KR100762927B1 - Molding apparatus for semiconductor package - Google Patents

Abstract

The present invention relates to a semiconductor package molding apparatus, and more particularly, an upper mold (2) and a lower mold (3) in which a molding compound is inserted into a plurality of cavities (4) formed by molding to mold a semiconductor package; A plunger 10 provided on one side of the lower mold 3 to pressurize the molding compound into the cavity 4 so that the molding compound is extruded between each of the plurality of cavities 4. The cavity part 5 is provided so that a plurality of gates 6, which are passages, may be formed, and the first port 13, the first curl 7, and the first runner 15 are connected to one side of the cavity part 5. Also, the second port 14, the second curl 8, and the second runner 16 are connected to the other side of the cavity part 5 so that unnecessary amount of molding compound is required to form the semiconductor package. To reduce the pressure and reduce the feed pressure to other components It provides a semiconductor device package, the molding pressure to reduce the damage.

Semiconductor Package, Mold, Compound, Port, Curl

Description

Molding apparatus for semiconductor package             

1 is a perspective view of a molding apparatus according to the prior art.

2 is a plan view of the upper mold of the molding apparatus according to the prior art.

3 is a front view of a molding apparatus according to the prior art.

4 is a perspective view of another embodiment mold according to the prior art.

5 is a cross-sectional view of the front of the molding apparatus according to the present invention.

6 is a plan view of the upper mold of the molding apparatus according to the present invention.

7 is a plan view of the lower mold of the molding apparatus according to the present invention.

*** Explanation of symbols for main parts of drawing ***

1 molding apparatus 2 upper mold

3: lower mold 4: cavity

5: cavity part 6: gate

7: 1st curl 8: 2nd curl

10: plunger 11: first plunger

12: 2nd plunger 13: 1st port

14: 2nd port 15: 1st runner

16: 2nd runner

The present invention relates to a semiconductor package molding apparatus, and more particularly, molding required to form a semiconductor package by shortening the length of each runner for transferring the molding compound from each port and each curl in which the plunger is located into each cavity of the cavity portion. It relates to a semiconductor package molding apparatus which reduces unnecessary amounts of compound and reduces transfer pressure to reduce damage pressure on other components.

In general, a semiconductor that can control electrical signals, amplification, memory, etc. by using a property that is intermediate between a conductor and a non-conductor can protect a surface from external moisture and impurities, and effectively prevent heat generated at a junction. It is embedded in a container made of metal, ceramic, plastic, or the like for diverging, which is commonly referred to as a semiconductor package.

The semiconductor package is manufactured by a manufacturing process consisting of a bonding process, a molding process, an MBT process, and a test process. First, according to the bonding process, a highly integrated circuit such as a transistor and a capacitor on a silicon wafer in a lead frame is used in a die bonding process. The formed semiconductor chip is mounted. Then, the external connection terminal is electrically energized by connecting the semiconductor chip and the wire in the wire bonding process.

Next, in the molding process, the appearance of the package is molded using a molding resin such as an epoxy molding compound (EMC) to protect the semiconductor chip in consideration of the electrical and mechanical properties of the package.

The molding process of molding the package appearance with the molding resin is performed by a molding machine having a pair of upper and lower molds. Here, the molding machine is provided with upper and lower molds configured to be mutually clamped as shown by reference numerals 110 and 120 in FIGS. 1 to 3, respectively, and the center blocks 113 and 123 are formed at the centers of the molds 110 and 120. Curl (116, 126) and runners (114, 124) are processed in the center of the center block (113, 123), the curl (116, 126) through the runner (114, 124) (112, 122). In addition, a plurality of chases 111 and 121 are symmetrical on both sides of the center blocks 113 and 123 so that lead frames on which the semiconductor chips are mounted are mounted on the contact surfaces of the upper and lower molds 110 and 120, respectively. The chases 111 and 121 are formed with a plurality of cavities 112 and 122 on which semiconductor chips mounted in lead frames are seated.

Therefore, in order to perform the molding process by the molding machine as described above, first, the wire-bonded semiconductor chip is seated in the cavities 112 and 122, and the compound C is formed in the compound supply passage 113a formed in the center blocks 113 and 123. ) And clamp the upper and lower molds (110, 120). Then, when the plunger 117 installed to move up and down along the port 109 in the upper mold 110 is lowered by a predetermined amount, the compound C charged in the supply passage 113a is compressed to run the runners 114 and 124. Through the flow through the cavity (112, 122) and solidified to seal the molding region of the semiconductor chip to manufacture a package.

The conventional center block or mold block provided as described above is disclosed in "Mold Block for Semiconductor Package Manufacturing" of Korean Patent Application Publication No. 10-2002-0030341, and as shown in FIG. 4, the curl formed in the center of the mold block 210 ( The runner 212 is formed to transfer the molding compound from the 216 to the plurality of cavity 214.

However, the conventional mold block 210 provided as described above has a shape of the runner 212 because the runner 212, which is a transfer passage for transferring the molding compound to the plurality of cavities 214, needs to be transferred from the curl 216. To lengthen is formed like a spider web. Therefore, the compound in the runner 212 is unnecessarily wasted because the compound actually made of the semiconductor package uses only the compound in each cavity 214. In addition, since the runner 212 is formed to be long and narrow, the extrusion pressure extruded from the plunger and the port must be strong, which causes other components to be damaged.

According to the present invention for solving the above problems, according to the semiconductor package molding apparatus, the plunger, the port and the curl for conveying the molding compound for molding the semiconductor package is provided on both sides of the cavity portion formed with a plurality of cavities, Shorten the length of each runner that transfers the molding compound from the port and each curl into each cavity of the cavity, reducing the unnecessary amount of molding compound required to form the semiconductor package and reducing the transfer pressure to reduce damage pressure on other components. To reduce it.

The present invention for achieving the above object is an upper mold and a lower mold to be molded into a plurality of cavities formed by molding to form a semiconductor package, and provided on one side of the lower mold, the molding compound into the cavity A semiconductor package molding apparatus having a plunger pressurized to be inserted into the semiconductor package molding apparatus, the semiconductor package molding apparatus including a cavity portion in which a plurality of gates are formed, which are passages through which the molding compound is extruded and transferred between each of the plurality of cavities. to provide.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 5 is a cross-sectional view of the front of the molding apparatus according to the invention, Figure 6 is a bottom view of the upper mold of the molding apparatus according to the invention, Figure 7 is a plan view of the lower mold of the molding apparatus according to the invention It is shown.

Therefore, the semiconductor package molding apparatus 1 of the present invention is a cavity 4 formed by combining the plunger 10, the upper mold 2, the lower mold 3, the upper mold 2, and the lower mold 3. And a cavity portion 5 in which a plurality of the cavities 4 are formed.

That is, a molding compound is inserted into a plurality of cavities 4 formed by molding to form a semiconductor package, and an upper mold 2 and a lower mold 3 are formed on one side of the lower mold 3 and the cavity 4 is provided. And a plunger 10 pressurizing the molding compound to be charged into the cavity, so that the plurality of gates 6, which are passages through which the molding compound is extruded, are formed between each of the plurality of cavities 4. (5) is provided.

And a first plunger 11 and a second plunger 12 which are provided at both sides of the cavity part 5 and are provided to charge the molding compound. The mold 3 is provided with a first port 13 and a second port 14 to position the molding compound extruded by the first plunger 11 and the second plunger 12.

In addition, the first compound 7 and the second curl 7 to allow the molding compound to be transferred from the first port 13 and the second port 14 to the upper mold 2 at both sides of the cavity part 5. 8). The first runner 15 is formed by joining the upper mold 2 and the lower mold 3 so that the molding compound is transferred between the cavity part 5 and both side first curls 7. And a second runner 16 through which the molding compound is transferred between the cavity part 5 and both sides of the second curl 8.

The semiconductor package molding apparatus 1 according to the present invention, which is provided as described above, is particularly focused on the middle of the cavity part 5 with respect to the plurality of cavities 4 and the plurality of gates constituting the cavity part 5. No gate 6 is formed connecting the two cavities 4 centrally located so as to be separated on both sides. Therefore, the cavity part 5 is formed by connecting the gate 6 so that a plurality of the cavity 4 is separated to both sides.

In addition, the gate 6 may be formed on either the upper mold 2 or the lower mold 3, or may be formed by a combination of the upper mold 2 and the lower mold 3.

Looking at the molding forming process by the semiconductor package molding device 1 provided as described above is as follows. That is, the cavity portion 5 formed by connecting the first plurality of cavities 4 with the gates 6 connecting to each other is formed in the upper mold 2 and the lower mold 3, respectively. The upper mold 2 is coupled to the upper mold base 20 according to the general technique, and the lower mold 3 is coupled to the lower mold base 21. Thus, the lower mold 3 elevating device (not shown) allows the upper mold 2 and the lower mold 3 to be joined so that the cavity 4 is formed. At this time, by the combination of the upper mold 2 and the lower mold 3, the first port 13, the first curl 7, and the first runner 15 described above are connected to one side of the cavity part 5. The second port 14, the second curl 8, and the second runner 16 are connected to each other so as to be provided at the other side of the cavity part 5. Thus, the molding compound located in the first first port 13 and the second port 14 is extruded into the cavity part 5 by pressurization by both the first plunger 11 and the second plunger 12. Therefore, the molding compound is charged into each of the plurality of cavities 4 by the plurality of gates 6, which are passages in the cavity portion 5.

In this way, the plurality of cavities 4 constituting the cavity part 5 are separated from the center to form two regions so that the molding compound charged into each cavity 4 can be extruded smoothly. Therefore, the molding compound extruded from both sides of the cavity part 5 is to be charged evenly distributed into each cavity (4).

According to the semiconductor package molding apparatus 1 of the present invention provided as described above, each cavity 4 of the cavity portion 5 from each port 13, 14 and each curl 7, 8 in which the plunger 10 is located. Since the lengths of the runners 15 and 16 for transporting the molding compound to the inside were shortened, the unnecessary amount of the molding compound required to form the semiconductor package was provided.

In addition, the upper mold 2 and the lower mold 3 are formed with one cavity portion 5 to enable a small amount of production, and the various cavity portions 5 are formed by the upper mold 2 and the lower mold. It was formed in (3) to enable mass production.

Embodiments as described above are merely for illustrating the present invention, it is apparent to those skilled in the art that various modifications are possible without departing from the scope of the present invention, the protection of the present invention The range is not limited by these examples.

According to the present invention semiconductor package molding device (1) provided as described above, it is possible to reduce the unnecessary amount of the molding compound required to form the semiconductor package, to reduce the transport pressure to reduce the damage pressure on other components, etc. Has the effect of.

Claims (6)

A molding compound is inserted into a plurality of cavities 4 formed by molding, and an upper mold 2 and a lower mold 3 for molding a semiconductor package, and one side of the lower mold 3 are provided on the cavity 4. In the semiconductor package molding apparatus having a plunger 10 for applying a pressure so that the molding compound is charged, The cavity part 5 in which the plurality of cavities 4 are arranged in a line, and the gate 6 provided between each of the plurality of cavities 4 is formed so that the plurality of cavities 4 communicate with each other. Including, A first plunger 11 and a second plunger 12 are provided on both sides of the cavity part 5 so as to be parallel with the cavity part 5 so that the molding compound is charged at both sides of the cavity part 5. A semiconductor package molding apparatus, characterized in that. The method of claim 1, First ports 13 provided in the lower molds 3 on both sides of the cavity part 5 to position the molding compound extruded by the first plunger 11 and the second plunger 12. And a second port (14). The method of claim 2, First and second curls 7 and 2 provided in the upper mold 2 on both sides of the cavity part 5 to transfer the molding compound from the first port 13 and the second port 14. A semiconductor package molding apparatus further comprising a curl (8). The method of claim 3, wherein The molding between the first runner 15 and the cavity part 5 and both sides of the second curl 8 to transfer the molding compound between the cavity part 5 and both sides of the first curl 7. And a second runner (16) for conveying the compound. The method according to any one of claims 1 to 4, The gate (6) is a semiconductor package molding device, characterized in that formed in the upper mold (2) or the lower mold (3). The method of claim 5, The cavity part (5) is a semiconductor package molding apparatus, characterized in that formed by connecting the gate (6) so that a plurality of the cavity (4) is separated on both sides.

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