KR20090062077A - 웨이퍼 레벨 반도체 패키지 및 그 제조 방법 - Google Patents
웨이퍼 레벨 반도체 패키지 및 그 제조 방법 Download PDFInfo
- Publication number
- KR20090062077A KR20090062077A KR1020070129176A KR20070129176A KR20090062077A KR 20090062077 A KR20090062077 A KR 20090062077A KR 1020070129176 A KR1020070129176 A KR 1020070129176A KR 20070129176 A KR20070129176 A KR 20070129176A KR 20090062077 A KR20090062077 A KR 20090062077A
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- KR
- South Korea
- Prior art keywords
- wafer
- via hole
- semiconductor package
- solder ball
- conductive filler
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (3)
- 웨이퍼와;본딩패드를 포함하는 상기 웨이퍼 상면에 걸쳐 코팅되며, 마더보드와 유사한 열팽창계수를 갖는 폴리머와;상기 웨이퍼의 백면으로부터 본딩패드쪽으로 통전 가능하게 관통된 비아홀과;상기 비아홀에 충진된 전도성 충진재와;상기 비아홀의 입구에 전도성 충진재와 통전 가능하게 융착되는 솔더볼;로 구성된 것을 특징으로 하는 웨이퍼 레벨 반도체 패키지.
- 웨이퍼의 상면에 노출된 본딩패드를 포함하여 웨이퍼 상면에 걸쳐 절연성 폴리머를 코팅하는 단계와;상기 웨이퍼의 백면을 백그라인딩하는 단계와;상기 웨이퍼의 백면으로부터 본딩패드쪽으로 비아홀을 관통 형성하는 단계와;상기 본딩패드와 통전 가능하게 전도성 충진재를 비아홀에 충진시키는 단계와;상기 비아홀의 입구에 전도성 충진재와 통전 가능하게 솔더볼을 융착시키는 단계;로 이루어지는 것을 특징으로 하는 웨이퍼 레벨 반도체 패키지 제조 방법.
- 청구항 2에 있어서, 상기 절연성 폴리머는 마더보드와 유사한 열팽창계수를 갖는 것으로 채택된 것을 특징으로 하는 웨이퍼 레벨 반도체 패키지 제조 방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070129176A KR100922309B1 (ko) | 2007-12-12 | 2007-12-12 | 웨이퍼 레벨 반도체 패키지 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070129176A KR100922309B1 (ko) | 2007-12-12 | 2007-12-12 | 웨이퍼 레벨 반도체 패키지 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090062077A true KR20090062077A (ko) | 2009-06-17 |
KR100922309B1 KR100922309B1 (ko) | 2009-10-21 |
Family
ID=40991371
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070129176A KR100922309B1 (ko) | 2007-12-12 | 2007-12-12 | 웨이퍼 레벨 반도체 패키지 제조 방법 |
Country Status (1)
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KR (1) | KR100922309B1 (ko) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4522574B2 (ja) | 2000-12-04 | 2010-08-11 | 大日本印刷株式会社 | 半導体装置の作製方法 |
EP1603170B1 (en) * | 2003-03-10 | 2018-08-01 | Toyoda Gosei Co., Ltd. | Method for manufacturing a solid-state optical element device |
TWI275168B (en) * | 2003-06-06 | 2007-03-01 | Sanyo Electric Co | Semiconductor device and method for making the same |
US7772116B2 (en) | 2005-09-01 | 2010-08-10 | Micron Technology, Inc. | Methods of forming blind wafer interconnects |
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2007
- 2007-12-12 KR KR1020070129176A patent/KR100922309B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
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KR100922309B1 (ko) | 2009-10-21 |
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