JP5281797B2 - Resin-sealed semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin packaged semiconductor device which can control flowing of resin during molding without prolonging a development period or increasing initial cost even if the composition of mold content is changed and can ensure the quality of mold resin. <P>SOLUTION: The resin packaged semiconductor device 10 includes a lead frame 11 and a circuit board 12 arranged on the lead frame 11, and the lead frame 11 and the circuit board 12 are made integral and are packaged with resin. An opening 34 is made at the specified position in the lead frame 11. The circuit board 12 is formed of a resin substrate, and a through-hole 36 is formed at a position where it can be communicated with the opening 34 and a fluid resin for packaging can pass therethrough. Since the circuit board 12 is formed of a resin substrate, the through-hole 36 or the like can be easily formed. Therefore, flowing of resin can be changed during molding only by adjusting the dimension of the through-hole or the opening. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a resin-encapsulated semiconductor device, and in particular, a resin-encapsulated semiconductor in which a semiconductor element and a mounted member are molded and integrated with a mold resin in a state where the semiconductor element is mounted on the mounted member. Relates to the device.

  For example, as a motor controller for an automobile, there is a resin-encapsulated semiconductor device in which a semiconductor element for control is sealed with a mold resin. In this resin-encapsulated semiconductor device, since the entire package is generally thick, resin flow unbalance, air traps, etc. occur during molding, which may lead to deterioration of the quality of the mold resin. is there. The mold for molding a resin-encapsulated semiconductor device should be simple in terms of cost, and from the viewpoint of standardization, the mold contents (for example, semiconductor elements) should be increased. It is desirable that the molds have the same shape.

  On the other hand, in order to ensure the quality of the mold resin, it is important to fill the resin uniformly without causing voids or air traps in the resin during molding. It is known that this resin filling is greatly affected by the overall speed balance of the resin flow during the injection process.

  However, if the configuration of the mold (for example, a semiconductor element) changes, the resin flow changes, and the mold resin needs to be in an optimal shape in order to make the resin flow rate uniform. For this reason, variations in the shape of the mold resin tended to increase. In addition, simulation may be performed on the resin flow, but the actual resin flow does not always match the simulation results, and it is necessary to fine-tune the actual mold and perform additional machining, often extending the development period and initials. There were problems such as an increase in cost.

  In this type of resin-encapsulated semiconductor device, for example, Japanese Patent Application Laid-Open No. H10-228867 is one that controls the flow of resin during molding.

In the example described in Patent Document 1, the resin flow is controlled by processing through holes in the lead frame. However, when a ceramic substrate is disposed on the lead frame as a substrate, it is difficult to form a control structure (through hole) for controlling the resin flow on the substrate whose shape is difficult to process. As a result, the place where the control structure is provided is limited, and the control structure can be provided only on the lead frame around the substrate. For this reason, there exists a difficulty that this control structure cannot be provided in the appropriate place which suppresses generation | occurrence | production of a void. Even if the lead frame shape is changed to suppress the generation of voids, it is necessary to make fine adjustments and additional machining of the mold for molding the lead frame, extending the development period and increasing the initial cost. There are difficulties such as inviting.
JP 2003-258184 A

  The present invention has been made in view of the above problems, and its purpose is to extend the development period and increase the initial cost even when the configuration of the mold contents (for example, semiconductor elements) is changed. An object of the present invention is to provide a resin-encapsulated semiconductor device capable of ensuring the quality of a mold resin by controlling the flow of resin during molding without incurring.

The invention according to claim 1 includes a lead frame and a substrate disposed on the lead frame and having at least one semiconductor element disposed on a mounting surface side, and the lead frame and the substrate are integrated. A resin-encapsulated semiconductor device sealed with resin in a state where
An opening formed in an elongated shape along the width direction of the lead frame is provided at a predetermined position of the lead frame, the substrate is made of a resin substrate, and the opening is formed at a predetermined position of the resin substrate. And a through-hole formed in an elongated shape along the width direction of the resin substrate and excluding both ends of the resin substrate. The frame is integrally formed with a resin flow state control member that extends through the through hole and extends toward the mounting surface.

  According to the first aspect of the present invention, the substrate disposed on the lead frame is not a ceramic substrate but a resin substrate. Therefore, molding of a through hole or the like can be easily performed. For example, the through hole can be formed simply by masking and etching the resin substrate. By performing such easy processing and adjusting the flow rate of the flowing resin passing through the opening and the through hole, the mounting surface side (upper surface side) of the resin substrate and the rear surface side (lower surface side) of the lead frame are adjusted. By controlling the flow of the resin on both sides, it becomes possible to join the resin flowing on the upper side of the substrate and the resin flowing on the lower side of the substrate at the air vent part, that is, to prevent the occurrence of voids during sealing. .

  Therefore, even when the configuration of the mold contents (for example, a semiconductor element) is changed, the dimensions of the mold and the lead frame are changed with a simple change of adjusting the dimensions of the through hole and the opening. Therefore, the flow of the resin during molding can be controlled to ensure the quality of the mold resin, and the development period is not extended and the initial cost is not increased.

Further, the invention according to claim 1 is characterized in that a resin flow state control member that is inserted through the through hole and extends to the mounting surface side is integrally formed in the lead frame. .

  Thereby, the resin flow on the mounting surface side of the resin substrate can be effectively controlled.

The invention according to claim 2 is characterized in that a plurality of the openings are formed in the lead frame.

  This increases the degree of freedom in forming the through hole in the resin substrate.

The invention according to claim 3 is characterized in that a lead frame portion between the plurality of adjacent openings is bridged .

  Thereby, even if a plurality of openings filled with the sealing resin are formed, the strength of the lead frame can be sufficiently maintained.

The invention according to claim 4 is characterized in that the thickness of the lead frame along the stacking direction of the resin substrate and the lead frame is thicker than the thickness of the terminal portion protruding from the sealed resin. And

  Thereby, the improvement of the moldability of the terminal portion (improvement of the flexibility of the terminal shape) can be achieved while improving the heat dissipation.

  Hereinafter, embodiments will be described and embodiments of the present invention will be described. In the second and subsequent embodiments, the same components as those already described are denoted by the same reference numerals, and description thereof is omitted.

[First Embodiment]
First, the first embodiment will be described. FIGS. 1A and 1B are a side view and a perspective view, respectively, showing the overall configuration of the resin-encapsulated semiconductor device 10 of the first embodiment.

  First, the configuration of the resin-encapsulated semiconductor device 10 according to the present embodiment will be described below.

  A resin-encapsulated semiconductor device 10 according to the present embodiment shown in FIG. 1 is a device for a control circuit that is integrally attached to a motor mounted on, for example, a motor mounted on an automobile. This resin-encapsulated semiconductor device 10 is provided with a lead frame 11 and a circuit board 12 disposed on the lead frame 11. The circuit board 12 is made of a resin material, and a circuit pattern (not shown) is formed on the surface thereof.

  On the upper surface side (mounting surface side) of the circuit board 12, the semiconductor element 14 and other peripheral electrical components 16 to 19 (for example, chip resistors) are mounted. As the semiconductor element 14, for example, a small element such as an SOP (Small Outline Package) is used. The semiconductor element 14 is provided with a plurality of terminal portions (lead portions) on the side portion. The semiconductor element 14 and other peripheral electrical components 16 to 19 are electrically connected to the circuit pattern of the circuit board 12 by soldering.

  The circuit board 12 to which the semiconductor element 14 and other peripheral electrical components 16 to 19 are soldered is fixed to the surface of the lead frame 11 using an adhesive or the like. The lead frame 11 is configured by machining a plate made of, for example, a copper alloy or the like. The lead frame 11 and the circuit board 12 are electrically connected by a thin wire 24 (see FIG. 7) using aluminum or gold. This fine wire is wired by, for example, a dummy wire bonding method.

  The semiconductor element 14, the other peripheral electrical components 16 to 19, the circuit board 12, and the lead frame 11 are sealed with a mold resin 28 by being molded as a whole. The terminal portions 20 and 22 of the lead frame 11 protrude outside the mold resin 28 and can be connected to an external device.

  Here, an opening 34 is formed in the lead frame 11 at a predetermined position. In the present embodiment, the opening 34 is elongated along the width direction of the lead frame 11.

  A through hole 36 is formed at a predetermined position of the circuit board 12 so as to communicate with the opening 34 of the lead frame 11 and allow the sealing resin to pass therethrough. In the present embodiment, one elongated through hole 36 along the width direction of the circuit board 12 is formed at a predetermined position. An opening 34 is formed in the lead frame 11 at a position communicating with the through hole 36. The dimension of the through hole 36 is set in advance so that the resin flow X on the upper side of the substrate and the resin flow Y on the lower side of the substrate merge at the air vent portion J when the resin is injected into the mold for molding. Has been.

  The substrate disposed on the lead frame 11 is not a ceramic substrate but a resin substrate, and it is easy to process the through hole 36 at an arbitrary position on the resin circuit substrate 12.

  Next, operations and effects of the resin-encapsulated semiconductor device 10 according to the present embodiment will be described below.

  In order to form the through hole 36, for example, the through hole 36 communicating with the opening 34 of the lead frame 11 can be formed simply by masking and etching the resin circuit board 12. In this case, the dimension of the through hole 36 can be adjusted by adjusting the masking dimension.

  In the present embodiment, for example, the semiconductor element 14 and other peripheral electrical components 16 to 19 are mounted on the circuit board 12, and the circuit board 12 is fixed to the surface of the lead frame 11. Set in the mold. When the mold is filled with a resin, the resin is cured to form a mold resin 28, and the mold resin 28 allows the semiconductor element 14, other peripheral electrical components 16 to 19, the circuit board 12, And the lead frame 11 is sealed integrally.

  Here, at the time of molding using the above-described mold, the resin flows on the upper side (mounting surface side) of the circuit board 12 as indicated by the arrow X, and the resin passes through the through-hole 36 and the arrow Y as indicated by the arrow Y. It flows under the circuit board 12 via the opening 34. Therefore, since the resin flow X on the upper side of the substrate and the resin flow Y on the lower side of the substrate are joined at the air vent portion J, no void is generated in the mold resin 28 when the resin is sealed. Therefore, even if the configuration of the mold (for example, a semiconductor element) is changed, the flow of the resin during molding can be changed by simply changing the dimensions of the through hole 36 and the opening 34. Control can ensure the quality of the mold resin. Therefore, even if the mold contents increase, the resin flow can be controlled so that one mold can be molded in a short time with good heat dissipation and shielding properties. It does not lead to an extended development period or an increase in initial cost.

  The thickness of the lead frame 11 along the stacking direction V of the circuit board 12 and the lead frame 11 is thicker than the thickness of the terminal portions (lead portions) 20 and 22 protruding from the sealed resin in the stacking direction V. It is preferable. Thereby, the improvement of the moldability of the terminal portion (improvement of the flexibility of the terminal shape) can be achieved while improving the heat dissipation.

  Moreover, the resin in the through-hole 36 and the opening 34 is solidified by molding, whereby the anchor effect by the resin is obtained. Thereby, it can prevent effectively that peeling arises between resin, the lead frame 11, and the circuit board 12. FIG.

  Note that the width W of the opening 34 of the lead frame 11 may be increased. Thereby, when finely adjusting the arrangement position of the through-hole 36, it is not necessary to change the dimension and arrangement position of the opening 34.

[Second Embodiment]
Next, a second embodiment will be described. 2A and 2B are a side view and a perspective view, respectively, showing the overall configuration of the resin-encapsulated semiconductor device 40 of the second embodiment.

  In the present embodiment, as compared with the first embodiment, a lead frame 41 is integrally provided with a thin plate-like control plate 42 that is inserted through the through hole 36 of the circuit board 12 and extends to the mounting surface side. Is provided instead. An opening 44 similar to the opening 34 is formed in the lead frame 41, and the control plate 42 is provided in the vicinity of the opening 44.

  The control plate 42 guides a part of the resin flowing on the circuit board 12 to the through hole 36 at the time of molding so that the resin flow X and the resin flow Y can merge at the air vent portion J. The arrangement and the like (the height of the control board 42 from the mounting surface of the circuit board 12, the inclination of the control board 42 with respect to the mounting surface of the circuit board, the arrangement position on the lead frame 41, etc.) are set in advance optimally.

  In this embodiment, at the time of molding using the above-described mold, as shown by the resin flows X and Y, the resin flows on the mounting surface side of the circuit board 12 and the lower surface side of the lead frame 41, respectively. The resin is guided to the through hole 24 by the control plate 42. Therefore, the flow state (especially the flow rate) of the resin passing through the through hole 36 and the opening 44 can also be controlled by adjusting the dimensions and arrangement of the control plate 42.

  Moreover, in this embodiment, it sets in a metal mold | die in the state in which the position of the control board 42 with respect to the through-hole 36 was fixed. Therefore, it is not necessary to position the control plate 42 with a mold or the like during molding. As a result, even if it is necessary to change the shape, arrangement, etc. of the control plate 42, it is possible to prevent the development period from being extended and the initial cost from being increased without changing the mold.

[Third Embodiment]
Next, a third embodiment will be described. 3 to 7 are a perspective view, a developed view, a cross-sectional view taken along the line 5-5 in FIG. 3, and an arrow 6 shown in FIG. 3, respectively, illustrating the overall configuration of the resin-encapsulated semiconductor device 50 according to the third embodiment. It is sectional drawing of -6, and sectional drawing of arrow 7-7 of FIG.

  In this embodiment, as compared with the first embodiment, a resin circuit board 52 having a different through hole shape is provided in place of the circuit board 12, and a lead frame 51 in which a plurality of openings are formed is provided in the lead frame 11. It is provided instead of.

  The openings 54 </ b> A to H formed in the lead frame 51 are all elongated along the width direction M (see FIG. 4) of the lead frame 51. Of the openings 54A to 54H, the openings 54D and E are wider than the other openings. Then, by narrowing the space between adjacent openings, the lead frame portion 51P is structured to be bridged.

  In the present embodiment, the positions of the through holes 56 </ b> A to 56 </ b> E of the circuit board 52 are set so that the openings 54 </ b> A to 54 </ b> H communicate with the second closest opening 54 </ b> B from the mold resin injection port (gate). The through holes 56 </ b> A to 56 </ b> E are arranged in a line along the width direction of the circuit board 52. Of the through holes 56A to 56E, the through hole 56C at the center in the width direction of the circuit board 52 has a smaller opening size than the other four through holes 56A, B, D, and E.

  According to the present embodiment, the flow rate of the fluid resin can be controlled for each of the through holes 56A to 56E, and the fluid resin can be controlled more finely in the mold.

  In the present embodiment, since the lead frame portion 51P between adjacent openings is bridged, the strength of the lead frame 51 can be increased even if a plurality of openings 54A to H are formed. It can be secured efficiently.

  Further, in the present embodiment, since the plurality of openings 54A to 54H are formed in the lead frame 51, the degree of freedom increases in setting the formation positions of the through holes 56A to 56E in the circuit board 52. Moreover, even if the dimensions and formation positions of the through holes 56A to E are changed without changing the dimensions and formation positions of the openings 54A to H of the lead frame 51, the through holes 56A to 56E and the opening 54B are passed through. The flow of the resin can be adjusted.

  Since a plurality of openings 54 are formed in this way, the through holes 56A to E can be formed in a plurality of rows in the circuit board 52. Thereby, it becomes easier to control the resin flow, and the anchor effect by the resin solidified in the through holes 56A to 56E and the opening 54 can be more remarkably exhibited.

  The embodiments of the present invention have been described above with reference to the embodiments. However, these embodiments are merely examples, and the present invention is not limited thereto, and various modifications can be made without departing from the scope of the invention.

1A and 1B are a side view and a perspective view, respectively, showing the overall configuration of the resin-encapsulated semiconductor device of the first embodiment. 2A and 2B are a side view and a perspective view, respectively, showing the overall configuration of the resin-encapsulated semiconductor device of the second embodiment. It is a perspective view which shows the whole structure of the resin-sealed semiconductor device of 3rd Embodiment. It is an expanded view which shows the whole structure of the resin-encapsulated semiconductor device of 3rd Embodiment. FIG. 5 is a cross-sectional view (cross-sectional perspective view from below) taken along arrow 5-5 in FIG. 3. It is sectional drawing (side sectional drawing) of the arrow 6-6 of FIG. FIG. 7 is a cross-sectional view (cross-sectional perspective view from above) taken along arrow 7-7 in FIG. 3, showing that the terminal portion and the circuit board are electrically connected by a thin line.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Resin sealing type semiconductor device, 11 ... Lead frame, 12 ... Circuit board (resin substrate), 14 ... Semiconductor element, 20 ... Terminal part, 22 ... Terminal part, 34 ... Opening, 36 ... Through-hole, 40 ... Resin-encapsulated semiconductor device, 41 ... lead frame, 42 ... control plate (resin flow state control member), 44 ... opening, 50 ... resin-encapsulated semiconductor device, 51 ... lead frame, 51P ... lead frame, 52 ... circuit Substrate, 54A to H ... opening, 56A to E ... through hole, M ... width direction, V ... stacking direction

Claims (4)

A lead frame and a substrate disposed on the lead frame and having at least one semiconductor element disposed on a mounting surface side, and sealed with resin in a state where the lead frame and the substrate are integrated A resin-encapsulated semiconductor device,
An opening formed in an elongated shape along the width direction of the lead frame is provided at a predetermined position of the lead frame,
The substrate is formed of a resin substrate, with a predetermined position of the resin substrate and can pass through the flow resin for sealing communication with said opening, and the resin along the width direction of the resin substrate Through holes formed in an elongated shape except for both ends of the substrate ,
The resin-encapsulated semiconductor device, wherein a resin flow state control member that is inserted through the through hole and extends toward the mounting surface is formed integrally with the lead frame.   2. The resin-encapsulated semiconductor device according to claim 1, wherein a plurality of the openings are formed in the lead frame.   3. The resin-encapsulated semiconductor device according to claim 2, wherein a lead frame portion between the adjacent openings is bridged.   2. The resin seal according to claim 1, wherein a thickness of the lead frame along a stacking direction of the resin substrate and the lead frame is thicker than a thickness of the terminal portion protruding from the sealed resin. Stop-type semiconductor device.

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