KR20100086944A - 기판처리장치 - Google Patents

기판처리장치 Download PDF

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Publication number
KR20100086944A
KR20100086944A KR1020100005013A KR20100005013A KR20100086944A KR 20100086944 A KR20100086944 A KR 20100086944A KR 1020100005013 A KR1020100005013 A KR 1020100005013A KR 20100005013 A KR20100005013 A KR 20100005013A KR 20100086944 A KR20100086944 A KR 20100086944A
Authority
KR
South Korea
Prior art keywords
glass substrate
substrate
laser
scribe
laser irradiation
Prior art date
Application number
KR1020100005013A
Other languages
English (en)
Korean (ko)
Inventor
마사노리 다오
도모오 우치카타
나오요시 하마카와
히로미쓰 와다
Original Assignee
도레 엔지니아린구 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도레 엔지니아린구 가부시키가이샤 filed Critical 도레 엔지니아린구 가부시키가이샤
Publication of KR20100086944A publication Critical patent/KR20100086944A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Drying Of Semiconductors (AREA)
  • Photovoltaic Devices (AREA)
KR1020100005013A 2009-01-23 2010-01-20 기판처리장치 KR20100086944A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009012494A JP2010167458A (ja) 2009-01-23 2009-01-23 基板処理装置
JPJP-P-2009-012494 2009-01-23

Publications (1)

Publication Number Publication Date
KR20100086944A true KR20100086944A (ko) 2010-08-02

Family

ID=42700082

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100005013A KR20100086944A (ko) 2009-01-23 2010-01-20 기판처리장치

Country Status (3)

Country Link
JP (1) JP2010167458A (ja)
KR (1) KR20100086944A (ja)
TW (1) TW201032934A (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI458587B (zh) * 2012-01-17 2014-11-01 Chin Yen Wang 位置校正裝置
JP5926592B2 (ja) * 2012-03-27 2016-05-25 川崎重工業株式会社 パターニング用レーザ加工装置
JP6255595B2 (ja) 2012-10-12 2018-01-10 株式会社Ihi 割断装置
JP2014124757A (ja) * 2012-12-27 2014-07-07 Mitsuboshi Diamond Industrial Co Ltd 加工装置
JP6269876B2 (ja) * 2017-03-16 2018-01-31 株式会社Ihi 割断装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003223213A (ja) * 2002-01-31 2003-08-08 Nippei Toyama Corp ティーチング方法及びその装置並びにティーチング装置を備えたレーザ加工機
JP2007034168A (ja) * 2005-07-29 2007-02-08 Fujifilm Holdings Corp ステージ位置変動情報取得方法および装置

Also Published As

Publication number Publication date
JP2010167458A (ja) 2010-08-05
TW201032934A (en) 2010-09-16

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