KR20100055684A - Apparatus for processing a substrate - Google Patents

Abstract

PURPOSE: A substrate processing device is provided to reduce a non-operation time of a system and time required for maintenance by easily performing a maintenance operation. CONSTITUTION: A chamber(82) has an open surface which is opened with a cover. First to third process containers(100-1,100-2,100-3) are installed on a base along the open surface. A first rotation base(900-1) mounts the first process container, rotates around a first hinge shaft, and is outputted through the open surface of the chamber. A second rotation base mounts the third processing base, rotates around a second hinge shaft, and is outputted through the open surface of the chamber. A fixing base is provided between the first rotation base and the second rotation base and mounts the second process container.

Description

Substrate processing apparatus {Apparatus for Processing A Substrate}

The present invention relates to a substrate processing apparatus.

In general, a semiconductor device includes a Fab process for forming an electrical circuit including electrical elements on a silicon wafer used as a semiconductor substrate, and an EDS (electrical) for inspecting electrical characteristics of the semiconductor devices formed in the fab process. die sorting) and a package assembly process for encapsulating and individualizing the semiconductor devices with an epoxy resin.

 The fab process includes a deposition process for forming a film on a wafer, a chemical mechanical polishing process for planarizing the film, a photolithography process for forming a photoresist pattern on the film, and the photoresist pattern using the photoresist pattern. An etching process for forming the film into a pattern having electrical characteristics, an ion implantation process for implanting specific ions into a predetermined region of the wafer, a cleaning process for removing impurities on the wafer, and a process for forming the film or pattern Inspection process for inspecting the surface;

Here, the photolithography process includes a process of applying and then heating a photoresist on the wafer, a process of heating after exposure of the photoresist, and a process of developing and heating the photoresist. In addition, the photolithography process includes a cooling process of cooling the photoresist to a predetermined temperature after the heating process.

The system for performing the photolithography process is divided into a system having a coating processing apparatus for the application process, a developing apparatus for the development process, and a baking processing apparatus for the baking process, and a separate system for the exposure process. do. The system for performing the photolithography process is arranged in multiple layers of the coating processing apparatus, the developing processing apparatus, and the baking processing apparatus in order to use the equipment space efficiently.

However, such a multi-layered arrangement structure has difficulty in maintenance work because it is difficult to secure space for servicing the inside of the processing apparatus.

An object of the present invention is to provide a substrate processing system that can secure a maintenance space.

An object of the present invention is to provide a substrate processing system that can improve the efficiency of work by reducing the time required for maintenance work and the downtime of the system by facilitating maintenance work.

The objects of the present invention are not limited thereto, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

The substrate processing apparatus of the present invention for achieving the above object is a chamber having an internal space; And a processing unit coupled to the internal space of the chamber in a hinge axis structure, the processing unit being capable of withdrawing through one surface of the chamber by rotating about the hinge axis.

According to an embodiment of the present invention, the processing unit includes a substrate support member including a spin head on which a substrate is placed; A processing vessel installed to wrap around the spin head to recover a processing fluid scattered on a substrate; And a rotating base supporting the processing container and the hinge axis being coupled to rotate about the hinge axis.

A substrate processing apparatus of the present invention for achieving the above object is a chamber having an open surface opened by a cover; A base installed inside the chamber; Including first to third processing containers installed in a line on the base along the opening surface; The base may include a first rotating base having the first processing container installed therein and being rotated about a first hinge axis and drawn out through an open surface of the chamber; A second rotating base having the third processing container installed therein and being rotated about a second hinge axis and drawn out through an open surface of the chamber; And a fixed base provided between the first rotating base and the second rotating base and provided with the second processing container.

According to an embodiment of the present invention, the interface between the first rotating base and the fixed base is formed in an arc shape to prevent mutual collision during the rotational movement of the first rotating base.

According to an embodiment of the present invention, the radial interface of the second rotating base and the fixed base is formed in an arc shape to prevent mutual collision during the rotational movement of the second rotating base.

According to an embodiment of the present invention, the first hinge shaft and the second rotation shaft are located close to the opening surface.

The substrate processing apparatus of the present invention for achieving the above object is a first surface having a substrate entrance and exit, a second surface facing the first surface and having an open surface, and a first surface connecting the first surface and the second surface; A chamber having three or four sides; A first rotating base capable of withdrawing to an open surface of the second surface about a first hinge axis provided adjacent to an edge where the second and third surfaces of the chamber meet; A second rotating base capable of withdrawing to an open surface of the second surface about a second hinge axis provided adjacent to a corner where the second and fourth surfaces of the chamber meet; And a fixed base provided between the first rotating base and the second rotating base.

According to an embodiment of the present invention, a processing container is installed in each of the first rotating base, the second rotating base, and the fixed base.

According to an embodiment of the present invention, the first rotating base has an arc-shaped side that is adjacent to the fixed base, and the second rotating base has an arc-shaped side that is adjacent to the fixed base.

According to the present invention, a maintenance space can be secured.

In addition, according to the present invention, it is possible to improve the work efficiency by reducing the time required for the maintenance work and the downtime of the system by the easy maintenance work in the structure consisting of a multi-layer substrate processing apparatus.

Hereinafter, a substrate processing apparatus according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. First, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are assigned to the same components as much as possible, even if shown on different drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

(Example)

In the present embodiment, a semiconductor substrate is illustrated and described as an example of the substrate processed by the substrate processing apparatus 1, but the present invention is not limited thereto and may be applied to various kinds of substrates such as glass substrates.

1 is a view schematically showing an example of a substrate processing apparatus 1 of the present invention. The substrate processing apparatus 1 performs a photolithography process on a wafer.

Referring to FIG. 1, the substrate processing apparatus 1 has an index portion 10, a processing portion 20, and an interface portion 30, which are sequentially arranged side by side in one direction (hereinafter, the first direction 62). do. The index unit 10 has a cassette holder 12 and a robot movement path 14.

Cassettes 12a in which semiconductor substrates such as a wafer are accommodated are placed in the cassette holder 12. The robot movement path 14 is provided with a robot 14a for transferring wafers between the cassette 12a placed on the cassette holder 12 and the processing unit 20. The robot 14a has a structure that can be moved in a direction perpendicular to the first direction 62 (hereinafter, the second direction 64) and the vertical direction on the horizontal plane. Since the structure for transferring the robot 14a in the horizontal direction and the vertical direction can be easily configured by those skilled in the art, detailed description thereof will be omitted.

The processing unit 20 performs a coating step of applying a photoresist such as a photoresist to the wafer and a developing step of removing photoresist in an exposed region or the opposite region from the wafer on which the exposure process is performed. The processing unit 20 is provided with a spin unit 70 for application, a spin unit 80 for development, and a bake unit 50.

One side of the processing unit 20 is provided with an interface unit 30 that is connected to the exposure unit 40. In the interface unit 30, a robot 32 for transferring a wafer between the exposure unit 40 and the processing unit 20 is disposed. The robot 32 has a structure that can be moved in the above-described second direction 64 and the vertical direction.

2 is a perspective view illustrating an example of the processor 20 of FIG. 1.

The processing unit 20 has a first processing chamber 20a and a second processing chamber 20b. The first processing chamber 20a and the second processing chamber 20b have a stacked structure. Spin units that perform an application process are provided in the first process chamber 20a, and spin units that perform a development process are provided in the second process chamber 20b. In other words, the first processing chamber 20a is provided with spin units 70 and baking units 50 for coating, and the second processing chamber 20b has spin units 80 and baking units 50 for development. Are provided. In one example, the first processing chamber 20a is disposed above the second processing chamber 20b. Alternatively, the first processing chamber 20a may be disposed below the second processing chamber 20b.

Due to the above-described structure, the wafer has an index unit 10, a first processing chamber 20a, an interface unit 30, an exposure unit 40, an interface unit 30, a second processing chamber 20b, and an index unit 10. ) Will be moved sequentially. That is, during the photolithography process, the wafer is moved in a loop in the vertical direction.

3 is a plan view of the first processing chamber 20a.

Referring to FIG. 3, a first moving path 60a is provided in the first processing chamber 20a in the center in the first direction 62. One end of the first moving path 60a is connected to the index unit 10, and the other end of the first moving path 60a is connected to the interface unit 30. The baking units 50 are arranged in a line along the first moving path 60a on one side of the first moving path 60a, and the spin units 70 for application are formed on the other side of the first moving path 60a. It is arrange | positioned along the 1 moving path 60a. In addition, the baking units 50 and the spin units 70 for application are arranged such that a plurality of baking units 50 are stacked up and down. The first moving path 60a is provided with a first robot 62a for transferring wafers between the interface unit 30, the spin unit 70 for application, the bake unit 50, and the index units 10. . The guide rail 64a is provided in the first movement path 60a so that the first robot 62a moves linearly in the first direction 62.

The baking unit 50 of the first processing chamber 20a performs a pre-baking process in which the substrate is heated to a predetermined temperature to remove organic substances or moisture from the surface of the substrate before the photoresist is applied. And a bake unit that performs a soft-baking process performed after the photoresist is applied onto the substrate, and a bake unit that performs the process of cooling the substrate.

4 is a plan view of the second processing chamber 20b.

Referring to FIG. 4, the second movement path 60b is provided in the center of the second processing chamber 20b in the first direction 62. One end of the second moving path 60b is connected to the index unit 10, and the other end of the second moving path 60b is connected to the interface unit 30. The baking units 50 are arranged in a line along the second moving path 60b on one side of the second moving path 60b, and the spin units 80 for developing are formed on the other side of the second moving path 60b. It is arrange | positioned along 2 moving paths 60b. In addition, the baking units 50 and the spin units 80 for development are arranged so that a plurality of the baking units 50 are stacked up and down. The second moving path 60b is provided with a second robot 62b for transferring wafers between the interface unit 30, the spin unit 80 for development, the bake unit 50, and the index units 10. .

After the baking module 0 of the second processing chamber 20b is exposed to light, a baking unit for performing a hard-baking process performed after developing the deformed photoresist and the photoresist is exposed to a light source. For example, the baking unit which performs the post-exposure baking process to which it carries out to a baking process, and the baking unit which performs the process which cools a board | substrate can be mentioned.

A guide rail 164b is provided in the second moving path 160b so that the second robot 162b linearly moves in the first direction 62. Unlike the above-described method, a first moving path may be disposed at one side of the first processing chamber, and spin units and baking units for coating may be disposed at the other side of the first processing chamber. In addition, a second moving path may be disposed at one side of the second processing chamber, and spin units and baking units for developing may be disposed at the other side of the second processing chamber.

5 and 6 are a plan view and a side view showing the configuration of the spin unit. In the present embodiment, the spin unit for development is described as an example, but the spin unit having the retractable structure shown in FIGS. 5 and 6 may have a foreign substance remaining on the surface of the substrate by using the spin unit for application or various processing fluids. And spin units for cleaning and etching for removing film quality. 6, the nozzle member is omitted for convenience of drawing.

5 and 6, the spin unit 80 includes a chamber 82, first, second and third processing containers 100-1, 100-2 and 100-3, and first, second and third substrate support members 200-. 1,200-2,200-3 and first, second, and third nozzle members 300-1,300-2,300-3. The spin unit 80 of this embodiment has a multi-processing structure in which first, second and third processing containers are arranged in a row so as to process three substrates at the same time.

The chamber 82 provides an internal space by the first surface 83a, the second surface 83b, and the third and fourth surfaces 83c and 83d, and a fan filter unit 89 is installed at the upper portion thereof. The fan filter unit 89 generates vertical airflow inside the chamber 82. The chamber 82 has substrate entrances 84 formed on a first surface 83a adjacent to the second moving path 160b and a second surface facing the first surface 83a on which the substrate entrances 84 are formed. 83b includes an open surface 85 that is open for maintenance work, which is closed by a cover 86.

The fan filter unit 89 is a unit in which the filter and the air supply fan are modularized into one unit, and filter the clean air to supply the inside of the chamber 82. The clean air passes through the fan filter unit 89 and is supplied into the chamber 82 to form vertical airflow. This vertical airflow provides a uniform airflow over the substrate.

As shown in FIG. 6, the chamber 82 is partitioned into a process region PA and a utility region UA by the base 900. Although only a part is shown in the drawing, the utility area UA includes a driving unit of the elevating unit in addition to the discharge line 141 and the exhaust line 148 connected to the first, second and third processing vessels 100-1, 100-2, and 100-3. It is a space where various pipes connected to the first, second and third nozzle members 300-1, 300-2, and 300-3 are located, and the process region is preferably isolated from the utility region UA to maintain high cleanliness.

The base 900 is divided into a first rotating base 900-1, a second rotating base 900-2, and a fixed base 900-3. The first rotating base 900-1 is formed through the opening surface 85 of the chamber 82 about the first hinge shaft 910 installed at the corner where the third surface 83c and the second surface 83b meet. It can be rotated and moved to the maintenance position (shown in FIG. 8). The second rotating base 900-2 is formed through the open surface 85 of the chamber 82 about the second hinge shaft 920 provided at the corner where the fourth surface 83d and the second surface 83b meet. It can be rotated and moved to the maintenance position (shown in FIG. 8).

On the other hand, the boundary surface of the first rotating base (900-1) and the fixed base (900-3) is made of an arc-shaped side surface 902 to prevent mutual collision during the rotational movement of the first rotating base (900-1) The interface between the second rotating base 900-2 and the fixed base 900-3 also includes an arc-shaped side surface 904 to prevent mutual collision during rotation of the second rotating base 900-2.

The first rotating base 900-1 is provided with a first processing container 100-1, a first nozzle member 300-1, and a first substrate supporting member 200-1, and a second rotating base 900. The second processing container 100-2, the second nozzle member 300-2, and the second substrate supporting member 200-2 are installed at -2), and the third processing container is installed at the fixed base 900-3. 100-3, the third nozzle member 300-3, and the third substrate supporting member 200-3 are installed.

The first processing container 100-1, the first nozzle member 300-1, and the first substrate supporting member 200-1 together with the first rotating base 900-1 are processed at a processing position (as shown in FIG. 5). The first state) to the maintenance position (second state shown in FIG. 8). The second processing container 100-2, the second nozzle member 300-2, and the second substrate supporting member 200-2 are processed together with the second rotating base 900-2 (the process shown in FIG. 5). The first state) to the maintenance position (second state shown in FIG. 8).

The description of the processing container and the substrate supporting member will be described with an example of the first processing container and the first substrate supporting member installed in the first rotating base.

7 is a cross-sectional view showing a first processing container and a first substrate supporting member.

Referring to FIG. 7, the first processing container 100-1 is installed in the first rotating base 900-1. The first processing container 100-1 has a cylindrical shape with an open upper portion, and provides a process space for processing the substrate w. The opened upper surface of the first processing container 100-1 serves as a carrying-out and carrying-in passage of the substrate w.

The first processing container 100-1 is installed to surround the first substrate supporting member 200-1. The first processing container 100-1 is for introducing and collecting fluid (developing liquid, cleaning liquid, dry gas, etc.) scattered on the substrate w which is rotated during the development, cleaning and drying process of the substrate w. . This not only prevents contamination of other external devices or surroundings, but also provides developer recovery and a uniform flow of air over the substrate.

The first processing container 100-1 has an outer space a and an inner space b. The outer space a is a space into which the developer and gas scattered from the substrate w are provided by the outer wall 132 and the vertical partition wall 134, and a drain port for draining the developer on the bottom surface 136. 150 is formed. In addition, an exhaust port 142 for exhausting gas is formed on the bottom surface of the inner space of the first processing container 100-1. An exhaust line 152 is connected to the exhaust port 142 of the processing vessel so that forced exhaust of gas is performed.

The outer cover 132 of the first processing container 100-1 is provided with an annular cover 160 that can be elevated. The cover 160 is lifted up and down by a lifting unit (not shown) to carry the substrate w onto the spin head 210 or to carry out the processed substrate. The cover 160 is elevated by the lifting unit (not shown) to the up position higher than the substrate and the down position lower than the substrate.

In this embodiment, the substrate processing apparatus 1 moves the first processing container 100-1 vertically so that the relative vertical position between the first processing container 100-1 and the first substrate supporting member 200-1 is vertical. To change. However, the substrate processing apparatus 1 changes the relative vertical position between the first processing container 100-1 and the first substrate supporting member 200-1 by vertically moving the first substrate supporting member 200-1. You can also

The first substrate supporting member 200-1 is installed inside the first processing container 100-1. The first substrate supporting member 200-1 supports the substrate W during the process, and may be rotated by the driver 240 to be described later as needed during the process. The first substrate supporting member 200-1 has a spin head 210 having a flat upper surface on which the substrate w is placed. The spin head 210 may directly vacuum-adsorb the substrate through a vacuum line (not shown) formed therein so that the substrate is not separated from the spin head 210 by centrifugal force. Unlike the above-described structure, the first substrate support member 200-1 may mechanically fix the edge of the substrate from the side of the substrate through the chucking pins installed in the spin head 210. The spindle 220 is fixedly coupled to the lower surface of the spin head 210, and the spindle 220 is rotatably provided by the driver 240. Although not shown, the driver 240 includes a motor, a belt, a pulley, and the like for providing rotational force.

The first nozzle member 300-1 is located outside the first processing container 100-1. The first nozzle member 300-1 supplies a processing fluid for developing, cleaning, and drying the substrate w to the substrate w fixed to the first substrate support member 200-1.

8 is a view showing a state in which the first and second processing containers are withdrawn from the chamber for maintenance.

For internal maintenance work of the spin unit 80, first, the cover 86 provided on the open surface 85 of the chamber 82 is removed, and the first rotating base 900-1 and the second rotating base 900- 2) when the first and second hinge shafts 910 and 920 are pulled toward the open surface direction, the first and second rotating bases 900-1 and 900-2 are moved around the first and second hinge shafts 910 and 920. 82) are drawn out. In this case, the first processing container 100-1 and the second processing container 100-2 also move together to be positioned outside the chamber 82. In this way, the first processing container 100-1 and the second processing container 100-2 disposed on both sides are taken out of the chamber 82 together with the first and second rotating bases 900-1 and 900-2, thereby allowing the worker to Is enough space for the maintenance (cleaning and maintenance) of the components installed on the fixed base (00-3) as well as the components installed on the first and second rotating base (900-1,900-2).

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

1 is a schematic view showing a substrate processing apparatus of the present invention.

2 is a perspective view illustrating an example of a processor in the apparatus of FIG. 1.

3 is a plan view of the first processing chamber in the processing unit of FIG. 2;

4 is a plan view of a second processing chamber in the processing unit of FIG. 2;

5 and 6 are a plan view and a side view showing the configuration of the spin unit.

7 is a cross-sectional view showing a first processing container and a first substrate supporting member.

8 is a view showing a state in which the first and second processing containers are withdrawn from the chamber for maintenance.

<Description of Symbols for Main Parts of Drawings>

82 chamber 100 processing vessel

200 substrate support member 300 nozzle member

90: base

Claims (10)

In the substrate processing apparatus: A chamber having an interior space; And a processing unit coupled to an internal space of the chamber in a hinge axis structure, the processing unit being capable of being rotated about the hinge axis to be pulled out through one surface of the chamber. The method of claim 1, The processing unit A substrate support member including a spin head on which the substrate is placed; A processing vessel installed to wrap around the spin head to recover a processing fluid scattered on a substrate; And And a rotating base supporting the processing container and having a hinge axis coupled thereto to rotate about the hinge axis. In the substrate processing apparatus: A chamber having an open surface opened by a cover; A base installed inside the chamber; A first to third processing vessels installed in a line on the base along the opening surface; The base is A first rotating base having the first processing container installed therein and being rotated about the first hinge axis and drawn out through the open surface of the chamber; A second rotating base having the third processing container installed therein and being rotated about a second hinge axis and drawn out through an open surface of the chamber; And a fixed base provided between the first rotating base and the second rotating base and provided with the second processing container. The method of claim 3, wherein The interface between the first rotating base and the fixed base is Substrate processing apparatus, characterized in that formed in an arc shape to prevent mutual collision during the rotational movement of the first rotary base. The method of claim 3, wherein The interface between the second rotating base and the fixed base is Substrate processing apparatus, characterized in that formed in an arc shape to prevent mutual collision during the rotational movement of the second rotary base. The method of claim 3, wherein The first hinge shaft and the second rotary shaft Substrate processing apparatus, characterized in that located close to the open surface. In the substrate processing apparatus: A chamber having a first surface having a substrate entrance, a second surface facing the first surface and having an open surface, and third and fourth surfaces connecting the first and second surfaces; A first rotating base capable of withdrawing to an open surface of the second surface about a first hinge axis provided adjacent to an edge where the second and third surfaces of the chamber meet; A second rotating base capable of withdrawing to an open surface of the second surface about a second hinge axis provided adjacent to a corner where the second and fourth surfaces of the chamber meet; And And a fixed base provided between the first rotating base and the second rotating base. The method of claim 7, wherein And a processing container is provided on each of the first rotating base, the second rotating base, and the fixed base. The method of claim 7, wherein The first rotating base is And a side surface adjacent to the fixed base has an arc shape. The method of claim 7, wherein And said second rotating base has an arc-shaped side surface adjacent to said fixed base.

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