KR20100069480A - 박막 실리콘 태양전지의 제조방법 - Google Patents
박막 실리콘 태양전지의 제조방법 Download PDFInfo
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- KR20100069480A KR20100069480A KR1020080128171A KR20080128171A KR20100069480A KR 20100069480 A KR20100069480 A KR 20100069480A KR 1020080128171 A KR1020080128171 A KR 1020080128171A KR 20080128171 A KR20080128171 A KR 20080128171A KR 20100069480 A KR20100069480 A KR 20100069480A
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 40
- 239000010703 silicon Substances 0.000 title claims abstract description 40
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 132
- 239000002184 metal Substances 0.000 claims abstract description 132
- 229910021417 amorphous silicon Inorganic materials 0.000 claims abstract description 74
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 57
- 238000002425 crystallisation Methods 0.000 claims abstract description 47
- 230000008025 crystallization Effects 0.000 claims abstract description 43
- 239000010409 thin film Substances 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims description 39
- 238000010438 heat treatment Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 12
- 238000002844 melting Methods 0.000 claims description 12
- 229910052804 chromium Inorganic materials 0.000 claims description 9
- 229910052750 molybdenum Inorganic materials 0.000 claims description 9
- 238000000059 patterning Methods 0.000 claims description 9
- 229910052719 titanium Inorganic materials 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 8
- 229910052721 tungsten Inorganic materials 0.000 claims description 8
- 239000010408 film Substances 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052763 palladium Inorganic materials 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 229910052787 antimony Inorganic materials 0.000 claims description 5
- 229910052793 cadmium Inorganic materials 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 claims description 5
- 229910052703 rhodium Inorganic materials 0.000 claims description 5
- 229910052707 ruthenium Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims 2
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 230000001939 inductive effect Effects 0.000 abstract description 3
- 239000003054 catalyst Substances 0.000 abstract 1
- 239000011651 chromium Substances 0.000 description 12
- 239000010936 titanium Substances 0.000 description 12
- 150000002500 ions Chemical class 0.000 description 10
- 238000005229 chemical vapour deposition Methods 0.000 description 8
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 239000011733 molybdenum Substances 0.000 description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 5
- 239000010937 tungsten Substances 0.000 description 5
- 229910006404 SnO 2 Inorganic materials 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- -1 or the like Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 239000007790 solid phase Substances 0.000 description 4
- 238000007715 excimer laser crystallization Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
- H01L31/1872—Recrystallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02672—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using crystallisation enhancing elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
- H01L31/182—Special manufacturing methods for polycrystalline Si, e.g. Si ribbon, poly Si ingots, thin films of polycrystalline Si
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/546—Polycrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Life Sciences & Earth Sciences (AREA)
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- Photovoltaic Devices (AREA)
- Recrystallisation Techniques (AREA)
Abstract
Description
Claims (16)
- (a) 기판 상에 시드(Seed) 금속층을 형성하는 단계;(b) 상기 시드 금속층의 상부에 캡핑층을 형성하고 상기 시드 금속층의 일부가 노출되도록 패터닝하는 단계;(c) 상기 패터닝된 캡핑층을 포함한 상기 기판 상에 제1 비정질 실리콘층을 형성하는 단계;(d) 상기 노출된 시드 금속층을 시드로 하여 상기 제1 비정질 실리콘층의 결정화에 의한 제1 다결정 실리콘층을 형성하는 단계;(e) 상기 제1 다결정 실리콘층 상에 제2 비정질 실리콘층을 형성하는 단계; 및(f) 상기 제1 다결정 실리콘층을 시드로 하여 상기 제2 비정질 실리콘층의 결정화에 의한 제2 다결정 실리콘층을 형성하는 단계를 포함하는 박막 실리콘 태양전지의 제조방법.
- 제1 항에 있어서,상기 단계 (b)에서, 상기 캡핑층은 상기 시드 금속층을 이용하여 상기 제1 비정질 실리콘층을 결정화 할 수 있도록 복수의 개구부를 가지는 시드 금속 결정화 영역을 형성하여 패터닝하는 것을 특징으로 하는 박막 실리콘 태양전지의 제조방 법.
- 제1 항에 있어서,상기 캡핑층은 Mo, Cr, Ti 또는 W 중 선택된 어느 하나의 고융점 금속으로 이루어지는 것을 특징으로 하는 박막 실리콘 태양전지의 제조방법.
- 제1 항에 있어서,상기 캡핑층의 두께는 100 Å 내지 1 ㎛인 것을 특징으로 하는 박막 실리콘 태양전지의 제조방법.
- (a') 기판 상에 전극층을 형성하는 단계;(b') 상기 전극층의 상부에 시드(Seed) 금속층을 형성한 후 패터닝 하는 단계;(c') 상기 시드 금속층 상부에 제1 비정질 실리콘층을 형성하는 단계;(d') 상기 시드 금속층을 시드로 하여 상기 제1 비정질 실리콘층의 결정화에의한 제1 다결정 실리콘층을 형성하는 단계;(e') 상기 제1 다결정 실리콘층 상에 제2 비정질 실리콘층을 형성하는 단계; 및(f') 상기 제1 다결정 실리콘층을 시드로 하여 상기 제2 비정질 실리콘층의 결정화에 의한 제2 다결정 실리콘층을 형성하는 단계를 포함하는 박막 실리콘 태양전지의 제조방법.
- 제5 항에 있어서,상기 전극층은 Mo, Cr, Ti 또는 W 중 선택된 어느 하나의 고융점 금속으로 이루어지는 것을 특징으로 하는 박막 실리콘 태양전지의 제조방법.
- 제5 항에 있어서,상기 전극층의 두께는 100 Å 내지 1 ㎛인 것을 특징으로 하는 박막 실리콘 태양전지의 제조방법.
- 제1 항 또는 제5 항에 있어서,상기 시드 금속층은 Ni, Pd, Ag, Au, Al, Sn, Sb, Cu, Co, Tr, Ru, Rh, Cd 또는 Pt 중 선택된 어느 하나의 금속으로 이루어지는 것을 특징으로 하는 박막 실리콘 태양전지의 제조방법.
- 제1 항 또는 제5 항에 있어서,상기 시드 금속층은 금속 박막 또는 금속 파우더의 형태인 것을 특징으로 하는 박막 실리콘 태양전지의 제조방법.
- 제1 항 또는 제5 항에 있어서,상기 시드 금속층의 두께는 10 내지 1000 Å 인 것을 특징으로 하는 박막 실리콘 태양전지의 제조방법.
- 제1 항 또는 제5 항에 있어서,상기 제1 및 제2 비정질 실리콘층은 각각 n 형 및 p 형 비정질 실리콘층인 것을 특징으로 하는 박막 실리콘 태양전지의 제조방법.
- 제1 항 또는 제5 항에 있어서,상기 제1 및 제2 다결정 실리콘층은 각각 n 형 및 p 형 다결정 실리콘층인 것을 특징으로 하는 박막 실리콘 태양전지의 제조방법.
- 제1 항 또는 제5 항에 있어서,상기 결정화는 열처리에 의해 이루어지는 것을 특징으로 하는 박막 실리콘 태양전지의 제조방법.
- 제13 항에 있어서,상기 열처리는 300 내지 800 ℃ 에서 이루어지는 것을 특징으로 하는 박막 실리콘 태양전지의 제조방법.
- 제1 항 또는 제5 항에 있어서,상기 단계 (f) 또는 단계 (f') 이후,(f-1)/(f'-1) 상기 제2 다결정 실리콘층 상부에 투명전극을 형성하는 단계; 및(f-2)/(f'-2) 상기 투명전극의 상부에 투명 보호필름을 형성하는 단계를 더 포함하는 것을 특징으로 하는 박막 실리콘 태양전지의 제조방법.
- 제15 항에 있어서,상기 투명전극은 SnO2 또는 ITO로 이루어지는 것을 특징으로 하는 박막 실리콘 태양전지의 제조방법.
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KR20150084305A (ko) * | 2014-01-13 | 2015-07-22 | 엘지전자 주식회사 | 태양 전지의 제조 방법 |
KR101959754B1 (ko) * | 2018-02-27 | 2019-03-19 | 한국과학기술원 | 비냉각형 적외선 센서용 감지막 형성방법과 그에 따라 형성된 비냉각형 적외선 센서용 감지막 및 비냉각형 적외선 센서 제조방법과 그에 따라 제조된 적외선 센서 |
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KR101074131B1 (ko) | 2010-07-27 | 2011-10-17 | 노코드 주식회사 | 다결정 실리콘 태양전지의 제조방법 및 그 방법으로 제조된 태양전지 |
KR101179223B1 (ko) | 2011-03-02 | 2012-09-03 | 노코드 주식회사 | 다결정 실리콘 박막의 제조방법 |
KR101470492B1 (ko) * | 2012-05-21 | 2014-12-09 | 주성엔지니어링(주) | 태양전지 및 태양전지 블록 |
WO2019182263A1 (ko) * | 2018-03-23 | 2019-09-26 | 홍잉 | 저온 다결정 반도체 소자 및 그 제조 방법 |
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KR101959754B1 (ko) * | 2018-02-27 | 2019-03-19 | 한국과학기술원 | 비냉각형 적외선 센서용 감지막 형성방법과 그에 따라 형성된 비냉각형 적외선 센서용 감지막 및 비냉각형 적외선 센서 제조방법과 그에 따라 제조된 적외선 센서 |
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