KR20090130016A - 반도체칩 및 광도파로층을 포함한 장치 - Google Patents
반도체칩 및 광도파로층을 포함한 장치 Download PDFInfo
- Publication number
- KR20090130016A KR20090130016A KR1020097020697A KR20097020697A KR20090130016A KR 20090130016 A KR20090130016 A KR 20090130016A KR 1020097020697 A KR1020097020697 A KR 1020097020697A KR 20097020697 A KR20097020697 A KR 20097020697A KR 20090130016 A KR20090130016 A KR 20090130016A
- Authority
- KR
- South Korea
- Prior art keywords
- cover layer
- semiconductor chip
- light
- layer
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 72
- 230000003287 optical effect Effects 0.000 title claims description 6
- 239000010408 film Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 15
- 239000010409 thin film Substances 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 239000004038 photonic crystal Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims 19
- 230000005855 radiation Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000000407 epitaxy Methods 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0055—Reflecting element, sheet or layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0051—Diffusing sheet or layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/0018—Redirecting means on the surface of the light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0075—Arrangements of multiple light guides
- G02B6/0076—Stacked arrangements of multiple light guides of the same or different cross-sectional area
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
- Semiconductor Lasers (AREA)
- Planar Illumination Modules (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007010755A DE102007010755A1 (de) | 2007-03-06 | 2007-03-06 | Anordnung mit einem Halbleiterchip und einer Lichtleiterschicht |
| DE102007010755.4 | 2007-03-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20090130016A true KR20090130016A (ko) | 2009-12-17 |
Family
ID=39496079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097020697A Ceased KR20090130016A (ko) | 2007-03-06 | 2008-01-23 | 반도체칩 및 광도파로층을 포함한 장치 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8393748B2 (enExample) |
| EP (1) | EP2130072B1 (enExample) |
| JP (1) | JP2010520627A (enExample) |
| KR (1) | KR20090130016A (enExample) |
| CN (1) | CN101627326B (enExample) |
| DE (1) | DE102007010755A1 (enExample) |
| TW (1) | TW200845431A (enExample) |
| WO (1) | WO2008106915A2 (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2448564B (en) * | 2007-11-26 | 2009-04-29 | Iti Scotland Ltd | Light guides |
| JP5152502B2 (ja) * | 2008-06-09 | 2013-02-27 | スタンレー電気株式会社 | 灯具 |
| CN102124384B (zh) | 2008-07-10 | 2016-10-12 | 3M创新有限公司 | 粘弹性光导 |
| US8297786B2 (en) | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
| JP2011530718A (ja) | 2008-08-08 | 2011-12-22 | スリーエム イノベイティブ プロパティズ カンパニー | 光を管理するための粘弾性層を有する光ガイド |
| DE102008047579B4 (de) | 2008-09-17 | 2020-02-06 | Osram Opto Semiconductors Gmbh | Leuchtmittel |
| DE102008048648B4 (de) * | 2008-09-24 | 2025-05-15 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip |
| GB2464916B (en) * | 2008-10-21 | 2013-07-31 | Iti Scotland Ltd | Light Guides |
| JP2012519931A (ja) | 2009-03-05 | 2012-08-30 | アイティーアイ スコットランド リミテッド | 光ガイド |
| EP2404202B1 (en) | 2009-03-05 | 2016-08-10 | Design LED Products Limited | Light guides |
| DE102010030660A1 (de) * | 2010-06-29 | 2011-12-29 | Lisa Dräxlmaier GmbH | Beleuchtetes Fahrzeuginnenausstattungsteil |
| CN103154788B (zh) | 2010-10-11 | 2015-08-19 | 3M创新有限公司 | 具有粘弹性光导的照明装置 |
| EP2447746A1 (en) * | 2010-10-28 | 2012-05-02 | Koninklijke Philips Electronics N.V. | Lighting device with waveguide plate |
| DE102011015148A1 (de) | 2011-03-25 | 2012-09-27 | Osram Opto Semiconductors Gmbh | Anordnung eines lichtemittierenden Halbleiterbauelementes und einer Lichtleiterschicht |
| WO2014006501A1 (en) * | 2012-07-03 | 2014-01-09 | Yosi Shani | Planar remote phosphor illumination apparatus |
| JP6438648B2 (ja) * | 2013-11-15 | 2018-12-19 | 日亜化学工業株式会社 | 半導体発光装置およびその製造方法 |
| CN105304802A (zh) * | 2015-10-12 | 2016-02-03 | 深圳万城节能股份有限公司 | 发光装置的制造方法 |
| JP7728756B2 (ja) | 2019-10-29 | 2025-08-25 | エイエムエス-オスラム インターナショナル ゲーエムベーハー | オプトエレクトロニクス装置 |
| US12388058B2 (en) | 2019-12-06 | 2025-08-12 | Osram Opto Semiconductors Gmbh | Optoelectronic device |
| DE112020005976T5 (de) | 2019-12-06 | 2022-10-13 | Osram Opto Semiconductors Gmbh | Optoelektronische vorrichtung |
| US12328983B2 (en) | 2019-12-06 | 2025-06-10 | Osram Opto Semiconductors Gmbh | Optoelectronic arrangement |
| US12330499B2 (en) | 2019-12-06 | 2025-06-17 | Osram Opto Semiconductors Gmbh | Apparatus comprising a carrier with optoelectronic elements and method for manufacturing the apparatus |
| DE112020005978T5 (de) | 2019-12-06 | 2022-09-22 | Osram Opto Semiconductors GmbH | Fenster oder oberfläche eines fahrzeugs mit mindestens einem optoelektronischen bauelement |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4714983A (en) * | 1985-06-10 | 1987-12-22 | Motorola, Inc. | Uniform emission backlight |
| JPH087614B2 (ja) | 1992-03-27 | 1996-01-29 | 株式会社牧野フライス製作所 | 工作機械の工具長補正方法及び装置 |
| JP3116727B2 (ja) | 1994-06-17 | 2000-12-11 | 日亜化学工業株式会社 | 面状光源 |
| JP3994447B2 (ja) * | 1996-03-29 | 2007-10-17 | セイコーエプソン株式会社 | 照明装置、及び液晶表示装置 |
| JP2001052518A (ja) * | 1999-08-16 | 2001-02-23 | Minebea Co Ltd | 面状照明装置 |
| JP3987257B2 (ja) * | 1999-12-10 | 2007-10-03 | ローム株式会社 | 液晶表示装置 |
| US6598987B1 (en) | 2000-06-15 | 2003-07-29 | Nokia Mobile Phones Limited | Method and apparatus for distributing light to the user interface of an electronic device |
| JP4368075B2 (ja) * | 2000-11-06 | 2009-11-18 | シャープ株式会社 | 面型照明装置 |
| JP2002169153A (ja) * | 2000-11-30 | 2002-06-14 | Citizen Electronics Co Ltd | カラー表示液晶の照明装置 |
| JP2003029654A (ja) * | 2001-07-11 | 2003-01-31 | Sony Corp | 表示装置 |
| KR100513718B1 (ko) * | 2002-06-20 | 2005-09-07 | 삼성전자주식회사 | 평판표시소자용 조명장치 |
| JP2004304041A (ja) * | 2003-03-31 | 2004-10-28 | Citizen Electronics Co Ltd | 発光ダイオード |
| JP4397728B2 (ja) * | 2004-04-21 | 2010-01-13 | 日東電工株式会社 | 直下型バックライト |
| US7997771B2 (en) * | 2004-06-01 | 2011-08-16 | 3M Innovative Properties Company | LED array systems |
| US7204630B2 (en) * | 2004-06-30 | 2007-04-17 | 3M Innovative Properties Company | Phosphor based illumination system having a plurality of light guides and an interference reflector |
| KR20060001251A (ko) * | 2004-06-30 | 2006-01-06 | 엘지.필립스 엘시디 주식회사 | 백 라이트 유닛 |
| JP2006078989A (ja) * | 2004-09-13 | 2006-03-23 | Ricoh Co Ltd | 発光デバイス、光書込み装置、および光通信装置 |
| TWI254821B (en) * | 2004-10-01 | 2006-05-11 | Delta Electronics Inc | Backlight module |
| JP2006114239A (ja) * | 2004-10-12 | 2006-04-27 | Fujikura Ltd | 面状光源用導光体とその製造方法、面状光源、照明装置、看板及び液晶表示装置 |
| DE102005042523A1 (de) * | 2005-05-31 | 2006-12-07 | Osram Opto Semiconductors Gmbh | Beleuchtungseinrichtung |
| TWI319504B (en) * | 2005-06-28 | 2010-01-11 | Chi Mei Optoelectronics Corp | Planar light source device and fabricating method thereof and liquid crystal display with the same |
| US20070001182A1 (en) * | 2005-06-30 | 2007-01-04 | 3M Innovative Properties Company | Structured phosphor tape article |
| KR100699263B1 (ko) * | 2005-07-22 | 2007-03-27 | 삼성전자주식회사 | 백라이트 유닛 및 액정표시장치 |
| DE102005055293A1 (de) | 2005-08-05 | 2007-02-15 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung von Halbleiterchips und Dünnfilm-Halbleiterchip |
| US7334933B1 (en) * | 2005-11-04 | 2008-02-26 | Simon Jerome H | Unified optical collection and distribution of light from quasi-point sources including LEDs, and linear light sources |
| US8021033B2 (en) * | 2005-11-30 | 2011-09-20 | Showa Denko K.K. | Light guide member, planar light source device provided with the light guide member, and display apparatus using the planar light source device |
| KR101222152B1 (ko) * | 2006-02-06 | 2013-01-14 | 삼성디스플레이 주식회사 | 백라이트 어셈블리 및 이를 갖는 표시 장치 |
| CN1852626A (zh) * | 2006-04-05 | 2006-10-25 | 友达光电股份有限公司 | 双面显示有机电激发光面板 |
| TW200825529A (en) * | 2006-12-06 | 2008-06-16 | Chi Lin Technology Co Ltd | Light mixer and backlight module having it |
-
2007
- 2007-03-06 DE DE102007010755A patent/DE102007010755A1/de not_active Withdrawn
-
2008
- 2008-01-23 WO PCT/DE2008/000124 patent/WO2008106915A2/de not_active Ceased
- 2008-01-23 CN CN200880006942.3A patent/CN101627326B/zh not_active Expired - Fee Related
- 2008-01-23 EP EP08706792.2A patent/EP2130072B1/de not_active Ceased
- 2008-01-23 US US12/528,960 patent/US8393748B2/en not_active Expired - Fee Related
- 2008-01-23 KR KR1020097020697A patent/KR20090130016A/ko not_active Ceased
- 2008-01-23 JP JP2009552056A patent/JP2010520627A/ja active Pending
- 2008-02-27 TW TW097106778A patent/TW200845431A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010520627A (ja) | 2010-06-10 |
| TW200845431A (en) | 2008-11-16 |
| EP2130072A2 (de) | 2009-12-09 |
| CN101627326B (zh) | 2014-06-11 |
| CN101627326A (zh) | 2010-01-13 |
| WO2008106915A2 (de) | 2008-09-12 |
| WO2008106915A3 (de) | 2009-01-22 |
| US20100103650A1 (en) | 2010-04-29 |
| EP2130072B1 (de) | 2018-10-24 |
| DE102007010755A1 (de) | 2008-10-30 |
| US8393748B2 (en) | 2013-03-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20091001 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20121227 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20140212 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20141226 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20140212 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |