CN208753297U - Electronic module - Google Patents
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- CN208753297U CN208753297U CN201821142414.8U CN201821142414U CN208753297U CN 208753297 U CN208753297 U CN 208753297U CN 201821142414 U CN201821142414 U CN 201821142414U CN 208753297 U CN208753297 U CN 208753297U
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Abstract
The utility model provides a kind of electronic module, and the hollow portion of the electronic component with hollow portion is not easy the pressure when filling sealing resin due to is subject to crushing.Have: the substrate (1) with the 1st interarea (1A) and the 2nd interarea (1B), multiple electrodes (7) are formed in the mounting surface installed to substrate (1) and with the 1st electronic component (4) of hollow portion (5), multiple electrodes (12) are formed in the mounting surface installed to substrate (1) and do not have the 2nd electronic component (11) of hollow portion, with sealing resin (13), 1st electronic component (4) is installed on the 1st interarea (1A) of substrate (1) and is sealed by sealing resin (13), 2nd electronic component (11) is installed on the 2nd interarea (1B) of substrate (1) and is not sealed by sealing resin (13).
Description
Technical field
The utility model relates to the electronic module of electronic component is equipped in substrate.
Background technique
Various electronic equipments are widely used in the electronic module that substrate is equipped with electronic component.As an example, in Fig. 6
Electronic module 1100 disclosed in WO2014-017159A1 (patent document 1) is shown.
Electronic module 1100 is equipped with capacitor, inductor, resistance etc. in an interarea of substrate (circuit board) 101 and exists
Both ends form the electronic component (chip part) 102,103,104 of the shaped like chips of electrode.In addition, substrate 101 another
Interarea, which is equipped with, forms the semiconductor device (semiconductor substrate) 105 of multiple electrodes in mounting surface.
Moreover, electronic component 102,103,104 is sealed by sealing resin (resin layer) 108.In addition, semiconductor device 105
It is sealed by sealing resin 109.
In electronic module 1100, substrate (circuit board) 101 an interarea and another interarea used as
The sealing resin 108 and sealing resin 109 of homogenous resins.But in the case where the warpage of electronic module 1100 is big, in order to press down
Warpage processed can make sealing resin 108 different with the linear expansion coefficient of sealing resin 109.
In addition, SAW (Surface Acoustic Wave is utilized；Surface acoustic wave), BAW (Bulk Acoustic
Wave；Bulk acoustic wave) acoustic wave device be widely used in the electronics such as mobile communicating equipment as resonator, filter etc. and set
It is standby.As an example, acoustic wave device 1200 disclosed in WO2015-098678A1 (patent document 2) is shown in FIG. 7.
Acoustic wave device 1200 has by the encirclements such as substrate (supporting substrates) 201, supporting member 202, lid 203
Empty portion 204.
Acoustic wave device 1200 is formed with IDT electrode 206 on the piezoelectric membrane 205 being formed in hollow portion 204.In
Empty portion 204 is arranged in order not to interfere the vibration of IDT electrode 206.
Citation
Patent document
Patent document 1:WO2014-017159A1
Patent document 2:WO2015-098678A1
Utility model content
The utility model project to be solved
Electronic module 1100 substrate 101 be mounted with the shaped like chips such as capacitor, inductor, resistance electronic component 102,
103,104, semiconductor device 105.In electronic module 1100, in order to further seek multifunction, occasionally wanting to will be in substrate
101 additional installations are as acoustic wave device 1200 with the electronic component of hollow portion.
However, can be produced in the case where substrate installation semiconductor device and electronic component the two with hollow portion
Raw following problem.
That is, although the electronic component as acoustic wave device 1200 with hollow portion has fluid tight but does not have sometimes
Standby perfect air-tightness needs to be sealed by sealing resin to mention in order to enable the high gas of humidity does not invade hollow portion
High moisture-proof.
In addition, in the case where being sealed to the electronic component as acoustic wave device 1200 with hollow portion,
Need the sealing resin low using the mobility under uncured state.The reason is that if using the flowing under uncured state
Property high sealing resin, then formed in the process of sealing resin, existed due to close around the electronic component with hollow portion
Seal the pressure of resin and anxiety that hollow portion is subject to crushing.
On the other hand, semiconductor device is formed with multiple electrodes in mounting surface, but normally due to spacing is minimum between the electrode,
Therefore in the case where being sealed to semiconductor device, if what use was suitable for being sealed the electronic component with hollow portion
The low sealing resin of mobility under uncured state then exists not sufficiently filled close between the electrode of the mounting surface of semiconductor device
Envelope resin is to form the anxiety in gap.Moreover, if the interelectrode sealing resin in semiconductor device forms gap, due to
Electronic module is installed on to the heat whens substrate etc. of electronic equipment by Reflow Soldering etc., for semiconductor device to be installed on substrate
Solder melt again, and expand, to there is the anxiety for entering gap.Then, there is the solder generated into gap makes
The inter-electrode short-circuit of semiconductor device, be referred to as solder flash of light (solder flash) the phenomenon that anxiety.
In this way, if need sealing resin, to the mobility under the uncured state of sealing resin requirement according to each electricity
Subassembly and it is different, therefore will substrate install have hollow portion electronic component (acoustic wave device etc.) and multiple electrodes with pole
Small spacing is formed in both electronic components (semiconductor device etc.) without hollow portion of mounting surface, and with identical close
Envelope resin in the case where sealing, can be led to the problem of following.
Firstly, if in order to be sufficient filling with sealing resin between the electrode for the electronic component for not having hollow portion and make in electricity
The sealing resin of interpolar does not form gap, and to the resin that sealing resin uses the mobility under uncured state high, then exist
The anxiety that pressure when the hollow portion of electronic component with hollow portion is filled sealing resin is damaged by pressure.
Conversely, if in order to enable pressure pressure when the hollow portion of the electronic component with hollow portion is not filled sealing resin
It is bad, and the resin low using the mobility under uncured state to sealing resin, then there is the electronic component without hollow portion
Electrode between not sufficiently filled sealing resin, interelectrode sealing resin formed gap, become solder flash of light the reason of anxiety.
Means for solving the problems
The utility model is precisely in order to solve above-mentioned existing issue and complete, as its means, the utility model
The electronic module related in one aspect to has: substrate, has the 1st interarea and the 2nd interarea；At least one the 1st electronic component,
The mounting surface installed to substrate forms multiple electrodes, and has hollow portion；At least one the 2nd electronic component, pacifies to substrate
The mounting surface of dress forms multiple electrodes, and does not have hollow portion；And sealing resin, the 1st electronic component are installed on the 1st of substrate
Interarea, and sealed by sealing resin, spacing is the smallest by 2nd between the electrode for the electrode for being formed in mounting surface among the 2nd electronic component
Electronic component, is installed on the 2nd interarea of substrate, and is not sealed by sealing resin with the bonding part of substrate at least.
Preferably, filler is contained in sealing resin.In this case, the flowing under the uncured state of sealing resin
Property is lower, and is subject to crushing due to can inhibit the pressure of the hollow portion of the 1st electronic component when filling sealing resin.In addition, it is general, pass through
Containing filler, so that the moisture-proof under the solid state of sealing resin improves, it can more reliably inhibit moisture to the 1st ministry of electronics industry
The intrusion of the hollow portion of part.
It is also preferred that the 2nd interarea in substrate assembles the external electrode being made of sheet metal.
1st electronic component is, for example, the acoustic wave device that SAW, BAW etc. is utilized.
It is also preferred that the smallest 2nd electronics of spacing between the electrode for the electrode for being formed in mounting surface among the 2nd electronic component
Component has the exterior resin for the outer surface for constituting itself.In this case, even if not resealing by sealing resin
2 electronic components can also maintain the moisture-proof and intensity of the 2nd electronic component by exterior resin.
The smallest 2nd electronic component of spacing is, for example, between the electrode for the electrode for being formed in mounting surface among 2nd electronic component
Semiconductor device.
It is also preferred that at least part in the outer surface of sealing resin forms bucking electrode.In this case, can
Inhibit to bring not from external noise to by the electronic component (the 1st electronic component etc.) that sealing resin seals by bucking electrode
The good electronic component for influencing, being sealed by sealing resin releases noise to outside.Further, since moisture can be inhibited by bucking electrode
To the intrusion inside sealing resin, therefore it can more reliably inhibit moisture to the intrusion of the hollow portion of the 1st electronic component.
The effect of utility model
The electronic module of the utility model is suitable for being sealed the 1st electronic component due to being able to use sealing resin
Uncured state under the low sealing resin of mobility, therefore the hollow portion of the 1st electronic component is not easy because filling sealing resin
When pressure and be subject to crushing.In addition, the electronic module of the utility model is since the 1st electronic component is sealed by sealing resin,
Moisture is not easy to invade the hollow portion of the 1st electronic component.In addition, the electronic module of the utility model due to the 2nd electronic component among
The smallest 2nd electronic component of spacing is not sealed by sealing resin between being formed in the electrode of the electrode of mounting surface, so even due to
Heat whens electronic module to be installed on to the substrate etc. of electronic equipment by Reflow Soldering etc. to be used to install the 2nd electronic component
Solder melts again, will not generate solder flash of light.
Detailed description of the invention
Fig. 1 is the sectional view for indicating electronic module 100 of the first embodiment.
Fig. 2 (A)~Fig. 2 (C) is cutting for the process for indicating to implement in an example of the manufacturing method of electronic module 100 respectively
Face figure.
Fig. 3 (A), Fig. 3 (B) are the connectings of Fig. 2 (C), are an example indicated in the manufacturing method of electronic module 100 respectively
The sectional view of the process of middle implementation.
Fig. 4 is the sectional view for indicating electronic module 200 of the second embodiment.
Fig. 5 is the sectional view for indicating electronic module 300 of the third embodiment.
Fig. 6 is the sectional view for indicating electronic module 1100 disclosed in patent document 1.
Fig. 7 is the sectional view for indicating acoustic wave device 1200 disclosed Patent Document 2.
Symbol description
1 ... substrate；
The 1st interarea of 1A ...；
The 2nd interarea of 1B ...；
2,3 ... electrodes (electrode for being formed in substrate 1)；
4 ... the 1st electronic components (have hollow portion；Acoustic wave device etc.)；
5 ... hollow portions；
6 ... IDT electrodes；
7 ... electrodes (electrode for being formed in the 1st electronic component 4)；
8 ... solders；
9,21 ... the 2nd electronic components (do not have hollow portion；Semiconductor device, capacitor, inductor, resistance etc.)；
10a, 10b ... electrode (electrode for being formed in electronic component 9)；
The smallest 2nd electronic component of spacing between the electrode for the electrode for being formed in mounting surface among 11 ... the 2nd electronic components
(semiconductor device etc.)；
11a, 21a ... exterior resin；
12, the electrode for being formed in mounting surface of 22 ... the 2nd electronic components；
13 ... sealing resins；
14 ... external electrodes (are made of) sheet metal；
31 ... bucking electrodes；
100,200,300 ... electronic module.
Specific embodiment
Hereinafter, coming together with attached drawing illustrates the mode for implementing the utility model.
In addition, each embodiment illustratively shows the embodiments of the present invention, the utility model is not limited to
The content of embodiment.It is further possible to combine the content recorded in different embodiments to implement, implementation in this case
Content is also contained in the utility model.In addition, attached drawing is used to help understand specification, schematically draws, draw out sometimes
The ratio of size between constituent element or constituent element is sometimes inconsistent with the ratio for these sizes recorded in specification.This
Outside, the constituent element recorded in specification has the case where being omitted in the accompanying drawings, omits number come the case where drafting etc..
[the 1st embodiment]
Electronic module 100 of the first embodiment is shown in FIG. 1.Wherein, Fig. 1 is the section of electronic module 100
Figure.
Electronic module 100 has substrate 1.The material of substrate 1 is arbitrary, such as is able to use and PCB (Poly is utilized
Chlorinated Biphenyl；Polychlorinated biphenyls) etc. resin substrate, LTCC (Low Temperature Co- is utilized
fired Ceramics；Low temperature simultaneously Low fire ceramic) etc. ceramic substrate.It, can be in addition, the construction of substrate 1 is also arbitrary
For multilager base plate, or single layer substrate.
Upside of the substrate 1 in Fig. 1 has the 1st interarea 1A, and the downside in Fig. 1 has the 2nd interarea 1B.Moreover,
1 interarea 1A is formed with electrode 2, is formed with electrode 3 in the 2nd interarea 1B.The material of electrode 2,3 is arbitrary, but can for example be made
With copper, silver etc..In addition, implementing the plating of tin, solder etc. on the surface of electrode 2,3 sometimes.
In the inside of substrate 1, although illustration omitted, such as by being formed with pore electrod copper or crossing pore electrod
And cloth line electrode, to constitute internal wiring.By internal wiring, in 2 He of electrode that the 1st interarea 1A of substrate 1 is formed
It is connected in the electrode 3 that the 2nd interarea 1B is formed.
In the 1st interarea 1A of substrate 1, two the 1st electronic components 4 with hollow portion 5 are installed.In present embodiment
In, the acoustic wave device of SAW will be utilized as the 1st electronic component 4.But, the type of the 1st electronic component 4 is arbitrary,
The acoustic wave device that SAW is utilized can be replaced, but the acoustic wave device of BAW is utilized, in turn, be also possible to elastic wave dress
Electronic component other than setting.
1st electronic component 4 has the hollow portion 5 being made of piezoelectric substrate 5a, supporting member 5b, lid 5c.Moreover, in
IDT electrode 6 is formed on the piezoelectric substrate 5a of the inside in empty portion 5.The hollow portion 5 of 1st electronic component 4 is in order not to interfere IDT
The vibration of electrode 6 and be arranged.In addition, in the present specification, hollow portion refers to the closed space intentionally formed, do not include
Such as air enters the medium gap etc. to unintentionally be formed of resin in the fabrication process.The hollow portion 5 of 1st electronic component 4
Although having fluid tight but not having perfect air-tightness sometimes.That is, the of acoustic wave device of SAW (or BAW) etc. is utilized
1 electronic component 4 has the tendency that height dimension becomes larger and forming hollow portion 5, it is therefore desirable to the thickness of skiving lid 5c as far as possible
So that inhibiting as small as possible height dimension, moisture-proof dies down sometimes.Therefore, the 1st electronic component 4 is needed through sealing tree
Rouge improves moisture-proof so that the high gas of humidity will not invade hollow portion 5.
1st electronic component 4 is formed with multiple electrodes 7 in mounting surface.The material of electrode 7 is arbitrary, but can for example be made
With Cu, Ni.Spacing is sufficiently big between the electrode of electrode 7, and spacing is, for example, 0.3mm between the mutual electrode of immediate electrode 7.Separately
Outside, electrode 7 may not be the electrode being made of metal film, but the salient pole of golden convex block etc..
The electrode 7 for being formed in mounting surface of 1st electronic component 4 is formed by solder 8 and the 1st interarea 1A in substrate 1
Electrode 2 engage.In addition, the engagement for electrode 7 and electrode 2, solder 8 can also be replaced and use conductive adhesive etc..
In the present embodiment, in the 1st interarea 1A installation of substrate 1, there are two the 1st electronic components 4.
In addition, being equipped with the 2nd electronic component 9 of the shaped like chips without hollow portion in the 1st interarea 1A of substrate 1.2nd
Electronic component 9 is, for example, capacitor, inductor, resistance etc..Electrode 10a, 10b are formed at the both ends of the 2nd electronic component 9.Electricity
Spacing is sufficiently big between the electrode of pole 10a, 10b, for example, 0.3mm.
Electrode 10a, 10b of 2nd electronic component 9 are connect by solder 8 and the electrode 2 of the 1st interarea 1A formation in substrate 1
It closes.In addition, the engagement for electrode 10a, 10b and electrode 2, solder 8 can also be replaced and use conductive adhesive etc..Separately
Outside, although the 2nd electronic component 9 does not have hollow portion, it not is formed with the component of electrode in mounting surface, therefore do not have and formed
Spacing (is not belonging to " be formed in the smallest 2nd electricity of spacing between the electrode of the electrode of mounting surface between the electrode of the electrode of mounting surface
Subassembly ").
In the 2nd interarea 1B of substrate 1, the 2nd electronic component 11 without hollow portion is installed.In the present embodiment,
Using semiconductor device as the 2nd electronic component 11.In addition, the outer surface of itself of the 2nd electronic component 11 is by exterior resin 11a structure
At.That is, the electronic component body of the 2nd electronic component 11 is (not shown；Semiconductor substrate etc.) it is sealed by exterior resin 11a.
2nd electronic component 11 is formed with multiple electrodes 12 in mounting surface.The material of electrode 12 is arbitrary, but for example can
Use Cu.Shape of the spacing than other the 2nd electronic components between the electrode of the electrode 12 for being formed in mounting surface of 2nd electronic component 11
At between the electrode of the electrode of mounting surface spacing it is small, spacing is, for example, 150 μm between the mutual electrode of immediate electrode 12.Separately
Outside, electrode 12 may not be the electrode being made of metal film, but the salient pole of golden convex block etc..
The electrode 12 for being formed in mounting surface of 2nd electronic component 11 by solder 8 in the 2nd interarea 1B shape of substrate 1
At electrode 3 engage.In addition, the engagement for electrode 12 and electrode 3, can also replace solder 8 and use conductive adhesive
Deng.
The 2nd electronic components 9 that be installed on the 1st interarea 1A of substrate 1, the 1st electronic component 4 and shaped like chips are by sealing resin
13 sealings.
For sealing resin 13, the high tree of moisture-proof under and solid state low using the mobility under uncured state
Rouge.Sealing resin 13 is using the reason of low resin of mobility in the uncured state, is forming sealing resin 13
Process in so that the hollow portion 5 of the 1st electronic component 4 will not be subject to crushing because of the pressure of sealing resin 13.In addition, for close
Envelope resin 13 is using the reason of high resin of the moisture-proof under solid state, and moisture intrusion is inhibited to be sealed by sealing resin 13
The 1st electronic component 4 hollow portion 5.
In the present embodiment, it as sealing resin 13, has used and has added in the epoxy resin as substrate as filler
Resin made of the powder for the silica that the average grain diameter of 80 volume % is 30 μm is added.
The addition of filler generally makes the mobility under the uncured state of sealing resin be lower.Further, since filler blocks
Moisture in sealing resin penetrates path, thus generally by filler add more more then sealing resins solid state under it is resistance to
It is moist higher.
In the present embodiment, as described above, being added to the average grain of 80 volume % as filler in sealing resin 13
The powder for the silica that diameter is 30 μm, therefore mobility is low in the uncured state for sealing resin 13, and in the solid state
Moisture-proof is high.In addition, additive amount of the sealing resin 13 by adjusting filler, average grain diameter, so as to adjust uncured state
Under mobility, the moisture-proof under solid state.
In addition, the type of the substrate of sealing resin 13 is arbitrary, can also be used with substituted epoxy resin silicone resin,
Acrylic resin etc..In addition, the material of filler is also arbitrary, can also replace silica and use aluminium oxide, boron nitride,
Or their composite material etc..
As described above, the 1st electronic component 4 of acoustic wave device of SAW (or BAW) etc. is utilized by forming hollow portion 5
And have the tendency that height dimension becomes larger, it is therefore desirable to which the thickness of skiving lid 5c as far as possible is so that inhibit most height dimension
It may be small.Then, it as a result, moisture-proof can die down sometimes, needs to improve moisture-proof by sealing resin 13.
In contrast, not sealed by sealing resin in the 2nd electronic component 11 that the 2nd interarea 1B of substrate 1 is installed.Institute as above
It states, since the 2nd electronic component 11 does not have hollow portion, so even not sealed by sealing resin, also has sufficient moisture-proof
And intensity.
The external electrode 14 being made of sheet metal is equipped in the 2nd interarea 1B of substrate 1.Specifically, the of substrate 1
The given electrode among electrode 3 that 2 interarea 1B are formed, engages external electrode 14 by solder 8.In present embodiment
In, Cu has been used for the material of external electrode 14.In addition, the shape of external electrode 14 is set as cylinder.But, external electrode
14 material and shape is arbitrary, and the metal other than Cu can be used, the shape being also possible to other than cylinder.But, it needs
The height of external electrode 14 is made to be greater than the height of the 2nd electronic component 11.In addition, the assembly for external electrode 14, it can also
To replace solder 8 using conductive adhesive etc..
It is suitable for due to being able to use for sealing resin 13 to the 1st ministry of electronics industry by the electronic module 100 constructed above constituted
The low sealing resin of mobility under the uncured state that part 4 is sealed, thus the hollow portion 5 of the 1st electronic component 4 be not easy because
Fill sealing resin 13 when pressure and be subject to crushing.
In addition, the electronic module 100 of the utility model is since the 1st electronic component 4 is sealed by sealing resin 13, water
Divide the hollow portion 5 for being not easy to invade the 1st electronic component 4.
In addition, the electricity of electrode of the electronic module 100 of the utility model due to being formed in mounting surface among the 2nd electronic component
The smallest 2nd electronic component 11 of interpolar spacing is not sealed by sealing resin, so even due to passing through Reflow Soldering etc. for electronic die
Heat whens block 100 is installed on the substrate etc. of electronic equipment makes the solder 8 for the 2nd electronic component 11 to be installed on to substrate 1 again
Secondary melting will not generate solder flash of light.
It for example can be by system described below by the electronic module of the first embodiment 100 constructed above constituted
Method is made to make.In addition, using mother substrate, carrying out singualtion in actual manufacturing process in midway, thus making together
Multiple electronic modules 100, but below for convenience's sake, illustrate the case where making electronic module 100.
(an example of the manufacturing method of electronic module 100)
Firstly, preparation is formed with electrode 2 in the 1st interarea 1A in advance as shown in Fig. 2 (A), electricity is formed in the 2nd interarea 1B
Pole 3 is formed with the substrate 1 for the internal wiring (not shown) that electrode 2 is connected with electrode 3 in inside.
Secondly, the 1st electronic component 4 and the 2nd electronic component 9 to be installed on to the 1st interarea 1A of substrate 1 as shown in Fig. 2 (B)
Electrode 2.Specifically, firstly, applying cream solder on the electrodes 2.Next, on the electrode 2 coated with cream solder
Configure the electrode 7 of the 1st electronic component 4, electrode 10a, 10b of the 2nd electronic component 9.Secondly, being heated and keeping cream solder molten
Melt, be then cooled off and form solder 8, by the electrode 7 of the 1st electronic component 4 and electrode 10a, 10b of the 2nd electronic component 9
It is engaged in the electrode 2 in the 1st interarea 1A formation of substrate 1.
Next, as shown in Fig. 2 (C), by sealing resin 13 to the 1st electronic component of the 1st interarea 1A installation in substrate 1
4 and the 2nd electronic component 9 is sealed.Specifically, firstly, around the 1st electronic component 4 and the 2nd electronic component 9
Fill uncured sealing resin 13.Secondly, implementing at least one party of heating and light irradiation, solidify sealing resin 13.Separately
Outside, since mobility is low in the uncured state for sealing resin 13, the hollow portion 5 of the 1st electronic component 4 will not be close because filling
Seal resin 13 when pressure and be subject to crushing.
Then, as shown in Fig. 3 (A), the up and down direction of substrate 1 is inverted.Specifically, making the 1st side interarea 1A of substrate 1
For under, make on the 2nd side interarea 1B of substrate 1.
Secondly, installing the 2nd electronic component 11 in the 2nd interarea 1B of substrate 1, and assemble external electrical as shown in Fig. 3 (B)
Pole 14.Specifically, applying cream solder on the electrode 3 that the 2nd interarea 1B of substrate 1 is formed.Next, being coated with paste
On the given electrode 3 of solder, the electrode 12 of the 2nd electronic component 11 is configured.In addition, being given coated with the another of cream solder
On fixed electrode 3, the external electrode 14 being made of sheet metal is configured.Secondly, heated and melt cream solder, then into
Row cooling and form solder 8, the electrode 12 of the 2nd electronic component 11 is engaged with electrode 3, and by external electrode 14 and electrode 3
Engagement.
By above process, electronic module 100 is completed.
[the 2nd embodiment]
Electronic module 200 of the second embodiment is shown in FIG. 4.Wherein, Fig. 4 is the section of electronic module 200
Figure.
Electronic module 200 is applied with change to electronic module 100 of the first embodiment.Specifically, in electronic die
In block 100, two the 1st electronic components 4 with hollow portion 5 are mounted in the 1st interarea 1A of substrate 1 and do not have hollow portion
The 2nd electronic component 9 one among the 1st electronic component 4 is replaced into the 2nd ministry of electronics industry but in electronic module 200
Part 21.2nd electronic component 21 is sealed by sealing resin 13 together with the 1st electronic component 4 and the 2nd electronic component 9.In addition,
The electronic component body (not shown) of 2nd electronic component 21 is sealed by exterior resin 21a.
2nd electronic component 21 is also semiconductor device in the same manner as the 2nd electronic component 11, is formed with multiple electricity in mounting surface
Pole 22.However, the 2nd electronic component 21 compared with the 2nd electronic component 11, is formed in spacing between the electrode of the electrode 22 of mounting surface
Greatly, for example, 0.3mm.
Even if the 2nd electronic component 21 is sealed by the low sealing resin 13 of mobility in the uncured state, due to electrode 22
Electrode between spacing it is big, therefore sealing resin 13 is also sufficient filling between electrode 22, not formed gap.
Even the 2nd electronic component, as long as being formed in as the 2nd electronic component 21 between the electrode of electrode 22 of mounting surface
Spacing is sufficiently big, then can also be installed on the 1st interarea 1A of substrate 1, and the sealing tree low by the mobility under uncured state
Rouge 13 seals.
[the 3rd embodiment]
Electronic module 300 of the third embodiment is shown in FIG. 5.Wherein, Fig. 5 is the section of electronic module 300
Figure.
Electronic module 300 has added structure to electronic module 100 of the first embodiment.Specifically, electronic module
300 form bucking electrode 31 in all outer surfaces of the sealing resin 13 of electronic module 100 and four end faces of substrate 1.
The material and structure of bucking electrode 31 are arbitrary, but be for example capable of forming for comprising Ti, Ni, Cr, SUS or they
The adhesion layer of alloy, includes Ti, Ni, Cr or their alloy at the conductive layer comprising Cu, Al, Ag or their alloy
3 layers of anticorrosion layer construction.
Electronic module 300 is inhibited from external noise by bucking electrode 31 to the 1st electronic component 4, shaped like chips
2nd electronic component 9 brings adverse effect.In addition, electronic module 300 inhibits the 1st electronic component the 4, the 2nd by bucking electrode 31
Electronic component 9 releases noise to outside.In turn, electronic module 300 by bucking electrode 31 due to inhibiting moisture to sealing resin
Intrusion inside 13, therefore the moisture-proof of the hollow portion 5 of the 1st electronic component 4 further increases.
More than, the 1st embodiment~electronic module of the third embodiment 100,200,300 is illustrated.
However, the utility model is not limited to above-mentioned content, can be made various changes according to the purport of utility model.
For example, having used epoxy resin for the substrate of sealing resin 13, but set in electronic module 100,200,300
The type of the substrate of rouge is arbitrary, can also be with substituted epoxy resin and such as using silicone resin.
In addition, having used the powder of silica for the filler of sealing resin 13 in electronic module 100,200,300
End, but the material of filler is arbitrary, silica can also be replaced and for example using aluminium oxide, boron nitride or they
Composite material etc..It, can also be in addition, in the case that the mobility under the uncured state of the substrate of sealing resin 13 is substantially low
Filler is not added in sealing resin 13, is set as so-called virgin resin.
In addition, having used bullet as the 1st electronic component 4 with hollow portion 5 in electronic module 100,200,300
Property wave apparatus, but the type of the 1st electronic component 4 is arbitrary, and can also be replaced acoustic wave device and be used the other kinds of 1st
Electronic component.
In addition, being used in electronic module 100,200,300 as the 2nd electronic component 11 for not having hollow portion
Semiconductor device, but the type of the 2nd electronic component 11 is arbitrary, and can also be replaced semiconductor device and be used other kinds of
2nd electronic component.
Claims (7)
1. a kind of electronic module, has:
Substrate has the 1st interarea and the 2nd interarea；
At least one the 1st electronic component forms multiple electrodes in the mounting surface installed to the substrate, and has hollow portion；
At least one the 2nd electronic component forms multiple electrodes in the mounting surface installed to the substrate, and does not have hollow
Portion；With
Sealing resin,
The electronic module is characterized in that,
1st electronic component is installed on the 1st interarea of the substrate, and is sealed by the sealing resin,
The smallest 2nd electricity of spacing between the electrode for the electrode for being formed in the mounting surface among 2nd electronic component
Subassembly is installed on the 2nd interarea of the substrate, and is not set by the sealing with the bonding part of the substrate at least
Rouge sealing.
2. electronic module according to claim 1, which is characterized in that
Contain filler in the sealing resin.
3. electronic module according to claim 1 or 2, which is characterized in that
The external electrode being made of sheet metal is equipped in the 2nd interarea of the substrate.
4. electronic module according to claim 1 or 2, which is characterized in that
1st electronic component is acoustic wave device.
5. electronic module according to claim 1 or 2, which is characterized in that
The smallest 2nd electricity of spacing between the electrode for the electrode for being formed in the mounting surface among 2nd electronic component
Subassembly has the exterior resin for the outer surface for constituting itself.
6. electronic module according to claim 1 or 2, which is characterized in that
The smallest 2nd electricity of spacing between the electrode for the electrode for being formed in the mounting surface among 2nd electronic component
Subassembly is semiconductor device.
7. electronic module according to claim 1 or 2, which is characterized in that
At least part in the outer surface of the sealing resin is formed with bucking electrode.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-139548 | 2017-07-19 | ||
| JP2017139548 | 2017-07-19 | ||
| JP2018081931A JP6848930B2 (en) | 2017-07-19 | 2018-04-21 | Electronic module |
| JP2018-081931 | 2018-04-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208753297U true CN208753297U (en) | 2019-04-16 |
Family
ID=65353235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821142414.8U Active CN208753297U (en) | 2017-07-19 | 2018-07-18 | Electronic module |
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| CN (1) | CN208753297U (en) |
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| WO2021060163A1 (en) * | 2019-09-27 | 2021-04-01 | 株式会社村田製作所 | Module and method for manufacturing same |
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| US9054077B2 (en) * | 2010-03-10 | 2015-06-09 | Altera Corporation | Package having spaced apart heat sink |
| JP5360425B2 (en) * | 2010-04-08 | 2013-12-04 | 株式会社村田製作所 | Circuit module and method of manufacturing circuit module |
| JP6456027B2 (en) * | 2013-03-27 | 2019-01-23 | 日東電工株式会社 | Sealing sheet, method for manufacturing sealing sheet, and method for manufacturing electronic component package |
| US20160035593A1 (en) * | 2014-07-31 | 2016-02-04 | Skyworks Solutions, Inc. | Devices and methods related to support for packaging substrate panel having cavities |
| DE102015101440B4 (en) * | 2015-02-02 | 2021-05-06 | Infineon Technologies Ag | Semiconductor component with a chip arranged below the package and method for mounting the same on an application board |
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| JP6848930B2 (en) | 2021-03-24 |
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