KR20100003324A - Light-emitting device - Google Patents

Abstract

PURPOSE: A light emitting device is provided to improve heat dissipation by dispersing the heat from a light emitting chip by forming several legs on a lead frame. CONSTITUTION: A package body(120) is comprised of a reflector(123) with an opening unit emitting the light from a light emitting chip and a housing(121). A first lead frame and a second lead frame are separated and are connected to the light emitting chip inside the opening. The first and second lead frames form at least two legs forming the electric contact to the outside of the package body. An upper leg(131,141) is protruded to the upper side of the package body and is bent forward or backward. A lower leg(133,143) is protruded to the lower side of the package body and is bent forward and backward. The legs formed on the first lead frame and the second lead frame are positioned on the surface symmetrical places.

Description

Light-emitting device {LIGHT-EMITTING DEVICE}

The present invention relates to a light emitting device, and more particularly, a light emitting device having improved compatibility to be used on various substrates having different lead patterns by forming a plurality of legs formed in a lead frame for electrical contact of the light emitting device. It is about.

In general, various light emitting chips are used in a light emitting device. For example, a light emitting diode using a phenomenon in which a small number of carriers (electrons or holes) are injected by using a pn junction structure of a semiconductor and emits light by recombination thereof is used. Emitting Diode, LED) is used. Light emitting diodes include red light emitting diodes using GaAsP and the like, green light emitting diodes using GaP and the like, and blue light emitting diodes using an InGaN / AlGaN double hetero structure.

The light emitting device is manufactured in various forms according to the type of chip, the shape of the package, or the light emitting direction. For example, chip type, lamp type, top view type, side view type, etc. are manufactured and used, and recently, due to slimming and low power of LCD (Liquid Crystal Display) products There is an increasing demand for a side view type light emitting device used as a backlight unit light source of an LCD.

FIG. 1A is a perspective view showing a general light emitting device, and FIG. 1B is a perspective view showing a main portion of a general light emitting device, and a general side view type light emitting device includes a package including a housing 11 and a reflector 13 as shown in the drawing. The main body 10, the first and second lead frames 20 and 30 spaced apart from each other on the housing 11, and the second lead frame 30 mounted on the first lead frame 20. The light emitting chip 40 includes a light emitting chip 40 connected to the wire 50 and a molding part 60 formed inside the reflector 13 to seal the light emitting chip 40. In this case, the legs 21 and 31, which are electrical contacts for mounting the light emitting devices on separate printed circuit boards, are bent and formed in the first and second lead frames 20 and 30, respectively. In particular, a solder pattern is formed on the printed circuit board to solder and mount the light emitting device. Therefore, the legs 21 and 31 should be formed at predetermined positions corresponding to the solder patterns. Therefore, a light emitting device produced to correspond to a solder pattern of a specific printed circuit board may be used only in the printed circuit board, but may not be used in other printed circuit boards at all.

In addition, since the legs are bent in one direction of the package body, heat generated from the light emitting chip during the operation of the light emitting device is concentrated in only one direction, thereby causing thermal damage to the light emitting device and the peripheral device.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problem, and an object thereof is to provide a light emitting device having improved compatibility that can be used for various printed circuit boards by forming a plurality of legs formed in a lead frame in various types.

In addition, it is another object to provide a light emitting device that can improve the heat dissipation efficiency by dispersing heat generated from the light emitting chip by forming a plurality of legs formed in the lead frame.

The light emitting device according to the present invention for achieving the above object is a light emitting chip; A package body having an opening through which light emitted from the light emitting chip is emitted; And a first lead frame and a second lead frame spaced apart from each other, electrically connected to the light emitting chip inside the opening, and at least two legs each formed to form an electrical contact outside the package body. do.

Each leg formed in the first and second lead frames may include an upper leg protruding to the top of the package body to be bent forward or backward, and a lower leg protruding to the bottom of the package body to be bent forward or rearward. And at least two or more of side legs protruding to the side of the package body and being primarily bent forwards or backwards, and being bent to the top or bottom of the package body.

At this time, each of the legs formed in the first and second lead frame is preferably formed in a position symmetric with each other.

The method may further include a molding part molded in the opening of the package body to seal the light emitting chip.

In addition, the opening of the package body is opened to the front of the package body, each leg formed in the first and second lead frame is formed in one or both directions of the top or bottom of the package body. It is done.

According to the present invention, by forming a plurality of legs for forming electrical contacts on the lead frame of the light emitting device, there is an effect of obtaining a compatible light emitting device that can be easily mounted on various printed circuit boards having different solder patterns.

In addition, the plurality of legs serve to disperse heat generated from the light emitting chip, thereby preventing thermal damage of the light emitting device and the peripheral device.

Hereinafter, a light emitting device according to the present invention will be described in detail with reference to the accompanying drawings.

2A is a perspective view showing a light emitting device according to a first embodiment of the present invention, and FIG. 2B is a perspective view showing main parts of a light emitting device according to a first embodiment of the present invention.

As shown in the drawing, the light emitting device according to the first embodiment of the present invention comprises: a light emitting chip 110; A package body 120 having an opening through which light emitted from the light emitting chip 110 is emitted; The first and the plurality of legs (131, 133, 141, 143) are provided spaced apart from each other, and electrically connected to the light emitting chip 110 inside the opening, and to form an electrical contact to the outside of the package body 120 and Second lead frames 130 and 140 are included.

The light emitting chip 110 is a means for generating light by application of an external power source, and may be selectively selected from chips emitting light in the infrared region from the infrared region. For example, a vertical white light emitting diode can be used.

The package body 120 defines a housing 121 in which the first and second lead frames 130 and 140 are installed and a mounting area of the light emitting chip 110, and emits light from the light emitting chip 110. And a reflector 123 having an opening to determine. The reflector 123 is manufactured integrally with or separately from the housing 121 and is coupled to one surface of the housing 121. Of course, the housing 121 and the reflector 123 may be variously changed and manufactured according to the use of the light emitting device. In particular, in the present embodiment, the opening direction of the opening formed in the reflector 123 is formed in front of the package body 120. The term “front” refers to a light emitting direction of the side view type light emitting device, and refers to a Z direction shown in the drawing. In the following description, in order to clarify the description of the components to be described later, the X direction shown in the drawing is upper, -X axis direction is lower, Y axis direction and -Y axis direction is side, Z axis direction is forward, and -Z axis direction is rear It is defined as.

In addition, the package body 120 includes a molding part 160 formed in an opening formed in the reflector 123 to encapsulate a portion of the light emitting chip 110 and the first and second lead frames 130 and 140. .

The molding part 160 is to encapsulate and protect a part of the light emitting chip 110 and the first and second lead frames 130 and 140. The forming method and shape may be variously implemented. In general, the molding part 160 may be formed of a transparent silicone resin or an epoxy resin. However, the present invention is not limited thereto, and any material may be used as long as the resin is transparent enough to transmit light depending on the use of the light emitting device. In addition, phosphors may be mixed to implement white light.

The first and second lead frames 130 and 140 are for applying external power to the light emitting chip 110 as the light emitting chip 110 is mounted or electrically connected through a wire 150. And spaced apart from each other on the interface or the coupling surface of the reflector 123. In the present embodiment, the light emitting chip 110 is mounted on the first lead frame 130, and a wire 150 connected to the light emitting chip 110 is connected to the second lead frame 140.

In particular, each of the first and second lead frames 130 and 140 includes at least two legs 131, 133, 141, and 143 which form an electrical connection with an external power source, for example, a solder pattern patterned on a printed circuit board and a contact point. It is formed over.

The legs may have upper legs 131 and 141 protruding upward from the package body 120 and bent forward or backward, and lower legs 133 and 143 protruding downward from the package main body 120 and bent forward or backward. Optionally in combination. In addition, the leg is not limited to the upper legs 131 and 141 and the lower legs 133 and 143, and protrudes to the side of the package body 120 to be bent primarily forward or backward, and the upper or lower portion of the package body 120 And side legs (235, 245 in FIG. 3B) that are bent second to each other. At this time, it is preferable that the legs 131 and 133 that protrude and bend from one lead frame 130 are spaced apart from each other to be insulated.

 In the first embodiment, the upper legs 131 and 141 protruding upward from the outer portions of the first and second lead frames 130 and 140 and bent backwards, respectively, and the first and second lead frames 130 and 140 respectively. Lower legs 133 and 143 which protrude downward from the outer portion and bend forward are provided. Thus, any one of the upper legs 131 and 141 formed on the upper portion of the package body 120 or the lower legs 133 and 143 formed under the package body 120 according to the solder pattern formed on the printed circuit board on which the light emitting device is mounted. Can be selected and bonded.

In the present exemplary embodiment, the upper legs 131 and 141 and the lower legs 133 and 143 are formed at the outer ends at the same distance from the inner side of the first and second lead frames 130 and 140, respectively. However, the formation positions and bending directions of the upper legs 131 and 141 and the lower legs 133 and 143 are not limited to those shown, but may be variously changed to correspond to solder patterns of a printed circuit board. However, the formation positions and bending directions of the legs 131, 133, 141, and 143 formed on the first and second lead frames 130 and 140, respectively, may be mutually adjusted with respect to the surface formed of the X axis and the Z axis to standardize the light emitting device or to improve workability. It is preferable to be formed to face symmetry. Of course, the present invention is not limited thereto, and the upper legs 131 and 141 and the lower legs 133 and 143 may be irregularly formed on the first and second lead frames 130 and 140 without being face-symmetric.

Meanwhile, the present invention may implement various embodiments by variously changing the legs formed on the first and second lead frames.

3A is a perspective view illustrating a light emitting device according to a second embodiment of the present invention, and FIG. 3B is a perspective view showing main parts of a light emitting device according to a second embodiment of the present invention.

As shown in FIGS. 3A and 3B, the light emitting device according to the second embodiment of the present invention may have similar components to those of the first embodiment, and may change the shape of the legs formed on the first and second lead frames 230 and 240. Is implemented. The description of the same configuration is omitted, and the same reference numerals are used for the same configuration and names below.

As shown in the drawing, the light emitting device according to the second exemplary embodiment is first bent toward the front of the package body 120 at the outer ends of each of the first and second lead frames 230 and 240, and then the package body 120 Side legs 235 and 245 which are bent second to the top and lower legs 233 and 243 which protrude downward from the outer portions of each of the first and second lead frames 230 and 240 are bent backwards. Thus, a pair of side legs 235 and 245 formed on the upper portion of the package body 120 or lower legs 233 and 243 formed on the lower portion of the package body 120 may be selected and bonded according to the solder pattern formed on the printed circuit board. Can be. As in the first embodiment, the formation positions and the bending directions of the side legs 235 and 245 and the lower legs 233 and 243 are not limited to those shown, but may be variously changed to correspond to the solder patterns of the printed circuit board.

4A is a perspective view showing a light emitting device according to a third embodiment of the present invention, and FIG. 4B is a perspective view showing main parts of a light emitting device according to a third embodiment of the present invention.

As shown in FIGS. 4A and 4B, the light emitting device according to the third embodiment of the present invention is formed on the first and second lead frames 330 and 340 while having similar components to those of the first embodiment as in the second embodiment. It is implemented by changing the shape of the legs.

As shown in the drawing, the light emitting device according to the third exemplary embodiment has an upper leg that protrudes upward from the outer side of each of the first and second lead frames 330 and 340 and is bent forward and backward ( 331a, 331b, 341a, and 341b are sequentially provided. Therefore, a pair of the inner upper legs 331b and 341b or the outer upper legs 331a and 341a formed on the package body 120 may be selected and bonded according to the solder pattern formed on the printed circuit board. Can be. As in the first embodiment, the formation positions and the bending directions of the upper legs 331a, 331b, 341a, and 341b are not limited to those shown, but may be variously changed to correspond to the solder patterns of the printed circuit board.

Meanwhile, although the first and second lead frames 130, 140, 230, 240, 330, and 340 shown in the first to third embodiments are all formed of two legs, the present invention is not limited thereto, and the position or bending of the upper leg, the lower leg, and the side leg is not limited thereto. At least three or more may be formed by changing a direction.

As described above, at least two legs formed on the first and second lead frames 130, 140, 230, 240, 330, and 340 may be changed into various shapes as the first and second lead frames 130, 140, 230, 240, 330, 340 extend and branch in various ways.

In addition, according to the formation of a plurality of legs extending and branching the first and second lead frames 130, 140, 230, 240, 330, and 340, it is possible to obtain an effect of dissipating and dissipating heat generated when the light emitting chip 110 emits light.

Although the above has been described with reference to embodiments of the drawings and the side view type light emitting device, those skilled in the art will appreciate that various changes may be made without departing from the spirit of the invention as set forth in the claims below. It will be understood that modifications and changes can be made.

1A is a perspective view showing a general light emitting device,

1B is a perspective view showing the main part of a general light emitting device;

2A is a perspective view showing a light emitting device according to a first embodiment of the present invention;

2B is a perspective view illustrating a main portion of the light emitting device according to the first embodiment of the present invention;

3A is a perspective view illustrating a light emitting device according to a second embodiment of the present invention;

3B is a perspective view illustrating a main part of a light emitting device according to a second embodiment of the present invention;

4A is a perspective view illustrating a light emitting device according to a third embodiment of the present invention;

4B is a perspective view illustrating a main part of a light emitting device according to a third embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

110: light emitting chip 120: package body

130, 230, 330: first lead frame 140, 240, 340: second lead frame

131,141,331a, 331b, 341a, 341b: upper leg

133,143,233,243: lower leg

135,245: side legs

150: wire 160: molding part

Claims (5)

Light emitting chip; A package body having an opening through which light emitted from the light emitting chip is emitted; And a first lead frame and a second lead frame spaced apart from each other, electrically connected to the light emitting chip inside the opening, and at least two legs each formed to form an electrical contact outside the package body. The method according to claim 1, Each leg formed in the first and second lead frames An upper leg protruding upward of the package body and bent forward or backward; A lower leg which protrudes to the bottom of the package body and is bent forward or backward; And at least two or more of side legs which protrude to the side of the package body and are bent forward or rearward, and which are bent upward or downward of the package body. The method according to claim 1 or 2, And each leg formed in the first and second lead frames is formed at positions that are face symmetric with each other. The method according to claim 1, And a molding part molded in the opening of the package body to encapsulate the light emitting chip. The method according to claim 1, The opening of the package body is opened to the front of the package body, each leg formed in the first and second lead frame is formed in any one direction or both directions of the upper or lower portion of the package body. Light emitting device.

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