KR20100045564A - Semiconductor mold with dam - Google Patents

Semiconductor mold with dam Download PDF

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Publication number
KR20100045564A
KR20100045564A KR1020080104541A KR20080104541A KR20100045564A KR 20100045564 A KR20100045564 A KR 20100045564A KR 1020080104541 A KR1020080104541 A KR 1020080104541A KR 20080104541 A KR20080104541 A KR 20080104541A KR 20100045564 A KR20100045564 A KR 20100045564A
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South Korea
Prior art keywords
runner
cavity
main runner
dam
resin
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KR1020080104541A
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Korean (ko)
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KR101437829B1 (en
Inventor
황태성
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주식회사 아이티엠반도체
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Priority to KR1020080104541A priority Critical patent/KR101437829B1/en
Publication of KR20100045564A publication Critical patent/KR20100045564A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/30—Flow control means disposed within the sprue channel, e.g. "torpedo" construction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C2045/2683—Plurality of independent mould cavities in a single mould

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: A semiconductor mold with a dam is provided to reduce pressure of resin which is provided from the nearest cavity from the end part and to control cutting of gold wires and a short circuit by being failed of gold wires which is the closest to the end of a main runner. CONSTITUTION: A semiconductor mold with a dam(40) comprises: a main runner(20) which has an injection port which is connected to a nozzle of an injection molding machine and a closed end portion(24) which is placed opposite the injection port; a plurality of cavities(10') which are formed along the longitudinal direction of the main runner and wherein a lead frame is installed with a chip; and an auxiliary runner(30') which interlinks the cavities and the main runner in order to supply resin into the cavities. The dam is formed between the end and the auxiliary runner which is connected with the nearest cavity from the end part. The dam flows backward a part of resin.

Description

댐을 구비한 반도체 금형{Semiconductor Mold With Dam}Semiconductor Mold With Dam

본 발명은 댐을 구비한 반도체 금형에 관한 것으로, 보다 상세하게는 주 러너 양측에 복수 개의 보조 러너가 구비되며 캐비티가 보조 러너에 각각 연결된 반도체 금형에 있어서 주 러너의 종단부에 인접한 캐비티에서 수지몰딩되는 반도체의 불량을 방지하기 위해 주 러너 종단부 근처에 댐을 구비한 반도체 금형에 관한 것이다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor mold having a dam, and more particularly, to a resin mold in a cavity adjacent to an end of the main runner in a semiconductor mold having a plurality of auxiliary runners provided at both sides of the main runner and having cavities connected to the auxiliary runner, respectively. The present invention relates to a semiconductor mold provided with a dam near the main runner end to prevent defects of semiconductors.

통상 반도체는 도 1과 같이 리드 프레임(1)에 칩(2)을 탑재하고, 리드 프레임(1)과 칩(2)을 금선(3, gold wire)으로 결선한 뒤, 리드 프레임(1)의 일부와 칩(2)을 수지 밀봉하여 점선으로 표시한 것과 같은 수지밀봉부(4)를 형성하는 과정을 거쳐 제조된다. In general, a semiconductor is mounted with a chip 2 in the lead frame 1 as shown in FIG. 1, and after connecting the lead frame 1 and the chip 2 with gold wires 3, the It is manufactured through the process of forming the resin sealing part 4 as shown by the dotted line by resin-sealing a part and chip 2.

수지로 밀봉하기 위해서는 금선(3)으로 결선된 칩(2)과 리드프레임(1)을 하부 금형내에 안착시킨 후 상부 금형과 하부 금형이 협동하여 형성한 캐비티에 수지 를 주입하게 된다. 통상적으로 수지는 에폭시 몰딩 컴파운드(epoxi moulding compound)가 사용된다. In order to seal with the resin, the chip 2 and the lead frame 1 connected with the gold wire 3 are seated in the lower mold, and the resin is injected into the cavity formed by the upper mold and the lower mold working together. Typically, the resin is an epoxy molding compound (epoxi molding compound) is used.

통상 수지 밀봉을 위해서는 도 2과 같은 형태의 금형을 사용하게 된다. 도 2는 하부 금형의 개략적인 평면도이며, 하부금형에는 상부 금형과 협동하여 도 1의 점선과 같은 수지밀봉부를 형성할 캐비티(10)가 구비되어 있다. 하부 금형중 캐비티를 이루는 부분에 금선(3)으로 결선된 칩(2)과 리드프레임(1)을 안착시키고, 상부 금형과 하부 금형을 결합시킨 뒤 주 러너(20)의 주입구(22)를 통해 수지를 주입하게 된다. 주 러너(20)는 직선 형태로 가공되며, 주 러너(20)의 주입구(22) 반대편에는 주 러너의 종단부(24)가 주 러너를 폐쇄하도록 형성되어 있다. 주 러너(20)의 주위에는 캐비티(10)들이 복수 개 대칭으로 형성되어 있다. 캐비티(10)와 주 러너(20)는 보조 러너(30)를 통해 서로 연통되어 있어 주 러너(20)의 수지가 캐비티(10)로 주입되어 수지밀봉부를 형성하게 된다. In general, a mold of the form as shown in FIG. 2 is used to seal the resin. FIG. 2 is a schematic plan view of the lower mold, and the lower mold is provided with a cavity 10 which cooperates with the upper mold to form a resin sealing portion as shown in FIG. 1. The chip 2 and the lead frame 1 connected with the gold wire 3 are seated on the cavity forming part of the lower mold, the upper mold and the lower mold are combined, and then through the inlet 22 of the main runner 20. Resin is injected. The main runner 20 is processed in a straight line shape, and an end portion 24 of the main runner is formed to close the main runner on the opposite side of the injection port 22 of the main runner 20. A plurality of cavities 10 are formed symmetrically around the main runner 20. The cavity 10 and the main runner 20 communicate with each other through the auxiliary runner 30 so that the resin of the main runner 20 is injected into the cavity 10 to form a resin sealing part.

사출 성형기의 노즐(도시하지 않음)과 연결되어 금형 내부로 수지를 공급받는 주 러너 내의 주입구로부터 종단부까지 수지의 흐름은 고속 대량 생산을 위하여 매우 빠르게 공급되게 된다. 주입구로 주입된 수지는 직선형태의 주 러너를 따라 종단부까지 대부분의 양이 먼저 흐르게 되고, 주 러너에 수지가 가득찬 상태에서 수지는 각 보조 러너를 통하여 캐비티로 대량 주입되게 된다. 각 캐비티에 공급되는 수지의 압력 등이 불균일하게 되는 문제점이 발생하게 되는데, 통상 이러한 문 제점은 보조 러너(30)의 단면적 등을 조절하는 형태로 이루어지게 된다. The flow of resin from the inlet to the end of the main runner, which is connected to a nozzle (not shown) of the injection molding machine and is supplied into the mold, is supplied very quickly for high speed mass production. The resin injected into the inlet flows first through the main runner in a straight line to the end, and in a state where the main runner is full of resin, the resin is injected into the cavity through each auxiliary runner. The problem of non-uniform pressure of the resin supplied to each cavity is generated, such a problem is usually made in the form of adjusting the cross-sectional area and the like of the auxiliary runner (30).

하지만, 도 3과 같이 종단부(24)에 가장 근접하게 형성된 캐비티(10')는 종단부(24)에 달하여 역류하는 수지의 흐름 등에 의해 다른 캐비티에 비해 훨씬 더 강한 압력을 받게 되며, 이러한 압력에 의해 종단부(24)에 가장 근접하게 형성된 캐비티(10') 내의 금선은 리드프레임과 칩사이의 결선상태를 유지하지 못하고 끊어지거나 쇼트가 나는 경우가 많이 발생한다. However, as shown in FIG. 3, the cavity 10 ′ formed closest to the end portion 24 is subjected to much stronger pressure than other cavities due to the flow of resin flowing back to the end portion 24. As a result, the gold wire in the cavity 10 ′ formed closest to the terminal portion 24 is broken or shorted without maintaining the connection state between the lead frame and the chip.

이러한 문제는 종단부(24)에 가장 근접하게 형성된 보조 러너(30')의 단면적 크기를 조절하여도 해결되지 않아, 종단부(24)에 가장 근접되게 형성된 캐비티(10')를 통해 형성된 반도체는 불량이 많이 발생하는 문제점이 있었다. This problem is not solved even by adjusting the size of the cross-sectional area of the auxiliary runner 30 'which is formed closest to the termination part 24, so that the semiconductor formed through the cavity 10' which is closest to the termination part 24 is formed. There was a problem that a lot of defects occur.

본 발명은 상기와 같은 문제점을 해결하기 위하여 안출된 것으로, 수지 주입시 금형의 주 러너 종단부에 가장 근접한 캐비티에서 공급되는 수지의 압력을 낮출 수 있고, 이에 따라 주 러너 종단부에 가장 근접한 캐비티 내의 금선이 넘어져 쇼트가 나거나 끊어지는 불량을 감소시킬 수 있는 금형을 제공하는 것을 그 목적으로 한다.The present invention has been made to solve the above problems, it is possible to lower the pressure of the resin supplied from the cavity closest to the main runner end of the mold during the resin injection, and thus within the cavity closest to the main runner end It is an object of the present invention to provide a mold capable of reducing defects in which the gold wire falls and shorts or breaks.

본 발명의 댐을 구비한 반도체 금형은,The semiconductor mold provided with the dam of this invention,

사출 성형기의 노즐과 연결되는 주입구를 구비하며 상기 주입구에서 직선으로 형성되며 주입구의 반대편에는 폐쇄된 종단부를 구비한 주 러너와,A main runner having an injection port connected to a nozzle of an injection molding machine and formed in a straight line at the injection hole and having a closed end portion opposite to the injection hole;

칩이 탑재된 리드 프레임이 장착되며 상기 주 러너의 길이방향을 따라 복수 개 형성된 캐비티와,A cavity in which a chip mounted lead frame is mounted and formed in plural along the longitudinal direction of the main runner;

각 캐비티에 상기 주 러너의 수지를 공급하기 위하여 상기 캐비티와 주 러너를 연통시키는 보조 러너를 구비하며,An auxiliary runner for communicating the cavity with the main runner for supplying the resin of the main runner to each cavity;

상 하부 금형으로 나누어진 반도체 금형에 있어서;A semiconductor mold divided into an upper lower mold;

상기 종단부에 가장 근접한 캐비티로 연결되는 보조 러너와 상기 종단부 사이에 형성되며 수지 흐름을 일부 역류시킬 수 있는 댐을 구비한 것을 특징으로 한 다. And a dam formed between the auxiliary runner connected to the cavity closest to the termination and the termination and capable of partially backflowing the resin flow.

또한, 상기 종단부에 가장 근접한 캐비티로 연결되는 보조 러너와 상기 종단부 사이의 주 러너의 단면적이, 상기 종단부에 가장 근접한 캐비티로 연결되는 보조 러너와 상기 주입구사이의 주 러너의 단면적보다 크게 형성된 확대부를 구비한 것을 또 다른 특징으로 한다.Further, a cross-sectional area of the secondary runner connected to the cavity closest to the end portion and the main runner is greater than the cross-sectional area of the primary runner between the secondary runner and the injection port connected to the cavity closest to the terminal portion. Another aspect of the present invention includes an enlarged portion.

상기와 같은 구성에 따라, 종단부에 가장 근접한 캐비티에서 공급되는 수지의 압력을 낮출 수 있고, 이에 따라 주 러너 종단부에 가장 근접한 캐비티 내의 금선이 넘어져 쇼트가 나거나 끊어지는 불량을 감소시킬 수 있는 효과가 있다.According to the above configuration, it is possible to lower the pressure of the resin supplied from the cavity closest to the end portion, thereby reducing the defect that the gold wire in the cavity closest to the main runner end portion falls and short or broken. There is.

이하, 본 발명을 그 실시예에 따라 도면을 참조하여 보다 상세하게 설명한다. Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

종단부 근처를 제외하고는 상기 배경 기술에서 설명한 것과 모두 동일하므로 설명을 생략 한다. Except for near the end portion, the description is the same as that described in the background art, so the description is omitted.

본 실시예에서는 도 4와 같이 상기 종단부(24)에 가장 근접한 캐비티(10')로 연결되는 보조 러너(30')와 상기 종단부(24) 사이에 형성되며, 수지 흐름을 일부 역류시킬 수 있는 댐(40)을 구비되어 있다. In this embodiment, as shown in Figure 4 is formed between the auxiliary runner 30 'connected to the cavity 10' closest to the end portion 24 'and the end portion 24, and can partially flow the resin flow back. The dam 40 is provided.

주 러너(20)를 따라 초기에 유입되는 수지 중 일부는 종단부(24)로 주입되는 한편, 댐(40)에 가로 막혀 일부 역류되는 수지는 보조 러너(30')을 통하여 종단부(24)에 가장 근접한 캐비티(10')로 미리 흘러 들어가게 되므로, 종단부(24)에 가장 근접한 캐비티(10')로 유입되는 수지에 의해 금선이 끊어지는 것이 방지될 수 있게 된다. Some of the resin initially introduced along the main runner 20 is injected into the termination 24, while the resin, which is blocked by the dam 40 and partially flowed back, is terminated through the auxiliary runner 30 ′. Since it is preliminarily flowed into the cavity 10 'which is closest to, the gold wires can be prevented from being broken by the resin flowing into the cavity 10' which is closest to the end portion 24.

또한, 도 4에 나타난 바와 같이 종단부(24)는 상기 종단부(24)에 가장 근접한 캐비티(10')로 연결되는 보조 러너(30')와 상기 종단부(24) 사이의 주 러너(22)의 단면적이, 상기 종단부(24)에 가장 근접한 캐비티(10')로 연결되는 보조 러너(30')와 상기 주입구사이의 주 러너(22)의 단면적보다 크게 형성된 확대부를 구비하고 있다.In addition, as shown in FIG. 4, the termination part 24 is connected between the auxiliary runner 30 ′ connected to the cavity 10 ′ closest to the termination part 24 ′ and the main runner 22 between the termination part 24. ) Has an enlarged portion formed larger than the cross-sectional area of the main runner 22 between the auxiliary runner 30 'and the injection port connected to the cavity 10' closest to the end 24.

이러한 확대부의 크기가 클수록, 종단부가 만충되는 시간이 더 소요 되며 그 동안 상기 종단부(24)에 가장 근접한 캐비티(10')로 연결되는 보조 러너(30')를 통해 캐비티(10')로 유입되는 수지의 양이 더 많아질 수 있게 되는 것이다. The larger the size of this enlargement, the longer it takes for the end to be fully filled, during which it enters the cavity 10 'through the auxiliary runner 30' which is connected to the cavity 10 'closest to the end 24. The amount of resin that becomes can be more.

도 1은 칩과 리드프레임이 금선으로 결선된 형태를 나타낸 사시도.1 is a perspective view showing a form in which a chip and a lead frame are connected by gold wires.

도 2는 종래의 반도체 금형 중 하부금형을 개략적으로 나타낸 평면도.Figure 2 is a plan view schematically showing a lower mold of a conventional semiconductor mold.

도 3은 도 2의 하부금형의 종단부 형태를 나타낸 부분 사시도.Figure 3 is a partial perspective view showing the end shape of the lower mold of Figure 2;

도 4는 본 발명의 하부금형의 종단부 근처를 나타낸 부분 사시도.Figure 4 is a partial perspective view of the lower mold near the end of the present invention.

** 도면의 주요부분에 대한 부호 설명 **** Explanation of symbols on the main parts of the drawing **

10 : 캐비티 20 : 주 러너 22 : 주입구 24 : 종단부DESCRIPTION OF SYMBOLS 10 Cavity 20 Main runner 22 Injection port 24 Terminal part

30 : 보조 러너 40 : 댐30: auxiliary runner 40: dam

Claims (2)

사출 성형기의 노즐과 연결되는 주입구를 구비하며 상기 주입구에서 직선으로 형성되며 주입구의 반대편에는 폐쇄된 종단부를 구비한 주 러너와,A main runner having an injection port connected to a nozzle of an injection molding machine and formed in a straight line at the injection hole and having a closed end portion opposite to the injection hole; 칩이 탑재된 리드 프레임이 장착되며 상기 주 러너의 길이방향을 따라 복수 개 형성된 캐비티와,A cavity in which a chip mounted lead frame is mounted and formed in plural along the longitudinal direction of the main runner; 각 캐비티에 상기 주 러너의 수지를 공급하기 위하여 상기 캐비티와 주 러너를 연통시키는 보조 러너를 구비하며,An auxiliary runner for communicating the cavity with the main runner for supplying the resin of the main runner to each cavity; 상 하부 금형으로 나누어진 반도체 금형에 있어서;A semiconductor mold divided into an upper lower mold; 상기 종단부에 가장 근접한 캐비티로 연결되는 보조 러너와 상기 종단부 사이에 형성되며 수지 흐름을 일부 역류시킬 수 있는 댐을 구비한 것을 특징으로 하는 댐을 구비한 반도체 금형.And a dam formed between the auxiliary runner connected to the cavity closest to the termination and the termination, the dam capable of backflowing a part of the resin flow. 제 1 항에 있어서, 상기 종단부에 가장 근접한 캐비티로 연결되는 보조 러너와 상기 종단부 사이의 주 러너의 단면적이, 상기 종단부에 가장 근접한 캐비티로 연결되는 보조 러너와 상기 주입구사이의 주 러너의 단면적보다 크게 형성된 확대부를 구비한 것을 특징으로 하는 댐을 구비한 반도체 금형.2. The main runner of claim 1, wherein the cross-sectional area of the secondary runner connected to the cavity closest to the end portion and the main runner between the terminal portion is a cross section of the primary runner between the secondary runner and the injection port connected to the cavity closest to the terminal portion. A semiconductor mold with a dam, characterized by having an enlarged portion formed larger than the cross-sectional area.
KR1020080104541A 2008-10-24 2008-10-24 Semiconductor Mold With Dam KR101437829B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109228124A (en) * 2018-09-12 2019-01-18 珠海福睿电子科技有限公司 A kind of injection molding compression mold device of cable connector

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* Cited by examiner, † Cited by third party
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JP2742638B2 (en) * 1991-12-25 1998-04-22 株式会社三井ハイテック Resin sealing molds for semiconductor devices
JPH08197570A (en) * 1995-01-31 1996-08-06 Nec Kansai Ltd Resin molding device
JPH11170306A (en) * 1997-12-08 1999-06-29 Nippon Plast Co Ltd Injection mold
KR20040068400A (en) * 2003-01-25 2004-07-31 유도실업주식회사 Prevention Device of Resin flowing backward on Cold runner for Shooting out machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109228124A (en) * 2018-09-12 2019-01-18 珠海福睿电子科技有限公司 A kind of injection molding compression mold device of cable connector

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