JP2007324149A - Resin-packaging mold and resin-packaging method for semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin-packaging mold which does not require adjustment of gate, even if the kind of resin or molding condition is changed, and can prevent failures caused by resin packaging, such as generation of voids or deformation of wires, etc. <P>SOLUTION: Melted resin put into a pot 13 is supplied to a cavity 11, wherein semiconductor chips are arranged via a main supply passage 15 and a sub supply passage 16, and a resin accumulation chamber 12 is connected to the downstream end of the main supply chamber 15. In such a resin packaging mold, an accumulation-side supply passage 17, connecting the main supply passage and the resin accumulation chamber, is made larger in length than in the sub supply passage, and the sectional shapes of both supply passages are made the same as those of each other. Furthermore, the capacity of the resin accumulation chamber is made equivalent or more to those of the cavities. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a resin-sealing mold for a resin-sealed semiconductor device using a lead frame and a resin wiring board, and a resin-sealing method using this mold.

In recent years, resin-encapsulated semiconductor integrated circuit devices (hereinafter referred to as semiconductor devices) using lead frames and resin wiring boards have come to be frequently used.
For example, in the assembly process of a resin-encapsulated semiconductor device using a lead frame, a die bonding process for mounting a semiconductor chip on the lead frame, and the electrodes of the semiconductor chip and leads on the lead frame are connected by a thin metal wire A wire bonding process, a sealing process for sealing a bonded semiconductor chip or the like with a resin, a cutting process for cutting and removing unnecessary portions such as an outer frame portion from the sealed lead frame, and the like are provided.

  By the way, the sealing process usually uses an upper mold and a lower mold having cavities to form the outer shape of the package, the lead frame after the bonding process is sandwiched between the upper and lower molds, and the cavity is in a high temperature state. This is performed by pouring a molten resin (generally a thermosetting resin).

  At this time, the poured resin is supplied from a portion called a pot installed in the lower mold (or the upper mold). The resin supplied from the pot flows into the cavity through a resin supply passage mold (consisting of a cull part, a runner part, and a gate part) formed so as to connect the pot and the cavity.

Usually, the runner part is installed in one of the lower mold and the upper mold, and the gate part is installed in one or both of the upper mold and the lower mold.
Then, after the poured resin is cured, when the upper mold and the lower mold are opened, a sealing resin portion corresponding to the cavity covering the semiconductor chip and a residual resin portion corresponding to the resin supply passage are present on the lead frame. It is in the state to do.

Of these, the remaining resin portion is unnecessary, and is usually removed in the sealing step.
In recent years, in order to reduce the manufacturing cost, in the sealing process, a die having a matrix type cavity corresponding to a matrix type lead frame capable of mounting semiconductor chips in a plurality of rows and a plurality of columns is collectively used. Resin sealing is increasing.

  FIG. 8 is a plan view of a lead frame after resin sealing of a conventional general QFP (quad flat package) type semiconductor device, and FIG. 9 shows a flow rate of molten resin in a conventional general QFP type semiconductor device. FIG. 8 and 9 mainly show the resin portion integrated with the lead frame sealed with resin, but the components on the mold side are indicated by phantom lines. To do.

  That is, the lower mold 51 is provided with one or a plurality of runners 53 from the pot 52, and a plurality of cavities 54 (54 </ b> A, 54 </ b> B, 54 </ b> C) are provided for the one runner 53. In addition, both are connected via a gate passage portion 55.

  Accordingly, when the sealing molten resin S is supplied from the pot 52 to the runner 53, the resin begins to fill the upstream cavity 54A of the runner 53 first. Then, as the resin of the runner 53 flows toward the final end, the resin is sequentially filled from the upstream cavity 54A to the downstream cavities 54B and 54C of the runner 53, and further from the upstream cavity 54A to the downstream cavity 54B. , 54C are sequentially filled with resin.

  However, as the filling from the upstream cavity 54A is sequentially completed, the flow rate of the resin flowing into the downstream cavity 54 increases, and in the most downstream cavity 54C, a jetting phenomenon caused by a rapid increase in the resin pressure occurs. In some cases, defects due to resin sealing such as voids and wire deformation may occur. A specific resin flow rate is shown in FIG. FIG. 9A shows the start of resin supply, FIG. 9B shows a state where the resin filling into the upstream cavity 54A is completed, and FIG. 9C shows a state where the resin filling into the intermediate cavity 54B is completed. (D) has shown the state which resin filling to 54 C of downstream cavities was completed. In the figure, the flow rate ratio (0.25 × ΔW / Δt, 0.33 × ΔW / Δt, 0.5 × ΔW / Δt, ΔW / Δt) passing through each gate portion is shown.

  As a countermeasure, a mold having a structure having a resin reservoir chamber for storing molten resin together with a cavity 54 connected via a gate passage portion 55 and a flow rate limiting gate for partitioning the runner and the resin reservoir chamber is used for the runner 53. It has been known.

  The resin flowing through the runner is temporarily blocked by the flow restricting gate, and as the resin is supplied, the resin is gradually filled into the resin reservoir chamber through the gap portion of the flow restricting gate.

  In this way, the resin filling pressure (also the injection pressure) applied to the cavity at the most downstream side of the runner escapes to the resin reservoir chamber through the gap portion of the flow restriction gate, so that the pressure rise in the cavity on the lead frame 61 side is increased. In other words, the jetting phenomenon is suppressed, and the occurrence of defects due to resin sealing such as generation of voids and wire deformation has been reduced.

In addition, even if there are changes in the resin type, molding conditions, wire bonding pattern, etc., as a versatile mold structure that can prevent the occurrence of defects due to resin sealing due to voids or wire deformation, the flow restriction gate There has been proposed a mold structure provided with a mechanism capable of adjusting the opening degree and a mechanism capable of adjusting the volume (capacity) of the resin reservoir (for example, see Patent Document 1). In this mold structure, a cavity is formed immediately next to the runner, that is, the cavity is connected to the runner via the gate passage portion, and the molten resin flows into the cavity. Regardless, the adjustment mechanism on the resin reservoir chamber side is used to cope with changes in molding conditions or bonding patterns.
JP-A-5-343455

  According to the above-mentioned conventional mold for resin sealing, when there is a change in the type of resin, molding conditions, wire bonding pattern, etc., the opening degree of the flow restriction gate and the capacity of the resin reservoir chamber should be adjusted. Therefore, when performing these adjustments, it is necessary to open the mold, that is, it is necessary to perform the adjustment with the mold removed from the sealing device. When working, etc., it is necessary to open and adjust the mold many times, and the adjustment work is very troublesome.

  Therefore, the present invention has been made in view of such a problem, and even when there is a change in the type of resin, molding conditions, or the bonding pattern of the wire, the gold portion is not required to be adjusted. An object of the present invention is to provide a resin sealing mold for a semiconductor device and a resin sealing method capable of resin sealing without generating voids or wire deformation continuously from the beginning of mold manufacture.

In order to solve the above problems, a resin sealing mold of a semiconductor device according to claim 1 of the present invention includes a pot filled with a molten resin, a plurality of cavities in which semiconductor chips are disposed, and a molten resin. And a resin supply passage for guiding the molten resin from the pot to the cavities and the resin reservoir chamber, and a semiconductor chip is mounted on the upper mold and the lower mold. A mold for resin sealing for sandwiching a chip mounted member and performing resin sealing of a semiconductor chip,
A main supply passage portion extending from the pot to a position corresponding to each cavity, and a sub-supply passage portion connecting the main supply passage portion and each cavity and having a cross-sectional area sequentially reduced; The main supply passage portion and the resin reservoir chamber are connected to each other, and the reservoir side supply passage portion whose cross-sectional area is sequentially reduced,
Further, the length of the reservoir side supply passage portion is made longer than that of the sub supply passage portion, and the cross-sectional shapes of the two supply passage portions are the same or substantially the same,
In addition, the volume of the resin reservoir is set to be equal to or greater than the volume of each cavity.

The resin sealing mold of the semiconductor device according to claim 2 is the resin sealing mold according to claim 1,
The first gate portion, which is a connection location to the cavity of the sub supply passage portion, and the second gate portion, which is a connection location to the resin reservoir chamber, of the reservoir side supply passage portion are formed of the same material, and the same surface treatment is performed. It is what I do.

The resin sealing mold of the semiconductor device according to claim 3 is the resin sealing mold according to claim 1,
The first gate part, which is a connection part to the cavity of the sub supply passage part, and the second gate part, which is a connection part to the resin reservoir chamber of the reservoir side supply passage part, are configured to be exchangeable with respect to the mold. is there.

The resin sealing mold of the semiconductor device according to claim 4 is the resin sealing mold according to claim 1,
The resin supply passage and the resin reservoir chamber are formed together in a lower mold or an upper mold, and the resin reservoir chamber is disposed in a region corresponding to the chip mounting member.

Further, the resin sealing mold of the semiconductor device according to claim 5 is the resin sealing mold according to claim 4,
In the position corresponding to one resin reservoir chamber formed in the lower mold or the upper mold, the other resin reservoir chamber is formed in the upper mold or the lower mold,
At the time of resin sealing, the molten resin that has flowed into one resin reservoir chamber is caused to flow into the other resin reservoir chamber through a through-hole formed in the chip mounting member.

Moreover, the resin sealing mold of the semiconductor device according to claim 6 is the resin sealing mold according to claim 5,
While extending the other resin reservoir chamber to a position corresponding to the resin supply passage,
The extended portion corresponding to the resin supply passage is shielded from the resin supply passage by the chip mounting member during resin sealing.

Further, the resin sealing mold of the semiconductor device according to claim 7 is the resin sealing mold according to claim 6,
A chip mounting member in which a plurality of through grooves are formed along the peripheral portion of the resin reservoir chamber and the resin supply passage formed in the upper and lower molds is used.

The resin sealing mold of the semiconductor device according to claim 8 is the resin sealing mold according to claim 1,
The resin supply passage and the resin reservoir chamber are formed together in the lower mold or the upper mold, and the resin reservoir chamber is disposed outside the region corresponding to the chip mounting member.

The resin sealing mold of the semiconductor device according to claim 9 is the resin sealing mold according to claim 1,
In the position corresponding to one resin reservoir chamber formed in the lower mold or the upper mold, the other resin reservoir chamber is formed in the upper mold or the lower mold,
Both of these resin reservoir chambers are arranged outside the area of the chip mounted member.

Further, a resin sealing method of a semiconductor device according to claim 10 is:
Preparing a resin-sealing mold according to any one of claims 1 to 6, claim 8, and claim 9,
Preparing a chip mounting member on which a semiconductor chip is mounted;
After the chip mounting member is clamped by the upper mold and the lower mold, the pot is filled with the molten resin, and the molten resin is supplied to the cavity through the main supply passage section and the sub supply passage section. Supplying the molten resin to the resin reservoir through the supply passage and the reservoir-side supply passage;
The step of taking out the chip mounting member together with the resin molding portion that is cured by opening both molds;
Removing the remaining resin portion cured in each of the supply passage portions and the resin reservoir chamber from the taken chip mounting member.

Furthermore, a resin sealing method of a semiconductor device according to claim 11 is provided.
Preparing a resin sealing mold according to claim 7;
Preparing a chip mounting member on which a semiconductor chip is mounted;
After the chip mounting member is clamped by the upper mold and the lower mold, the pot is filled with the molten resin, and the molten resin is supplied to the cavity through the main supply passage section and the sub supply passage section. Supplying the molten resin to the resin reservoir through the supply passage and the reservoir-side supply passage;
The step of taking out the chip mounting member together with the resin molding portion that is cured by opening both molds;
And a step of removing the remaining resin portion cured in each supply passage portion and the resin reservoir chamber from the chip mounted member by cutting along the portion corresponding to the through groove of the chip mounted member taken out. It is.

  According to the resin sealing mold and the resin sealing method, the sub supply passage portion connecting the main supply passage portion and the cavity, and the reservoir side supply passage portion connecting the main supply passage portion and the resin reservoir chamber are provided. The cross-sectional shape is the same or substantially the same, or the gate portions provided in both supply passage portions are made of the same material and are subjected to the same surface treatment. When supplied to the cavity, the resin reservoir is filled under the same conditions as the filling of the cavity, so there is no need to adjust the filling conditions of the resin reservoir with respect to the cavity. Even if there is a change in conditions and wire bonding pattern, or when the opening of the gate part wears out by continuing the resin molding operation, for example Since there is no change installation effect of the resin reservoir for the cavity, it is possible to perform continuous resin sealing without causing such voids generation and wire deformation.

  Furthermore, by providing the resin reservoir chambers in the upper and lower molds, the capacity of the chip mounting member can be increased without changing the size of the chip mounting member, and therefore various sizes without increasing the cost. It can correspond to a semiconductor chip.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[Embodiment 1]
Hereinafter, a resin sealing mold and a resin sealing method for a semiconductor device according to Embodiment 1 of the present invention will be described with reference to FIGS. 1 to 3 (corresponding to claims 1 to 4).

  1 is a perspective view of a lower mold in the resin sealing mold according to the first embodiment, FIG. 2 is a diagram for explaining a resin sealing state by the mold, and FIG. 3 is a resin seal according to the first embodiment. It is a top view explaining the stopping method.

As shown in FIG. 1, the resin sealing mold includes a lower mold 1 and an upper mold (shown in FIG. 2) 2.
The lower mold 1 is formed with a plurality of, for example, 3 × 2 rows of cavities (also referred to as “dents” or “concave portions”) 11 in which semiconductor chips are arranged, and at positions corresponding to these rows. The resin reservoir chambers 12 are formed one by one, and the pots 13 are formed one by one at a position corresponding to each row of the cavities 11 and filled with a molding material, that is, a molten resin material (hereinafter referred to as a molten resin). ing.

  Further, the lower mold 1 includes a resin supply passage (also referred to as a resin supply passage) 14 between the pot 13 in each row and the three cavities 11 and the resin reservoir chamber 12 corresponding thereto. Each is formed.

  The lower mold 1 includes, as described above, one pot 13 for each row, three cavities 11 corresponding to the pots 13, and one resin corresponding to the cavities 11. The reservoir chamber 12 and the resin supply passage 14 that connects them are arranged, and in the following, when describing them in detail, the configuration for each column is the same, so the description will focus on one column. Shall.

  That is, the lower mold 1 has a resin supply passage 14 formed in parallel with the three cavities 11 connected to the pot 13 and arranged in a row, and the resin supply passage 14 is opposite to the pot 13. A resin reservoir 12 is formed at the end on the side. Hereinafter, the three cavities 11 arranged in a row are referred to as an upstream cavity 11A, an intermediate cavity 11B, and a downstream cavity 11C from the pot 13 side toward the resin reservoir chamber 12, and the resin supply passage 14 Also, the pot 13 side is referred to as the upstream side, and the resin reservoir chamber 12 side is referred to as the downstream side.

  The resin supply passage 14 includes a main supply passage portion (also referred to as a runner) 15 disposed between the pot 13 and the resin reservoir chamber 12 and in parallel with the cavities 11, and the main supply passage portion 15 and the cavities 11. And three sub-supply passage portions (also referred to as gate passage portions) 16 (16A, 16B, 16C), and one reservoir-side supply passage portion that similarly connects the main supply passage portion 15 and the resin reservoir chamber 12. 17.

  Each of the main supply passage portions 15 is formed to have a predetermined cross-sectional shape over substantially the entire length, while each of the sub supply passage portions 16 and the reservoir side supply passage portions 17 has a main supply passage portion. The cavity 11 side is tapered rather than the 15 side so that the cross-sectional area (opening area) is gradually narrowed (both in the width direction and the height direction). A first gate portion (which is a throttle portion) 21 for restricting the amount of resin inflow is also provided at the connection location to the cavity 11, and at the connection location to the resin reservoir chamber 12 of the reservoir-side supply passage portion 17. Is provided with a second gate portion (which is a throttle portion) 22 for restricting the amount of inflow of the resin.

  Then, the length of each of the sub supply passage portions 16, particularly the length of the sub supply passage portion 16 C connected to the downstream cavity 11 C, is longer than the length of the reservoir side supply passage portion 17 connected to the resin reservoir chamber 12. Has been long.

  In addition, the sub-feed passage portions 16 and the reservoir-side supply passage portions 17 have the same (or substantially the same) cross-sectional shape and cross-sectional dimensions, and an opening angle (throttle angle) in both the supply passage portions 16 and 17. And also the intersection angle between both wall surfaces). Therefore, the shapes and constituent materials of the gate portions 21 and 22 are the same (or substantially the same).

  Further, the gate parts 21 and 22 are provided so as to be replaceable (detachable) from the lower mold 1 by using gate pieces. Of course, for each of these gate pieces, a super hard material or the like made of the same material and having excellent wear resistance is used. In addition, when each gate part is integrally formed in a metal mold | die without using a gate piece, naturally, it will be comprised with the material same as a metal mold | die, and also about each gate part 21 and 22 at least. Are subjected to the same surface treatment (for example, hard chrome treatment). For this reason, the inflow state of the molten resin into the cavity 11 and the resin reservoir 12 is the same (or substantially the same), and the influence of the degree of wear on the gate portions 21 and 22 is the same (or substantially the same). .

  That is, even when there is a change in the resin forming conditions or bonding pattern, the influence of the molten resin inflow conditions and the degree of wear in both gate parts 21 and 22 are the same (or substantially the same). In accordance with the first gate portion, and it is not necessary to adjust the cross-sectional shape, in other words, as in the prior art, the opening area between the cavity-side gate portion and the resin reservoir chamber-side gate portion at least having a different cross-sectional shape, and There is no need to adjust the volume (capacity) of the resin reservoir.

Further, the volume of the resin reservoir 12 is set to be equal to or greater than (equal to or greater than) the volume of each cavity 11A, 11B, 11C.
In addition, in the resin sealing mold in a package such as QFP, a cavity (not shown) is formed at a position corresponding to the cavity of the lower mold for the upper mold, and the semiconductor chip is arranged by the upper and lower cavities. One cavity to be formed is formed. In addition, in molds for resin sealing in packages such as QFN (quad flat non-ready package) using a similar lead frame and BGA (ball grid array) using a resin wiring substrate, May be formed on only one of the upper and lower molds.

  Further, the reservoir-side supply passage portion 17, the second gate portion 22, and the resin reservoir chamber 12 formed in the same lower mold 1 as the main supply passage portion 15, the sub-supply passage portion 16 and the first gate portion 21 are formed by a mold. The lead frame is disposed in a region of a lead frame (described later).

Next, a resin sealing method of a semiconductor device using the resin sealing mold will be described in a process format based on FIGS.
FIG. 2 is a plan view of the lead frame after resin sealing, and FIG. 3 is a plan view for explaining the inflow state of the molten resin. Note that FIG. 2 mainly shows a resin portion integrated with a lead frame that has been sealed with resin, but components on the mold side are indicated by virtual lines.

  That is, this resin sealing method includes a step of preparing the resin sealing mold, a lead frame having a die pad 32 and an inner lead 33 on which a semiconductor chip 31 is mounted at a position corresponding to the cavities 11A, 11B, and 11C. (An example of a chip mounting member, which may be a resin wiring board, for example) 34, and the lead frame 34 is clamped by the upper mold 2 and the lower mold 1, and the main supply passage from the pot 13 The molten resin is supplied (filled) to each cavity 11 via the portion 15 and the auxiliary supply passage portion 16, and the molten resin is supplied to the resin reservoir chamber 12 via the main supply passage portion 15 and the reservoir-side supply passage portion 17 ( Filling), curing the supplied molten resin, opening the resin sealing mold, and taking out the lead frame 34 together with the cured resin molded portion. Step and Step of Removing Unnecessary Resin Resin S2 Cured in Supply Channels 15-17 and Resin Reserving Chamber 12 from Removed Lead Frame 34 Using a Removal Device (for example, Ejector Pin) It consists of and. The portion where the semiconductor chip is sealed is referred to as a sealing resin portion S1. That is, the resin molding part is composed of a sealing resin part S1 and a residual resin part S2.

Here, the process of filling the molten resin will be described in detail.
When the molten resin is supplied from the pot 13 to the main supply passage portion 15, first, the molten resin starts to be filled from the upstream cavity 11 </ b> A, and as the molten resin flows toward the downstream end portion of the main supply passage portion 15, the upstream side The molten resin is sequentially filled (supplied) from the cavity 11A to the downstream cavity 11C, and the molten resin is sequentially filled (supplied) from the upstream cavity 11A toward the downstream cavity 11C.

  At this time, the flow rate of the molten resin flowing into the downstream cavity 11C increases as the upstream cavity 11A is filled, but the first of the cavity 11C is further away from the downstream cavity 11C (distant position). Since the resin reservoir chamber 12 to which the second gate portion 22 having substantially the same configuration as the gate portion 21 is connected is formed, at least until the molten resin is filled in the downstream cavity 11C, the resin reservoir chamber 12 is filled. Filling with molten resin will continue.

  As shown in FIG. 3, when the flow resistance of the resin is ignored and the amount of resin flowing into the main supply passage 15 from the pot 13 is ΔW / Δt, the resin to the upstream cavity 11A and the intermediate cavity 11B The amount of the resin flowing into the downstream cavity 11C at the time when the filling of the resin is completed is divided into two by the resin flowing into the resin reservoir chamber 12, and thus becomes 0.5ΔW / Δt. Incidentally, when the resin reservoir 12 is not provided, ΔW / Δt is obtained (see FIG. 9C).

  As a result, also in the downstream cavity 11C, a sudden pressure increase called a jetting phenomenon is alleviated, and the occurrence of defects due to resin sealing such as generation of voids and wire deformation is suppressed.

  In addition, since the sub-supply passage portion 16 and the reservoir-side supply passage portion 17 have the same shape, the same size, the same material, and the same surface treatment, in particular, the gate portions 21 and 22 are both gate portions. 21 and 22 wear out in the same manner, and therefore, even when the sealing operation is continued for a long time, after the resin filling into the downstream cavity 11C is completed, the resin filling into the resin reservoir chamber 12 is completed. Therefore, the resin can be reliably filled in all the cavities 11.

  In the step of removing the unnecessary residual resin portion, the residual resin portion of the resin reservoir chamber 12 is formed on one side of the lead frame 34 together with the residual resin portion of the main supply passage portion 15, so that the conventional main supply is performed. The residual resin portion in the resin reservoir chamber 12 can be removed together by using a method similar to that for removing the passage portion 15.

  As a removing method using the removing device, for example, the resin removal is previously performed at the position of the lead frame 34 corresponding to the main supply passage portion 15, the sub supply passage portion 16, the reservoir side supply passage portion 17, and the resin reservoir chamber 12. After the resin through-hole 35 is formed and the resin sealing is finished, each remaining resin portion can be removed by protruding an ejector pin provided in the removing device from the through-hole 35.

  According to the resin sealing mold and the resin sealing method described above, the sub supply passage portion that connects the main supply passage portion and the cavity, and the reservoir side supply passage portion that connects the main supply passage portion and the resin reservoir chamber, In the cross-sectional shape thereof (and substantially the same), the length of the reservoir side supply passage portion is made longer than the length of the sub supply passage portion, and further provided in both supply passage portions. The gate part has the same shape and the same material (or the same shape and the same material and the same surface treatment), so when the molten resin is supplied to each cavity, the resin reservoir chamber is the same as filling the cavity. It is not necessary to adjust the filling condition of the resin reservoir chamber for the cavity, so change the resin type, molding condition, wire bonding pattern, etc. If there is or if the resin molding operation is continued, for example, even if the opening of the gate portion wears, the effect of installing the resin reservoir with respect to the cavity will not change, causing voids and wire deformation. Resin sealing can be performed continuously without any problems.

  In addition, by configuring the gate part to be removable from the mold, when the gate part is worn, the mold can be easily repaired by replacement. In addition, by configuring the gate portion with a material having excellent wear resistance such as a super hard material, the life of the mold can be further extended.

By the way, in Embodiment 1 described above, each gate portion has been described as being removable. However, as described above, it can also be formed integrally with a mold.
[Embodiment 2]
Hereinafter, a resin sealing mold and a resin sealing method for a semiconductor device according to Embodiment 2 of the present invention will be described with reference to FIG. 4 (corresponding to claim 5).

  FIG. 4 is a diagram for explaining a resin sealing state according to the second embodiment of the present invention, and mainly shows a resin portion integrated with a lead frame subjected to resin sealing. The component on the side is indicated by a virtual line.

  The difference between the second embodiment and the first embodiment described above is the resin reservoir chamber. Therefore, in the second embodiment, the description will be given focusing on this portion, and the embodiment will be described. Constituent members that are the same as in Embodiment 1 are assigned the same member numbers, and descriptions thereof are omitted.

  That is, as shown in FIG. 4, the mold for resin sealing according to the second embodiment is placed in a resin reservoir chamber (hereinafter referred to as a first resin reservoir chamber) 12 (12A) provided in the lower mold 1. A second resin reservoir chamber 12 (12B) is formed in an upper mold (a mold in which no resin supply passage is formed) 2 at a corresponding position.

  In the lead frame 34 held between the lower mold 1 and the upper mold 2, a through hole 34a is formed at a position corresponding to the first resin reservoir chamber 12A. The molten resin that has flowed into the first resin reservoir chamber 12A from the passage portion 15 via the reservoir supply passage portion 17 flows into the second resin reservoir chamber 12B through the through hole 34a.

  The resin sealing method using the resin sealing mold is the same as that in the first embodiment, and thus the description thereof is omitted. Of course, the molten resin flowing into the first resin reservoir chamber 12A flows into the second resin reservoir chamber 12B through the through hole 34a of the lead frame 34.

According to this configuration, in addition to the effects described in the first embodiment, the following effects are obtained.
That is, since the volume (capacity) of the resin reservoir chamber 12 can be increased as compared with the configuration of the first embodiment, the lead frame can be used even when the semiconductor device having the cavity 11 having a large volume is sealed with resin. Without enlarging (widening) 34, it is possible to suppress the occurrence of defective resin sealing due to voids or wire deformation. In other words, in the case of a mold in which the resin reservoir chamber is arranged in the lead frame region, it is inevitably necessary to increase the volume only by the resin reservoir chamber formed in one of the lower mold and the upper mold. Although the lead frame is also large, the configuration of the second embodiment does not require a large lead frame, which can reduce the cost.

Further, by forming the through hole 34a larger than the first resin reservoir chamber 12A and the second resin reservoir chamber 12B, the method for removing the residual resin portion described in the first embodiment can be used. .
[Embodiment 3]
Hereinafter, a resin sealing mold and a resin sealing method for a semiconductor device according to Embodiment 3 of the present invention will be described with reference to FIG. 5 (corresponding to claims 6 and 7).

  FIG. 5 is a diagram for explaining a resin sealing state according to the third embodiment of the present invention, and mainly shows a resin portion integrated with a lead frame subjected to resin sealing. The component on the side is indicated by a virtual line.

  Note that the difference between the third embodiment and the second embodiment described above is the arrangement state of the resin reservoir chambers. For this reason, in the third embodiment, the description will be given focusing on this portion, and the above description will be given. The same constituent members as those described in each embodiment are given the same member numbers, and the description thereof is omitted.

  That is, as shown in FIG. 5, the resin sealing mold according to the third embodiment is placed in a resin reservoir chamber (hereinafter referred to as a first resin reservoir chamber) 12 (12A) provided in the lower mold 1. A second resin reservoir chamber 12 (12B) is formed in the corresponding upper mold (a mold in which no resin supply passage is formed) 2 and the second resin reservoir chamber 12A is connected to the main supply passage portion 15. To the position corresponding to (precisely, to the position immediately downstream of the connecting portion of the auxiliary supply passage portion 16 connected to the upstream cavity 11A).

  In the lead frame 34 sandwiched between the lower mold 1 and the upper mold 2, a through hole 34a is formed at a position corresponding to the first resin reservoir 12A, and on the upstream side of the through hole 34a. The first resin reservoir chamber 12A and the second resin reservoir chamber 12B are shielded from each other by the lead frame 34.

  Therefore, as in the second embodiment, when the molten resin is filled, the molten resin flowing from the main supply passage portion 15 through the reservoir side supply passage portion 17 into the first resin reservoir chamber 12A passes through the through hole 34a. 2 It flows into the resin reservoir chamber 12B.

  Further, in the lead frame 34, a through groove 34b having a predetermined length corresponding to the periphery of the main resin supply passage portion 15, the reservoir supply passage portion 17, and the residual resin portion S2 of the resin reservoir chamber 12 (12A, 12B). Are formed.

  This can be removed by the ejector pin through the through hole 34a when the main supply passage and the resin reservoir are formed only in the lower mold as in the above-described embodiments. If there is a residual resin portion above and below the lead frame 34, removal with an ejector pin cannot be performed, so a through groove 34b is formed around the residual resin portion S2 in the lead frame 34, so-called a cut. A part along the through groove 34b is cut later by a cutting device. Thus, by forming the through groove 34b, it can be easily removed with a slight cutting force.

  The resin sealing method using the resin sealing mold is the same as that in the first embodiment, and thus the description thereof is omitted. Of course, the molten resin flowing into the first resin reservoir chamber 12A flows into the second resin reservoir chamber 12B through the through hole 34a of the lead frame 34.

According to this configuration, in addition to the effects described in the second embodiment, the following effects are obtained.
That is, since the volume of the resin reservoir chamber 12 is increased as compared with the configuration of the second embodiment, the lead frame 34 is increased even when the resin sealing of the semiconductor device having the cavity 11 having a larger volume is performed. Therefore, it is possible to suppress the occurrence of defective resin sealing due to voids or wire deformation. For example, the size of the cavity is small, from 1.0 mm × 1.0 mm × 1.0 mm or less to the largest one is about 40.0 mm × 40.0 mm × 4.0 mm, especially When the cavity volume is large, the configuration of the third embodiment is effective.

Further, since the lead frame 34 is formed with through grooves 34b at a plurality of locations corresponding to the periphery of the main resin supply passage portion 15, the reservoir-side supply passage portion 17 and the residual resin portions of the resin reservoir chambers 12A and 12B, The resin portion can be easily removed with a slight cutting force along the through groove 34b by the cutting device.
[Embodiment 4]
Hereinafter, a resin sealing mold and a resin sealing method for a semiconductor device according to Embodiment 4 of the present invention will be described with reference to FIG. 6 (corresponding to claim 8).

  FIG. 6 is a diagram for explaining a resin sealing state according to the fourth embodiment of the present invention, and mainly shows a resin portion integrated with a lead frame subjected to resin sealing. The component on the side is indicated by a virtual line.

  Note that the difference between the fourth embodiment and the first embodiment described above is the arrangement state of the resin reservoir chambers. For this reason, in the fourth embodiment, the description will be given focusing on this portion, and the above description will be given. The same constituent members as those described in the first embodiment are given the same member numbers, and the description thereof is omitted.

That is, as shown in FIG. 6, the resin sealing mold according to the fourth embodiment has the resin reservoir chamber 12 formed in the lower mold 1 arranged outside the region of the lead frame 34. .
More specifically, the resin reservoir chamber 12 connected to the downstream end portion of the reservoir-side supply passage portion 17 is straightly extended outside the area of the lead frame 34 and then bent 90 degrees. That is, the first resin reservoir chamber 12 </ b> A on the upstream side connected to the main supply passage portion 15 and the second resin reservoir chamber 12 </ b> B on the downstream side parallel to the side edge portion of the lead frame 34 are configured.

The resin sealing method using the resin sealing mold is the same as that in the first embodiment, and thus the description thereof is omitted.
According to this configuration, since most of the resin reservoir chamber 12 is disposed outside the lead frame 34 compared to the first embodiment, the volume of the resin reservoir chamber 12 can be increased without increasing the lead frame 34. Therefore, even when performing resin sealing of a semiconductor device having a cavity 11 having a large volume and a short side, resin sealing failure due to voids or wire deformation without enlarging the lead frame 34 Can be suppressed.
[Embodiment 5]
Hereinafter, a resin sealing mold and a resin sealing method for a semiconductor device according to Embodiment 5 of the present invention will be described with reference to FIG. 7 (corresponding to claim 9).

  FIG. 7 is a view for explaining a resin sealing state according to the fifth embodiment of the present invention, and mainly shows a resin portion integrated with a lead frame subjected to resin sealing. The component on the side is indicated by a virtual line.

  Note that the difference between the fifth embodiment and the fourth embodiment described above is the resin reservoir chamber. Therefore, in the fifth embodiment, the description will be given focusing on this portion, and each of the above-described embodiments will be described. Constituent members that are the same as those described in the above embodiment are given the same member numbers, and descriptions thereof are omitted.

  That is, as shown in FIG. 7, the mold for resin sealing according to the fifth embodiment is the downstream second resin reservoir chamber 12 (12B) provided in the lower mold 1 described in the fourth embodiment. ) In the upper mold (resin supply passage, i.e., a mold in which each supply passage section is not formed) 2 at the position corresponding to), the downstream upper portion is symmetrical with the second resin reservoir chamber 12B on the downstream side. The third resin reservoir chamber 12 (12C) is formed.

The resin sealing method using the resin sealing mold is the same as that in the first embodiment, and thus the description thereof is omitted.
According to this configuration, the resin sealing of the semiconductor device having the cavity 11 having a larger volume than that of the fourth embodiment has a resin sealing failure due to void or wire deformation without increasing the lead frame 34. Occurrence can be suppressed.

  According to the present invention, it is possible to stably produce a resin-encapsulated semiconductor integrated circuit device such as a quad flat package with high quality and low cost by using a highly integrated and high-density semiconductor chip. it can.

It is a perspective view of the lower metal mold | die in the metal mold | die for resin sealing which concerns on Embodiment 1 of this invention. It is a figure which shows the resin sealing state by the metal mold | die, (a) is a top view of a lead frame, (b) is AA 'sectional drawing of (a). It is a top view explaining the resin sealing method which concerns on the same Embodiment 1. FIG. 5A and 5B are diagrams showing a resin sealing state according to the second embodiment, where FIG. 5A is a plan view of a lead frame, and FIG. 5B is a cross-sectional view taken along line BB ′ of FIG. It is a figure which shows the resin sealing state which concerns on the same Embodiment 3, (a) is a top view of a lead frame, (b) is CC 'sectional drawing of (a). It is a figure which shows the resin sealing state which concerns on the same Embodiment 4, (a) is a top view of a lead frame, (b) is DD 'sectional drawing of (a). It is a figure which shows the resin sealing state which concerns on the same Embodiment 5, (a) is a top view of a lead frame, (b) is EE 'sectional drawing of (a). It is a figure which shows the resin sealing state of the conventional QFP type | mold semiconductor device, (a) is a top view of a lead frame, (b) is FF 'sectional drawing of (a). It is a top view which shows the flow rate ratio of the molten resin of the conventional QFP type | mold semiconductor device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Lower mold 2 Upper mold 11 Cavity 12 Resin reservoir chamber 12A First resin reservoir chamber 12B Second resin reservoir chamber 12C Third resin reservoir chamber 13 Pot 14 Resin supply passage 15 Main supply passage portion 16 Sub supply passage portion 17 Side supply passage portion 21 First gate portion 22 Second gate portion 31 Semiconductor chip 34 Lead frame 34a Through hole 34b Through groove

Claims (11)

A pot filled with molten resin, a plurality of cavities in which semiconductor chips are arranged, a resin reservoir chamber for storing molten resin, and for guiding the molten resin from the pot to the cavities and the resin reservoir chamber And a resin sealing die for sealing the semiconductor chip by sandwiching a chip mounting member on which the semiconductor chip is mounted between the upper die and the lower die. There,
A main supply passage portion extending from the pot to a position corresponding to each cavity, and a sub-supply passage portion connecting the main supply passage portion and each cavity and having a cross-sectional area sequentially reduced; The main supply passage portion and the resin reservoir chamber are connected to each other, and the reservoir side supply passage portion whose cross-sectional area is sequentially reduced,
Further, the length of the reservoir side supply passage portion is made longer than that of the sub supply passage portion, and the cross-sectional shapes of the two supply passage portions are the same or substantially the same,
A resin sealing mold for a semiconductor device, wherein the volume of the resin reservoir chamber is equal to or greater than the volume of each cavity.   The first gate portion, which is a connection location to the cavity of the sub supply passage portion, and the second gate portion, which is a connection location to the resin reservoir chamber, of the reservoir side supply passage portion are formed of the same material, and the same surface treatment is performed. The mold for resin sealing of a semiconductor device according to claim 1, wherein the mold is used.   The first gate portion that is a connection location to the cavity of the sub supply passage portion and the second gate portion that is a connection location to the resin reservoir chamber of the reservoir side supply passage portion are configured to be replaceable with respect to the mold. The mold for resin sealing of a semiconductor device according to claim 1, wherein   2. The resin supply passage and the resin reservoir chamber are formed together in a lower mold or an upper mold, and the resin reservoir chamber is disposed in a region corresponding to a chip mounting member. Mold for resin sealing of semiconductor devices. In the position corresponding to one resin reservoir chamber formed in the lower mold or the upper mold, the other resin reservoir chamber is formed in the upper mold or the lower mold,
The molten resin that has flowed into one resin reservoir chamber is allowed to flow into the other resin reservoir chamber through a through hole formed in the chip mounting member during resin sealing. A mold for resin sealing of the semiconductor device described. While extending the other resin reservoir chamber to a position corresponding to the resin supply passage,
6. The semiconductor device according to claim 5, wherein the extended portion corresponding to the resin supply passage is shielded by a chip mounting member with respect to the resin supply passage at the time of resin sealing. Resin sealing mold.   7. The semiconductor according to claim 6, wherein a chip mounting member in which a plurality of through grooves are formed along a peripheral portion of the resin reservoir chamber and the resin supply passage formed in the upper and lower molds is used. Mold for resin sealing of equipment.   2. The resin supply passage and the resin reservoir chamber are formed together in a lower mold or an upper mold, and the resin reservoir chamber is disposed outside an area corresponding to a chip mounting member. Mold for resin sealing of semiconductor devices. In the position corresponding to one resin reservoir chamber formed in the lower mold or the upper mold, the other resin reservoir chamber is formed in the upper mold or the lower mold,
2. The mold for resin sealing of a semiconductor device according to claim 1, wherein both the resin reservoir chambers are arranged outside the area of the chip mounting member. Preparing a resin sealing mold according to any one of claims 1 to 6, claim 8 and claim 9,
Preparing a chip mounting member on which a semiconductor chip is mounted;
After the chip mounting member is clamped by the upper mold and the lower mold, the pot is filled with the molten resin, and the molten resin is supplied to the cavity through the main supply passage section and the sub supply passage section. Supplying the molten resin to the resin reservoir through the supply passage and the reservoir-side supply passage;
The step of taking out the chip mounting member together with the resin molding portion that is cured by opening both molds;
And a step of removing the remaining resin portion cured in each of the supply passage portions and the resin reservoir chamber from the taken chip mounting member. Preparing a resin sealing mold according to claim 7;
Preparing a chip mounting member on which a semiconductor chip is mounted;
After the chip mounting member is clamped by the upper mold and the lower mold, the pot is filled with the molten resin, and the molten resin is supplied to the cavity through the main supply passage section and the sub supply passage section. Supplying the molten resin to the resin reservoir through the supply passage and the reservoir-side supply passage;
The step of taking out the chip mounting member together with the resin molding portion that is cured by opening both molds;
A step of removing the remaining resin portion cured in each supply passage portion and the resin reservoir chamber from the chip mounted member by cutting along a portion corresponding to the through groove of the chip mounted member taken out. A resin sealing method for a semiconductor device.

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