KR20090102502A - 색상차와 박리강도 특성이 개선된 인쇄회로용 동박 - Google Patents
색상차와 박리강도 특성이 개선된 인쇄회로용 동박Info
- Publication number
- KR20090102502A KR20090102502A KR1020080027982A KR20080027982A KR20090102502A KR 20090102502 A KR20090102502 A KR 20090102502A KR 1020080027982 A KR1020080027982 A KR 1020080027982A KR 20080027982 A KR20080027982 A KR 20080027982A KR 20090102502 A KR20090102502 A KR 20090102502A
- Authority
- KR
- South Korea
- Prior art keywords
- copper foil
- nodule
- printed circuit
- cluster
- color difference
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (6)
- 표면 조도를 가지고, 표면 위에 노듈 클러스터(nodule cluster)가 형성된 인쇄회로용 동박에 있어서,평균 직경이 1~8㎛인 노듈이 상기 노듈 클러스터 전체의 90% 이상인 것을 특징으로 하는 인쇄회로용 동박.
- 제1항에 있어서,상기 동박의 전체 표면적에서 상기 노듈 클러스터가 차지하는 면적비가 50~90%인 것을 특징으로 하는 인쇄회로용 동박.
- 제1항 또는 제2항에 있어서,상기 노듈 클러스터를 구성하는 노듈들의 전체 표면적에 대한 상기 노듈 클러스터의 표면적비가 20~80%인 것을 특징으로 하는 인쇄회로용 동박.
- 제1항에 있어서,상기 노듈 클러스터 위에는 아연(Zn), 아연(Zn) 합금 또는 아연(Zn) 산화물을 포함하는 표면처리층이 형성되고,상기 아연(Zn)의 도금양이 2~20mg/m2 인 것을 특징으로 하는 인쇄회로용 동박.
- 제1항에 있어서,상기 노듈 클러스터 위에는 크롬(Cr), 크롬(Cr) 합금 또는 크롬(Cr) 산화물을 포함하는 표면처리층이 형성되고,상기 크롬(Cr)의 도금양이 1~9mg/m2 인 것을 특징으로 하는 인쇄회로용 동박.
- 제1항에 있어서,동박의 명도가 65~82인 것을 특징으로 하는 인쇄회로용 동박.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080027982A KR100974368B1 (ko) | 2008-03-26 | 2008-03-26 | 색상차와 박리강도 특성이 개선된 인쇄회로용 동박 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080027982A KR100974368B1 (ko) | 2008-03-26 | 2008-03-26 | 색상차와 박리강도 특성이 개선된 인쇄회로용 동박 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090102502A true KR20090102502A (ko) | 2009-09-30 |
KR100974368B1 KR100974368B1 (ko) | 2010-08-05 |
Family
ID=41359963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080027982A KR100974368B1 (ko) | 2008-03-26 | 2008-03-26 | 색상차와 박리강도 특성이 개선된 인쇄회로용 동박 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100974368B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170088602A (ko) * | 2016-01-25 | 2017-08-02 | 엘에스엠트론 주식회사 | 전해 동박 및 그 제조 방법과, 동박적층판 및 인쇄회로기판 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101008750B1 (ko) | 2010-08-10 | 2011-01-14 | 엘에스엠트론 주식회사 | 리튬 이차전지의 집전체용 동박 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4379854B2 (ja) | 2001-10-30 | 2009-12-09 | 日鉱金属株式会社 | 表面処理銅箔 |
JP2006103189A (ja) * | 2004-10-06 | 2006-04-20 | Furukawa Circuit Foil Kk | 表面処理銅箔並びに回路基板 |
JP2006222185A (ja) * | 2005-02-09 | 2006-08-24 | Furukawa Circuit Foil Kk | ポリイミド系フレキシブル銅張積層板用銅箔、ポリイミド系フレキシブル銅張積層板、及びポリイミド系フレキシブルプリント配線板 |
-
2008
- 2008-03-26 KR KR1020080027982A patent/KR100974368B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170088602A (ko) * | 2016-01-25 | 2017-08-02 | 엘에스엠트론 주식회사 | 전해 동박 및 그 제조 방법과, 동박적층판 및 인쇄회로기판 |
Also Published As
Publication number | Publication date |
---|---|
KR100974368B1 (ko) | 2010-08-05 |
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