KR20100034536A - Substrate hoder unit and substrate assembling appratus having the same - Google Patents

Abstract

PURPOSE: A substrate holder unit and a substrate assembling apparatus having the same are provided to separate an upper substrate and a lower substrate from a bonding chuck by installing a separate vacuum controlling part to the bonding chuck for attaching the substrate. CONSTITUTION: A first driving part(400) transfers an upper chuck(200). A second driving part(500) transfers a lower chuck(300). A third driving part(700) transfers a bonding chuck(600). A first vacuum controlling part(310) is installed on the lower chuck. The first vacuum controlling part supports a substrate(1000) using a vacuum absorption force. A second vacuum controlling part(800) is installed to the bonding chuck. The second vacuum controlling part supports the substrate using the vacuum absorption force.

Description

Substrate hoder unit and substrate assembling appratus having the same}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate mounting unit and a substrate bonding apparatus having the same, and a substrate mounting unit and a substrate bonding apparatus capable of separating the bonded upper and lower substrates from the chuck without misalignment.

Conventionally, a CRT (Cathode Ray Tube) is used as a display device. This has the disadvantage of being bulky and heavy. Recently, the use of flat panel displays such as liquid crystal display panels (LCDs), plasma display panels (PDPs), and organic light emitting devices (OLEDs) has been increasing. The display panel as described above has characteristics such as light weight, thinness, and low power consumption.

In the case of such a flat panel display panel, a pair of flat panel type substrates are bonded together and manufactured. That is, taking the manufacture of a liquid crystal display panel as an example, first, a lower substrate on which a plurality of thin film transistors and pixel electrodes are formed, and an upper substrate on which a color filter and a common electrode are formed are manufactured. Thereafter, a liquid crystal is dropped on the lower substrate, and a sealant is applied to the edge region of the lower substrate. Subsequently, the lower substrate is supported on the lower chuck of the substrate bonding apparatus, and the upper substrate is supported on the upper chuck so that the upper substrate and the lower substrate face each other. Then, the upper chuck supporting the upper substrate is lowered to bond and seal the upper substrate and the lower substrate to produce a liquid crystal display panel. Here, the upper chuck and the lower chuck support and fix each of the upper substrate and the lower substrate by using vacuum suction force or electrostatic force. In addition, one end of the lower chuck is mounted with at least one adhesive chuck for supporting and fixing the lower substrate by using an adhesive force. Thus, the lower substrate is supported and fixed by the adhesive chuck mounted on the lower chuck and the lower chuck.

Thereafter, the bonded upper substrate and the lower substrate are separated from the lower chuck and the adhesive chuck. That is, after removing the electrostatic force or vacuum suction force of the lower chuck, the lift bar is lifted. At this time, the lower substrate is separated from the lower chuck and the adhesive chuck by elevating the lift bar. In this way, an excessive stress is applied to the lower substrate by lifting the lift bar to forcibly separate the lower substrate from the adhesive chuck. This causes a problem that the alignment of the bonded upper substrate and the lower substrate is misaligned.

In order to solve the above problems, a substrate seating unit and a substrate bonding apparatus having a driving unit and a vacuum control unit for raising and lowering the adhesive chuck to separate the bonded upper substrate and the lower substrate from the adhesive chuck without misalignment. To provide.

A substrate seating unit according to the present invention includes a lower chuck supporting and fixing a substrate, an adhesive chuck supporting and fixing the substrate together with the lower chuck, and a driving unit for moving the adhesive chuck.

The adhesive chuck is manufactured to move independently of the lower chuck by a driving unit.

The adhesive chuck includes an adhesive member supporting and fixing the substrate by an adhesive force, and a body supporting the adhesive member.

The plurality of adhesive chucks are manufactured to have a smaller size than the lower chucks and are installed to penetrate the edges of the lower chucks.

The said drive part is connected to each of the some sticky chuck, or it is connected to the support part which supports the said some sticky chuck.

The drive unit is a drive shaft spaced apart from the lower side of the adhesive chuck, a power unit for applying a driving force to the drive shaft, a steel ball located between the drive shaft and the adhesive chuck moveable in the X, Y and θ direction, and the steel ball And a cap disposed to cover at least one end portion of the upper side of the arranged drive shaft and connected to any one of the plurality of adhesive chucks and the support portion.

The adhesive chuck is equipped with a vacuum control unit for assisting the attachment and detachment of the substrate.

The vacuum control unit includes a nozzle unit penetrating through a plurality of adhesive chucks, an extension pipe connecting the nozzle unit, a vacuum pump and a purge gas supply unit connected to the extension pipe.

The extension pipe is preferably inserted into the support portion for supporting a plurality of adhesive chuck.

The substrate bonding apparatus according to the present invention includes a substrate seating unit having a chamber portion, an upper chuck disposed in the chamber portion, a lower chuck disposed to face the upper chuck, and an adhesive chuck disposed to face the upper chuck and moved independently of the lower chuck. It includes.

An upper driving part for moving the upper chuck is connected to the upper chuck, and a lower driving part for moving the lower chuck is connected to the lower chuck.

The adhesive chuck is manufactured to have a smaller size than the lower chuck and is mounted to penetrate the lower chuck.

The lower driving part includes a position adjusting part for adjusting X, Y and θ positions of the lower chuck.

The substrate processing method according to the present invention comprises supporting each of the upper substrate and the lower substrate to the upper chuck and the substrate seating unit respectively disposed in the chamber portion, and lowering the upper chuck to bond the upper substrate and the lower substrate, Detaching the upper chuck from the upper substrate, and lowering the adhesive chuck of the substrate seating unit.

In the step of supporting the lower substrate to the substrate seating unit, an edge region of the lower substrate is supported by the adhesive chuck of the substrate seating unit, and the other region is supported by the lower chuck.

In the step of supporting the lower substrate to the substrate seating unit, the step of elevating the adhesive chuck mounted on the lower chuck to the same height as the lower chuck.

In the step of elevating the adhesive to the same height as the lower chuck, using a steel ball of the drive unit of the substrate mounting unit comprises the step of moving the adhesive chuck in the X, Y and θ direction to adjust the horizontal degree of the adhesive chuck. .

After the step of elevating the adhesive chuck mounted on the lower chuck to the same height as the lower chuck, the step of vacuuming the nozzle portion inserted into the adhesive chuck includes a step of being in close contact by the vacuum suction force.

Before the step of lowering the adhesive chuck of the substrate mounting unit, supplying a purge gas to the nozzle portion inserted into the adhesive chuck.

After the step of lowering the adhesive chuck of the substrate seating unit, further comprising the step of detaching the bonded upper substrate and the lower substrate from the lower chuck.

In the present invention, by providing a separate vacuum control unit to assist the attachment and detachment of the substrate to the adhesive chuck, it is possible to make the substrate completely adhered to the adhesive chuck. And a board | substrate can be stably separated from an adhesion chuck by a vacuum control part. In addition, by lowering the adhesive chuck by using a driving unit for moving the adhesive chuck to detach the substrate from the adhesive chuck, it is possible to minimize the stress applied to the substrate. This allows the bonded upper and lower substrates to be separated from the adhesion chuck without misalignment. Therefore, it is possible to minimize the occurrence of a failure of the device that can be caused by the misalignment of the bonded upper substrate and the lower substrate.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention, and to those skilled in the art to fully understand the scope of the invention. It is provided to inform you. Like numbers refer to like elements in the figures.

1 is a cross-sectional view of a substrate bonding apparatus according to an embodiment of the present invention. 2 is an enlarged view of area A of FIG. 1 according to an embodiment.

Referring to FIG. 1, the substrate bonding apparatus according to the present embodiment includes a chamber part 100 having an inner space, an upper chuck 200 and a lower chuck 300 disposed in the chamber part 100 so as to face each other, A first driving unit 400 connected to an upper portion of the upper chuck 200 to move the upper chuck 200, and a second driving unit connected to a lower portion of the lower chuck 300 to move the lower chuck 300 ( 500, at least one adhesive chuck 600 mounted on the edge region of the lower chuck 300, and a third driving part 700 connected to the lower portion of the adhesive chuck 600 to move the adhesive chuck 600. It includes. In addition, the electrostatic chuck 210 mounted on the upper chuck 200 to support the substrate by the electrostatic force, and the first vacuum control unit 310 mounted on the lower chuck 300 to support the substrate by the vacuum suction force, It is attached to the adhesive chuck 600 includes a second vacuum control unit 800 for supporting the substrate by the vacuum suction force. At this time, although not shown, it may further include a separate frame surrounding the chamber portion 100 and the lower chuck 300 and the upper chuck 200 is disposed.

The chamber unit 100 includes an upper chamber 110 and a lower chamber 120 that form a space for performing the bonding process of the upper substrate 1000 and the lower substrate 2000. At this time, it is effective that the upper chamber 110 and the lower chamber 120 is detachably coupled. And, although not shown, the chamber part 100 may further include a separate pressure adjusting means for adjusting the pressure of the internal space of the chamber part 100. In addition, the chamber unit 100 may be provided with a separate purge means for exhausting impurities in the internal space. In addition, the upper chamber 110 or the lower chamber 120 of the chamber unit 100 may be raised and lowered so that the substrate may enter and exit the chamber unit 100. In this case, a separate lifting member for lifting up and down each of the lower chambers 120 of the upper chamber 110 may be further provided.

The upper chuck 200 is manufactured in a plate shape and disposed adjacent to the inner side surface of the upper chamber 110. The shape of the upper chuck 200 may be variously changed according to the shape of the substrate. The upper chuck 200 according to the present embodiment is manufactured in the shape of a square plate. In addition, the lower chuck 300 is also produced in a plate shape and disposed adjacent to the inner side surface of the lower chamber 110. In addition, the shape of the lower chuck 300 is effectively produced in the same or the same shape as the upper chuck 200. The lower side of the upper chuck 200 and the upper side of the lower chuck 300 are disposed to face each other.

The electrostatic chuck 210 is mounted to the upper chuck 200 and supports and fixes the upper substrate 1000 by using electrostatic force. At this time, the electrostatic chuck 210 is preferably manufactured in a plate shape of a size corresponding to the upper substrate (1000). The electrostatic chuck 210 according to the present embodiment is manufactured integrally and mounted on the upper chuck 200. However, the present invention is not limited thereto, and a plurality of electrostatic chucks 210 may be manufactured and mounted in a matrix form on the upper chuck 200. When the upper substrate 1000 is positioned on the upper chuck 200, the upper substrate 1000 is supported and fixed by the electrostatic force of the electrostatic chuck 210.

The first vacuum controller 310 is mounted on the lower chuck 300 to help the attachment and detachment of the lower substrate 2000. Here, the first vacuum controller 310 may include a plurality of first nozzle parts 301 to which the lower substrate 2000 is in close contact, and a first extension pipe 302 connecting the plurality of first nozzle parts 301. And a first vacuum pump 303 and a first purge gas supply unit 304 connected to the first extension pipe 302. The first nozzle unit 301 and the first extension pipe 302 of the first vacuum control unit 310 are mounted in an area except the edge area of the lower chuck 300, that is, the adhesive chuck 600. It is preferable. At this time, the upper side surface of the first nozzle unit 301 is exposed to the upper side surface of the lower chuck 300. Through this, by placing the lower substrate 2000 on the lower chuck 300 and vacuum treatment of the first extension pipe 302 and the first nozzle unit 301 by using the first vacuum pump 303 by the vacuum suction force The lower substrate 2000 is supported and fixed to the lower chuck 300. In addition, the lower substrate 2000 is separated from the lower chuck 300 by supplying the purge gas to the first extension pipe 302 and the first nozzle unit 301 using the first purge gas supply unit 304.

The first driving unit 400 is connected to the upper portion of the upper chuck 200 to move the upper chuck 200, the second driving unit 500 is connected to the lower portion of the lower chuck 300 to move the lower chuck 300. Let's do it. First, the first driving unit 400 includes at least one first driving shaft 410 connected to the upper chuck 200, and a first power unit 420 for applying driving force to the first driving shaft 410. In this case, the first driving shaft 410 penetrates through an upper portion of the chamber part 100. Therefore, the first bellows 430 is installed around the first drive shaft 410 in order to prevent the seal breaking of the chamber part 100 by the first drive shaft 410. Accordingly, the upper chuck 200 may be lowered using the first driving unit 500 to pressurize the upper substrate 1000 and the lower substrate 2000 to be bonded together. In addition, by elevating the upper chuck 200 using the first driver 400, the upper chuck 200 may be separated from the upper substrate 1000 bonded to the lower substrate 200 by a subsequent process.

The second drive unit 500 includes at least one second drive shaft 510 connected to the lower chuck 300, and a second power unit 520 for applying a driving force to the second drive shaft 510. In this case, the second driving shaft 510 penetrates through an upper portion of the chamber part 100. Therefore, a second bellows 530 is installed around the second drive shaft 510 to prevent the sealing failure of the chamber part 100 by the second drive shaft 510. In addition, although not shown, the second driving part 500 further includes a plurality of lift bars (not shown) that move up and down through the lower chuck 300. And the second drive unit 500 is preferably manufactured to adjust the X, Y, and θ position of the lower chuck 300. Thus, the second driving unit 500 includes a position adjusting means (not shown) for moving the lower chuck 300 in the X, Y and θ directions to adjust the position of the lower chuck 300. Therefore, by moving the lower chuck 300 in the X, Y, and θ directions by using a position adjusting means (not shown), the lower substrate 2000 and the upper substrate 1000 can be aligned. In this case, the substrate bonding apparatus according to the present embodiment may further include a separate alignment means such as a camera (not shown) or a sensor (not shown) for alignment.

The glue chuck 600 supports and fixes at least one end of the lower substrate 2000 by using an adhesive force. At this time, the adhesive chuck 600 is manufactured in a cylindrical shape having a smaller size than the lower chuck 300. Of course, the shape of the adhesive chuck 600 is not limited thereto and may be variously modified. In addition, the adhesive chuck 600 is installed to penetrate through the edge region of the lower chuck 300. As shown in FIG. 2, the adhesive chuck 600 includes an adhesive member 610 for supporting and fixing the lower substrate 2000 and a body 620 to which the adhesive member 610 is coupled. At this time, the adhesive member 610 is manufactured using a rubber excellent in stress relaxation property, and an adhesive for imparting adhesion. The adhesive has a property that the adhesive is attached to the upper surface of the body 620 without leaving an adhesive trace on the lower substrate 2000 even though the lower substrate 2000 is adhered to the lower substrate 2000. That is, the adhesive force of the adhesive chuck 600 has a greater adhesive force with the body 620 than with the lower substrate 2000. In the present embodiment, a plurality of adhesive chucks 600 as described above are provided to be mounted to be spaced apart from each other at four edge regions of the lower chuck 300. As a result, end portions of the lower substrate 2000 corresponding to the adhesive chuck 600 are supported and fixed by the adhesive chuck 600, and other regions are supported and fixed by the lower chuck 300. In addition, the plurality of adhesive chucks 600 respectively positioned at the four edge regions of the lower chuck 300 are supported by one support 760. In this embodiment, three adhesive chucks 600 were manufactured to be supported by one support part 760. Of course, the present invention is not limited thereto, and the number of adhesive chucks 600 supported by one support 760 may be variously modified. Here, the support part 760 is connected with the 3rd drive part 700 mentioned later. Thus, the adhesive chuck 600 according to the present embodiment may be separated from the lower chuck 300 as it is moved by the third driving unit 700. That is, the adhesive chuck 600 is movable independently. In addition, the adhesive chuck 600 according to the present embodiment is equipped with a second vacuum control unit 800 to assist the attachment and detachment of the lower substrate 2000. Accordingly, the lower substrate 2000 may be completely adhered to the adhesive chuck 600 by the second vacuum adjusting unit 800, or the lower substrate 2000 may be stably detached from the adhesive chuck 600. A detailed description of the third driving unit 700 and the second vacuum control unit 800 will be described below.

Conventionally, there is no separate vacuum control unit to help the attachment and detachment of the lower substrate 200 to the adhesive chuck 600 as described above. Thus, when the lower substrate 2000 is separated from the adhesive chuck 600, the lift bar (not shown) of the second driving unit 500 is lifted to penetrate the lower chuck 300, thereby forcibly separating the lower substrate 2000. For this reason, there is a problem in that the alignment of the upper substrate 1000 and the lower substrate 2000 that are bonded as the stress applied to the lower substrate 2000 is distorted. Therefore, in the present exemplary embodiment, the second vacuum controller 800 is attached to the adhesive chuck 600 to assist the attachment and detachment of the lower substrate 200. The second vacuum control unit 800 includes a plurality of second nozzle portions 810 passing through each of the plurality of adhesive chucks 600, and a second extension pipe 820 connecting the plurality of second nozzle portions 810. And a second vacuum pump 830 and a second purge gas supply unit 840 connected to the second extension pipe 820. At this time, the upper surface of the second nozzle unit 810 is exposed to the upper surface of the adhesive chuck 600. In addition, the second extension pipe 820 connected to the plurality of second nozzle parts 810 is mounted in the support part 760 supporting the plurality of adhesive chucks 600. As a result, when the lower substrate 2000 is positioned on the lower chuck 300, the area of the lower substrate 2000 corresponding to the point chuck 600, that is, the edge region, is first moved by the vacuum suction force. Adheres to the phase. That is, by vacuum-processing the 2nd extension pipe 820 and the 2nd nozzle part 810 using the 2nd vacuum pump 830, the lower board | substrate 2000 adheres to the adhesion chuck 600 by the vacuum suction force. . Thereafter, the lower substrate 2000 is supported and fixed by the adhesive force of the adhesive chuck 600. In addition, the lower substrate 2000 is easily separated from the adhesive chuck 600 by supplying the purge gas to the second extension pipe 820 and the second nozzle unit 810 using the second purge gas supply unit 840. You can.

In addition, the conventional adhesive chuck 600 was fixedly mounted to the lower chuck 300. Accordingly, when the upper substrate 1000 and the lower substrate 2000 bonded to the lower chuck 300 are separated, the lift bar (not shown) of the second driving unit 700 is lifted to penetrate the lower chuck 300 to force it. Separated. For this reason, there is a problem in that the alignment of the bonded upper substrate 1000 and lower substrate 2000 is incorrect. Therefore, the adhesive chuck 600 according to the present embodiment is separated from the lower chuck 300 and manufactured to be movable independently. To this end, as shown in FIGS. 1 and 2, a third driving part 700 for moving the adhesive chuck 600 is provided. At this time, the adhesive chuck 600 is mounted to penetrate the edge region of the lower chuck 300 as described above. The third driving part 700 includes a third driving shaft 710 spaced apart from the lower side of the supporting part 760 supporting the plurality of adhesive chucks 600, and a third power for applying driving force to the third driving shaft 710. Covers the portion 720, the steel ball 740 located on the upper side of the third drive shaft 710, and a portion of the upper portion of the third drive shaft 710 on which the steel ball 740 is disposed. A cap 750 connected to the support 760. In this case, the third driving shaft 710 penetrates a part of the chamber part 100. Therefore, a third bellows 730 is installed around the third drive shaft 710 to prevent the sealing failure of the chamber part 100 by the third drive shaft 710. As a result, the third driving shaft 710 is moved up and down by the third power unit 720, thereby raising and lowering the support unit 760 supporting the plurality of adhesive chucks 600. Therefore, the plurality of adhesive chucks 600 may be separated from the lower chuck 300 without being fixed to the lower chuck 300.

The steel ball 740 serves to move the support 760 on which the plurality of adhesive chucks 600 are mounted in the X, Y, and θ directions. The steel ball 740 is positioned between the support 760 and the third drive shaft 710. Preferably, the steel ball 740 is positioned on the upper side surface of the third drive shaft 710, and the cap 750 is disposed to cover a portion of the upper portion of the third drive shaft 710 to which the steel ball 740 is connected. . Here, the cap 750 is connected to the support portion 760 for supporting the plurality of adhesive chuck 600. For example, when the support 760 and the plurality of adhesive chucks 600 are elevated by using the third driving unit 700, when the adhesive chucks 300 are not arranged horizontally, One end is connected to the lower substrate 200 and the other end is not connected. Alternatively, at least one of the plurality of adhesive chucks 600 may not be connected to the lower substrate 300. At this time, the steel ball 740 is moved in the X, Y and θ direction, thereby adjusting the horizontal degree of the adhesive chuck 300. That is, the steel ball 740 is moved in the X, Y and θ direction, so that the cap 740 covering the steel ball 740 and the support portion 760 connected to the cap 740 are in the X, Y and θ directions Go to. Therefore, as the plurality of adhesive chucks 600 coupled to the support 760 move in the X, Y, and θ directions, the adhesive chucks 300 are horizontally disposed. Thus, the lower substrate 2000 may not be connected to one end of the adhesive chuck 600, or at least one of the plurality of adhesive chucks 600 may be prevented from being connected to the lower substrate 200. Thus, a portion of the lower substrate 2000 may be prevented from being connected to the upper substrate 1000 during the alignment of the upper substrate 1000 and the lower substrate 2000.

Although the plurality of adhesive chucks 600 according to the present exemplary embodiment have been described as being positioned at four edge regions of the lower chuck 300, the arrangement of the adhesive chuck 600 may be variously changed. Although not shown, the adhesive chuck 600 may be disposed in four corner regions of the lower chuck 300. In addition, the plurality of adhesive chucks 600 may not be supported by the support part 760, and the third driving part 700 may be directly connected to each of the adhesive chucks 600. In addition, the third driving unit 700 is not limited thereto, and the third driving unit 700 may be deformed into any structure capable of raising and lowering the adhesive chuck 600 or moving in the X, Y, and θ directions.

3A and 3B are views for explaining a substrate processing method through the substrate bonding apparatus according to the embodiment.

Referring to FIG. 3A, a lower substrate 2000 having a thin film transistor (not shown) and a pixel electrode (not shown) is positioned on a lower chuck 300 inside a chamber part (not shown). The lower substrate 2000 is connected to the adhesive chuck 600 by elevating the adhesive chuck 600 using the third driving unit 700. At this time, the steel ball 740 of the third driving unit 700 is moved in the X, Y and θ direction to adjust the support portion 760 and the plurality of adhesive chuck 600 is arranged horizontally. For this reason, the front surface of the lower substrate 2000 is connected to the upper surface of the lower chuck 300 and the adhesive chuck 600. Subsequently, the lower chuck 300 and the adhesive chuck 600 are mounted on the lower chuck 300 by using the first vacuum control unit 310 and the second vacuum control unit 800 mounted on the adhesive chuck 600. The lower substrate 2000 is in close contact with each other. That is, the first nozzle part 301 of the lower chuck 300 and the second nozzle part 810 of the adhesive chuck 600 are vacuum-processed using the first and second vacuum pumps 303 and 830. The lower substrate 2000 is attached to the lower chuck 300 and the chuck 600 gradually. At this time, the edge region of the lower substrate 2000 correspondingly disposed on the adhesive chuck 600 is supported and fixed by the adhesive force of the adhesive chuck 600. Then, a liquid crystal is dropped on the lower substrate 2000, and a sealing member such as a sealant is applied along the edge of the lower substrate 2000. In addition, the upper substrate 1000 on which the common electrode and the color filter pattern are formed is positioned on the upper chuck 200. At this time, the upper substrate 1000 is supported and fixed by the electrostatic force of the electrostatic chuck unit 210 mounted on the upper chuck 200. Then, a sealing member such as a sealant may be applied along the edge of the upper substrate 1000.

Subsequently, the inside of the chamber part 100 is maintained in a vacuum state, and then the upper substrate 1000 and the lower substrate 2000 are aligned. Subsequently, the upper chuck 200 is lowered to bond the upper substrate 1000 and the lower substrate 2000 to each other.

The upper chuck 200 is detached from the upper substrate 1000 bonded to the lower substrate 2000. That is, after the electrostatic force of the electrostatic chuck 210 mounted on the upper chuck 200 is released, the upper chuck 200 is lifted using the first driving unit 400. As a result, the upper chuck 200 is detached from the upper part 1000. Subsequently, the bonded upper substrate 1000 and lower substrate 2000 are separated from the lower chuck 300. First, the purge gas is supplied to the first and second nozzle parts 301 and 810 inserted into the lower chuck 300 and the adhesive chuck 600 using the first and second purge gas supply parts 304 and 840, respectively. do. Subsequently, as shown in FIG. 3B, the adhesive chuck 600 is lowered using the third driving unit 700. Through this, the lower substrate 2000 is detached from the adhesive chuck 600. That is, in the present embodiment, by lowering the adhesive chuck 600 using the third driving unit 700, the upper and lower substrates 1000 and 2000 attached to and detached from the adhesive chuck 600 are removed without applying excessive stress. You can. Accordingly, the alignment of the bonded upper substrate 1000 and lower substrate 2000 may be prevented. The purge gas is supplied to the first nozzle unit 301 inserted into the lower chuck 300 using the first purge gas supply unit 304 to separate the lower substrate 200 from the lower chuck 300. Thereafter, the lift bar (not shown) of the second driving part 500 is elevated to penetrate the lower chuck 300. As a result, the upper substrate 1000 and the lower substrate 1000 bonded to the lower chuck 300 are detached. Subsequently, although not shown, the bonded upper substrate 1000 and lower substrate 2000 are moved to separate curing apparatuses, and then the sealing member is cured by irradiating light or heat to the sealing member to cure the sealing member. The substrates 2000 are completely bonded to each other.

In the present embodiment, a substrate bonding apparatus has been described as an example, but the present invention is not limited thereto and can be applied to various substrate processing apparatuses.

1 is a cross-sectional view of a substrate bonding apparatus according to an embodiment of the present invention.

2 is an enlarged view of region A of FIG. 1 according to an embodiment.

3 (a) and 3 (b) are views for explaining a substrate processing method through the substrate bonding apparatus according to the embodiment;

Description of the main parts of the drawing

100: chamber 200: upper chuck

300: lower chuck 400: first drive unit

500: second drive unit 600: adhesive chuck

700: third drive unit

Claims (20)

A lower chuck supporting and fixing the substrate; A plurality of adhesive chucks supporting and fixing the substrate together with the lower chuck and separated from the upper lower chuck; And a driving unit for moving the adhesive chuck. The method according to claim 1, And the adhesive chuck moves independently of the lower chuck by a driving unit. The method according to claim 1, The adhesive chuck is a substrate mounting unit including an adhesive member for holding and fixing the substrate by the adhesive force, and a body for supporting the adhesive member. The method according to claim 1, The plurality of adhesive chuck is manufactured in a smaller size than the lower chuck, the substrate mounting unit is installed to penetrate through the edge of the lower chuck. The method according to claim 1, The driving unit is connected to each of the plurality of adhesive chuck, or a substrate mounting unit connected to the support portion for supporting the plurality of adhesive chuck. The method according to claim 1, The drive unit drive shaft spaced apart from the lower side of the adhesive chuck; A power unit for applying a driving force to the drive shaft; A steel ball positioned between the driving shaft and the adhesive chuck and movable in the X, Y, and θ directions; And a cap disposed to cover at least one end of an upper portion of a driving shaft on which the steel ball is disposed and connected to any one of the plurality of adhesive chucks and the support portion. The method according to claim 1, The adhesive mounting chuck is a substrate mounting unit is equipped with a vacuum control unit to assist in the attachment and detachment of the substrate. The method of claim 7, The vacuum control unit includes a nozzle unit penetrating a plurality of adhesive chuck, an extension pipe connecting the nozzle unit, a vacuum pump and a purge gas supply unit connected to the extension pipe. The method according to claim 8, The extension pipe is inserted into the support portion for supporting a plurality of adhesive chuck substrate mounting unit. Chamber portion; An upper chuck disposed in the chamber portion; And a substrate seating unit having a lower chuck disposed opposite the upper chuck and an adhesive chuck disposed opposite the upper chuck and moved independently of the lower chuck. The method according to claim 10, And an upper driving portion for moving the upper chuck to the upper chuck, and a lower driving portion for moving the lower chuck to the lower chuck. The method according to claim 10, And the adhesive chuck is manufactured to have a smaller size than the lower chuck and is mounted to penetrate the lower chuck. The method according to claim 11, And the lower driving part includes a position adjusting part for adjusting X, Y and θ positions of the lower chuck. Supporting each of the upper substrate and the lower substrate to the upper chuck and the substrate seating unit, each of which is disposed in the chamber portion so as to face each other; Lowering the upper chuck to bond the upper substrate and the lower substrate, and then detaching the upper chuck from the upper substrate; And lowering the adhesive chuck of the substrate seating unit. The method according to claim 12, And supporting the lower substrate on a substrate seating unit, wherein an edge region of the lower substrate is supported by an adhesive chuck of the substrate seating unit, and the other region is supported by a lower chuck. The method according to claim 14, And supporting the lower substrate on a substrate seating unit, lifting and lowering the adhesive chuck mounted on the lower chuck to the same height as the lower chuck. 18. The method of claim 16, In the step of elevating the adhesive to the same height as the lower chuck, using the steel ball of the drive unit of the substrate mounting unit by moving the adhesive chuck in the X, Y and θ direction to adjust the horizontal degree of the adhesive chuck Substrate processing method. 18. The method of claim 16, And raising and lowering the adhesive chuck mounted on the lower chuck to the same height as the lower chuck, and vacuum treating the nozzle portion inserted into the adhesive chuck to be in close contact with a vacuum suction force. The method according to claim 14, And supplying a purge gas to the nozzle portion inserted into the adhesive chuck before the adhesive chuck of the substrate seating unit is lowered. The method according to claim 14, And after lowering the adhesive chuck of the substrate seating unit, detaching the bonded upper substrate and the lower substrate from the lower chuck.

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