KR20100064809A - Method of connecting pcb sheet - Google Patents

Abstract

PURPOSE: A connecting method of a printed circuit board sheet is provided to prevent cost increase to an expensive heat-resistant tape by removing the expensive heat-resistant tape. CONSTITUTION: A defective PCB(120) is cut on a printed circuit board sheet(100). The printed circuit board sheet and a faultless printed circuit board(110) are fastened to a fixing frame(300). The fastening tape is attached to the upper side of the joint area of the faultless printed circuit board and the printed circuit board sheet fastened to the fixing frame. The fixing frame is separated from the printed circuit board sheet. The lower fastening tape is attached to the lower side of the joint area. An adhesive injection hole is formed on either the upper fastening tape or the lower fastening tape. An adhesive is inserted into the joint area of the printed circuit board sheet and the faultless printed circuit board through the adhesive injection hole. A light radiation unit radiates light to the joint area.

Description

METHODS OF CONNECTING PCB SHEET}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of connecting a printed circuit board sheet, and more particularly, to an increase in the number of processes, a delay in process time, a decrease in productivity, and an expensive heat-resistant tape, caused by the use of a conventional thermosetting adhesive. The present invention relates to a method for connecting a new printed circuit board sheet that solves problems such as necessity, addition of OSP peeling and reprocessing process, addition of a point-stone X-out marking process, and the like.

Recently, in the case of manufacturing and supplying a printed circuit board sheet consisting of a plurality of printed circuit boards, for the receiving company, various problems such as environmental problems such as an increase in manufacturing cost due to the defective rate and disposal of defective products In order to reduce the number of defects, the allowable defect rate of printed circuit board sheets is being lowered from about 20% to about 10%.

With this trend, so-called "page regeneration" of printed circuit board sheets has become more important. Here, "page regeneration" refers to a process of cutting out a defective printed circuit board from a printed circuit board sheet, refilling a good printed circuit board, and joining them. A general technique for this is disclosed in Korean Patent No. 642848.

This trend, as mentioned earlier, would also be a desirable direction for the prevention of environmental problems and cost reduction. For example, in the case of expensive products, since the unit price of the product of about 100,000 won per printed circuit board sheet can be lowered to 2,000 won through page regeneration, it brings significant economic benefits.

However, in the case of conventional regeneration, hot air drying is performed during drying, that is, a process of thermosetting the adhesive for 30 to 60 minutes at a temperature of 80 to 140 degrees Celsius is adopted. However, when the adhesive is thermally cured, serious problems such as discoloration, discoloration, and warping of the surface of the printed circuit board are often caused, and the meaning of regeneration of the replacement of defective parts with good quality is faded. Caused.

In addition, the expensive heat-resistant tape must be used due to the specific process of thermal curing in the past, resulting in a cost increase.

In addition, due to the specific process of using the existing thermosetting, there was a problem that takes a lot of heating costs.

In addition, since the epoxy resin is thermally cured using an epoxy resin, the elevated temperature during thermal curing causes the flowability of the epoxy resin, which is an adhesive, to cause the epoxy resin to be oriented laterally from the original position at the site to be bonded, that is, the adhesive surface. There was a problem that a tendency to escape down. Furthermore, a secondary problem due to the epoxy resin thus removed, namely, a fatal problem such as damage to the printed circuit pattern of the printed circuit board sheet.

Furthermore, when conventionally heated for thermal curing, the OSP, ie, the flux solvent, which is applied to the surface of the printed circuit board near the curing temperature, is partially evaporated and blows away, and a portion of the flux solvent remains on the printed circuit board surface. Since there is a problem that the thickness of the flux solvent is non-uniform, conventional page regeneration requires more OSP peeling process before page regeneration and additional OSP reprocessing step after page regeneration to solve this problem. I had a problem.

In addition, if you look at the general process of page regeneration, you can perform a "final inspection of printed circuit board sheets ⇒ point X-out marking ⇒ OSP peeling ⇒ Pumice or acid treatment ⇒ page regeneration ⇒ OSP reprocessing ⇒ final inspection ⇒ shipment inspection". do. At this time, it is necessary to have a process called "Gumseok X-out Marking". This "Gumseok X-out Marking" process is like a pointed pen, and scrapes the printed circuit board with a letter X to recognize defective products. As a step, the scrapes, powder components and debris components of the scraped-out printed circuit board acted as a factor to increase the defective rate in the subsequent process.

However, when a defective product is displayed by means of being erased well without a process of scraping a printed circuit board, it is usually erased in a later step of OSP peeling, so that the defective product cannot be recognized. There was a problem that we had to use a process called "Gum X-out Marking" which had the fundamental problem mentioned above.

For this reason, in order to remove foreign substances, conventionally, there was the trouble of additionally performing Pumice or acid treatment.

The present invention, which was devised to solve the above problems, can provide a method of connecting a printed circuit board sheet which can shorten the number of processes and processing time and reduce the process cost through UV adhesive or visible light adhesive. It is an object of the present invention.

In addition, since there is no need for conventional heat curing, the heating cost consumed for heat curing can be reduced, and furthermore, since expensive heat resistant tape is not required, unnecessary cost increase caused by purchasing expensive heat resistant tape can be eliminated. Another object of the present invention is to provide a method of connecting a printed circuit board sheet.

In addition, since there is no conventional thermal curing step, it is another object of the present invention to provide a method for connecting a printed circuit board sheet, which is a source of the problem of adhesive leakage due to the flowability of the above-mentioned adhesive is blocked at the source. It is done.

In addition, since there is no conventional thermal curing step, the OSP, that is, the flux solvent due to the heating is partially evaporated and blown away, and some of the flux solvent remains on the surface of the printed circuit board, thereby eliminating the problem of uneven thickness of the flux solvent. Another object of the present invention is to provide a method of connecting a printed circuit board sheet, which does not require additional OSP peeling and OSP reprocessing.

In addition, when the adhesive is thermally cured, serious problems such as discoloration, discoloration, and warping of the surface of the printed circuit board are often caused, and the meaning of regeneration of the replacement of defective parts with good quality is faded. The invention provides a method of connecting a printed circuit board sheet that eliminates the problem and provides a very thin, ie ultra-thin printed circuit board that is susceptible to variations, discolorations and warpage in heating. Another purpose.

In addition, since there is no need to perform the OSP peeling process and the OSP reprocessing process previously added, there is no need to perform a process called "Grip Point X-out Display", and only a "Name Pen X-out Display" process is sufficient, thus, Connection of a printed circuit board sheet due to a process called "point X-out marking", which can prevent debris, powder, and debris from scraped printed circuit boards, which is a factor of increasing the defective rate in a subsequent process. It is another object of the present invention to provide a method.

Another object of the present invention is to provide a method of connecting a printed circuit board sheet, which is sufficiently possible only by a router washing process after page regeneration, without additionally performing a Pumice or acid treatment.

In order to achieve the above object, according to an embodiment of the present invention, a cutting step (a) step of cutting and removing the defective printed circuit board from a printed circuit board sheet consisting of a plurality of printed circuit board; A fixing step (b) of fixing the printed circuit board sheet from which the defective printed circuit board is removed and the good printed circuit board to the fixing frame; The upper fixing tape is attached to the upper portion of the coupling portion between the printed circuit board sheet fixed to the fixing frame and the good quality printed circuit board, the printed circuit board sheet is turned upside down, and the lower fixing tape is attached to the lower portion of the coupling portion. Attaching (step (c)); An injection hole forming step (d) of forming an adhesive injection hole in one of the upper fixing tape and the lower process tape attached to the printed circuit board sheet; An injection step (e) step of injecting an adhesive to the coupling portion between the printed circuit board sheet and the good printed circuit board through the adhesive injection hole; And a light irradiating step ((f) step) of irradiating light with a light irradiator for irradiating light of a wavelength at which the adhesive photoreacts to the coupling portion between the printed circuit board sheet and the good printed circuit board. It includes, wherein the upper fixing tape or the lower fixing tape, characterized in that the adhesive is made of a material that can transmit light of the wavelength of the photoreaction, providing a method of connecting a printed circuit board sheet.

In addition, the light is ultraviolet or visible light, the adhesive is preferably included a photoinitiator reacting to the ultraviolet or visible light.

In addition, the upper fixing tape or the lower fixing tape irradiated through the light irradiator is preferably transparent.

In addition, the light irradiation step, it is preferable to irradiate within 20 seconds at room temperature (or room temperature).

In addition, before the step (a), it may further include a defective printed circuit board display step of displaying, with a name pen for the defective printed circuit board of the printed circuit board sheet.

In addition, after the step (f), it may further include a washing step.

On the other hand, according to another embodiment of the present invention, a cutting step (a) step of cutting and removing the defective printed circuit board from the printed circuit board sheet consisting of a plurality of printed circuit board; A fixing step (b) of fixing the printed circuit board sheet from which the defective printed circuit board is removed and the good printed circuit board to the fixing frame; Attaching an upper fixing tape to an upper portion of the coupling portion between the printed circuit board sheet fixed to the fixing frame and the good quality printed circuit board and removing the printed circuit board sheet from the fixing frame (step (c1)); An injection step (e1) of injecting an adhesive into a coupling portion between the printed circuit board sheet and a good printed circuit board through a lower portion of the printed circuit board sheet; And a light irradiating step ((f) step) of irradiating light with a light irradiator for irradiating light of a wavelength at which the adhesive photoreacts to the coupling portion between the printed circuit board sheet and the good printed circuit board. It provides a method of connecting a printed circuit board sheet comprising.

Here, the step (f), if the irradiation is made through the lower portion of the printed circuit board sheet, or the upper fixing tape is made of a material that can transmit light of the wavelength of the adhesive photoreaction, the ( In step f), irradiation may be performed through the lower or upper portion of the printed circuit board sheet.

On the other hand, according to another embodiment of the present invention, there is provided a printed circuit board sheet manufactured using the connection method of the printed circuit board sheet described above.

According to the method of connecting a printed circuit board sheet according to an embodiment of the present invention,

First, it is possible to provide a method of connecting a printed circuit board sheet that can shorten the number of processes and the process time / cost through the UV adhesive.

Second, since it does not require conventional heat curing, it is possible to reduce the heating cost consumed for heat curing.

Third, since the expensive heat resistant tape is not required, the unnecessary cost increase due to the purchase of the expensive heat resistant tape can be eliminated.

Fourth, since there is no conventional heat curing step, the problem of adhesive leakage due to the flowability due to the temperature rise of the above-mentioned adhesive can be fundamentally blocked.

Fifth, since there is no conventional thermal curing step, the OSP, that is, the flux solvent due to heating evaporates partly and some of the flux solvent remains on the surface of the printed circuit board, so the problem of uneven thickness of the flux solvent disappears. This eliminates the need for additional OSP exfoliation and OSP reprocessing.

Sixth, when the adhesive is thermally cured, serious problems such as discoloration, discoloration, and warping of the surface of the printed circuit board are often caused, and the meaning of the regeneration of the replacement of defective parts with good quality is faded. It can eliminate what caused the.

Seventh, in the case of heat-curing the adhesive in the past, it provides a connection method of the printed circuit board sheet, which is sufficiently applicable to the thin, that is, ultra-thin printed circuit board, which is very susceptible to variation, discoloration, and warpage when heating. can do.

Eighth, since there is no need to perform an additional OSP peeling process and OSP reprocessing process, there is no need to perform a process called "Gripstone X-out marking", and only a "name pen X-out marking" process is sufficient. Therefore, it is possible to prevent the debris, powder component, and debris components of the scraped printed circuit board, which is a factor of increasing the defective rate in the subsequent process, due to the process called "point X-out marking".

Ninth, conventionally, the router washing process after the page regeneration is sufficient without the need for additional Pumice or acid treatment.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the present specification and claims should not be construed as being limited to the common or dictionary meanings, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that it can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

1 is a perspective view illustrating a method of connecting a printed circuit board sheet according to an exemplary embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line IV-IV of FIG. 1.

1 and 2, a method of connecting a printed circuit board sheet 100 according to an exemplary embodiment of the present invention includes a defective printed circuit board (PCB) in a printed circuit board sheet 100 including a plurality of printed circuit boards. A cutting step (step (a)) of cutting and removing 120; A fixing step (step (b)) of fixing the printed circuit board sheet 100 and the good printed circuit board 110 to which the defective printed circuit board 120 has been removed to the fixing frame 300; The upper fixing tape 210 is attached to the upper portion of the coupling portion between the printed circuit board sheet 100 and the good printed circuit board 110 fixed to the fixing frame 300, and the printed circuit board sheet 100 is fixed to the fixing frame 300. After the upside down to remove, attaching the lower fixing tape 220 to the lower portion of the coupling portion (step (c)); An injection hole forming step (d) of forming an adhesive injection hole 160 in one of the upper fixing tape 210 or the lower fixing tape 220 attached to the printed circuit board sheet 100; An injection step ((e) step) of injecting the adhesive 140 to the coupling portion between the printed circuit board sheet 100 and the good printed circuit board 110 through the adhesive injection hole 160; And a light irradiator (not shown) for irradiating light of a wavelength at which the adhesive 140 reacts with respect to the coupling portion between the printed circuit board sheet 100 and the good printed circuit board 110. Irradiation step (step (f)). Hereinafter, each step will be described in detail.

Referring to the drawings, a cutting step (step a) is a step of cutting and removing the defective printed circuit board 120 from the printed circuit board sheet 100. Here, the printed circuit board sheet 100 refers to a plurality of printed circuit boards are connected to form a single sheet (100). The defective printed circuit board 120 may be determined by inspecting a good product and a defective product by using a printed circuit board inspection device (not shown) or the like before the electronic device is mounted. Through this, it may be possible to eliminate a subsequent problem caused by using a printed circuit board sheet containing a defective product.

Here, when it is determined that the defective product, conventionally, went through the "pointing point X-out display" process, in the present invention, "name pen X-out" instead of the "pointing point X-out display" process that causes the above-mentioned problem The marking process is sufficient. The reason for this is that in the past, OSP peeling and OSP reprocessing processes were essentially necessary. However, according to the present invention, such a process is unnecessary, and only the "name pen X-out marking" process is sufficient. Of course, it can be replaced by a variety of methods to display as a means that can be recognized as a bad printed circuit board, not a name pen.

At this time, the cut surface 150 of the printed circuit board sheet 100 can be cut so as to be formed perpendicular to the printed circuit board sheet, that is, the two-dimensional cutting is possible, and the three-dimensional end is It may be cut in three dimensions to form. In the case of three-dimensional cutting, it is described in detail in Korean Patent No. 642848.

In addition, the good printed circuit board 110 may be cut to form a cut surface corresponding to the cut surface 150 of the printed circuit board sheet 100. In the cutting step (step (a)), in the subsequent fixing step (step (b)), when the printed circuit board sheet 100 and the good printed circuit board 110 contacted for fixing, the adhesive 140 The printed circuit board sheet 100 and the good printed circuit board 110 may be cut so that the adhesive injection groove 130 is formed to be injected.

The adhesive injection groove 130 is formed in a circular shape, but preferably cut to have a diameter of 2mm or less, but is not limited thereto. That is, depending on the case, it is possible to form various shapes such as polygons according to the printed circuit board sheet 100, and even in the case of a circular shape, the size can be adjusted according to the situation. Of course, in some cases, although the adhesive can be injected to the coupling surface without the adhesive injection groove 130, it will be desirable to form the adhesive injection groove 130.

In addition, since the printed circuit board sheet 100 is continuously miniaturized according to the development of manufacturing technology, by forming such a small adhesive injection groove 130, the limitation of the method of connecting the printed circuit board sheet of small and thin sheets To overcome. On the other hand, the cutting step may be made of a CNC router (not shown), the operation of the machine is automatically controlled by computer-controlled numerical information.

In addition, in the fixing step (step (b)), the printed circuit board sheet 100 is fixed to the fixing frame (300). The fixing frame 300 forms a groove corresponding to the size of the printed circuit board sheet 100 so that the printed circuit board sheet 100 can be inserted and fixed. Therefore, the printed circuit board sheet 100 is fixed to the groove.

Here, the fixing frame 300, as shown in Figure 1, may be used without a positioning protrusion, the alignment protrusion may be formed in the fixing frame 300. In this case, of course, the alignment hole corresponding to the printed circuit board sheet should be formed.

When the printed circuit board sheet 100 and the good printed circuit board 110 are fixed to the fixing frame 300, the printed circuit board sheet 100 and the good printed circuit board 110 are located inside the fixing frame 300. The lower portion of the) and the open side of the fixing frame 300 is fixed so that the upper portion of the printed circuit board sheet 100 and the good quality printed circuit board 110 is located.

Next, in the attaching step (step (c)), the upper fixing tape 210 is attached to the upper portion of the coupling portion between the printed circuit board sheet 100 and the good printed circuit board 110 fixed to the fixing frame (300). Then, the printed circuit board sheet is flipped out of the fixing frame 300, and the lower fixing tape 220 is attached to the lower portion of the coupling part.

Here, the concept of the upper part and the lower part is to refer to the inner side to enter the fixing frame 300 as the lower side, and only the open side of the fixing frame 300 is referred to as the upper for convenience, it can be changed according to the choice of those skilled in the art. . In addition, the printed circuit board sheet may be removed from the fixing frame 300 through another additional tool, for example, an adsorption means, without inverting the fixing frame 300.

In the embodiment of the present invention, as shown in Figure 2, by attaching the lower fixing tape 220 to the lower portion of the coupling portion, as well as attaching the upper fixing tape 210 to the upper portion of the coupling portion, When the 100 and the good printed circuit board 110 are combined, the adhesive 140 can be injected more stably. As a result, the adhesive 140 flows out to the good printed circuit board 110, causing the circuit to malfunction. It prevents the problem. In addition, it has been found that the flatness of the printed circuit board sheet 100 may be significantly improved after the bonding is completed.

Meanwhile, in the related art, the upper fixing tape 210 and the lower fixing tape 220 are attached with a heat resistant tape to prevent thermal deformation, but the present invention has a specific wavelength, usually ultraviolet or visible light. By using an adhesive that reacts to, an expensive heat resistant tape is no longer needed. It is possible to use a general low-cost tape.

Here, the upper fixing tape 210 or the lower fixing tape 220 should be made of a material that can transmit light having a wavelength at which the adhesive 140 reacts photoelectrically. For example, the light may be ultraviolet light (representative wavelength is 365 nm) or visible light, and the adhesive 140 may include a photoinitiator that reacts to ultraviolet light or visible light. Further, in the subsequent light irradiation step, the upper fixing tape or the lower fixing tape, which is irradiated through a light irradiator (not shown), will generally be transparent. Therefore, it is preferable to use a transparent tape.

Next, in the injection hole forming step (d), the adhesive injection hole 160 for injecting the adhesive 140 to the upper fixing tape 210 attached to the printed circuit board sheet 100 is formed. Let's do it. Here, when the adhesive injection hole 160 is formed in the upper fixing tape 210, the adhesive injection hole 160 is formed by using various members having sharp ends such as needles or awls, and mounted in an automated system. It is also possible to form the adhesive injection hole 160 as a member having a sharp end. The adhesive injection hole 160 may be finely formed in the center of the adhesive injection groove 130 so that an end from which the adhesive 140 of the adhesive injector 200 is discharged may enter.

Therefore, when using the upper and lower tapes employed in the present invention, the adhesive 140 is not leaked to the outside when the adhesive 140 is injected, the upper fixing tape is bonded to the printed circuit board even if a small amount of adhesive 140 is leaked to the outside After the adhesive is cured, the adhesive 140 is cured, and the adhesive 140 is removed from the printed circuit board sheet 100 by removing the upper fixing tape 210.

In some cases, since the adhesive 140 is injected using compressed air, the adhesive injection is possible even when the end from which the adhesive 140 of the adhesive injector 200 is discharged is not inserted into the adhesive injection hole 160.

Furthermore, it can be seen experimentally that adhesive injection is possible even if the size of the pointed end at which the adhesive 140 of the adhesive injector 200 is larger than the size of the adhesive injection hole 160.

In addition, the adhesive injection hole may be formed in any one of the upper fixing tape or the lower fixing tape attached to the printed circuit board sheet. Of course, it can be injected by forming the adhesive injection holes on both sides, but it will be inefficient.

Next, in the injection step (e), the adhesive injector 200 is inserted into the adhesive injection hole 160 formed in the upper fixing tape 210, and is compressed from a compressor (not shown). The adhesive 140 embedded in the adhesive injector 200 is injected into the adhesive injection groove 130 by the pressure of air, and the adhesive is coupled to the coupling portion between the printed circuit board sheet 100 and the good quality printed circuit board 110. It is infiltrated and injected.

As described above, through several experiments, even if the adhesive injector 200 is not inserted into the adhesive injection hole 160, the adhesive is sealed by the compressed air and the coupling portion sealed by the upper and lower fixing tapes 210 and 220. It can be seen that it can be injected.

Next, in the light irradiation step (step f), the adhesive is photoreacted to the bonding portion between the cut surface 150 of the printed circuit board sheet 100 and the good printed circuit board 110, in particular the adhesive A light irradiator (typically, a lamp having a specific wavelength) irradiates light with a light of a wavelength at which the photoinitiator included in the light reacts.

It has been common to cure a printed circuit board sheet that has been subjected to an adhesive injection step for 30 to 60 minutes at a temperature of 80 to 140 degrees Celsius. As described above, the heating cost for such a temperature rise, and various problems due to the heating occurred. In the present invention, however, the adhesive is sufficiently cured by irradiation at room temperature or room temperature within 20 seconds.

Here, the irradiation at room temperature or room temperature is most preferable in order to extend the life of the light irradiator in order to protect the light irradiator such as a mercury lamp used for light irradiation. This is not the case at all with the curing of the adhesive. However, in the case of a UV adhesive that contains some epoxy-based components, etc. may be to react to light with heat. Moreover, although time also changes with kinds and characteristics of an adhesive agent, hardening is generally completed in about 3 second. Limiting the light irradiation time to 20 seconds is limited in terms of productivity.

Such a breakthrough, that is, it is possible to shorten the curing time of 30 minutes to 60 minutes within 20 seconds. As a result, it is possible to prevent the increase in productivity, that is, the occurrence of discoloration, discoloration or warpage of the PCB surface due to thermal curing. In addition, cost savings can be achieved because it is not necessary to use expensive heat-resistant tape required for curing. In addition, the epoxy resin, which is a conventional high temperature adhesive, tends to be exfoliated at the site to be bonded by causing flowability during thermal curing, but by using a UV adhesive such as the present invention, most of these problems are solved.

When the curing through light irradiation is completed, the printed circuit board sheet 100 and the good printed circuit board 110 by removing the upper fixing tape 210 and the lower fixing tape 220 from the printed circuit board sheet 100. The combination of is completed.

Of course, after the page regeneration, that is, after the step (f), it may further include a washing step. Furthermore, it is common to further include final inspection and release inspection.

Next, a method of connecting a printed circuit board sheet according to another embodiment of the present invention will be described. In another embodiment, a method of connecting a printed circuit board sheet includes: a cutting step (step (a)) of cutting and removing a defective printed circuit board from a printed circuit board sheet having a plurality of printed circuit boards; A fixing step (b) of fixing the printed circuit board sheet from which the defective printed circuit board is removed and the good printed circuit board to the fixing frame; Attaching an upper fixing tape to an upper portion of the coupling portion between the printed circuit board sheet fixed to the fixing frame and the good printed circuit board, and removing the printed circuit board sheet from the fixing frame (step (c)); An injection step (e1) of injecting an adhesive into a coupling portion between the printed circuit board sheet and a good printed circuit board through a lower portion of the printed circuit board sheet; And a light irradiating step ((f) step) of irradiating light with a light irradiator for irradiating light of a wavelength at which the adhesive photoreacts to the coupling portion between the printed circuit board sheet and the good printed circuit board. Include.

Here, the steps (a), (b) and (f) that are the same as the previous embodiment will be omitted.

First, in the step (c1), the upper fixing tape is attached to the upper portion of the coupling portion between the printed circuit board sheet fixed to the fixing frame and the good printed circuit board, and the printed circuit board sheet is directly removed from the fixing frame. There is a difference in that the lower fixing tape is not attached to the lower portion of the coupling portion.

In this case, the adhesive is injected into the coupling portion between the printed circuit board sheet and the good printed circuit board taken out from the fixing frame through the lower portion of the printed circuit board sheet, to which the fixing tape is not attached (step (e1)).

Here, the step (f) may be irradiated through the lower portion of the printed circuit board sheet, the fixing tape is not attached. In this case, the upper fixing tape may be made of a material which does not transmit light of a wavelength at which the adhesive photoreacts.

Alternatively, when the upper fixing tape is made of a material capable of transmitting light of a wavelength at which the adhesive photoreacts, step (f) is irradiated through one or both of the lower and upper portions of the printed circuit board sheet. May be done.

On the other hand, according to another embodiment of the present invention, it is possible to provide a printed circuit board sheet manufactured using the connection method of the printed circuit board sheet described above.

As mentioned above, although this invention was demonstrated by the limited embodiment and drawing, this invention is not limited by this, The person of ordinary skill in the art to which this invention belongs, Various modifications, changes and variations are possible without departing from the scope of the claims to be described.

1 is a perspective view showing a method of connecting a printed circuit board sheet according to an embodiment of the present invention;

FIG. 2 is a cross-sectional view taken along line IV-IV of FIG. 1.

<Explanation of symbols for the main parts of the drawings>

100 ... Printed circuit board sheet 110 ... Good quality printed circuit board

120 ... bad printed circuit board 130 ... adhesive injection groove

140 ... Adhesive 150 ... Cutting Section

160 ... glue injection hole 200 ... glue injector

210 ... upper fixing tape 220 ... upper fixing tape

300 ... Fixing frame

Claims (9)

A cutting step (step (a)) of cutting and removing the defective printed circuit board from the printed circuit board sheet including a plurality of printed circuit boards; A fixing step (b) of fixing the printed circuit board sheet from which the defective printed circuit board is removed and the good printed circuit board to the fixing frame; Attaching an upper fixing tape to an upper portion of the coupling portion of the printed circuit board sheet fixed to the fixing frame and a good quality printed circuit board, removing the printed circuit board sheet from the fixing frame, and then attaching a lower fixing tape to the lower portion of the coupling portion Attaching (step (c)); An injection hole forming step (d) of forming an adhesive injection hole in one of the upper fixing tape and the lower process tape attached to the printed circuit board sheet; An injection step (e) step of injecting an adhesive to the coupling portion between the printed circuit board sheet and the good printed circuit board through the adhesive injection hole; And A light irradiating step ((f) step) of irradiating light with a light irradiator for irradiating light of a wavelength at which the adhesive photoreacts to the bonding portion between the printed circuit board sheet and the good printed circuit board; and, The upper fixing tape or the lower fixing tape, characterized in that made of a material that can transmit light of the wavelength that the adhesive photoreacting, the printed circuit board sheet connection method. The method of claim 1, The light is ultraviolet or visible light, Wherein the adhesive is characterized in that it comprises a photoinitiator in response to ultraviolet or visible light, the method of connecting a printed circuit board sheet. The method of claim 2, And the upper fixing tape or the lower fixing tape irradiated through the light irradiator is transparent. The method of claim 2, The light irradiation step, characterized in that for irradiating within 20 seconds at room temperature, the method of connecting a printed circuit board sheet. A cutting step (step (a)) of cutting and removing the defective printed circuit board from the printed circuit board sheet including a plurality of printed circuit boards; A fixing step (b) of fixing the printed circuit board sheet from which the defective printed circuit board is removed and the good printed circuit board to the fixing frame; Attaching an upper fixing tape to an upper portion of the coupling portion between the printed circuit board sheet fixed to the fixing frame and the good quality printed circuit board and removing the printed circuit board sheet from the fixing frame (step (c1)); An injection step (e1) of injecting an adhesive into a coupling portion between the printed circuit board sheet and a good printed circuit board through a lower portion of the printed circuit board sheet; And A light irradiating step ((f) step) of irradiating light with a light irradiator for irradiating light of a wavelength at which the adhesive photoreacts to the bonding portion between the printed circuit board sheet and the good printed circuit board; To connect a printed circuit board sheet. The method of claim 5, In the step (f), the irradiation is made through the lower portion of the printed circuit board sheet, or When the upper fixing tape is made of a material through which light of the wavelength of the adhesive photoreacts, the step (f) is characterized in that the irradiation through the lower or upper portion of the printed circuit board sheet, How to connect printed circuit board sheet. The method of claim 6, The light is ultraviolet or visible light, Wherein the adhesive is characterized in that it comprises a photoinitiator in response to ultraviolet or visible light, the method of connecting a printed circuit board sheet. The method of claim 7, wherein Step (f), the connection method of the printed circuit board sheet, characterized in that irradiated within 20 seconds at room temperature. The printed circuit board sheet manufactured using the connection method of the printed circuit board sheet in any one of Claims 1-8.

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