KR20090060187A - Composition and transfer film for forming flat panel display member, and method for producing flat panel display member - Google Patents

Abstract

A composition for forming a flat panel display member is provided to form an inorganic layer of a flat panel display panel member with high surface smoothness and film thickness uniformity and to prevent residual bubble after plasticity. A composition for forming a flat panel display member comprises (A) inorganic powder, (B) binder resin, (C) silyl group-containing compound and (D) metal alkoxide. The binder resin(B) includes (meth)acrylic polymer of average molecular weight 10,000-50,000 having a polyoxyalkylene site. A method for manufacturing a flat panel display member comprises the steps of: transferring a composition layer for forming a flat panel display member on a substrate; and plasticizing the composition layer for forming a flat panel display member.

Description

A composition for forming a flat panel display member, a transfer film for forming a flat panel display member, and a method for manufacturing a flat panel display member {COMPOSITION AND TRANSFER FILM FOR FORMING FLAT PANEL DISPLAY MEMBER, AND METHOD FOR PRODUCING FLAT PANEL DISPLAY MEMBER}

This invention relates to the inorganic powder containing resin composition which is preferable in order to form the panel member of a flat panel display, the transfer film which has the inorganic powder containing resin layer containing the said composition, and the manufacturing method of the flat panel display member using the said transfer film.

Recently, flat panel displays (hereinafter also referred to as "FPD") such as plasma display panels (hereinafter referred to as "PDP") and field emission displays (hereinafter also referred to as "FED") have attracted attention as flat fluorescent displays. . PDP is a display which forms a transparent electrode, seals inert gas, such as argon or neon, between two adjacent glass plates, makes plasma discharge, and makes a gas shine, and light-emitting fluorescent substance and displays information. On the other hand, FED is a display which displays information by emitting electrons in a vacuum from a cathode by applying an electric field and irradiating the electrons to a phosphor on the anode to emit phosphors. 1 is a schematic diagram showing a cross-sectional shape of an AC PDP.

As a method for producing a dielectric, a partition, an electrode, a phosphor, a color filter, and a black stripe (matrix) of such FPD, for example, an inorganic powder-containing resin layer is formed on a substrate, and then fired (see Patent Document 1 below). Is known.

In the process of forming an inorganic powder containing resin layer on a board | substrate by such a method, it contains the said inorganic powder using the transfer film which formed the inorganic powder containing resin layer containing inorganic powder and binder resin on the support film which has flexibility. Since the method of transferring a resin layer onto a board | substrate can form efficiently the panel member excellent in film thickness uniformity and surface uniformity, it is used preferably.

[Patent Document 1] Japanese Patent Application Laid-Open No. 9-102273

However, the inorganic powder-containing resin layer in the conventional transfer film did not sufficiently have flexibility and transferability (heat adhesion to the substrate, which is the same below). When flexibility is insufficient, problems arise, such as cracking when winding a film on a roll, and a crack generate | occur | produce on the surface of the inorganic powder containing resin layer transferred to the board | substrate. If the transferability is insufficient, problems such as peeling from the substrate occur when firing the inorganic powder-containing resin layer.

In order to solve these problems, it is thought to improve the flexibility and transferability by lowering the glass transition point of the binder resin constituting the inorganic powder-containing resin layer or by adding a large amount of plasticizer, but the handleability of the resulting transfer film There existed a problem of being low, and becoming difficult to transfer-transform an inorganic powder containing resin layer efficiently with high positional precision.

In addition, in the conventional material design as described above, poor dispersion tends to occur during the production of the inorganic powder-containing resin paste. When poor dispersion occurs, there is a problem that pinholes are generated in the transfer film, and surface smoothness and film thickness uniformity are lowered because the aggregated inorganic powder is present in the paste.

Moreover, in the conventional transfer film, since many bubbles remain in the inorganic layer formed by baking an inorganic powder containing resin layer, the problem that the transparency and intensity | strength of an inorganic layer were lacking occurred.

Therefore, an object of this invention is to provide the composition for FPD member formation which can suppress the residual bubble after baking, and can form the FPD panel member (inorganic layer) with high surface smoothness and film thickness uniformity.

Moreover, an object of this invention is to provide the transfer film which is excellent in flexibility, transferability, and handleability, and has an inorganic powder resin layer containing the said composition.

The composition for flat panel display member formation of this invention contains (A) inorganic powder, (B) binder resin, (C) silyl group containing compound, (D) metal alkoxide, and the said binder resin (B) It is characterized by containing the (meth) acrylic-type polymer of the weight average molecular weights 10,000-50,000 which have a (B-1) polyoxyalkylene site | part in the inside.

The said polymer (B-1) originates in 5-30 weight% of structural units derived from the (meth) acrylate compound which has a polyoxyalkylene site | part, and the (meth) acrylate compound which does not have a polyoxyalkylene site | part. It is preferable to contain 30-50 weight% of structural units and 30-50 weight% of structural units derived from an aromatic vinyl compound.

The (meth) acrylate compound having the polyoxyalkylene moiety includes polyethylene glycol mono (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, methoxy polyethylene glycol (meth) acrylate, phenoxy polyethylene glycol (meth ) Acrylate, nonylphenoxypolyethylene glycol (meth) acrylate, polypropylene glycol mono (meth) acrylate, methoxypolypropylene glycol (meth) acrylate, ethoxypolypropylene glycol (meth) acrylate and nonylphenoxy It is preferable that it is at least 1 sort (meth) acrylate compound chosen from polypropylene glycol (meth) acrylate.

It is preferable that the said silyl group containing compound (C) is a compound represented by following formula (1).

(In formula, p is an integer of 3-20, m is an integer of 1-3, n is an integer of 1-3, a shows the integer of 1-3.)

It is preferable that the said metal alkoxide (D) is 1 or more types chosen from titanium alkoxide, aluminum alkoxide, and magnesium alkoxide.

It is preferable that the composition for FPD member formation of this invention contains a plasticity provision substance (E) further.

The transfer film for FPD member formation of this invention has an inorganic powder containing resin composition layer (henceforth "the composition layer for FPD member formation") on a support film, It is characterized by the above-mentioned.

The manufacturing method of the FPD member of the present invention (hereinafter also referred to as "FPD manufacturing method (I)") is a step of transferring a composition layer for forming a FPD member formed on a supporting film onto a substrate, and a composition for forming the FPD member. It is characterized by including the process of baking a layer.

Preferably, the flat panel display member is a dielectric or partition.

The transfer film of the present invention in which the inorganic powder-containing resin layer is formed using the composition for forming a FPD member of the present invention has excellent flexibility and transferability, and also has excellent handleability. In addition, residual bubbles in the inorganic powder-containing resin layer formed after firing can be reduced. Therefore, by using the transfer film of the present invention, after firing, panel members (dielectric layers, partition walls, etc.) of FPD having excellent surface smoothness and film thickness uniformity and having high transmittance and high strength can be efficiently formed with high positional accuracy. Can be.

EMBODIMENT OF THE INVENTION Hereinafter, the manufacturing method of the composition for FPD member formation of this invention, the transfer film, and the panel member of FPD is demonstrated in detail.

[Composition for FPD Member Formation]

[Inorganic powder (A)]

The inorganic powder (A) used for the composition for FPD member formation of this invention changes with kinds of panel members to form. Hereinafter, each kind of panel member is demonstrated.

As an inorganic powder used for a dielectric formation material and a partition formation material, glass powder, Preferably the glass powder whose softening point is 400-600 degreeC is mentioned, for example.

If the softening point of the glass powder is less than 400 ° C, the glass powder is melted at a stage in which the organic material such as the binder resin is not completely decomposed and removed in the firing step of the inorganic powder-containing resin layer. It may remain, and as a result, the outgas diffuses in the obtained FPD, which may reduce the lifetime of the phosphor. On the other hand, when the softening point of glass powder exceeds 600 degreeC, since an inorganic powder containing resin layer needs to be baked at higher temperature than 600 degreeC, distortion etc. may arise in the glass substrate which is a to-be-transferred body of this resin layer. .

Specific examples of the glass powder include lead oxide, boron oxide, silicon oxide and calcium oxide (PbO-B ₂ O ₃ -SiO ₂ -CaO) -based;

Zinc oxide, boron oxide and silicon oxide (ZnO—B ₂ O ₂ —SiO ₂ ) systems;

Lead oxide, boron oxide, silicon oxide and aluminum oxide (PbO-B ₂ O ₃ -SiO ₂ -Al ₂ O ₃ ) based;

Lead oxide, zinc oxide, boron oxide and silicon oxide (PbO—ZnO—B ₂ O ₃ —SiO ₂ );

Lead oxide, zinc oxide, boron oxide, silicon oxide and titanium oxide (PbO-ZnO-B ₂ O ₃ -SiO ₂ -TiO ₂ );

Bismuth oxide, boron oxide, silicon oxide (Bi ₂ O ₃ -B ₂ O ₃ -SiO ₂ ), and the like.

It is preferable that the average particle diameter of the said glass powder is 0.5-2.5 micrometers. In addition, inorganic oxides such as aluminum oxide, chromium oxide, manganese oxide, titanium oxide, zirconium oxide, silicon oxide, cerium oxide, and cobalt oxide may be used in the glass powder. It is preferable that content of the inorganic oxide to mix is 40 weight% or less of inorganic powder whole quantity (glass powder + inorganic oxide).

As inorganic powder used for an electrode formation material, Ag, Au, Al, Ni, Ag-Pd alloy, Cu, Cr, Co, etc. are mentioned, for example.

The inorganic powder used in the resistor-forming material includes, for example, RuO ₂ or the like.

As the inorganic powder used for the phosphor-forming material, for example

Y ₂ O ₃ : Eu ³⁺ , Y ₂ SiO ₅ : Eu ³⁺ , Y ₃ Al ₅ O ₁₂ : Eu ³⁺ , YVO ₄ : Eu ³⁺ , (Y, Gd) BO ₃ : Eu ³⁺ , Zn ₃ Red phosphors such as (PO ₄ ) ₂ : Mn;

Green phosphors such as Zn ₂ SiO ₄ : Mn, BaAl ₁₂ O ₁₉ : Mn, BaMgAl ₁₄ O ₂₃ : Mn, LaPO ₄ : (Ce, Tb), Y ₃ (Al, Ga) ₅ O ₁₂ : Tb;

Y ₂ SiO ₅ : Ce, BaMgAl ₁₀ O ₁₇ : Eu ²⁺ , BaMgAl ₁₄ O ₂₃ : Eu ²⁺ , (Ca, Sr, Ba) ₁₀ (PO ₄ ) ₆ C ₁₂ : Eu ²⁺ , (Zn, Cd) Blue phosphors, such as S: Ag, etc. are mentioned.

As an inorganic powder used for a color filter formation material, for example

Red pigments such as Fe ₂ O ₃ , Pb ₃ O ₄ , CdS, CdSe, PbCrO ₄ , PbSO ₄ , Fe (NO ₃ ) ₃ ;

Green pigments such as Cr ₂ O ₃ , TiO ₂ -CoO-NiO-ZnO, CoO-CrO-TiO ₂ -Al ₂ O ₃ , Co ₃ (PO ₄ ) ₂ , CoO-ZnO;

As inorganic pigments for color correction, in addition to blue pigments such as 2 (Al ₂ Na ₂ Si ₃ O ₁₀ ) · Na ₂ S ₄ ) and CoO-Al ₂ O ₃ ,

Yellow pigments such as PbCrO ₄ -PbSO ₄ , PbCrO ₄ , PbCrO ₄ -PbO, CdS and TiO ₂ -NiO-Sb ₂ O ₃ ;

Orange pigments such as Pb (Cr-Mo-S) O ₄ ;

And purple pigments such as Co ₃ (PO ₄ ) ₂ .

[Binder Resin (B)]

The binder resin (B) which comprises the composition for FPD member formation of this invention contains the (meth) acrylic-type polymer (B-1) which has a polyoxyalkylene site | part.

<Polymer (B-1)>

Polymer (B-1) used in the present invention is a (meth) acrylic polymer having a weight average molecular weight (Mw) of 10,000 to 50,000 having a polyoxyalkylene moiety. When the polymer (B-1) is contained, the transfer film of the present invention having the inorganic powder-containing resin layer obtained from the composition for forming a FPD member of the present invention is excellent in flexibility and transferability. That is, since the polymer (B-1) functions as a plasticizer, even if the inorganic powder-containing resin film is bent, no minute cracking (cracking) occurs on the surface of the resin layer, and even if it is wound up in a roll shape and stored, The storage stability is good.

Moreover, when the composition for FPD member formation contains a polymer (B-1), the thermal decomposition property of an inorganic powder containing resin paste improves and it can extinguish the bubble water which remains in an inorganic layer after baking an inorganic powder containing resin layer. have. Moreover, since polymer (B-1) is easily decomposed | disassembled and removed by heat, the function of the inorganic layer obtained by baking the said inorganic powder containing resin layer does not fall.

Moreover, when polymer (B-1) is contained, the dispersibility and storage stability of an inorganic powder containing resin paste become high, and the surface smoothness of the inorganic layer obtained by baking an inorganic powder containing resin layer and the said inorganic powder containing resin layer improves.

The polymer (B-1) constituting the binder resin of the present invention is derived from a structural unit derived from a (meth) acrylate compound having a polyoxyalkylene moiety and a (meth) acrylate compound having no polyoxyalkylene moiety. It is preferable to contain the structural unit and the structural unit derived from an aromatic vinyl compound. In addition, a polymer (B-1) may contain the structural unit derived from the other copolymerizable monomer mentioned later in addition to the said structural unit.

As said polymer (B-1), the homopolymer of the (meth) acrylate compound (henceforth a "specific (meth) acrylate compound") which has a polyoxyalkylene site | part, and said specific (meth) acrylate compound, (Meth) acrylate compound having no polyoxyalkylene moiety represented by the following formula (2) (hereinafter also referred to as "(meth) acrylate compound (1)"), selected from aromatic vinyl compounds and other copolymer monomers The copolymer with 1 or more types of these is mentioned.

(In formula, R <^1> represents a hydrogen atom or a methyl group, and R <^2> represents a monovalent organic group.)

The compound which forms the unit which comprises a polymer (B-1) below is demonstrated, respectively.

In the composition for forming a FPD member of the present invention, the preferred molecular weight of the polymer (B-1) is also referred to as weight average molecular weight (hereinafter, simply referred to as "weight average molecular weight" or "Mw") in terms of polystyrene by gel permeation chromatography (GPC). 10,000 to 50,000, more preferably 20,000 to 40,000.

Specific (meth) acrylate compound

Specific (meth) acrylate compounds that are components of the polymer (B-1) include polyethylene glycol mono (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, phenoxy Polyethylene glycol (meth) acrylate, nonylphenoxy polyethylene glycol (meth) acrylate, polypropylene glycol mono (meth) acrylate, methoxy polypropylene glycol (meth) acrylate, ethoxy polypropylene glycol (meth) acrylate And nonylphenoxy polypropylene glycol (meth) acrylate.

(Meth) acrylate compound (1)

As a (meth) acrylate compound (1) which is a component of a polymer (B-1), it is an alkyl (meth) acrylate, a hydroxyalkyl (meth) acrylate, a phenoxyalkyl (meth) acrylate, an alkoxyalkyl (meth) Acrylate, cycloalkyl (meth) acrylate, glycidyl (meth) acrylate, benzyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, and the like.

Examples of the alkyl (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth ) Acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, amyl (meth) acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (Meth) acrylate, isooctyl (meth) acrylate, ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylic The rate, dodecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, isostearyl (meth) acrylate, etc. are mentioned.

Examples of the hydroxyalkyl (meth) acrylates include hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, and 2-hydroxybutyl (meth ) Acrylate, 3-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, etc. are mentioned.

Examples of the phenoxyalkyl (meth) acrylates include phenoxyethyl (meth) acrylate and 2-hydroxy-3-phenoxypropyl (meth) acrylate.

Examples of the alkoxyalkyl (meth) acrylates include 2-methoxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2-propoxyethyl (meth) acrylate, and 2-butoxyethyl ( Meth) acrylate, 2-methoxybutyl (meth) acrylate, and the like.

Examples of the cycloalkyl (meth) acrylates include cyclohexyl (meth) acrylate, 4-butylcyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, and dish Clopentadienyl (meth) acrylate, bornyl (meth) acrylate, isobornyl (meth) acrylate, tricyclo decanyl (meth) acrylate, etc. are mentioned.

Preferred examples of the (meth) acrylate compound (1) include butyl (meth) acrylate, ethylhexyl (meth) acrylate, lauryl (meth) acrylate, isodecyl (meth) acrylate and 2-ethoxyethyl ( Meth) acrylate, and the like.

Aromatic vinyl compounds

The aromatic vinyl compound which is a component of the polymer (B-1) is not particularly limited as long as it is a compound copolymerizable with the specific (meth) acrylate compound or the (meth) acrylate compound (1). For example, styrene and α- Aromatic vinyl compounds such as methyl styrene, vinyl benzoic acid, vinyl phthalic acid, vinyl benzyl methyl ether, and vinyl toluene; Polystyrene etc. which have a (meth) acryloyl group at the terminal are mentioned. These may be used individually by 1 type and may be used in combination of 2 or more type.

Preferred examples of the aromatic vinyl compound include vinyl benzoic acid, vinyl benzyl methyl ether, styrene and α-methyl styrene.

Other copolymerizable monomer

The said polymer (B-1) reacts with copolymerizable monomers (henceforth "other copolymerizable monomer") other than the said specific (meth) acrylate compound, (meth) acrylate compound (1), and an aromatic vinyl compound. You can also As another copolymerizable monomer, Unsaturated carboxylic acid aminoalkyl ester, such as amino ethyl acrylate; Carboxylic acid vinyl esters, such as vinyl acetate and a vinyl propionate; Vinyl cyanide compounds such as (meth) acrylonitrile and α-chloroacrylonitrile; Aliphatic conjugated dienes such as 1,3-butadiene and isoprene; Unsaturated monocarboxylic acids such as (meth) acrylic acid and crotonic acid; Unsaturated dicarboxylic acids such as itaconic acid, maleic acid and fumaric acid; Other unsaturated carboxylic acids; Vinyl ethers such as vinyl benzyl methyl ether and vinyl glycidyl ether; Macromonomers, such as polymethyl (meth) acrylate, polybutyl (meth) acrylate, and polysilicon, etc. are mentioned.

Preferred examples of other copolymerizable monomers include (meth) acrylic acid, vinylbenzoic acid, maleic acid and vinylphthalic acid; Vinylglycidyl ether, styrene, butadiene and isoprene.

Polymer (B-1)

As mentioned above, as a polymer (B-1), the homopolymer of the said specific (meth) acrylate and the said specific (meth) acrylate, (meth) acrylate compound (1), an aromatic vinyl compound, and other copolymerizability The copolymer with 1 or more types chosen from a monomer is mentioned. As a preferable specific example of the said copolymer, the copolymer of the said specific (meth) acrylate, the said (meth) acrylate compound (1), and aromatic vinyl compounds is mentioned.

As a composition ratio of the said copolymer, 5-30 weight% of specific (meth) acrylates, 30-50 weight% of (meth) acrylate compounds (1), and aromatic vinyl compounding with respect to 100 weight% of a polymer (B-1) normally Logistics is 30-50 weight%, 10-25 weight% of specific (meth) acrylates, 35-45 weight% of (meth) acrylate compounds (1), and 35-45 weight% of aromatic vinyl compounds are more preferable. In addition, when it contains another copolymer monomer, it is an inorganic powder containing resin transfer film containing 1-20 weight% with respect to 100 weight% of polymer (B-1), More preferably, it is 5-15 weight%. It is preferable because it further improves the flexibility and the transferability.

As the polymer (B-1) used in the present invention, polymethylene glycol (meth) acrylate-polybutyl methacrylate copolymer, polyethylene glycol (meth) acrylate-polybutyl methacrylate copolymer, polypropylene glycol (meth Acrylate-polybutyl methacrylate copolymer, polyethylene glycol poly (meth) acrylate-methyl methacrylate-butyl methacrylate copolymer, polyethylene glycol poly (meth) acrylate-methyl methacrylate-butyl (meth ) Acrylate-styrene copolymer, polyethylene glycol poly (meth) acrylate- (meth) acrylic acid-styrene copolymer, polypropylene glycol poly (meth) acrylate-2-ethoxyethyl (meth) acrylate-styrene copolymer , Polymethylene glycol (meth) acrylate-2-ethylhexyl acrylate-styrene copolymer, polyethylene glycol (meth) acryl The rate-2-ethylhexyl acrylate styrene copolymer, the polypropylene glycol (meth) acrylate-2-ethylhexyl acrylate styrene copolymer, etc. are mentioned.

Polymer (B-1) is obtained by polymerizing the said specific (meth) acrylate compound and the said (meth) acrylate compound (1) and other copolymerizable monomer by a well-known method as needed. In addition, the molecular weight of polymer (B-1) can be adjusted by adjusting the quantity of polymerization initiator, polymerization temperature, and polymerization time suitably.

<Polymer (B-2)>

As the polymer (B-2) used in the present invention, other than the above polymer (B-1), resins other than those described above can be used without particular limitation. Especially, the (meth) acrylate polymer (henceforth simply called "acrylic resin") which does not have a polyoxyalkylene site | part is preferable. When the composition for FPD member formation of this invention contains an acrylic resin as a polymer (B-2), the inorganic powder containing resin layer formed from the said composition for FPD member formation exhibits the outstanding (heating) adhesiveness to a board | substrate. Therefore, the transfer film which apply | coated and manufactured the composition for FPD member formation of this invention on a support film becomes what is excellent in the transfer property (heat adhesiveness to a board | substrate) of an inorganic powder containing resin layer.

It is preferable that it is a (co) polymer which has appropriate adhesiveness, can bind an inorganic powder (A), and is fully oxidized and removed by the baking process (400-600 degreeC) of an inorganic powder containing resin layer as said acrylic resin.

As such an acrylic resin, the homopolymer of the said (meth) acrylate compound (1), the copolymer containing 2 or more types of said (meth) acrylate compounds (1), and a different from the said (meth) acrylate compound (1) Copolymers with copolymerizable monomers are included.

As a (meth) acrylate compound (1) used for the said polymer (B-2), the compound similar to the (meth) acrylate compound (1) used as a structural unit of the above-mentioned polymer (B-1) is used. . For example, alkyl (meth) acrylate, hydroxyalkyl (meth) acrylate, phenoxyalkyl (meth) acrylate, alkoxyalkyl (meth) acrylate, cycloalkyl (meth) acrylate, benzyl (meth) Acrylate, tetrahydrofurfuryl (meth) acrylate, and the like. Hereinafter, a specific example is shown.

Examples of the alkyl (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth ) Acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, amyl (meth) acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (Meth) acrylate, isooctyl (meth) acrylate, ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylic The rate, dodecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, isostearyl (meth) acrylate, etc. are mentioned.

Examples of the hydroxyalkyl (meth) acrylates include hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, and 2-hydroxybutyl (meth ) Acrylate, 3-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, etc. are mentioned.

Examples of the phenoxyalkyl (meth) acrylates include phenoxyethyl (meth) acrylate and 2-hydroxy-3-phenoxypropyl (meth) acrylate.

Examples of the alkoxyalkyl (meth) acrylates include 2-methoxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2-propoxyethyl (meth) acrylate, and 2-butoxyethyl ( Meth) acrylate, 2-methoxybutyl (meth) acrylate, and the like.

Examples of the cycloalkyl (meth) acrylates include cyclohexyl (meth) acrylate, 4-butylcyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, and dish Clopentadienyl (meth) acrylate, bornyl (meth) acrylate, isobornyl (meth) acrylate, tricyclo decanyl (meth) acrylate, etc. are mentioned.

Among these, the group represented by R ² in the formula (2) is preferably a group containing an alkyl group or an oxyalkylene group, and particularly preferably butyl (meth) acrylate and ethylhexyl (meth) acryl as the (meth) acrylate compound. And lauryl (meth) acrylate, isodecyl (meth) acrylate, and 2-ethoxyethyl (meth) acrylate.

Examples of the other copolymerizable monomer include, but are not particularly limited as long as it is a compound copolymerizable with the (meth) acrylate compound (1); unsaturated carboxylic acids such as (meth) acrylic acid, vinylbenzoic acid, maleic acid and vinylphthalic acid; And vinyl group-containing radically polymerizable compounds such as vinyl benzyl methyl ether, vinyl glycidyl ether, styrene, α-methyl styrene, butadiene and isoprene.

The copolymerization component derived from the (meth) acrylate compound represented by the formula (2) in the polymer (B-2) constituting the composition for forming a FPD member of the present invention is usually 70% by weight or more, preferably 90% by weight or more. to be.

Specific examples of preferred acrylic resins include polymethyl methacrylate, polybutyl methacrylate and methyl methacrylate-butyl methacrylate copolymer, butyl methacrylate-2-ethylhexyl methacrylate-2-hydroxypropyl Methacrylate copolymer, and the like.

The molecular weight of the polymer (B-2) constituting the composition for forming a FPD member of the present invention is 4,000 to 300,000, preferably 10,000 to 200,000, in terms of weight average molecular weight (Mw) in terms of polystyrene.

<The compounding quantity of binder resin (B)>

The said binder resin (B-2) is 5-80 weight part with respect to 100 weight part of inorganic powders (A), Preferably it is 10-50 weight part. If the amount of the binder resin (B-2) is too small, the inorganic powder may not be reliably bound. On the other hand, when the quantity of binder resin (B-2) is excessive, the baking process may require a long time, or the sintered body (for example, dielectric layer) formed may not have sufficient strength or film thickness.

The polymer (B-1) is usually used in an amount of 0.01 to 50 parts by weight, preferably 0.05 to 30 parts by weight, and more preferably 0.1 to 10 parts by weight based on 100 parts by weight of the inorganic powder (A). When the amount of the polymer (B-1) is less than the above range, the handleability at room temperature of the inorganic powder-containing resin layer and the transferability (heat adhesion to the substrate) of the inorganic powder-containing resin layer may be inferior. Moreover, when the quantity of a polymer (B-1) is more than the said range, the adhesiveness and transferability at the time of the transfer | transformation of the inorganic powder containing resin layer formed become excessive, and a support film becomes difficult to peel off, or has the said inorganic powder containing resin layer The handleability of a transfer film may be inferior.

[Silyl group-containing compound (C)]

The silyl group-containing compound (C) used in the present invention is a compound represented by the following general formula (1).

<Formula 1>

(In formula, p is an integer of 3-20, m is an integer of 1-3, n is an integer of 1-3, a shows the integer of 1-3.)

Sufficient flexibility may not be expressed in the said inorganic powder containing resin layer obtained even if the value of p contains saturated alkyl group containing (alkyl) alkoxysilane which is less than 3. On the other hand, since the saturated alkyl group-containing (alkyl) alkoxysilane having a p value of more than 20 has a high decomposition temperature, the silyl group-containing compound (C) is not completely decomposed and removed in the firing step of the inorganic powder-containing resin layer. The glass frit melts and a part of organic substance remains in the dielectric layer formed, and the light transmittance of a dielectric layer may fall.

The specific example used as said silyl group containing compound (C) is shown below.

As saturated alkyl dimethyl methoxysilanes (a = 1, m = 1 n = 1), for example, n-propyldimethylmethoxysilane, n-butyldimethylmethoxysilane, n-decyldimethylmethoxysilane, n- Hexadecyl dimethyl methoxysilane, n-diacid dimethyl methoxysilane, etc. are mentioned.

As saturated alkyldiethyl methoxysilanes (a = 1, m = 1, n = 2), for example, n-propyldiethylmethoxysilane, n-butyldiethylmethoxysilane, n-decyldiethyl methoxy Oxysilane, n-hexadecyldiethyl methoxysilane, n-diacid diethyl methoxysilane, etc. are mentioned.

As saturated alkyldipropylmethoxysilanes (a = 1, m = 1, n = 3), for example, n-butyldipropylmethoxysilane, n-decyldipropylmethoxysilane, n-hexadecyldipropyl Methoxysilane, n-icosane dipropyl methoxysilane, etc. are mentioned.

As saturated alkyldimethylethoxysilanes (a = 1, m = 2, n = 1), for example, n-propyldimethylethoxysilane, n-butyldimethylethoxysilane, n-decyldimethylethoxysilane, n -Hexadecyl dimethyl ethoxy silane, n-diacid dimethyl ethoxy silane, etc. are mentioned.

As saturated alkyldiethyl ethoxysilanes (a = 1, m-2, n = 2), for example, n-propyldiethylethoxysilane, n-butyldiethylethoxysilane, n-decyldiethyl Oxysilane, n-hexadecyl diethyl ethoxysilane, n- icosane diethyl ethoxysilane, etc. are mentioned.

As saturated alkyldipropylethoxysilanes (a = 1, m = 2, n = 3), for example, n-butyldipropylethoxysilane, n-decyldipropylethoxysilane, n-hexadecyldipropyl Ethoxysilane, n-icosane dipropyl ethoxysilane, etc. are mentioned.

As saturated alkyldimethylpropoxysilanes (a = 1, m = 3, n = 1), for example, n-propyldimethylpropoxysilane, n-butyldimethylpropoxysilane, n-decyldimethylpropoxysilane, n -Hexadecyl dimethyl propoxy silane, n-di-acid dimethyl propoxy silane, etc. are mentioned.

As saturated alkyldiethyl propoxysilanes (a = 1, m = 3, n = 2), for example, n-propyldiethylpropoxysilane, n-butyldiethylpropoxysilane, n-decyldiethylprop Foxy silane, n-hexa decyl diethyl propoxy silane, n- icosane diethyl propoxy silane, etc. are mentioned.

As saturated alkyldipropyl propoxysilanes (a = 1, m = 3, n = 3), for example, n-butyldipropylpropoxysilane, n-decyldipropylpropoxysilane, n-hexadecyldipropyl Propoxysilane, n-icosane dipropyl propoxysilane, etc. are mentioned.

As saturated alkylmethyldimethoxysilane (a = 2, m = 1, n = 1), for example, n-propylmethyldimethoxysilane, n-butylmethyldimethoxysilane, n-decylmethyldimethoxysilane, n -Hexadecylmethyldimethoxysilane, n-methyl dimethoxysilane, etc. are mentioned.

As saturated alkylethyldimethoxysilanes (a = 2, m = 1, n = 2), for example, n-propyldimethoxysilane, n-butyldimethoxysilane, n-decylethyldimethoxysilane, n-hexa Decyl ethyl dimethoxy silane, n-diethyl ethyl methoxysilane, etc. are mentioned.

As saturated alkyl propyl dimethoxysilanes (a = 2, m = 1, n = 3), For example, n-butylpropyldimethoxysilane, n-decylpropyldimethoxysilane, n-hexadecylpropyldimethoxysilane, n-icosane propyldimethoxysilane, etc. are mentioned.

As saturated alkylmethyl diethoxysilanes (a = 2, m = 2, n = 1), for example, n-propylmethyl diethoxysilane, n-butylmethyl diethoxysilane, n-decylmethyl diethoxysilane, n -Hexadecyl methyl diethoxysilane, n-methyl diethoxysilane, etc. are mentioned.

As saturated alkylethyl diethoxysilanes (a = 2, m = 2, n = 2), for example, n-propylethyl diethoxysilane, n-butylethyl diethoxysilane, n-decylethyl diethoxysilane, n -Hexadecyl ethyl diethoxysilane, n-diethyl ethyl diethoxysilane, etc. are mentioned.

As saturated alkylpropyl diethoxysilanes (a = 2, m = 2, n = 3), for example, n-butylpropyl diethoxysilane, n-decylpropyl diethoxysilane, n-hexadecylpropyl diethoxysilane and n-icosane propyl diethoxysilane.

As saturated alkylmethyl dipropoxysilanes (a = 2, m = 3, n = 1), for example, n-propylmethyldipropoxysilane, n-butylmethyldipropoxysilane, n-decylmethyldiprop Foxy silane, n-hexadecyl methyl dipropoxy silane, n- methyl di-propoxy silane, etc. are mentioned.

As saturated alkylethyl dipropoxysilanes (a = 2, m = 3, n = 2), for example, n-propylethyldipropoxysilane, n-butylethyldipropoxysilane, n-decylethyldiprop Foxy silane, n-hexadecyl ethyl dipropoxy silane, n- icosyl ethyl dipropoxy silane, etc. are mentioned.

As saturated alkyl propyl dipropoxy silanes (a = 2, m = 3, n = 3), for example, n-butylpropyl dipropoxy silane, n-decyl propyl dipropoxy silane, n-hexadecyl propyl dip Lopoxysilane, n-icosane propyldipropoxy silane, etc. are mentioned.

As saturated alkyl trimethoxysilanes (a = 3, m = 1), for example, n-propyltrimethoxysilane, n-butyltrimethoxysilane, n-decyltrimethoxysilane, n-hexadecyl tree Methoxysilane, n-icosane trimethoxysilane, etc. are mentioned.

As saturated alkyl triethoxysilanes (a = 3, m = 2), for example, n-propyl triethoxysilane, n-butyl triethoxysilane, n-decyl triethoxysilane, n-hexadecyl tree Ethoxysilane, n-icosane triethoxysilane, etc. are mentioned.

As saturated alkyl tripropoxysilanes (a = 3, m = 3), for example, n-propyl tripropoxy silane, n-butyl tripropoxy silane, n-decyl tripropoxy silane, n-hexadecyl tree Propoxysilane, n-icosane tripropoxysilane, etc. are mentioned.

As content rate of the silyl group containing compound (C) of this invention, it is preferable that it is 0.01-10 weight part with respect to 100 weight part of inorganic powders (A), More preferably, it is 0.1-5 weight part. When the ratio of the silyl group-containing compound (C) is too small, the surface smoothness of the inorganic powder-containing resin layer may be lowered, or the transparency of the fired film obtained by firing the inorganic powder-containing resin layer may be lowered. On the other hand, when this ratio is excessive, the storage stability of an inorganic powder containing resin composition may fall, or the handleability of the transfer film obtained may fall.

[Metal alkoxide (D)]

The metal alkoxide (D) is contained in the inorganic powder containing resin layer of this invention. Metal alkoxide (D) reacts rapidly with the hydroxyl group contained in the glass powder which is an inorganic powder (A), and then carries out substitution reaction efficiently with the said silyl group containing compound (C). For this reason, the effect of the further improvement of the dispersibility of glass powder, and the surface smoothness in the film formation material layer formed is expressed. Since a silyl group containing compound alone is inadequate reaction with glass powder, the improvement of dispersibility cannot be expected very much.

Examples of the metal alkoxide (D) used in the present invention include titanium alkoxides, aluminum alkoxides, and magnesium alkoxides. Among them, titanium alkoxide is particularly preferably used in view of reactivity.

As a specific example of the metal alkoxide used by this invention, the compound represented by following formula (3) is mentioned as a preferable thing.

R _s M (OR ') _ts

(Wherein M is a metal atom such as aluminum, titanium, or magnesium, R is a monovalent organic group having 1 to 8 carbon atoms, R 'is an alkyl group having 1 to 6 carbon atoms, t is a valence of M, and s is An integer from 0 to t-1, each of which may be the same or different when a plurality of R's or R's are present;

In the above formula (3), examples of the monovalent organic group having 1 to 8 carbon atoms include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, s-butyl group and t-butyl group. alkyl groups such as n-hexyl group, n-heptyl group, n-octyl group and 2-ethylhexyl group; Acyl groups such as an acetyl group, propionyl group, butyryl group, valeryl group, benzoyl group and trioyl group; Acyloxyl groups, such as an acetoxyl group, a propionyloxyl group, a butyryloxyl group, valeryloxyl group, a benzoyloxyl group, and a triyloxyl group; Vinyl groups, allyl groups, cyclohexyl groups, phenyl groups, glycidyl groups, (meth) acryloxy groups, ureido groups, amide groups, fluoroacetamide groups, isocyanate groups, etc., and some or all of the hydrogen atoms contained in these groups Groups substituted with a halogen atom, a substituted or unsubstituted amino group, hydroxyl group, mercapto group, isocyanate group, glycidoxy group, 3,4-epoxycyclohexyl group, (meth) acryloxy group, ureido group, ammonium base group, etc. Can be.

As the alkyl group having 1 to 6 carbon atoms of R ', for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, s-butyl group, t-butyl group, n -Hexyl group etc. are mentioned.

Examples of such metal alkoxides include titanium alkoxides such as titanium tetramethoxide, titanium tetraethoxide, titanium tetraisopropoxide and titanium tetrabutoxide; Aluminum alkoxides such as aluminum trimethoxide, aluminum triethoxy degree, aluminum triisopropoxide and aluminum tributoxide; Magnesium alkoxides, such as magnesium dimethoxide and magnesium diethoxide, are mentioned. These metal alkoxides are used individually by 1 type or in combination of 2 or more types.

As a content rate of the metal alkoxide (D) in the composition for FPD member formation of this invention, it is preferable that it is 0.001-10 weight part with respect to 100 weight part of inorganic powders (A), More preferably, it is 0.01-1 weight part to be. When the ratio of a metal alkoxide (D) is too small, the improvement effect of the dispersibility of glass powder and the improvement effect of the surface smoothness in the film formation material layer formed may not fully be exhibited. On the other hand, when this ratio is excessive, when preserving the composition for FPD member formation of this invention, a viscosity may increase with time, or it may become the cause of lowering the light transmittance of the dielectric layer obtained by reaction of metal alkoxides (D). have.

[Plasticity Granting Material (E)]

The composition for FPD member formation of this invention may contain a plasticity provision substance (E) as an adjuvant of the said binder resin (B), in order to provide favorable softness to a transfer film. The inorganic powder-containing resin layer formed of the composition for forming a FPD member containing the plasticizing substance (E) has sufficient flexibility.

Examples of the plasticizing substance (E) include a plasticizer selected from the group consisting of a compound represented by the following formula (4), a compound represented by the following formula (5), a copolymerizable monomer such as polypropylene glycol, and the above-mentioned (meth) acrylate compound; The solvent etc. which are mentioned later are mentioned, In this, it is preferable that boiling point is 150 degreeC or more. Such plasticity giving substance (E) may be used individually by 1 type, or may be used in combination of 2 or more type.

(Wherein R ³ and R ⁶ each independently represent a monovalent chain hydrocarbon group having 1 to 30 carbon atoms, and R ⁴ and R ⁵ each independently represent a methylene group or a divalent chain hydrocarbon group having 2 to 30 carbon atoms). s is an integer from 0 to 5 and t is an integer from 1 to 10.

In the general formula (4), the monovalent chain hydrocarbon group represented by R ³ or R ⁶ is a linear or branched alkyl group (saturated group) or an alkenyl group (unsaturated group), and the chain hydrocarbon group has 1 to 30 carbon atoms. Preferably it is 2-20, More preferably, it is 4-10. When carbon number of a chain hydrocarbon group exceeds the said range, the solubility to the solvent mentioned later becomes low and it may become difficult to provide favorable flexibility to an inorganic powder containing resin layer.

The divalent chain hydrocarbon group represented by R ⁴ or R ⁵ is a linear or branched alkylene group (saturated group) or an alkenylene group (unsaturated group).

Examples of the compound represented by Formula 4 include dibutyl adipate, diisobutyl adipate, di-2-ethylhexyl adipate, di-2-ethylhexyl azelate, dibutyl sebacate and dibutyl diglycol adipate Etc. can be mentioned.

(Wherein R ⁷ represents a monovalent chain hydrocarbon group having 1 to 30 carbon atoms.)

In Formula 5, the monovalent chain hydrocarbon group represented by R ⁷ is a linear or branched alkyl group (saturated group) or an alkenyl group (unsaturated group), and the carbon number of the chain hydrocarbon group is 1 to 30, preferably 2 To 20, more preferably 10 to 18.

Examples of the compound represented by Formula 5 include propylene glycol monolaurate and propylene glycol monooleate.

When using polypropylene glycol as a plasticity provision substance (E), it is preferable that the weight average molecular weights (Mw) of polystyrene conversion of the said polypropylene glycol exist in the range of 200-3,000, Especially it exists in the range of 300-2,000. desirable. When Mw is less than 200, it may become difficult to form the inorganic powder containing resin layer with a large film strength on a support film, and it heats to a glass substrate in the process of transferring the said inorganic powder containing resin layer from a support film to a glass substrate. When peeling a support film from the said inorganic powder containing resin layer bonded, the cohesive failure of this resin layer may be caused. On the other hand, when Mw exceeds 3,000, the inorganic powder containing resin layer with favorable heat adhesiveness with the glass substrate which is a to-be-transferred body may not be obtained.

The plasticity imparting substance (E) is used in an amount of 3% by weight or more, preferably 4 to 15% by weight of the total components from which the solvent is removed from the composition for forming a FPD member of the present invention. When the content of the plasticizing substance (E) is too small, it may be difficult to provide good flexibility to the transfer film to be formed.

<Solvent>

The composition for FPD member formation of this invention contains a solvent normally. Such solvents have good affinity with the inorganic powder (A) and solubility of the binder resin (B), can impart appropriate viscosity to the composition for forming the FPD member, and are easily evaporated and removed when subjected to drying treatment. It is desirable to be able to.

Moreover, especially preferable solvents include ketones, alcohols and esters (hereinafter, these are referred to as "specific solvents") having a standard boiling point (boiling point at 1 atmosphere) of 60 to 200 ° C.

Examples of the specific solvent include ketones such as methyl ethyl ketone, diethyl ketone, methyl butyl ketone, dipropyl ketone, and cyclohexanone;

alcohols such as n-pentanol, 4-methyl-2-pentanol, cyclohexanol and diacetone alcohol;

Ether alcohols such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether and propylene glycol monoethyl ether;

Saturated aliphatic monocarboxylic acid alkyl esters such as n-butyl acetate and amyl acetate;

Lactic acid esters such as ethyl lactate and n-butyl lactate;

Ether esters such as methyl cellosolve acetate, ethyl cellosolve acetate, propylene glycol monomethyl ether acetate and ethyl 3-ethoxypropionate; and the like can be given. Among these, methyl butyl ketone, cyclohexanone, diacetone alcohol, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, ethyl lactate, ethyl 3-ethoxypropionate, and the like are preferable. These specific solvents may be used alone, or may be used in combination of two or more thereof.

Moreover, as a solvent which can be used other than the said specific solvent, For example, terevin oil, ethyl cellosolve, methyl cellosolve, terpineol, butyl carbitol acetate, butyl carbitol, isopropyl alcohol, benzyl alcohol, etc. Can be mentioned.

The solvent is used in an amount of 5 to 50 parts by weight, preferably 10 to 40 parts by weight with respect to 100 parts by weight of the inorganic powder (A) from the viewpoint of maintaining the viscosity of the composition for forming the FPD member in a preferable range. Moreover, the ratio of the specific solvent with respect to all the solvent is 50 weight% or more, Preferably it is 70 weight% or more. Moreover, it is preferable that the viscosity of the composition for FPD member formation is normally the range of 2,000-200,000 cps.

[Various additives]

The composition for FPD member formation of this invention may contain various additives, such as a dispersing agent, a development promoter, an adhesion | attachment adjuvant, a halation inhibitor, a leveling agent, a storage stabilizer, an antifoamer, antioxidant, and / or a chain transfer agent as arbitrary components. have.

[Transfer film]

The transfer film for forming the FPD member of the present invention (hereinafter also referred to simply as "transfer film") is an inorganic powder (A), a binder resin (B), a silyl group-containing compound (C) and a metal alkoxide (on the support film). It is characterized by having the inorganic powder containing resin layer formed from the composition for FPD member formation containing D). Moreover, the said composition for FPD member formation may contain a plastic provision substance (E).

The transfer film of this invention may be what has a laminated film of a resist film and the said inorganic powder containing resin layer on a support film (laminated transfer film).

Moreover, you may have a cover film on the surface of an inorganic powder containing resin layer as needed.

Hereinafter, each component of a transfer film is demonstrated concretely.

(1) support film

The transfer film of this invention has a support film which supports an inorganic powder containing resin layer. It is preferable that this support film is a resin film which has heat resistance and solvent resistance, and has flexibility. Since the support film has flexibility, the composition for forming the FPD member can be applied to the surface of the support film by a roll coater or a blade coater or the like, and the resultant transfer film can be stored or supplied in a rolled state.

Examples of the resin forming the support film include fluorine-containing resins such as polyethylene terephthalate, polyester, polyethylene, polypropylene, polystyrene, polyimide, polyvinyl alcohol, polyvinyl chloride, polyfluoroethylene, nylon and cellulose. Can be.

The thickness of a support film is 20-100 micrometers. Moreover, it is preferable that the mold release process is given to the surface of a support film, and the peeling operation of a support film can be easily performed by the transfer process to a glass substrate by this.

(2) cover film

In the transfer film of this invention, in order to protect the surface of an inorganic powder containing resin layer, a cover film may be provided on the surface of the said inorganic powder containing resin layer. It is preferable that this cover film is a resin film which has flexibility, and it can preserve | save or supply in the state which wound up the transfer film obtained by this in roll shape.

As an example of resin which comprises a cover film, a polyethylene terephthalate film, a polyethylene film, a polyvinyl alcohol-type film, etc. are mentioned.

The thickness of the cover film is 20 to 100 μm. Moreover, a mold release process may be given to the surface of a cover film, and it is preferable that adhesiveness with an inorganic powder containing resin layer is smaller than a support film.

(3) inorganic powder-containing resin layer

An inorganic powder containing resin layer (composition layer for forming a FPD member) is normally formed by apply | coating the composition for FPD member formation on a support film, drying the obtained coating film, and removing all or one part of a solvent.

As a method of apply | coating the said composition for FPD member formation on a support film, it is preferable that it is a method which can form the coating film with high uniformity of film thickness, and large film thickness (for example, 10 micrometers or more) with high efficiency. Specifically, the coating method by a roll coater, the coating method by a blade coater, the coating method by a curtain coater, the coating method by a wire coater, etc. are mentioned. Although the film thickness of an inorganic powder containing resin layer changes also with the height of the panel member which should be formed, it is 10-300 micrometers normally.

As drying conditions of a coating film, it is about 0.5 to 30 minutes at 50-150 degreeC, for example, and the residual ratio (content rate in an inorganic powder containing resin layer) of the solvent after drying is usually 2 weight% or less.

[Production method of FPD]

The following aspect is mentioned as a manufacturing method of FPD of this invention.

[1] A method of forming a dielectric layer that is a panel member by a method comprising transferring a inorganic powder-containing resin layer of the transfer film of the present invention onto a substrate and firing the transferred inorganic powder-containing resin layer (FPD (I)).

[2] a process of transferring the inorganic powder-containing resin layer of the transfer film of the present invention onto a substrate, a process of forming a resist pattern on the transferred inorganic powder-containing resin layer, and an inorganic powder-containing resin layer by etching the resist Forming a pattern corresponding to the pattern and forming at least one selected from a dielectric layer, an electrode, a partition, a phosphor, a resistor, a color filter, and a black matrix, which are panel members, by a method including a step of baking the pattern. (Method for preparing FPD (II)).

[3] transferring the laminated film of the laminated transfer film onto the substrate such that the inorganic powder-containing resin layer contacts the substrate; and exposing the resist film in the transferred laminated film to form a latent image of the resist pattern; A dielectric layer that is a panel member by a process including developing and presenting a resist pattern, etching a inorganic powder-containing resin layer to form a pattern corresponding to the resist pattern, and firing the pattern; A method of forming at least one selected from an electrode, a partition, a phosphor, a resistor, a color filter, and a black matrix (manufacturing method (FPD) of FPD).

[4] a step of transferring the inorganic powder-containing resin layer of the photosensitive transfer film onto the substrate, a step of exposing the transferred inorganic powder-containing resin layer to form a latent image of the pattern, and a development treatment of the inorganic powder-containing resin layer Forming at least one kind selected from the group consisting of a dielectric layer, an electrode, a partition, a phosphor, a resistor, a color filter, and a black matrix by a method comprising a step of forming a pattern and a step of baking the pattern ( Method of Preparation of FPD (IV)).

[5] transferring the inorganic powder-containing resin layer of the transfer film of the present invention onto a substrate, baking the transferred inorganic powder-containing resin layer to form an inorganic film, and forming a resist pattern on the inorganic film At least one selected from a dielectric member, an electrode, a partition, a phosphor, a resistor, a color filter, and a black matrix, which are panel members, by a method including a step of forming a pattern corresponding to a resist pattern by etching the inorganic film. How to form (V).

Hereinafter, the manufacturing method (I) of the FPD of this invention is demonstrated.

<Method for Manufacturing FPD Member (I)>

An example of the transfer process in the manufacturing method (I) of the said FPD member is as follows.

(1) The transfer film of the state wound up in roll shape is cut out to the magnitude | size according to the area of a board | substrate.

(2) After peeling a cover film from the inorganic powder containing resin layer surface in the cut transfer film as needed, the transfer film is superposed so that the surface of an inorganic powder containing resin layer may contact the surface of a board | substrate.

(3) The heat roller is moved and thermocompressed on the transfer film superimposed on the substrate.

(4) The support film is peeled off from the inorganic powder containing resin layer fixed to the board | substrate by thermocompression bonding.

By the operation as described above, the inorganic powder-containing resin layer on the support film is transferred onto the substrate. As transfer conditions at this time, the surface temperature of a heating roller is 60-120 degreeC, the roll pressure by a heating roller is 1-5 kg / cm <2>, and the moving speed of a heating roller is 0.2-10.0 m / min, for example. Such an operation (transfer step) can be performed by a laminator device. In addition, the board | substrate may be preheated and can be 40-100 degreeC as preheating temperature, for example.

The inorganic powder-containing resin layer transferred and formed on the surface of the substrate is fired to form an inorganic sintered body (dielectric layer). As a baking method, the method of arrange | positioning the board | substrate with which the inorganic powder containing resin layer was transferred and formed in high temperature atmosphere is mentioned. By the baking treatment, the organic substance contained in the inorganic powder-containing resin layer is decomposed and removed, and the inorganic powder is melted and sintered. The firing temperature is also different depending on the melting temperature of the substrate and the constituent materials and the like in the inorganic powder-containing resin layer, but is, for example, 300 to 800 ° C, preferably 400 to 620 ° C.

EXAMPLE

Hereinafter, although an Example demonstrates this invention more concretely, this invention is not limited to these Examples. In addition, "part" shows a "weight part" below.

Synthesis Example 1

40 parts of polyethylene glycol methacrylate (hereinafter also referred to as "PEGMA"), 40 parts of 2-ethylhexyl acrylate (hereinafter also referred to as "EHA"), 20 parts of styrene (hereinafter also referred to as "ST") and N, 0.75 parts of N'- azobisisobutyronitrile were put into the autoclave equipped with the stirrer, and it stirred until it became uniform at room temperature in nitrogen atmosphere. After stirring, the mixture was polymerized at 80 ° C for 3 hours, further 0.25 parts of N, N'-azobisisobutyronitrile was polymerized for 1 hour, and the polymerization reaction was continued at 100 ° C for 1 hour, and then to room temperature. Cooling gave a polymer solution. Polymerization rate of the obtained polymer solution was 98%, and Mw of the polymer (B-1) (henceforth "resin (1)") precipitated from this polymer solution was 30,000. The results are shown in Table 1 below.

In addition, resin (2)-(5) was synthesize | combined similarly to synthesis example 1 except having used the monomer by the quantity shown in Table 1 in the synthesis example.

Synthesis Example 6

20 parts of PEGMA, 40 parts of EHA, 40 parts of ST, and 1.5 parts of N, N'-azobisisobutyronitrile were charged into an autoclave equipped with a stirrer and stirred until uniform at room temperature under a nitrogen atmosphere. After stirring, the mixture was polymerized at 90 DEG C for 3 hours, and 0.5 parts of N, N'-azobisisobutyronitrile was further polymerized for 1 hour, and the polymerization reaction was continued at 100 DEG C for 1 hour, and then until room temperature. Cooling gave a polymer solution. Polymerization rate of the obtained polymer solution was 96%, and Mw of resin (6) which precipitated from this polymer solution was 10,000. The results are shown in Table 1.

Synthesis Example 7

20 parts of PEGMA, 40 parts of EHA, 40 parts of ST, and 0.5 part of N, N'-azobisisobutyronitrile were charged into an autoclave equipped with a stirrer, and stirred until uniform at room temperature under a nitrogen atmosphere. After stirring, the mixture was polymerized at 75 ° C. for 4 hours, and 0.25 parts of N, N′-azobisisobutyronitrile was further polymerized for 2 hours, and the polymerization reaction was stirred at 100 ° C. for 1 hour, followed by room temperature. Cooling gave a polymer solution. Polymerization rate of the obtained polymer solution was 98%, and Mw of resin (7) which precipitated from this polymer solution was 50,000. The results are shown in Table 1.

Example 1

(1) Preparation of glass paste composition (composition for forming FPD member)

100 parts of a mixture of PbO-B ₂ O ₃ -SiO ₂ system having a composition of 70% by weight of lead oxide, 10% by weight of boron oxide, and 20% by weight of silicon oxide as a glass powder (inorganic powder (A)) And 10 parts of the polymer (B-1), 20 parts of the polymer (B-2) as the binder resin (B), and n-decyltrimethoxysilane (hereinafter referred to as "nDTMS") as the silyl group-containing compound (C). ) 5 parts, titanium tetraisopropoxide (hereinafter also referred to as "TTiPO") as metal alkoxide (D), 1 part, bis (2-ethylhexyl) azelate (hereinafter referred to as 3 parts and 35 parts of propylene glycol monomethyl ether as a solvent were kneaded using a dispersing machine to prepare a composition for forming an FPD member having a viscosity of 3 Pa · s.

(2) Preparation and evaluation of transfer film (flexibility and handleability)

Applying the composition for forming the FPD member prepared in the above (1) using a blade coater on a support film (400 mm wide; 30 m long; 38 μm thick) made of polyethylene terephthalate (PET) previously released. The formed coating film was dried at 100 degreeC for 5 minutes, and the solvent was removed, and the inorganic powder containing resin layer of thickness 50micrometer was formed on the support film. Subsequently, by adhering the cover film (width 400 nm; length 30 m; thickness 25 μm) made of PET previously released on the inorganic powder-containing resin layer, the present invention having the structure as shown in Fig. 2 below. A transfer film was prepared.

The obtained transfer film had flexibility, and the operation to wind up in roll shape could be performed easily. Moreover, even when this transfer film was bent, gold (flexing crack) did not exist on the surface of the inorganic powder-containing resin layer, and the resin layer had excellent flexibility.

Moreover, the cover film was peeled from this transfer film, and the said transfer film was peeled off from the surface of a glass substrate, after overlapping the said transfer film without pressing so that the surface of an inorganic powder containing resin layer might contact the surface of a glass substrate. As a result, the said resin layer showed appropriate adhesiveness with respect to a glass substrate, Moreover, the said resin layer was able to peel a transfer film without causing cohesive failure, and the handleability as a transfer film was favorable.

(3) Transfer of Inorganic Powder-Containing Resin Layer

After peeling a cover film from the transfer film obtained by said (2), the said transfer film is polymerized so that the surface of an inorganic powder containing resin layer may contact the surface (fixed surface of a bus electrode) of the glass substrate for 20-inch panels, This transfer film was thermocompression-bonded with the heating roll. As crimping conditions, the surface temperature of the heating roll was 110 degreeC, the roll pressure was 3 kg / cm <2>, and the moving speed of the heating roll was 1 m / min.

After completion of the thermocompression-bonding treatment, the support film was peeled off and removed from the inorganic powder-containing resin layer fixed (heat-bonded) to the surface of the glass substrate, thereby completing the transfer of the resin layer.

When the support film was peeled off in this transfer step, the inorganic powder-containing resin layer did not cause cohesive failure, and the resin layer had sufficiently large film strength. In addition, the transferred inorganic powder-containing resin layer had good adhesion to the surface of the glass substrate. The results are shown in Table 2 below.

(4) Firing step of inorganic powder-containing resin layer

As described above, the inorganic powder-containing resin fixed (heat-bonded) to the surface of the glass substrate was calcined in a firing furnace for 20 minutes in a temperature atmosphere of 590 ° C. Thereby, the panel member by which the dielectric material with a thickness of 40 micrometers was formed in the surface of the glass substrate was obtained. The results are shown in Table 2.

<Evaluation Method of Transfer Film>

The evaluation method of the transfer film of this invention is shown below.

(1) flexibility

When the transfer film was bent, gold was not found on the surface of the inorganic powder-containing resin layer as ○, and gold was x.

(2) residual bubbles

The inorganic layer obtained after baking was observed with the transmission optical microscope, and the average diameter of the bubble which remained in the inorganic layer was measured. Residual foam was performed based on the following evaluation criteria.

A: less than 5 μm

B: 5 micrometers or more and less than 10 micrometers

C: 10 µm or more

(3) surface smoothness

Using a non-contact three-dimensional shape measuring device (model number: NH-3 Mitaka Co., Ltd.), the measurement was performed under the conditions of the measurement range of 500 μm × 500 μm and the measurement pitch of 10 μm, and the ten-point average roughness Rz was determined as the surface roughness. It was. Surface roughness was performed based on the following evaluation criteria.

○: less than 0.01 μm

X: 0.01 micrometer or more

[Examples 2 to 9]

In Example 1, the composition for FPD member formation and the transfer film were produced like Example 1 except having used the thing of Table 2 as a composition for FPD member formation. The results are shown in Table 2.

Comparative Example 1

In Example 3, the composition for FPD member formation and the transfer film were produced like Example 3 except not having used the polymer (B-1). The results are shown in Table 2.

Comparative Example 2

In Example 3, the composition and the transfer film for FPD member formation were produced like Example 3 except having not used n-decyl trimethoxysilane (silyl group containing compound (C)). The results are shown in Table 2.

Comparative Example 3

In Example 3, the composition for FPD member formation and the transfer film were produced like Example 3 except not having used titanium tetraisopropoxide (metal alkoxide (D)). The results are shown in Table 2.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows the cross-sectional shape of AC PDP.

2 is a schematic view of a configuration example of a transfer film of the present invention.

<Brief description of symbols for the main parts of the drawings>

1, 2: glass substrate

3: bulkhead

4: transparent electrode

5: bus electrode

6: address electrode

7: fluorescent material

8, 9: dielectric layer

10: protective layer

11: bulkhead

F1: support film

F2: member formation material layer

F3: cover film

Claims (9)

Weight which contains (A) inorganic powder, (B) binder resin, (C) silyl group containing compound, (D) metal alkoxide, and has (B-1) polyoxyalkylene site | part in the said binder resin (B) A composition for forming a flat panel display member comprising a (meth) acrylic polymer having an average molecular weight of 10,000 to 50,000. The said polymer (B-1) is 5-30 weight% of structural units derived from the (meth) acrylate compound which has a polyoxyalkylene site | part, and the (meth) acryl which does not have a polyoxyalkylene site | part. 30-50 weight% of structural units derived from a rate compound, and 30-50 weight% of structural units derived from an aromatic vinyl compound are contained, The composition for flat panel display member formation characterized by the above-mentioned. The method of claim 2, wherein the (meth) acrylate compound having a polyoxyalkylene moiety is polyethylene glycol mono (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, Phenoxypolyethylene glycol (meth) acrylate, nonylphenoxy polyethylene glycol (meth) acrylate, polypropylene glycol mono (meth) acrylate, methoxy polypropylene glycol (meth) acrylate, ethoxy polypropylene glycol (meth) A composition for forming a flat panel display member, characterized in that it is at least one (meth) acrylate compound selected from among acrylates and nonylphenoxypolypropylene glycol (meth) acrylates. The composition for forming a flat panel display member according to any one of claims 1 to 3, wherein the silyl group-containing compound (C) is a compound represented by the following general formula (1). <Formula 1>

(Wherein p is an integer of 3 to 20, m is an integer of 1 to 3, n is an integer of 1 to 3, and a represents an integer of 1 to 3) The composition for forming a flat panel display member according to any one of claims 1 to 4, wherein the metal alkoxide (D) is at least one member selected from titanium alkoxide, aluminum alkoxide and magnesium alkoxide. The composition for forming a flat panel display member according to any one of claims 1 to 5, further comprising a plasticity imparting substance (E). The transfer film for flat panel display member formation which has a composition layer for flat panel display member formation obtained from the composition for flat panel display member formation in any one of Claims 1-6 on a support film. The process of transferring the composition layer for flat-panel display member formation obtained from the composition for flat-panel display member formation in any one of Claims 1-6 formed on the support film on a board | substrate, and the composition layer for flat panel display member formation A method of manufacturing a flat panel display member, comprising the step of firing a metal. The method of manufacturing a flat panel display member according to claim 8, wherein the flat panel display member is a dielectric or a partition wall.

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