KR20100060953A - Bubble taking apparatus for taking bubbles in line - Google Patents

Bubble taking apparatus for taking bubbles in line Download PDF

Info

Publication number
KR20100060953A
KR20100060953A KR1020080119769A KR20080119769A KR20100060953A KR 20100060953 A KR20100060953 A KR 20100060953A KR 1020080119769 A KR1020080119769 A KR 1020080119769A KR 20080119769 A KR20080119769 A KR 20080119769A KR 20100060953 A KR20100060953 A KR 20100060953A
Authority
KR
South Korea
Prior art keywords
chemical liquid
bubbles
pipe
bubble
unit
Prior art date
Application number
KR1020080119769A
Other languages
Korean (ko)
Inventor
유재혁
장동혁
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020080119769A priority Critical patent/KR20100060953A/en
Publication of KR20100060953A publication Critical patent/KR20100060953A/en

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K5/00—Plug valves; Taps or cocks comprising only cut-off apparatus having at least one of the sealing faces shaped as a more or less complete surface of a solid of revolution, the opening and closing movement being predominantly rotary
    • F16K5/08—Details
    • F16K5/10—Means for additional adjustment of the rate of flow
    • F16K5/103—Means for additional adjustment of the rate of flow specially adapted for gas valves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The present invention relates to a bubble removing device for removing bubbles in a pipe, and more particularly, to a bubble removing device for removing bubbles in a pipe for removing bubbles generated in a chemical liquid by installing a bubble removing unit in a pipe for supplying a chemical liquid. will be.

Bubble removing apparatus for removing bubbles in the pipe according to an embodiment of the present invention, the bubble removing unit for collecting the chemical liquid containing bubbles from the chemical liquid supplied from the chemical liquid supply unit, and draining the chemical liquid containing the collected bubbles A recovery pipe and a supply pipe for supplying the chemical liquid in which the bubbles are collected to the chemical liquid storage unit.

Description

Bubble removing apparatus for removing bubbles in a pipe {Bubble taking apparatus for taking bubbles in line}

The present invention relates to a bubble removing device for removing bubbles in a pipe, and more particularly, to a bubble removing device for removing bubbles in a pipe for removing bubbles generated in a chemical liquid by installing a bubble removing unit in a pipe for supplying a chemical liquid. will be.

In general, semiconductor devices are fabricated by repeating processes such as photo, diffusion, deposition, etching, and ion implantation on a substrate.

In each of these processes, when the chemical liquid is used, the chemical liquid is supplied to the process treatment apparatus through a separate chemical liquid supply device. At this time, the chemical liquid should be supplied to meet the conditions of the process.

When the chemical liquid is applied to the substrate by a foreign matter, bubbles, two or more kinds of chemical liquids contained in the chemical liquid, the chemical liquid on the substrate may not be uniformly applied.

For example, bubbles generated during the flow of a chemical liquid were not possible to remove from the chemical reservoir.

Therefore, there is a need for an apparatus for collecting bubbles and the like generated from continuously supplied chemical liquids.

The problem to be solved of the present invention relates to a bubble removing apparatus for removing bubbles generated in the chemical liquid by installing a bubble removing unit in a line (line) for supplying a chemical liquid.

The objects of the present invention are not limited to the above-mentioned objects, and other objects that are not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, the bubble removing device for removing bubbles in the pipe according to an embodiment of the present invention, the bubble removing unit for collecting the chemical liquid containing bubbles from the chemical liquid supplied from the chemical liquid supply unit, and the collected bubbles It includes a recovery pipe for draining the chemical liquid containing a, and a supply pipe for supplying the chemical liquid collected in the bubble to the chemical liquid storage.

Specific details of other embodiments are included in the detailed description and the drawings.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

According to the bubble removing device for removing bubbles in the pipe of the present invention as described above has one or more of the following effects.

First, by installing the bubble removing unit in the pipe for supplying the chemical liquid, it has the advantage of reducing the error of the flow rate meter by filtering the bubbles in the pipe.

Second, by removing the bubbles generated in the chemical liquid through the bubble removal unit installed in the pipe for supplying the chemical liquid, it is possible to reduce the flow meter error, there is an advantage that the chemical liquid can reduce the mixing ratio error.

Specific details of other embodiments are included in the detailed description and the drawings. Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

When an element is referred to as being "connected to" or "coupled to" with another element, it may be directly connected or coupled to another element or through another element in between. This includes all cases. On the other hand, when one device is referred to as "directly connected to" or "directly coupled to" with another device indicates that no other device is intervened. Like reference numerals refer to like elements throughout. “And / or” includes each and all combinations of one or more of the items mentioned.

Although the first, second, etc. are used to describe various elements, components and / or sections, these elements, components and / or sections are of course not limited by these terms. These terms are only used to distinguish one element, component or section from another element, component or section. Therefore, the first device, the first component, or the first section mentioned below may be a second device, a second component, or a second section within the technical spirit of the present invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In this specification, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, “comprises” and / or “comprising” refers to the presence of one or more other components, steps, operations and / or elements. Or does not exclude additions.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. In addition, the terms defined in the commonly used dictionaries are not ideally or excessively interpreted unless they are specifically defined clearly.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a view showing a system for removing bubbles in a pipe according to an embodiment of the present invention.

As shown, the system for removing bubbles in the pipe includes a bubble remover 100, a chemical liquid storage unit 200, a dispense nozzle 300, a circulation unit 400, a supply unit 500, and a valve 600. It is configured by. Here, the bubble removing unit 100 may be understood as a bubble removing device for removing bubbles in the pipe.

Bubble removal unit 100 is to remove the chemical (Chemical) including the bubble, bubble removal unit 100 is connected to the chemical solution supply unit (10 and 20) and the chemical liquid storage unit (200: 210 and 220) to supply the chemical liquid Located in the pipe 700 to be moved, the chemical liquid supplied from the chemical liquid supply unit (10, 20) is moved through the pipe 700 before being supplied to the first chemical liquid storage unit 210 and the second chemical liquid storage unit 220 Remove the bubbles generated while Here, the bubble removing unit 100 temporarily stores the chemical liquid supplied from the chemical liquid supply units 10 and 20.

For example, bubbles are generated while the chemical liquids supplied from the chemical liquid supply units 10 and 20 are moved through the pipe 700, and the bubble removing unit 100 temporarily stores the supplied chemical liquid (including bubbles). The bubble removing unit 100 may remove (collect) the chemical liquid containing the bubble by using a pump (not shown) using a principle that bubbles rise due to a specific gravity lower than that of the chemical liquid.

The chemical liquid storage unit 200 stores the chemical liquid used in the process, and serves to supply the chemical liquid when the chemical liquid is needed. Here, the chemical liquid storage unit 200 is composed of two or more chemical liquid storage unit, for example, the first chemical liquid storage unit 210 and the second chemical liquid storage unit 220. In addition, when the chemical liquid storage unit 200 is supplied with ultra pure water (Diw) and the chemical liquid to each of the chemical liquid storage units 210 and 220, one chemical liquid storage unit may supply the chemical liquid to the dispense nozzle 300 while the other chemical liquid storage unit is supplied. Always prepare for a chemical exchange.

In addition, the chemical storage unit 200 may further include a mixer (not shown) such that a plurality of chemical liquids are supplied and mixed, and the chemical liquid storage unit 200 (210, 220) and the chemical liquid storage unit 200 for storing the chemical liquid: It may further include a heater (not shown) capable of heating the chemical liquid staying in the 210,220.

For example, chemicals include acidic solutions such as hydrofluoric acid, sulfuric acid, nitric acid, phosphoric acid, and the like, and alkaline solutions containing potassium hydroxide, sodium hydroxide, ammonium, and the like, and chemicals used for cleaning liquids. The type of chemical is not limited. In addition, the type, concentration, amount, temperature, and the like of the liquid supplied to the process may be controlled through a system for removing bubbles in the pipe. Such chemical liquids may be mixed or bubbles may occur when the chemical liquids supplied from the chemical liquid supply units 10 and 20 are supplied to the chemical liquid storage unit 200 through the pipe 700.

The dispense nozzle 300 receives the chemical liquid supplied by the supply unit 500 from the chemical liquid storage units 210 and 220 and serves to supply the chemical liquid in a process chamber (not shown). Here, the dispensing nozzle 300 may be manufactured in various shapes in order to receive the chemical liquid and uniformly spray to a large area. For example, the dispense nozzle 300 may be flared or in the form of a slit nozzle.

The circulation unit 400 serves to circulate the chemical liquid in the first chemical liquid storage unit 210 and the second chemical liquid storage unit 220.

The supply unit 500 serves to supply the chemical liquid in the first chemical liquid storage unit 210 and the second chemical liquid storage unit 220 to the dispense nozzle 300, and may be configured as a pipe pump, a valve, or the like.

The valve 600 serves to supply the chemical liquid supplied from the chemical liquid supply units 10 and 20 to the chemical liquid storage units 210 and 220.

2 is a view showing a bubble removing device for removing bubbles in a pipe according to an embodiment of the present invention.

The bubble removing unit 100 stores the chemical liquid supplied from the chemical liquid supply unit 10 and the bubbles 30 generated while the supplied chemical liquid moves through the pipe 700, and then removes the chemical liquid including bubbles.

For example, the bubble removing unit 100 may operate the second valve 620 before the chemical liquid supplied from the chemical liquid supply unit 10 is supplied to the first chemical liquid storage unit 210 and the second chemical liquid storage unit 220. Opening the suction of the chemical liquid containing the bubble 30 in the bubble removing unit 100 through the pump 800 to remove the bubble 30 by moving the chemical liquid containing the bubble 30 to the recovery pipe 900.

The chemical liquid storage unit 210 or 220 stores the chemical liquid used in the process, and supplies the chemical liquid when the chemical liquid is needed. Here, the chemical liquid stored in the chemical storage units 210 and 220 may be understood as the chemical liquid from which the bubble 30 provided after passing through the bubble 30 removing unit 100 is removed.

The first valve 610 serves to move the chemical liquid supplied from the chemical liquid supply unit 10. Here, the first valve 610 may be understood as a toggle valve.

The second valve 620 serves to collect the chemical liquid containing bubbles, that is, to turn on / off the operation of the bubble removing unit 100 for collecting the chemical liquid containing bubbles 30. . Here, it is located in the recovery pipe 900 for providing the chemical liquid containing the collected bubbles 30 to the drain (not shown).

The third valve 630 serves to supply the chemical liquid, and is located in the supply pipe 1000 for supplying the chemical liquid to the chemical liquid storage parts 210 and 220.

The pump 800 is positioned in the recovery pipe 900 to serve to suck the chemical liquid including the bubbles 30 in the bubble removing unit 100. Here, the pump 800 applies pressure to the chemical liquid stored in the bubble removing unit 100 and sucks the bubbles 30 floating upward of the bubble removing unit 100, thereby recovering the chemical liquid containing the bubble 30 from the collection pipe ( Go to 900).

The recovery pipe 900 provides a chemical liquid including the collected bubbles 30 to a drain portion (not shown). For example, as the second valve 620 is opened, the chemical liquid including the bubbles 30 is collected, and the chemical liquid including the collected bubbles 30 is provided to the drain portion (not shown) through the recovery pipe 900. And drained.

The supply pipe 1000 connects the ultrapure water supply unit, the chemical liquid supply units 10 and 20, and the chemical liquid storage units 210 and 220 to supply ultrapure water (Diw) and two or more chemical liquids to the chemical liquid storage units 210 and 220. Here, the supply pipe 1000 is to supply the chemical liquid from which bubbles are collected (removed) to the chemical liquid storage units 210 and 220.

In addition, on the supply pipe 1000, an ultrasonic flow rate \ meter 50 that controls the flow rate of ultrapure water and chemical liquid may be installed.

The operation of the bubble removing device for removing bubbles in the pipe will be briefly described with reference to FIG. 2.

First, the first valve 610 is opened for chemical liquid supply from the chemical liquid supply unit 10, and the chemical liquid is moved through the pipe 700 and stored in the bubble removing unit 100. Here, the bubble remover 100 stores the chemical liquid supplied from the chemical liquid supply unit 10 and the bubble 30 generated while the supplied chemical liquid moves through the pipe 700.

Next, the second valve 620 and the third valve 630 are opened to supply the chemical liquid to the chemical liquid storage parts 210 and 220. Here, the second valve 620 serves to collect the chemical liquid containing the bubbles 30, the recovery pipe 900 for providing the chemical liquid containing the collected bubbles 30 to the drain portion (not shown) Is located in. The third valve 630 serves to supply the chemical liquid, and is located in the supply pipe 1000 for supplying the chemical liquid to the chemical liquid storage parts 210 and 220.

The pump 800 is operated while the second valve 620 is opened to drain the chemical liquid including the air bubbles 30 through the recovery pipe 900, and the chemical liquid is supplied to the supply pipe while the third valve 630 is opened. It is supplied to the chemical storage unit 210, 220 through the 1000.

Then, the chemical liquid supplied to the chemical storage units 210 and 220 is supplied to the dispense nozzle 300 through the supply unit 500 and sprayed in the process chamber.

Meanwhile, the remaining chemical liquid in the chemical storage units 210 and 220 may be drained to the outside as needed.

Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may implement the present invention in other specific forms without changing the technical spirit or essential features thereof. You will understand that. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

1 is a view showing a system for removing bubbles in a pipe according to an embodiment of the present invention.

2 is a view showing a bubble removing device for removing bubbles in a pipe according to an embodiment of the present invention.

<Explanation of symbols on main parts of the drawings>

100: bubble removing unit 200: chemical liquid storage unit

300: dispense nozzle 400: circulation

500: supply part 620: second valve

630: third valve 800: pump

900: recovery piping 1000: supply piping

Claims (4)

A bubble removing unit for collecting a chemical liquid including bubbles from the chemical liquid supplied from the chemical liquid supply unit; A recovery pipe for draining the chemical liquid containing the collected bubbles; And And a supply pipe for supplying the chemical liquid from which the bubbles are collected to the chemical storage unit, and remove the air bubbles in the pipe. The method of claim 1, The bubble removing unit is a bubble removing device for removing air bubbles in the pipe is located in the pipe connected to the chemical liquid supply unit and the chemical liquid storage unit for supplying the chemical liquid. The method of claim 1, And a second valve positioned on the recovery pipe and configured to turn on / off an operation of the bubble removing unit for collecting the chemical liquid containing the bubbles. The method of claim 1, A bubble removing device for removing bubbles in the pipe further comprises a pump positioned in the recovery pipe to suck the chemical liquid containing the bubble.
KR1020080119769A 2008-11-28 2008-11-28 Bubble taking apparatus for taking bubbles in line KR20100060953A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080119769A KR20100060953A (en) 2008-11-28 2008-11-28 Bubble taking apparatus for taking bubbles in line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080119769A KR20100060953A (en) 2008-11-28 2008-11-28 Bubble taking apparatus for taking bubbles in line

Publications (1)

Publication Number Publication Date
KR20100060953A true KR20100060953A (en) 2010-06-07

Family

ID=42361810

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080119769A KR20100060953A (en) 2008-11-28 2008-11-28 Bubble taking apparatus for taking bubbles in line

Country Status (1)

Country Link
KR (1) KR20100060953A (en)

Similar Documents

Publication Publication Date Title
TWI690979B (en) Substrate processing device and cleaning method of substrate processing device
TWI553888B (en) Substrate processing apparatus and substrate processing method
US20070175387A1 (en) Substrate processing apparatus and substrate processing method
CN109201608A (en) A kind of wafer high-efficiency washing device and cleaning method
JP5977058B2 (en) Treatment liquid supply apparatus and treatment liquid supply method
TWI615186B (en) Cleaning solution of photoresist stripping liquid filter, washing device and washing method
CN207204736U (en) Solar silicon wafers cleaning device
TWI512818B (en) Cleaning apparatus for silicon wafer
JP3138901B2 (en) Substrate immersion processing equipment
JP2013207207A (en) Substrate liquid processing apparatus and substrate liquid processing method
KR20100060953A (en) Bubble taking apparatus for taking bubbles in line
KR101915358B1 (en) Semiconductor cleaning device and cleaning method by it
CN216574501U (en) Cleaning device
JP2000173962A (en) Equipment and method for cleaning wafer
JP2016063204A (en) Cleaning method of substrate processing apparatus and substrate processing apparatus
KR100794585B1 (en) Apparatus and method for wet cleaning
KR100982802B1 (en) Bubble absorbing apparatus for taking bubbles in in/out lines.
JP2016046268A (en) Liquid discharging method of substrate processing device and substrate processing device
JP2003273061A (en) Treating method and treating system
JP6022765B2 (en) Liquid management system
US20150090299A1 (en) Processes and apparatus for cleaning, rinsing, and drying substrates
KR100664787B1 (en) Chemical exhaust system of cleaning bath
KR200222121Y1 (en) Semiconductor Wafer Cleaning Equipment
CN113714201A (en) Groove type process system for single-chip wet treatment process
JP2022151639A (en) Substrate processing device, substrate processing method and computer readable recording medium

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application