irradiate light downward; An inspection stage mounted on the lower portion of the exposure unit so that the optical element array panel to be inspected is placed; Selectively connected to optical element array terminals disposed around the inspection stage and arranged around the optical element array panel to detect an electrical signal from each optical element of the optical element array in response to light emitted from the exposure unit. Probe unit; A motherboard mounted to a lower portion of the inspection stage while being connected to the probe to receive an electrical signal of each optical device from the probe and perform arithmetic processing; And And a central processing unit connected to the motherboard and analyzing the electrical signals of the computed optical elements transmitted from the motherboard to determine the quantity / defect. The method of claim 1, The exposure part A support plate having a through hole formed in the center thereof; A lamp installed at a predetermined distance above the transmission hole of the support plate to irradiate light toward the inspection stage below through the transmission hole; A lens positioned between the lamp and the support plate to limit the irradiation range of the irradiated light; And The optical device array panel inspection apparatus is installed on the support plate and provided with a vertical transfer unit when the lens is vertically lifted. 3. The method of claim 2, The vertical transfer unit Vertical spiral rods installed on the upper support plate; A horizontal bracket connected to the vertical spiral bar on one side thereof to be elevated according to a rotation direction of the vertical spiral bar, and connected to the lamp and the lens on the other side; And Optical device array panel inspection device, characterized in that consisting of a lifting handle for imparting a rotational force to the vertical spiral bar. The method according to any one of claims 1 to 3, An optical device array panel inspection apparatus, characterized in that the aperture is further provided on the upper side of the support plate of the exposure unit to limit the irradiation range of light passing through the lens. The method of claim 4, wherein The aperture is A pair of x-axis apertures installed side by side on the support plate; A pair of y-axis apertures installed side by side on the support plate to intersect the x-axis apertures; And An optical element array panel inspection apparatus, characterized in that it comprises a first moving means for imparting a moving force to the upper apertures. The method of claim 5, The first moving means An x-axis rotating rod having a forward screw portion and a reverse screw portion formed to sequentially connect end portions of the x-axis apertures through the forward screw portion; A y-axis rotating rod having a forward screw portion and a reverse screw portion formed to sequentially connect end portions of y-axis apertures through the forward screw portion; And Optical device array panel inspection device, characterized in that consisting of a handle for imparting reverse rotational power to each of the rotating rods. The method of claim 1, The probe units are installed to be selectively accessible toward the inspection stage through a transfer rod spirally coupled to the end of each probe unit, and a forward and reverse motor for forward and reverse rotation of the transfer rod; The inspection stage is connected to a first base block coupled to the lower portion of the inspection stage, a vertical spiral rod inserted into the lower portion of the first base block, a fastening block fastened through the lower portion of the vertical spiral rod, and connected to a lower end of the vertical spiral rod. An optical element array panel inspection apparatus, characterized in that the elevating is possible through the vertical control unit having a stationary motor for imparting a rotational force to the vertical spiral bar. The method of claim 1, An optical device array panel inspection device, characterized in that the upper portion of the inspection stage is further provided with an alignment camera for inspecting the position of the optical device array panel. The method of claim 8, The alignment camera is an optical element array panel inspection apparatus, characterized in that installed to inspect the position of the panel while moving to both sides of the optical element array panel through a transfer guide installed in the base frame. The method according to any one of claims 7 to 9, The inspection stage Optical device array panel inspection apparatus characterized in that it comprises a position control means to enable posture correction according to the position signal of the optical device array panel transmitted from the alignment camera. The method of claim 10, The position control means A second base block positioned above the first base block in a fixed state below the test stage; A cross roller ring installed through four edges of the second base block; X-axis L-m guides and y-axis L-m guides stacked in a direction orthogonal to each other at a lower portion of each cross roller ring; A pair of x-axis LM guide drive motors installed side by side on the first base block; And An optical element array panel inspection apparatus, comprising a y-axis EL guide drive motor installed in a direction orthogonal to the x-axis LED guide motor. The method of claim 1, An optical microscope is further provided on the upper part spaced apart from the test stage by a microscope for inspecting an abnormality of the connection part between the optical device array terminal of the optical device array panel and the probe while moving along the transport guide installed on the base frame. Device array panel inspection device.
KR1020090020657A 2009-03-11 2009-03-11 Apparatus for probing light element array pannel KR20100102332A (en)

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KR1020090020657A KR20100102332A (en) 2009-03-11 2009-03-11 Apparatus for probing light element array pannel

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102778594A (en) * 2011-05-10 2012-11-14 日本麦可罗尼克斯股份有限公司 Insulation measurement probe unit and insulation measurement device
CN110726481A (en) * 2019-11-19 2020-01-24 哈工大机器人（山东）智能装备研究院 Automatic test equipment for parameter performance of infrared focal plane array detector
CN113655194A (en) * 2021-01-12 2021-11-16 杭州瑞声检测科技有限公司 Rotary adjusting mechanism and probe frame detection table with same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102778594A (en) * 2011-05-10 2012-11-14 日本麦可罗尼克斯股份有限公司 Insulation measurement probe unit and insulation measurement device
CN110726481A (en) * 2019-11-19 2020-01-24 哈工大机器人（山东）智能装备研究院 Automatic test equipment for parameter performance of infrared focal plane array detector
CN113655194A (en) * 2021-01-12 2021-11-16 杭州瑞声检测科技有限公司 Rotary adjusting mechanism and probe frame detection table with same
CN113655194B (en) * 2021-01-12 2024-03-22 杭州申昊科技股份有限公司 Rotation adjusting mechanism and probe frame detection table with same

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