KR100983606B1 - Sealing apparatus for vaccum chamber and substrate assembling apparatus having the same - Google Patents

Abstract

The present invention relates to an airtight holding device for a vacuum chamber and a substrate bonding device having the same, wherein the chamber portion, the upper surface plate and the lower surface plate respectively disposed in the chamber portion, and the lower surface plate are moved in the X, Y, and θ directions. And an alignment unit for aligning the substrates which are respectively supported and fixed on the upper plate and the lower plate, and airtight holding means for maintaining airtightness between the alignment unit and the chamber unit, wherein the alignment unit penetrates the bottom of the chamber unit. And a plurality of shaft portions connected to the lower surface plate, wherein the airtight holding means has a first hermetic plate which is in close contact with the bottom surface of the shaft portion and the chamber portion, respectively, and between the shaft portion and the chamber portion and the first hermetic plate. Provided are an airtight holding device for a vacuum chamber and at least one substrate bonding device having the at least one O-ring portion positioned at each. As such, by maintaining the airtightness of the shaft portion and the chamber portion through the O-ring, it is possible to increase the facility operation rate.

Board Bonding, Liquid Crystal Display Panel, Shaft, Chamber, Airtight, O-Ring

Description

The hermetic holding device for a vacuum chamber and the board | substrate bonding apparatus having the same {SEALING APPARATUS FOR VACCUM CHAMBER AND SUBSTRATE ASSEMBLING APPARATUS HAVING THE SAME}

The present invention relates to an airtight holding device for a vacuum chamber and a substrate bonding device having the same, and to a substrate bonding device having an airtight holding means for arranging and bonding a pair of substrates in a vacuum chamber to maintain an airtight inside the vacuum chamber. .

Conventionally, a CRT (Cathode Ray Tube) is used as a display device. This has the disadvantage of being bulky and heavy. Recently, the use of flat panel displays such as a liquid crystal display panel (LCD), a plasma display panel (PDP), and an organic light emitting device (OLED) has been increasing. It is characterized by light weight, thinness and low power consumption.

In the case of such a flat panel display panel, a pair of flat panel type substrates are bonded together and manufactured. That is, taking the manufacture of a liquid crystal display panel as an example, first, a lower substrate on which a plurality of thin film transistors and pixel electrodes are formed, and an upper substrate on which a color filter and a common electrode are formed are manufactured. Thereafter, a liquid crystal is dropped on the lower substrate, and a sealant is applied to the edge region of the lower substrate. Subsequently, the lower substrate surface on which the pixel electrode is formed and the upper substrate surface on which the common electrode is formed are positioned to face each other, and then the two substrates are bonded and sealed to manufacture a liquid crystal display panel.

Here, the liquid crystal is dripped, and the board | substrate bonding apparatus is used for the bonding sealing of the two board | substrates with which the sealant was apply | coated. This substrate bonding apparatus opposes the two substrates (ie, the upper substrate and the lower substrate) and then seals the two substrates together in a vacuum. As a result, a liquid crystal display panel having a plurality of pixels can be manufactured.

At this time, as described above, fine patterns for forming pixels are formed on each of the two substrates. Therefore, it is very important to align the pixel patterns between the two substrates before bonding sealing of the two substrates. That is, when the two substrates are bonded and sealed in an unaligned state, fine patterns for forming pixels are displaced, which causes a problem that the display panel itself does not operate.

Accordingly, the substrate bonding apparatus for bonding and sealing two substrates for pattern alignment includes alignment means for aligning the two substrates. The alignment means is provided outside the chamber of the substrate bonding apparatus, and a portion of the axis thereof extends inside the chamber to align the substrate placed inside the chamber. Here, the chamber should be kept airtight in order to prevent ingress of impurities during the adhesive sealing of the substrate. Thus, the airtightness of the chamber was maintained by wrapping the shaft with a bellows so that the airtightness of the chamber was not destroyed by the shaft area of the alignment means extending into the chamber. However, when the bellows is used, there is a problem in that the bellows is stressed when the substrate inside the chamber is started in the X, Y and θ directions so that the bellows is easily broken. In addition, if the bellows is broken, it takes a lot of time to replace it, causing a problem that the operation rate of the facility is lowered.

Accordingly, the present invention is derived to solve the above problems, it is possible to maintain the airtight (ie vacuum) inside the chamber by using the O-ring instead of the bellows, it is possible to simplify the replacement operation of the O-ring to improve the equipment operation rate It is an object of the present invention to provide an airtight holding device for a vacuum chamber and a substrate bonding device having the same.

The present invention is to align the chamber portion, the upper surface plate and the lower surface plate respectively disposed in the chamber portion, and the lower surface plate in the X, Y and θ direction to align the substrates respectively supported and fixed to the upper surface plate and the lower surface plate. And an airtight holding means for holding an airtight portion between the alignment portion and the chamber portion, wherein the alignment portion has a plurality of shaft portions penetrating the bottom of the chamber portion and connected to the lower surface plate. Is provided with a first hermetic plate which is in close contact with the bottom surface of the shaft portion and the chamber portion, respectively, and at least one O-ring portion which is located between the shaft portion and the chamber portion and the first hermetic plate. do.

The hermetic holding means preferably includes a second hermetic plate positioned below the first hermetic plate and fixedly mounted to the shaft portion, and at least one elastic portion provided between the first and second hermetic plates.

It is effective to provide an elastic fixing groove in which the elastic portion is fixed to the lower side of the first hermetic plate and the upper side of the second hermetic plate, respectively.

A part of the lower region of the shaft portion protrudes outwardly based on the center region thereof, and the second hermetic plate is formed in a circular ring shape having a through hole through which the center region of the shaft portion penetrates, and a bottom of the second hermetic plate is formed. It is preferable that the surface is in close contact with the protruding lower region.

It is effective to include a lubrication groove formed on the surface of the first hermetic plate adjacent to the O-ring and filled with a lubrication member therein. Lubricating oil or grease may be used as the lubricating member.

The O-ring portion includes at least one first O-ring portion positioned between the first hermetic plate and the lower bottom surface of the chamber portion, and at least one second O-ring portion positioned between the first hermetic plate and the shaft portion. It is desirable to.

The first hermetic plate is formed in a circular ring shape having a through hole through which the shaft portion passes, and at least one O-ring in which at least a portion of the first o-ring portion is introduced along the through hole in an upper surface of the first hermetic plate. The fixing groove is formed, it is effective to form at least one O-ring fixing groove in which at least a portion of the second O-ring portion is drawn in the side of the through hole of the first hermetic plate.

Preferably, the alignment unit includes an alignment stage unit that moves the plurality of shaft units to move the lower surface plate 300 in the X, Y, and θ directions.

An airtight plate fixing groove is formed in the shaft portion, and the first airtight plate is preferably fixed to the inside of the airtight plate fixing groove.

In addition, the airtight holding device for a vacuum chamber through which at least one shaft portion according to the present invention is provided, the first hermetic plate which is in close contact with the shaft portion and the outer surface of the vacuum chamber, the shaft portion and the vacuum chamber and At least one O-ring portion respectively positioned between the first hermetic plate, a second hermetic plate positioned below the first hermetic plate, and at least one elastic portion provided between the first hermetic plate and the second hermetic plate. It provides an airtight holding device for a vacuum chamber.

It is effective that the second hermetic plate is fixedly mounted on the shaft portion.

The vacuum chamber may include a stage portion for moving the shaft portion, and the second hermetic plate may be fixedly mounted to the stage portion.

It is preferable to include a lubrication groove formed on the surface of the first hermetic plate adjacent to the O-ring portion, and filled with a lubricating portion material therein.

The O-ring portion includes at least one first O-ring portion positioned between the first hermetic plate and the outer surface of the vacuum chamber, and at least one second O-ring portion positioned between the first hermetic plate and the shaft portion. Is effective.

As described above, the present invention can maintain the airtightness between the shaft part and the chamber part by using an airtight plate having an O-ring, thereby improving facility operation rate.

In addition, the present invention is provided with a groove in which the lubrication member is stored on the surface of the airtight plate in the area adjacent to the O-ring to reduce the friction between the O-ring and the chamber when the airtight plate moves.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention in more detail. It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know. Like numbers refer to like elements in the figures.

1 is a cross-sectional conceptual view of a substrate bonding apparatus according to an embodiment of the present invention. 2 is a conceptual diagram illustrating a movement for alignment of a lower table according to an embodiment. 3 is a perspective view of a partial region of the substrate bonding apparatus for explaining the airtight holding means according to one embodiment. 4 is a plan view of the airtight holding means according to the embodiment; 5 is a plan view illustrating an electrostatic chuck according to a modification of the embodiment.

6 and 7 are cross-sectional views of some regions of the substrate bonding apparatus for explaining the airtight holding means according to the modification of the embodiment.

1 to 5, the substrate bonding apparatus according to the present exemplary embodiment includes a chamber part 100 having an inner space, an upper surface plate 200 and a lower surface plate which are disposed to face each other in the chamber portion 100. 300 and the alignment unit 400 for moving the lower surface plate 300 to align the substrates respectively supported and fixed to the upper surface plate 200 and the lower surface plate 300, the alignment unit 400 and the The airtight holding means 500 which keeps the airtight between the chamber parts 100, and the upper stage part 600 which moves the upper surface plate 200 are provided. Here, although not shown, the substrate bonding apparatus of the present embodiment may further include a separate frame surrounding the chamber part 100 and the alignment part 400 and the upper stage part 600 are disposed.

The above-described chamber part 100 includes an upper chamber 110 and a lower chamber 120 forming a space for performing substrate bonding. At this time, it is effective that the upper chamber 110 and the lower chamber 120 is detachably coupled. In addition, the chamber unit 100 may further include a separate exhaust means 130 for exhausting impurities in the internal space. And, although not shown, the chamber part 100 may further include a separate pressure adjusting means for adjusting the pressure of the internal space of the chamber part 100.

In FIG. 1, the upper chamber 110 and the lower chamber 120 are coupled to each other. However, the present invention is not limited thereto, and the chamber part 100 may include an upper part, a side wall part, and a lower part. In addition, although not shown, an entrance through which the substrate enters and exits is provided at one side of the chamber part 100. In addition, a separate gate valve for opening and closing the entrance and exit may be further provided. Of course, the upper chamber 110 or the lower chamber 120 of the chamber part 100 may be elevated to allow the substrate to enter and exit the chamber part 100. In this case, separate lifting members for elevating each of the upper chamber 110 and the lower chamber 120 may be further provided.

As described above, the upper surface plate 200 and the lower surface plate 300 for supporting and fixing the first and second substrates 11 and 12 are disposed inside the chamber part 100 described above.

The upper surface plate 200 is disposed in the upper space of the chamber portion 100. That is, the inner side of the upper chamber 110 is located. At this time, the upper surface plate 200 is formed in a plate shape, and supports the first substrate 11 on the lower bottom surface. In this embodiment, a rectangular plate is produced. Of course, the upper surface plate 200 may be variously changed depending on the shape of the substrate located on the lower surface of the upper surface plate as well as the rectangular plate shape.

In addition, the lower surface plate 300 is disposed in the lower space of the chamber portion 100, that is, the inner surface of the lower chamber 120. That is, the lower surface plate 300 is disposed opposite the upper surface plate 200. The lower surface plate 300 is also produced in a plate shape. The lower surface plate 300 may be manufactured to have a shape similar or identical to that of the upper surface plate 200. The second substrate 12 is disposed on the upper bottom surface of the lower surface plate 300. As a result, the first and second substrates 11 and 12 are disposed to face each other. That is, the lower surface of the first substrate 11 and the upper surface of the second substrate 12 are disposed to face each other.

The upper surface plate 200 of the present embodiment is disposed on the upper table 210 and the upper table 210 of the plate shape and the upper electrostatic chuck 220 for supporting and fixing the first substrate 11 using the electrostatic force, Located in the upper table 210 is provided with an upper vacuum suction unit 230 for supporting the first substrate 11 through a vacuum force. That is, when the first substrate 11 is loaded into the chamber part 100, the upper surface plate 200 first supports the first substrate 11 by using the upper vacuum adsorption part 230. Thereafter, the first substrate 11 is supported and fixed by using the upper electrostatic chuck 220. This may prevent the first substrate 11 from being separated from the upper surface plate 200 even when the inside of the chamber part 100 is in a vacuum state.

Here, although not shown, the upper electrostatic chuck 220 includes a positive electrode pattern and a negative electrode pattern for generating electrostatic power, and a power supply unit for supplying power to the positive electrode pattern and the negative electrode pattern. This means that the positive electrode pattern is connected to one line and the negative electrode pattern is electrically connected to one line on the upper table 210. In addition, the upper table 210 and the upper electrostatic chuck 220 may be integrally manufactured.

However, the upper electrostatic chuck 220 of the present embodiment is not limited thereto, and as shown in the modification of FIG. 5, a plurality of upper electrostatic chucks 221 which are individually driven on the upper table 210 may be attached and manufactured. Can be. In this case, each of the plurality of upper electrostatic chucks 221 may be provided with a positive electrode and a negative electrode 222 to be driven separately. In this case, although each upper electrostatic chuck 221 is not shown, a buffer layer (ie, a cushion layer) may be provided under the electrode. In addition, although not limited thereto, the positive and negative electrode patterns formed on the upper table 210 may be divided into a plurality of groups, and the groups may be electrically connected to each other to individually drive the groups.

The upper vacuum suction unit 230 is located in the upper table 210 and the upper vacuum pipe 231 partially exposed to the lower surface of the upper electrostatic chuck 220, and the upper vacuum pipe 231 communicating with the upper vacuum pipe 231. A pump 232 is provided. Therefore, the vacuum force generated by the upper vacuum pump 232 may be provided to the first substrate 11 through the upper vacuum pipe 231.

In addition, the lower surface plate 300 of the present embodiment is disposed on the lower table 310 and the lower table 310 of the plate-like lower electrostatic chuck 320 for holding and fixing the second substrate 12 using the electrostatic force And a lower vacuum suction unit 330 positioned in the lower table 310 to support the second substrate 12 through a vacuum force. In this case, the lower surface plate 200 supports and fixes the second substrate 12 loaded into the chamber part 100 using the lower vacuum adsorption part 330 first, and then uses the lower electrostatic chuck part 320. Fix it.

At this time, the lower electrostatic chuck 320 is preferably manufactured in the same way as the upper electrostatic chuck described above. That is, a single positive and negative electrode pattern may be provided, a plurality of electrostatic chucks may be separately driven, or a positive and negative electrode pattern may be provided for driving in groups.

The lower vacuum suction unit 330 includes a lower vacuum pipe 331 for holding and fixing the second substrate 12 with a vacuum force, and a lower vacuum pump 332 for providing a vacuum force to the lower vacuum pipe 331.

In the present exemplary embodiment, the lower surface plate 300 is moved in the X, Y, and θ directions as shown in FIG. 2 to support and fix the first substrate 11 and the lower surface plate 300 which are fixed to the upper surface plate 200. An alignment unit 400 for aligning the second substrates 12 is provided. That is, the upper surface plate 200 is used as a reference to move the lower surface plate 300 in the X, Y, and θ directions to align the first substrate 11 and the second substrate 12. Here, the upper surface plate 200 moves in the vertical direction only to seal the two substrates together.

The alignment unit 400 penetrates the chamber part 100 and moves the plurality of shaft parts 410 connected to the lower surface plate 300, and the plurality of shaft portions 410 to move the lower surface plate 300. It is provided with an alignment stage unit 420 to move the X, Y and θ in the direction.

In this case, as illustrated in FIGS. 1 and 3, a plurality of through holes 121 through which each of the plurality of shaft parts 410 penetrate are provided on the bottom surface of the chamber part 100. In the present embodiment, four shaft portions 410 are used. That is, each of the four shaft parts 410 is positioned at four corner regions of the lower surface plate 300 and is fixed to the lower surface plate 300. At this time, the shaft portion 410 and the lower surface plate 300 may be fixed by a predetermined fixing means. This allows the lower surface plate 300 to move together when the plurality of shaft portions 410 are moved. At this time, the movement of the shaft portion 410 is determined by the size of the through hole 121. That is, the separation distance between the shaft part 410 and the through hole 121 becomes the maximum separation distance of the shaft part 410. In this embodiment, it is effective that the separation distance is 0.2 to 100 mm. When the distance is smaller than the distance, the alignment movement is limited, and when the distance is larger than the above range, airtightness may not be maintained.

In the present exemplary embodiment, as shown in FIGS. 1 and 3, a concave groove 311 in which a part of the shaft part 410 is mounted and fixed is formed in a lower bottom region of the lower surface plate 300. That is, the upper end of the shaft portion 410 is inserted into the concave groove 311 so that the moving force of the shaft portion 410 may be provided to the lower surface plate 300 through the concave groove 311.

Each of the shaft portions 410 is manufactured in a circular columnar shape, the upper end portion of which is fixed to the lower surface plate 300, and the lower end portion is connected to the alignment stage portion 420. The alignment stage unit 420 applies a moving force in the X, Y, and θ directions to the plurality of shaft units 410.

In addition, the present embodiment is provided with an airtight holding means 500 for maintaining the airtight between the alignment unit 400 and the chamber 100. At this time, the airtight holding means 500 maintains the airtight in the space between the shaft portion 410 of the alignment unit 400 and the through hole 121 of the chamber 100.

As shown in FIG. 3, the airtight holding means 500 includes a first airtight plate 510 which is in close contact with each of the shaft part 410 of the alignment part 400 and the lower bottom surface of the chamber part 100, and the shaft. An O-ring portion 520 positioned between the portion 410 and the chamber portion 100 and the first hermetic plate 510, and an agent disposed below the first hermetic plate 510 and fixedly mounted to the shaft portion 410. And a second airtight plate 530 and at least one elastic part 540 provided between the first and second airtight plates 510 and 530.

The first hermetic plate 510 is manufactured in the shape of a circular ring having an inner through hole as shown in FIG. 4. Here, when the shaft portion 410 is cylindrical, it is effective that the inner diameter of the inner through hole of the circular ring (ie, the diameter of the inner opening) is the same as the diameter of the central region of the shaft portion 410 penetrating it. Of course, the shape of the inner through hole may be variously changed according to the shape of the shaft portion 410.

The upper surface of the first hermetic plate 510 is in close contact with the bottom bottom of the chamber part 100, and the inner wall surface of the first hermetic plate 510 is in close contact with the shaft part 410. Through this, the airtightness of the chamber part 100 may be maintained in the region where the alignment part 400 penetrates.

The O-ring portion 520 may include at least one first O-ring portion 520a positioned between the first hermetic plate 510 and the lower bottom surface of the chamber part 100, the first hermetic plate 510, and the shaft portion. At least one second O-ring portion 520b is disposed between the 410.

Here, as shown in FIG. 3, an upper ring region of the first airtight plate 510 is provided with an O-ring fixing groove in which the first O-ring portion 520a is inserted and fixed. At this time, a part of the first O-ring part 520a is inserted into the O-ring fixing groove, and the other part protrudes out of the O-ring fixing groove. As illustrated in FIG. 4, the first O-ring portion 520a is disposed along the inner periphery of the first hermetic plate 510. That is, the first O-ring portion 520a is manufactured in a circular ring shape. In addition, an O-ring fixing groove in which the second O-ring part 520b is inserted and fixed is provided in the side wall surface area of the first hermetic plate 510. A part of the second O-ring part 520b also enters the O-ring fixing groove and a part of the second O-ring part 520b protrudes. In addition, the second O-ring 520b is also manufactured in a circular ring shape like the first O-ring 520a.

As described above, in the present exemplary embodiment, the region of the chamber portion 100 through which the shaft portion 410 of the alignment portion 400 passes is sealed by using the first airtight plate 510 and the O-ring portion 520 positioned on the surface thereof. The airtightness of the chamber part 100 can be maintained.

At this time, the shaft portion 410 of the present embodiment is moved in the X, Y and θ direction by the alignment stage portion 420. Therefore, the first hermetic plate 510 in close contact with the shaft portion 410 also moves in the X, Y and θ directions. That is, the first hermetic plate 510 moves in the X, Y, and θ directions on the lower bottom surface of the chamber part 100.

This movement may cause a problem in that airtight is destroyed between the first hermetic plate 510 and the lower bottom surface of the chamber part 100.

In this embodiment, the second hermetic plate 530 fixedly mounted to the shaft portion 410 is positioned below the first hermetic plate 510 and has at least one elasticity between the first and second hermetic plates 510 and 530. By arranging the portion 540, the first hermetic plate 510 is pushed to the lower bottom surface of the chamber portion 100 by a pushing force by the elastic portion. As a result, the airtight between the chamber part 100 and the first airtight plate 510 may be prevented from being destroyed when the first airtight plate 510 is moved.

At this time, the second hermetic plate 530 is fixedly mounted to the shaft portion 410. In the present embodiment, as shown in FIGS. 1 and 3, the kft portion 410 is manufactured in a shape in which the diameter of the lower region is larger than that of the central region. In other words, the lower partial region is produced in a shape that protrudes from the central region. At this time, the second hermetic plate 530 is manufactured in substantially the same shape as the first hermetic plate 510, the central region of the shaft portion 410 penetrates the central region of the second hermetic plate 530, Its lower side is mounted in the protruding region of the shaft portion 410. Through this, the second hermetic plate 530 may be fixed to the shaft portion 410. Of course, the present invention is not limited thereto, and the second hermetic plate 530 may be mounted to the shaft portion 410 through a separate fixing means. In addition, a predetermined concave groove may be formed in a lower region of the shaft part 410, and the second hermetic plate 530 may be fixed to the concave groove. In this case, the second hermetic plate 530 may be manufactured separately into a plurality of regions.

As described above, at least one elastic portion 540 is positioned between the first and second hermetic plates 510 and 530. At this time, it is preferable to use a compression spring as the elastic portion 540. As shown in FIG. 3, elastic fixing grooves are provided in the lower side of the first hermetic plate 510 and the upper side of the second hermetic plate 530. Herein, the elastic part 540 may be fixedly inserted into the ballistic fixing groove to prevent the elastic part 540 from being separated. In FIG. 3, a plurality of elastic parts are disposed between the first and second airtight plates 510 and 530. However, the present invention is not limited thereto, and one elastic part 540 may be provided between the first and second hermetic plates 510 and 530.

In addition, in the present embodiment, as shown in FIG. 3, a guide pin 550 fixed to the first hermetic plate 510 is provided through the inner regions of the second hermetic plate 530 and the elastic part 540. do. By placing the guide pin as described above, the force of the coalesced portion 540 may be smoothly transmitted to the first hermetic plate 510, and the separation of the elastic portion 540 may be prevented.

In addition, the present invention is not limited thereto, and in the present embodiment, since the first airtight plate 510 on which the O-ring part 520 is mounted moves in the X or Y-axis direction in close contact with the lower surface of the chamber part 100. Friction can occur greatly between them. 6, at least one lubrication groove 560 is formed on the upper surface of the first hermetic plate 510, and a lubrication member may be filled inside the lubrication groove 560. When the first airtight plate 510 on which the O-ring part 520 is mounted moves in the X or Y-axis direction while being in close contact with the lower surface of the chamber part 100, the lubricating member in the lubrication groove 560 is moved. Friction can be reduced by spreading on the travel distance of. Through this, the shaft portion 410 can be smoothly moved. Here, lubricating oil or grease may be used as the lubricating member. In this embodiment, vacuum grease is used. Here, a lubrication groove filled with a lubrication member may be formed in the side wall surface of the first hermetic plate 510.

In addition, at least one airtight plate fixing groove 411 is formed in the shaft portion 410 as in the modification of FIG. 7, and the first airtight plate 510 and the first airtight plate 510 are formed inside the airtight plate fixing groove 411. 2 hermetic plate 530 may be fixed. At this time, it is effective that the second O-ring portion 520b is disposed in an area between the airtight plate fixing groove 411 and the first airtight plate 510. And, as shown in FIG. 7, a hermetic plate moving groove 101 is formed on the bottom bottom of the chamber part 100, and a protrusion 511 in which a part of the first hermetic plate 510 protrudes upward is formed. It may be in close contact with the bottom surface of the airtight plate moving groove (101). In this case, the first O-ring portion 520a may be located in a region between the first hermetic plate 510 and the bottom surface of the hermetic plate moving groove 101. In addition, a moving elastic part 570 may be positioned between the protrusion 511 of the first hermetic plate 510 and the side surface of the hermetic plate moving groove 101. Through this, it is possible to improve the airtight ability of the chamber part 100 and to smoothly move the shaft part 410. In addition, the support elastic part 580 may be located between the second hermetic plate 530 and the alignment stage part 420.

In this embodiment, even when the alignment unit 400 moves in the X, Y, and θ directions through the airtight holding means 500, the airtightness between the alignment unit 400 and the chamber unit 100 can be maintained. As such, the second substrate 12 on the lower surface plate 300 and the first substrate 11 below the upper surface plate 200 are aligned through the movement of the alignment unit 400.

In this case, although not shown, the first and second substrates 11 and 12 may be aligned through the optical system. That is, the alignment marks are positioned on the first and second substrates 11 and 12, respectively, and the alignment marks of the two substrates are observed by using an optical system (that is, a camera) to confirm the alignment.

After the two substrates 11 and 12 are aligned in this manner, the upper surface plate 200 is driven to seal the two substrates 11 and 12 together.

Here, in order to give a driving force to the upper surface plate 200, in this embodiment, the upper stage unit 600 is provided.

The upper stage unit 600 includes at least one upper driving shaft 610 connected to the upper surface plate 200 and an upper driving unit 620 for applying a driving force to the upper driving shaft 610 as shown in FIG. 1. . Here, the upper stage part 600 may pressurize to lower the upper surface plate 200 through the upper driver 620 and the upper drive shaft 610 to bond the first and second substrates 11 and 12 to each other. Can be.

In this case, a bellows may be used to maintain airtightness between the upper driving shaft 610 and the chamber part 100 of the present embodiment. However, the present invention is not limited thereto, and it is possible to use the airtight holding means of the present embodiment as described above.

In the above-described embodiment, a substrate bonding apparatus for bonding and sealing two substrates in a vacuum chamber has been described. However, the present invention is not limited thereto, and the airtight holding device including the first airtight plate, the second airtight plate, the O-ring part, and the elastic part may be applied to various types of vacuum chambers. In other words, it may be applied to vacuum chambers having a plurality of shafts and pins penetrated into the chamber in which a predetermined process is performed after the inner space is sealed with the outside. That is, vacuum chambers, such as a thin film deposition chamber, a thin film etching chamber, and an organic film deposition chamber, are mentioned, for example. At this time, a plurality of shafts or pins penetrate into the vacuum chamber as described above. At this time, the first hermetic plate is in close contact with the outer surface (ie, the upper surface, the lower surface or the side wall surface) of the vacuum chamber and the shaft or pin, and at least one between the outer surface of the vacuum chamber and the shaft or pin. O-ring is located. Then, the second hermetic plate is located below the first hermetic plate, and is fixed to a shaft, a pin or a stage, and the like, and an elastic portion is provided between the first hermetic plate and the second hermetic plate to improve the vacuum force (sealing force) by the O-ring portion. have.

Although the invention has been described with reference to the accompanying drawings and the preferred embodiments described above, the invention is not limited thereto, but is defined by the claims that follow. Accordingly, one of ordinary skill in the art may variously modify and modify the present invention without departing from the spirit of the following claims.

1 is a cross-sectional conceptual view of a substrate bonding apparatus according to an embodiment of the present invention.

2 is a conceptual diagram illustrating a movement for alignment of a lower table according to an embodiment.

3 is a perspective view of a part of the substrate bonding apparatus for explaining the airtight holding means according to one embodiment;

4 is a plan view of the airtight holding means according to the embodiment;

5 is a plane conceptual view illustrating an electrostatic chuck according to a modification of the embodiment;

6 and 7 are cross-sectional views of a partial region of the substrate bonding apparatus for explaining the airtight holding means according to the modification of the embodiment;

<Explanation of symbols for the main parts of the drawings>

100: chamber 200: upper surface plate

300: lower surface plate 400: alignment unit

410: shaft portion 420: alignment stage portion

500: confidentiality means 510, 530: airtight plate

520: O-ring portion 540: elastic portion

600: upper stage part

Claims (15)

Chamber portion; An upper surface plate and a lower surface plate respectively disposed in the chamber portion to face each other; An alignment unit for moving the lower platen in X, Y, and θ directions to align the substrates respectively supported and fixed to the upper plate and the lower plate; And Airtight holding means for maintaining the airtightness between the alignment portion and the chamber portion, The alignment portion includes a plurality of shaft portions connected to the lower surface plate through the bottom of the chamber portion, The confidentiality means, A first hermetic plate in close contact with the bottom surface of the shaft portion and the chamber portion, respectively; And at least one O-ring portion respectively positioned between the chamber portion and the first hermetic plate and between the shaft portion and the first hermetic plate. The method according to claim 1, The hermetic holding means includes a second hermetic plate positioned below the first hermetic plate and fixedly mounted to the shaft portion, and at least one elastic portion provided between the first and second hermetic plates. The method according to claim 2, And an elastic fixing groove in which the elastic portion is fixed, respectively, on the lower side surface of the first hermetic plate and the upper side area of the second hermetic plate. The method according to claim 2, A part of the lower region of the shaft portion protrudes outwardly based on the center region thereof, and the second hermetic plate is formed in a circular ring shape having a through hole through which the center region of the shaft portion penetrates, and a bottom of the second hermetic plate is formed. A substrate bonding apparatus in which a surface is in close contact with the protruding lower region. The method according to claim 1 or 2, And a lubrication groove formed on a surface of the first hermetic plate adjacent to the O-ring portion and filled with a lubrication member therein. The method according to claim 5, Substrate bonding apparatus which uses lubricating oil or grease as said lubricating member. The method according to claim 1 or 2, The O-ring portion includes at least one first O-ring portion positioned between the first hermetic plate and the lower bottom surface of the chamber portion, and at least one second O-ring portion positioned between the first hermetic plate and the shaft portion. Substrate bonding apparatus. The method of claim 7, The first hermetic plate is formed in a circular ring shape having a through hole through which the shaft portion passes, and at least one O-ring in which at least a portion of the first o-ring portion is introduced along the through hole in an upper surface of the first hermetic plate. And a fixing groove is formed, and at least one O-ring fixing groove into which at least a portion of the second O-ring portion is inserted is formed at a side surface of the through hole of the first hermetic plate. The method according to claim 1 or 2, And the alignment unit includes an alignment stage unit that moves the plurality of shaft units to move the lower surface plate 300 in the X, Y, and θ directions. The method according to claim 1 or 2, An airtight plate fixing groove is formed in the shaft portion, And the first hermetic plate is fixed inside the hermetic plate fixing groove. An airtight holding device for a vacuum chamber in which at least one shaft portion passes, A first hermetic plate in close contact with the shaft portion and an outer surface of the vacuum chamber, respectively; At least one O-ring portion respectively positioned between the vacuum chamber and the first hermetic plate, the shaft portion and the first hermetic plate; A second hermetic plate located below the first hermetic plate; And An airtight holding device for a vacuum chamber including at least one elastic portion provided between the first hermetic plate and the second hermetic plate. The method of claim 11, And the second hermetic plate is fixedly mounted to the shaft part. The method of claim 11, The vacuum chamber is provided with a stage portion for moving the shaft portion, the airtight holding device for a vacuum chamber in which the second hermetic plate is fixedly mounted to the stage. The method according to any one of claims 11 to 13, And a lubrication groove formed on a surface of the first hermetic plate adjacent to the O-ring portion and filled with a lubrication member therein. The method according to any one of claims 11 to 13, The O-ring portion includes at least one first O-ring portion positioned between the first hermetic plate and the outer surface of the vacuum chamber, and at least one second O-ring portion positioned between the first hermetic plate and the shaft portion. The airtight holding device for a vacuum chamber.

Images