KR20100023577A - Ceramic component element and ceramic components using the same - Google Patents

Abstract

PURPOSE: A ceramic component element and a ceramic components using the same is provided to absorb external physical impact by using elastic property of an elastic adhesive. CONSTITUTION: A ceramic component element(100) comprises a ceramic base(10), an elastic adhesive(20), and a conductive sheet(30). The elastic adhesive is laminated in one side of the ceramic base. The conductive sheet is laminated on the elastic adhesive. The conductive sheet elastically is attached to the ceramic base through the hardening of the elastic adhesive. The elastic adhesive is a heat-proof silicon rubber.

Description

Ceramic component element and ceramic components using the same}

The present invention relates to a ceramic component element, and more particularly to a ceramic component element resistant to physical impacts applied from the outside. It also relates to ceramic component elements provided with economical conductive sheets and reliable sealing.

Recently, with the development of the electronics industry, the size of electronic devices is getting smaller, the processing speed is getting faster, and the processing capacity is getting bigger. In accordance with the demand for high functionalization of such electronic devices, the importance of ceramic parts resistant to physical shocks is increasing.

Such a ceramic part is manufactured by forming a metal layer on the surface of a ceramic substrate. For example, a method of forming a metal material such as gold, silver, copper, aluminum, nickel or an alloy containing them on the surface of an alumina substrate or the like by sputtering or plating, and the metal paste containing the metal material described above. Or a method of forming a metal layer on the surface of a ceramic substrate by using a bonding technique such as diffusion bonding of the metal foil composed of the metal material.

However, the ceramic components manufactured by the above method have the following problems because the ceramic substrate and the metal layer are not elastically bonded.

When the metal layer is formed by sputtering or plating, the metal layer is formed to an extremely thin thickness, thereby limiting the range of use, and in order to form the metal layer thickly, the manufacturing cost increases.

In addition, when the metal layer is formed by the printing of the metal paste, there is a disadvantage that the manufacturing cost increases to lower the electrical resistance.

Moreover, when bonding a metal foil made of a metal material to form a metal layer, since the metal foil is bonded to the ceramic substrate by applying a constant pressure, the ceramic substrate having a high brittleness as compared to the metal during the pressing is broken or the metal foil is broken. There is a problem that and the ceramic substrate is separated.

On the other hand, according to the prior art Patent Publication No. 2001-0071232 (name: manufacturing method of metal foil / ceramic bonding material and metal foil laminated ceramic substrate), the surface to be bonded of the metal foil and the surface to be bonded of the ceramic material are activated and cleaned by ion etching. Then, a metal foil laminated ceramic substrate produced by press-bonding a surface to be joined of a metal foil to a surface to be joined of a ceramic material to form a metal foil / ceramic bonding material and cutting to a predetermined dimension is proposed.

The conventional metal foil laminated ceramic substrate has a problem in that manufacturing time and cost increase because the surface to be bonded of the metal foil and the surface to be bonded of the ceramic material must be activated and cleaned by ion etching.

In addition, the conventional ceramic substrate and the ceramic substrate is bonded by a non-elastic adhesive such as an epoxy resin, there is a problem that is weak from the external impact and is not well sealed with the outside.

Accordingly, it is an object of the present invention to provide a ceramic component element capable of absorbing external physical shocks by utilizing the elasticity of the elastic adhesive.

Another object of the present invention is to provide a ceramic component which is inexpensive to manufacture, has a large allowable rated current and is excellent in electrical conductivity.

Another object of the present invention is to provide a ceramic component in which the conductive sheet is reliably bonded and sealed.

Still another object of the present invention is to provide a ceramic component suitable for various applications using the ceramic component element described above.

The above object, the ceramic base; An elastic adhesive laminated on one surface of the ceramic base; And a conductive sheet laminated on the elastic adhesive and elastically bonding with the ceramic base by curing the elastic adhesive.

Preferably, the ceramic base is a pre-fired ceramic substrate and may be formed of any one of a magnetic ceramic such as piezoelectric ceramic and ferrite, alumina, aluminum nitride, magnesia or low temperature calcined ceramic (LTCC).

Preferably, the elastic adhesive may be a heat resistant silicone rubber formed by bonding a liquid heat resistant silicone rubber paste by curing, and the elastic adhesive may include any one of a conductive powder, a magnetic powder, and a piezoelectric powder.

Preferably, the conductive sheet may be a metal foil having a constant thickness or a cross section FCCL (Flexible Copper Clad Laminate) formed integrally with the metal foil.

In addition, the above object, a ceramic base; An elastic adhesive layered on at least one of a surface or a rear surface of the ceramic base; A conductive sheet laminated on the elastic adhesive and elastically bonding to the ceramic base by curing the elastic adhesive; And external electrodes formed on opposite sides of the ceramic base and electrically connected to the conductive sheet.

Preferably, the cover sheet may be formed on the conductive sheet. The cover sheet protects the conductive sheet from the external environment or imparts additional electrical performance to the conductive sheet.

In addition, the above object, a ceramic base; A first elastic adhesive laminated on the surface of the ceramic base; A first conductive sheet laminated on the first elastic adhesive and elastically bonded to the ceramic base by curing the first elastic adhesive; A second elastic adhesive laminated on the rear surface of the ceramic base; And a second conductive sheet laminated on the second elastic adhesive and elastically bonding to the ceramic base by curing the second elastic adhesive.

In addition, the above object, a ceramic base; A first elastic adhesive laminated on the surface of the ceramic base; A first conductive sheet laminated on the first elastic adhesive and elastically bonded to the ceramic base by curing the first elastic adhesive; A second elastic adhesive laminated on the rear surface of the ceramic base; A second conductive sheet laminated on the second elastic adhesive and elastically bonding to the ceramic base by curing the second elastic adhesive; And external electrodes formed on opposite sides of the ceramic base and electrically connected to the first and second conductive sheets.

Preferably, the cover sheet may be formed on the first conductive sheet or the second conductive sheet.

In addition, the first conductive sheet and the second conductive sheet may be made of the same material, and the first elastic adhesive and the second elastic adhesive may be made of the same material. That is, the same thermal expansion coefficient, etc. must be made of the same material to obtain a reliable adhesion and sealing effect.

The above object, the ceramic base; A first elastic adhesive laminated on one side of the ceramic base; A conductive sheet laminated on the first elastic adhesive and elastically bonding to the ceramic base by curing the first elastic adhesive; A second elastic adhesive laminated on the conductive sheet; And a ceramic cover laminated on the second elastic adhesive and elastically bonded to the conductive sheet by curing of the second elastic adhesive.

Preferably, the ceramic base and the ceramic cover may be formed of the same material. The ceramic cover serves to protect the conductive sheet physically or chemically.

The above object, the ceramic base; An elastic adhesive laminated on one surface of the ceramic base; And a conductive sheet laminated over the elastic adhesive and elastically bonding with the ceramic base by curing the elastic adhesive, wherein the conductive sheet is achieved by a ceramic component element separated by one or more insulating gaps.

In addition, the above object, a ceramic base; An elastic adhesive layered on at least one of a surface or a rear surface of the ceramic base; A conductive sheet laminated on the elastic adhesive and separated by one or more insulating gaps, the conductive sheet elastically bonding with the ceramic base by curing the elastic adhesive; A cover sheet laminated on the conductive sheet; And external electrodes formed on opposite sides of the ceramic base and electrically connected to the separated conductive sheets.

Preferably, the insulating gap may be filled with an electrically functional material. The electrically functional material may be selected from magnetic, piezoelectric or dielectric materials. Also preferably an electrically functional powder mixed with a polymer is used.

The above object, the ceramic base; An elastic adhesive layered on at least one of a surface or a rear surface of the ceramic base; A conductive sheet laminated on the elastic adhesive and separated by one or more insulating gaps, the conductive sheet elastically bonding with the ceramic base by curing the elastic adhesive; A cover sheet laminated on the conductive sheet; External electrodes formed on opposite sides of the ceramic base and electrically connected to the separated conductive sheets; And auxiliary conductors formed over the respective conductive sheets to electrically connect the respective conductive sheets.

Preferably, the auxiliary conductor may be any one of a metal foil, an FCCL, and a bonding wire.

The above object, the ceramic base; An elastic adhesive layered on at least one of a surface or a rear surface of the ceramic base; A conductive sheet laminated on the elastic adhesive and elastically bonding to the ceramic base by curing the elastic adhesive; And external electrodes formed on opposite sides of the ceramic base and electrically connected to the conductive sheet, and the ceramic is formed by cutting the conductive sheet to form a bridge having a narrow width in a longitudinal middle portion of the conductive sheet. Achieved by parts.

Preferably, grooves may be formed in the ceramic base across the bridge.

According to the above structure, the external physical shock can be absorbed by the elasticity of the elastic adhesive, and the ceramic base and the conductive sheet can be prevented from being separated by the physical shock.

In addition, by using the metal foil as the conductive sheet, the manufacturing cost is low, the large allowable rated current and the electrical conductivity are excellent.

In addition, the conductive sheet is reliably bonded and sealed by the elastic adhesive.

In addition, the upper and lower surfaces can be distinguished, and reel taping for vacuum pickup is easy.

Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention;

First Example

1 is a perspective view of a ceramic component element according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line AA ′ of FIG. 1.

1 and 2, the ceramic component element 100 is adhered thereon through a ceramic base 10, an elastic adhesive 20 stacked on a surface of the ceramic base 10, and an elastic adhesive 20. Made of a conductive sheet 30.

(1) ceramic base (10)

The ceramic base 10 may be, for example, a ceramic substrate molded in the form of a substrate and pre-fired. The ceramic base 10 may be any one of a low temperature calcined ceramic (LTCC) substrate, an alumina substrate, an aluminum nitride substrate, a ferrite ceramic substrate, or a piezoelectric ceramic substrate, and the alumina substrate may be used in consideration of sufficient mechanical strength and economic efficiency. It is preferable.

The ceramic base 10 of the alumina substrate has a good thermal conductivity, small deformation due to heat, and high mechanical strength.

On the other hand, the ceramic base 10 may be selected according to the purpose of use of the ceramic component 100, for example, an aluminum nitride substrate to increase the thermal conductivity, a ferrite ceramic substrate having a magnet to attenuate electromagnetic noise, and a piezoelectric effect. In order to have a piezoelectric ceramic substrate can be selected and used. As an example, when a ferrite substrate including Ni-Mn as a main component of the ceramic base 10 is used, a part of noise of current flowing through the conductive sheet 30 may be attenuated.

The thickness of the ceramic base 10 is preferably between 0.2 and 0.5 mm in the case of a surface mount (SMD) small chip component having an external electrode, but may be thicker than this when a large size or high mechanical strength is required such as an electrostatic chuck. Can be.

(2) elastic adhesive (20)

The elastic adhesive 20 is a curable elastic adhesive that has elasticity and is not melted by heat after being cured. The elastic adhesive 20 is a method of casting or screen printing a liquid elastic adhesive onto the surface of the ceramic base 10. After coating to a constant thickness by curing, it is formed by curing with heat or moisture. Once hardened, they are not melted again by heat, so they maintain reliable adhesion even at high temperatures such as soldering.

The thickness of the elastic adhesive 20 may be formed between 0.03 and 0.2 mm, the hardness after curing may be, for example, shore A 10 to 50.

Since the elastic adhesive 20 can absorb external physical shocks by inherent elasticity, the ceramic base 10 and the conductive sheet 30 can be effectively prevented from being separated by external physical shocks.

In addition, the elastic adhesive 20 is excellent in the sealing (moisture) effect of the moisture-proof and waterproof, and elastic bonding by curing provides reliable adhesion and sealing. Preferably, the elastic adhesive 20 may be a silicone rubber adhesive in which a liquid silicone rubber paste is bonded and formed by curing. Therefore, by reliably preventing the penetration of moisture and other foreign matter between the ceramic base 10 and the conductive sheet 30, it is possible to prevent separation of the ceramic base 10 and the conductive sheet 30. Moreover, it provides economically reliable bonding and sealing when bonding with the ceramic cover 60 of FIG.

Meanwhile, any one or two or more of conductive powder, magnetic powder, or piezoelectric powder may be selectively mixed in the elastic adhesive 20. According to such a configuration, it can have inherent characteristics by the dispersion-mixed functional powder, for example, it can be provided with electrical or magnetic properties or piezoelectric properties.

(3) conductive sheet (30)

The conductive sheet 30 is laminated thereon via the elastic adhesive 20, and is bonded to the ceramic base 10 by curing the elastic adhesive 20.

The conductive sheet 30 is a metal foil formed of any one of silver, gold, copper, aluminum, nickel, iron, or an alloy containing them, or a cross-section flexible copper clad laminate formed by forming a metal foil integrally on one surface of a polyimide film. : Flexible copper foil laminated film). In the case of the cross-sectional FCCL, a metal layer may be formed by plating or the like instead of the metal foil.

In particular, when the conductive sheet 30 is a metal foil, by selectively applying the material and thickness of the metal foil, it is possible to economically manufacture the ceramic component 100 of various standards. In addition, since the metal foil is dense and dense, the metal foil has excellent electrical conductivity, and the price is low, so that the ceramic part 100 may be manufactured at low cost.

Preferably, the conductive sheet 30 may form a conductive pattern to have an insulating gap by etching, which is a chemical method, or by laser or the like, which is a mechanical method. In particular, when the conductive sheet 30 is FCCL, it is easy to have a finer conductive pattern.

In addition, the thickness of the conductive sheet 30 is selected in consideration of an allowable rated current or a thermal expansion coefficient, and the like, and may be, for example, 0.003 to 0.2 mm.

In this case, the thermal expansion coefficient of the ceramic base 10 is the lowest and the elastic adhesive 20 is the highest, but the elastic adhesive 20 is bonded with elasticity can provide a reliable adhesion in response to changes in the surrounding environment. Furthermore, when the thermally conductive powder is mixed with the elastic adhesive 20, the coefficient of thermal expansion is low.

Meanwhile, another metal layer may be plated on the conductive sheet 30 for corrosion resistance.

3 shows an example of a ceramic component using the ceramic component element according to the first embodiment of FIG. 1.

As shown, the ceramic component 110 includes external electrodes 40 formed on opposite sides of the ceramic component element 100 so as to be electrically connected to at least the conductive sheet 30. The external electrode 40 is made by a dipping process using a metal paste such as nickel or tin, which is a common technique.

According to this structure, the external electrode 40 can be used as a ceramic chip component capable of surface mounting by soldering.

3A illustrates a modification of the ceramic component of FIG. 3.

As shown, the conductive sheet 30 forms a bridge 32 having a narrow width in the longitudinal middle portion by etching or the like. According to this structure, when the bridge 32 acts as a fuse, when the overcurrent flows in, the narrow bridge 32 is melted and broken by heat. Preferably, a groove 12 is formed in the ceramic base 10 across the bridge 32 to cause the molten bridge 32 to fall into the groove 12. Although not shown, an insulating protective film is laminated on the conductive sheet 30.

4 illustrates another modified example of the ceramic component of FIG. 3.

As shown, the ceramic component 120 includes a cover sheet 50 that is stacked over the conductive sheet 30 of the ceramic component element 100. Here, the cover sheet 50 is formed on the surface of the conductive sheet 30.

The material of the cover sheet 50 may be selected and used according to the use of the ceramic component 120. That is, the cover sheet 50 is used for protecting the conductive sheet 30 from the external environment or for imparting additional electrical functions to the conductive sheet 30. For example, when the ceramic component 120 is used as a chip component or a chip fuse for a current sensor, the cover sheet 50 may be formed of a heat resistant polymer resin such as an epoxy resin, and the ceramic component 120 may be made of an elastic electrical contact. When used as a terminal, the cover sheet 50 may be formed of an electrically conductive heat resistant elastic rubber having a constant thickness, such as electrically conductive rubber. In addition, when the ceramic component 120 is used as a component for the current sensor to reduce the noise, it may be formed of a heat-resistant polymer resin mixed with ferrite powder. The cover sheet 50 may be formed by a printing or dispensing process.

2nd Example

5 is a cross-sectional view of the ceramic component element 200 according to the second embodiment of the present invention.

As shown, the ceramic component element 200 according to the second embodiment of the present invention includes a first elastic adhesive 20 laminated on the surface of the ceramic base 10 and the ceramic base 10, and the first elastic adhesive. The first conductive sheet 30 adhered to the top surface 20, the second elastic adhesive 21 laminated on the rear surface of the ceramic base 10, and the second conductive sheet 31 bonded under the second elastic adhesive 21. It consists of

In this case, the first and second elastic adhesives 20 and 21 may be silicone rubber adhesives, and are preferably formed of the same material. In addition, the first and second conductive sheets 30 and 31 may be metal foil or FCCL selectively used, preferably formed of the same.

6 illustrates an example of a ceramic component using the ceramic component element according to the second embodiment of FIG. 5.

As shown, the ceramic component 210 includes external electrodes 40 formed on opposite sides of the ceramic component 210 to be electrically connected to at least the first and second conductive sheets 30 and 31.

7 illustrates a modification of the ceramic component of FIG. 6.

As shown, the ceramic component 220 includes a cover sheet 50 that is stacked over the first conductive sheet 30 of the ceramic component element 200. In this example, the cover sheet 50 is laminated on the first conductive sheet 30. Here, the cover sheet 50 is formed by bonding on the surface of the conductive sheet 30.

As described above, the material of the cover sheet 50 may be selected and used according to the use of the ceramic component 220.

3rd Example

8 is a cross-sectional view of a ceramic component element 300 according to a third embodiment of the present invention.

As shown, the ceramic component element 300 according to the third embodiment of the present invention includes a first elastic adhesive 20 laminated on a surface of the ceramic base 10 and the ceramic base 10, and a first elastic adhesive. And a ceramic cover 60 bonded to the second elastic adhesive 23 and the second elastic adhesive 23 stacked on the conductive sheet 30.

Preferably, the conductive sheet 30 does not exist in the portion adjacent to the edges of the ceramic base 10 and the ceramic cover 60, so that the ceramic base 10 and the ceramic cover 60 are formed of the first or second elastic adhesive ( It is directly bonded by 20 to seal the conductive sheet 30 to protect it from the external environment.

In this case, the conductive sheet 30 disposed therein may be electrically connected to the outside by a hole (not shown) or a through hole (not shown) formed in the ceramic base 10 or the ceramic cover 60.

In this case, the first and second elastic adhesives 20 and 23 may be silicone rubber adhesives, and are preferably formed of the same material. In other words, the same thermal expansion coefficient, etc. must be used to ensure reliable adhesion and sealing.

In addition, the ceramic base 10 and the ceramic cover 60 may be any one of a low temperature calcined ceramic (LTCC) substrate, an alumina substrate, an aluminum nitride substrate, a ferrite ceramic substrate, or a piezoelectric ceramic substrate, and are preferably formed of the same material. Do. That is, the same material must be used to have the same coefficient of thermal expansion, thus providing reliable electrical performance.

4th Example

9 is a cross-sectional view of a ceramic component element 400 according to a fourth embodiment of the present invention.

As shown, the ceramic component element 400 according to the fourth embodiment of the present invention comprises an elastic adhesive 25 laminated on the surface of the ceramic base 10 and the ceramic base 10, and on the elastic adhesive 25. It consists of a conductive sheet 35 which is bonded and separated by one or more insulating gaps 36.

The elastic adhesive 25 is a curable elastic adhesive that has elasticity and is not melted again by heat after being cured. A liquid elastic adhesive has a constant thickness by casting or screen printing on the surface of the ceramic base 10. After application, it is cured and formed by heat or moisture. It is preferably heat curable in order to improve the working speed.

The elastic adhesive 25 may be a heat-resistant silicone rubber adhesive having excellent adhesion and sealing effects and having elasticity and heat resistance. The thickness of the elastic adhesive 25 may be formed between 0.03 and 0.2 mm.

On the other hand, the elastic adhesive 25 can optionally be dispersed and mixed with any one or two or more of conductive powder, magnetic powder or piezoelectric powder.

The conductive sheet 35 is laminated on top of the elastic adhesive 25 and adhered by curing of the elastic adhesive 25, and may be separated by one or more insulating gaps 36.

The insulating gap 36 is formed by mechanical processing such as a dicing saw after the conductive sheet 35 is bonded by curing of the elastic adhesive 25 or by chemical processing such as etching. Can be. In the case of FCCL, an insulation gap can be formed by etching or the like in advance.

The conductive sheet 35 may selectively use FCCL in which a metal layer is integrally formed on one surface of a metal foil or a polyimide film formed of silver, gold, copper, aluminum, nickel, iron, or an alloy containing them. The thickness is selected according to the allowable current capacity and the coefficient of thermal expansion and the like, and may be, for example, 0.003 to 0.20 mm in consideration of workability.

FIG. 10 shows an example of a ceramic component using the ceramic component element 400 according to the fourth embodiment of FIG. 9.

As shown, the ceramic component 410 is stacked on the conductive sheet 35 and the external electrodes 40 formed on both sides of the ceramic component constituting element 400 to be electrically connected to the separated conductive sheets 35, respectively. The cover sheet 50 is included.

In addition, the interior of the insulating gap 36 between the separated conductive sheets 35 may be filled with an electrically functional material 37 mixed with a polymer resin and an electrically functional powder. In this case, the electrical characteristics of the ceramic component 410 may be determined by the electrically functional material 37. For example, when the electrically functional material 37 having electrical resistance mixed with a conductive powder in a liquid epoxy is formed in the insulating gap 36 by printing or dispensing, a heating ceramic part may be manufactured.

11 shows another example of the ceramic component using the ceramic component element 400 according to the fourth embodiment.

As shown, the ceramic component 420 is laminated on the conductive sheet 35 and the external electrodes 40 formed on both sides of the ceramic component element 400 opposite to each other so as to be electrically connected to the separated conductive sheets 35. The cover sheet 50 is included.

It also includes an auxiliary conductor 38 formed over each conductive sheet 35 to electrically connect each conductive sheet 35.

Here, the auxiliary conductor 38 may be made of a material having a lower melting point than the conductive sheet 35 or a metal foil, FCCL, or bonding wire. Alternatively, as the auxiliary conductor 38, a metal foil having high electrical resistance and generating heat may be used.

For example, according to such a structure, when the ceramic component 420 is surface-mounted by solder cream on a printed circuit board (PCB) or the like, when the overvoltage and overcurrent flow into the ceramic component 420, the auxiliary conductor 38 is formed. As it melts, it is electrically shorted. Therefore, it is possible to use a ceramic fuse that can protect the circuit by blocking the inflow of overvoltage and overcurrent.

Manufacture of ceramic parts

Hereinafter, the manufacturing method of the ceramic component which concerns on this invention is demonstrated. For convenience of description, the ceramic component 110 of FIG. 3 will be described.

A liquid elastic rubber paste prepared in advance on the alumina substrate, which is a pre-fired ceramic base 10 having a width, a length, and a thickness of, for example, 80 mm × 80 mm × 0.03 mm, that is, the elastic adhesive 20 after curing. Is applied to a thickness of about 0.1 mm by casting or screen printing.

Here, if the thickness of the ceramic base 10 is too thick, it is difficult to cut in a subsequent cutting process, and if it is too thin, it may be broken in a later process. In addition, when the coating thickness of the elastic adhesive 20 is too thick, the curing time may be long, too thin may be vulnerable to external physical impact, unstable external and sealing, and also weak adhesive strength with the conductive sheet.

Preferably, the liquid elastic rubber paste is a liquid heat-resistant silicone rubber paste and may be a silicone rubber paste in which piezoelectric, magnetic or dielectric powder is mixed as necessary.

Next, the conductive sheet 30 is laminated on the elastic rubber paste 20 applied on the ceramic base 10 and bonded while applying a constant and uniform force. At this time, the conductive sheet 30 is preferably laminated immediately after the elastic rubber paste 20 is applied.

Here, a jig having a constant weight and flatness is placed on the conductive sheet 30 during the curing process of the elastic rubber paste 20 for thickness uniformity and reliable adhesion of the elastic adhesive 20. The pressure and curing conditions applied are adjusted by the material, viscosity and the like of the rubber paste.

If the conductive sheet 30 has a cross section FCCL, the portion where the metal layer is formed is exposed to the outside.

As described above, the curing of the elastic adhesive 20 may be performed by heat, moisture, or ultraviolet rays, but thermal curing is preferable in consideration of economical efficiency.

Preferably the curing process is performed at isothermal isostatic pressure

For example, when the elastic rubber paste 20 is cured in a curing oven of 160 ° C. to 260 ° C. and thermally cured for about 5 minutes, the elastic rubber paste 20 is cured while the ceramic base 10 and the conductive sheet 30 are cured. ) Is reliably bonded to form a solid elastic adhesive layer 20.

The elastic adhesive 20 bonded and formed by hardening as described above elastically bonds the ceramic base 10 and the conductive sheet 30 or the ceramic base 10 and the ceramic cover 60, and further, by heat provided in a subsequent process. It does not melt again, providing more reliable adhesion.

Thereafter, the insulating gap 36 of FIG. 9 may be formed by using a laser, a dicing saw, or the like, or through an etching process.

Next, the cover sheet 50 is formed on the conductive sheet 30.

The cover sheet 50 may be formed of an insulating heat resistant polymer resin, an electrically conductive heat resistant elastic rubber, or an electrically functional heat resistant polymer resin in which an electrically conductive metal powder or a ferrite powder is mixed with the insulating heat resistant polymer resin. The cover sheet 50 is formed on the surface of the sheet 30, and then bonded and formed by curing.

Subsequently, in order to electrically connect the conductive sheet 30 to the outside, the external electrodes 40 are formed on the opposite sides of the ceramic base 10 by using a dipping process using nickel or silver paste. This is a conventional external electrode 40 forming process.

As described above, the cover sheet 50 and the external electrode 40 may be selected according to the use of the ceramic component 110.

Thereafter, using a chip cutter or a laser to cut in the desired dimensions in the horizontal and vertical directions. For example, a blade automatic cutting machine can be used to cut the width and length to 2mm x 1.2mm.

The ceramic component 110 capable of surface mounting (SMT) having the external electrode 40 manufactured as described above may be applied as a current sensor having a very low electrical resistance.

Although the above has been described with reference to one embodiment of the present invention, various changes and modifications can be made at the level of those skilled in the art. Such changes and modifications may belong to the present invention without departing from the scope of the present invention. It is intended that the scope of the invention be determined by the claims set forth below.

1 is a perspective view of a ceramic component element 100 according to a first embodiment of the invention.

FIG. 2 is a cross-sectional view taken along the line AA ′ of FIG. 1.

3 shows an example of a ceramic component using the ceramic component element according to the first embodiment of FIG. 1.

3A illustrates a modification of the ceramic component of FIG. 3.

4 illustrates another modified example of the ceramic component of FIG. 3.

5 is a cross-sectional view of the ceramic component element 200 according to the second embodiment of the present invention.

6 illustrates an example of a ceramic component using the ceramic component element according to the second embodiment of FIG. 5.

7 illustrates a modification of the ceramic component of FIG. 6.

8 is a cross-sectional view of a ceramic component element 300 according to a third embodiment of the present invention.

9 is a cross-sectional view of a ceramic component element 400 according to a fourth embodiment of the present invention.

FIG. 10 shows an example of a ceramic component using the ceramic component element 400 according to the fourth embodiment of FIG. 9.

11 shows another example of the ceramic component using the ceramic component element 400 according to the fourth embodiment.

Claims (21)

Ceramic base; An elastic adhesive laminated on one surface of the ceramic base; And And a conductive sheet laminated on the elastic adhesive and elastically bonding with the ceramic base by curing the elastic adhesive. The method according to claim 1, The ceramic base is formed of any one of piezoelectric ceramic, magnetic ceramic, alumina, aluminum nitride, magnesia or low temperature calcined ceramic (LTCC). The method according to claim 1, And the elastic adhesive is a heat resistant silicone rubber. The method according to claim 1, The elastic adhesive includes any one of conductive powder, magnetic powder or piezoelectric powder. The method according to claim 1, The conductive sheet is a ceramic component element, characterized in that the metal foil or a flexible copper clad laminate (FCCL) formed integrally with the metal foil. Ceramic base; An elastic adhesive layered on at least one of a surface or a rear surface of the ceramic base; A conductive sheet laminated on the elastic adhesive and elastically bonding to the ceramic base by curing the elastic adhesive; And And external electrodes formed on opposite sides of the ceramic base and electrically connected to the conductive sheet. The method according to claim 6, And a cover sheet formed on the conductive sheet. Ceramic base; A first elastic adhesive laminated on the surface of the ceramic base; A first conductive sheet laminated on the first elastic adhesive and elastically bonded to the ceramic base by curing the first elastic adhesive; A second elastic adhesive laminated on the rear surface of the ceramic base; And And a second conductive sheet laminated on the second elastic adhesive and elastically adhering to the ceramic base by curing the second elastic adhesive. Ceramic base; A first elastic adhesive laminated on the surface of the ceramic base; A first conductive sheet laminated on the first elastic adhesive and elastically bonded to the ceramic base by curing the first elastic adhesive; A second elastic adhesive laminated on the rear surface of the ceramic base; A second conductive sheet laminated on the second elastic adhesive and elastically bonding to the ceramic base by curing the second elastic adhesive; And And external electrodes formed on opposite sides of the ceramic base and electrically connected to the first and second conductive sheets. The method according to claim 9, And a cover sheet formed on the first conductive sheet. The method according to claim 9, And the first conductive sheet and the second conductive sheet are made of the same material, and the first elastic adhesive agent and the second elastic adhesive agent are made of the same material. Ceramic base; A first elastic adhesive laminated on one side of the ceramic base; A conductive sheet laminated on the first elastic adhesive and elastically bonding to the ceramic base by curing the first elastic adhesive; A second elastic adhesive laminated on the conductive sheet; And And a ceramic cover laminated on the second elastic adhesive and elastically bonded to the conductive sheet by hardening of the second elastic adhesive. The method according to claim 12, The ceramic base and the ceramic cover are made of the same material, and are formed of any one of piezoelectric ceramic, magnetic ceramic, alumina, aluminum nitride, magnesia, or low temperature calcined ceramic (LTCC). Ceramic base; An elastic adhesive laminated on one surface of the ceramic base; And A conductive sheet laminated on the elastic adhesive and elastically bonded to the ceramic base by curing the elastic adhesive, And the conductive sheet is separated by one or more insulating gaps. Ceramic base; An elastic adhesive layered on at least one of a surface or a rear surface of the ceramic base; A conductive sheet laminated on the elastic adhesive and separated by one or more insulating gaps, the conductive sheet elastically bonding with the ceramic base by curing the elastic adhesive; A cover sheet formed on the conductive sheet; And And external electrodes formed on opposite sides of the ceramic base and electrically connected to the separated conductive sheets. The method according to claim 15, And the insulating gap is filled with an electrically functional powder mixed in a polymer resin. Ceramic base; An elastic adhesive layered on at least one of a surface or a rear surface of the ceramic base; A conductive sheet laminated on the elastic adhesive and separated by one or more insulating gaps, the conductive sheet elastically bonding with the ceramic base by curing the elastic adhesive; A cover sheet laminated on the conductive sheet; External electrodes formed on opposite sides of the ceramic base and electrically connected to the separated conductive sheets; And And an auxiliary conductor formed over each of the conductive sheets to electrically connect the respective conductive sheets. The method according to claim 17, The auxiliary conductor is a ceramic component, characterized in that any one of a metal foil, a flexible copper clad laminate (FCCL) or a bonding wire. Ceramic base; An elastic adhesive layered on at least one of a surface or a rear surface of the ceramic base; A conductive sheet laminated on the elastic adhesive and elastically bonding to the ceramic base by curing the elastic adhesive; An insulating protective film formed on the conductive sheet; And An external electrode formed on opposite sides of the ceramic base and electrically connected to the conductive sheet; And cutting the conductive sheet to form a bridge having a narrow width in a middle portion of the conductive sheet in the longitudinal direction thereof. The method according to claim 19, And a groove formed in the ceramic base across the bridge. The method according to any one of claims 6, 9, 15, 17 or 19, The ceramic component may be reflow soldered by surface mounting by the external electrode.

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