JP2009283355A - Flat panel display member forming material, transfer film, and manufacturing method of flat panel display member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a material for forming a flat panel display member with excellent surface smoothness and transparency. <P>SOLUTION: The flat panel display member forming material contains inorganic powder (A), and acrylic polymer (B) containing a constituent unit having a group represented by formula (i) of 0.01-50 wt.% of entire constituent units. In the formula (i), n is an integer 0-3, and X is a hydroxyl group or a hydrolyzable group. When two or more Xs exist, they may be equal or different. R is a monovalent 1-20C hydrocarbon group. When two or more Rs exist, they may be equal or different. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a material suitable for forming a panel member of a flat panel display, a transfer film having an inorganic powder-containing resin layer obtained from the material, and a method for producing a flat panel display member.

  In recent years, flat panel displays (hereinafter also referred to as “FPD”) such as plasma display panels (hereinafter also referred to as “PDP”) and field emission displays (hereinafter also referred to as “FED”) as flat fluorescent displays. ) Is attracting attention.

  FIG. 1 shows a cross-sectional shape of the AC type PDP. In the figure, reference numerals 1 and 2 denote glass substrates facing each other, and 3 and 11 denote partition walls. A cell is partitioned by the glass substrate 1, the glass substrate 2, and the partition walls 3 and 11. 4 is a transparent electrode fixed to the glass substrate 1, 5 is a bus electrode fixed to lower the resistance value of the transparent electrode 4, 6 is an address electrode fixed to the glass substrate 2, and 7 is held in the cell. A phosphor, 8 is a dielectric layer formed on the surface of the glass substrate 1 so as to cover the transparent electrode 4 and the bus electrode 5, 9 is a dielectric layer, and 10 is a protective layer.

Manufacturing method of dielectrics, partition walls, electrodes, phosphors, color filters, and black stripes (or black matrix) which are panel members (hereinafter also referred to as “FPD members”) of FPDs typified by such PDPs and FEDs For example,
(1) A method of forming an inorganic powder-containing resin layer on a substrate and firing it (see Patent Document 1), (2) An inorganic powder-containing resin layer is formed on a substrate, and a resist is formed on the resin layer. A method of forming a pattern, etching the resin layer using this as a mask to form a pattern, and firing the pattern (see Patent Documents 2 and 3),
(3) A photosensitive inorganic powder-containing resin layer is formed on a substrate, the resin layer is irradiated with ultraviolet rays through a photomask, and developed to form a pattern on the substrate, which is baked. Method (see Patent Document 4)
Etc. are known.

  Further, in the step of forming the inorganic powder-containing resin layer on the substrate, an FPD member having excellent film thickness uniformity and surface uniformity can be formed with high work efficiency, so that the support film has flexibility. A method of transferring a resin layer onto a substrate using a transfer film on which an inorganic powder-containing resin layer containing an inorganic powder and a binder resin is formed is preferably used.

  Incidentally, in recent years, in order to increase the definition of FPD members, there has been an increasing demand for panel members having no surface roughness and no bubble residue and having high surface smoothness. In particular, a member such as a dielectric formed on the front plate of the FPD is also required to exhibit high transmittance from the viewpoint of panel luminance.

However, FPD members obtained by the FPD member manufacturing methods disclosed in Patent Documents 1 to 4 do not sufficiently satisfy the above-described requirements, and can form FPD members having high surface smoothness and transparency. New materials have not yet been obtained.
Japanese Patent Laid-Open No. 09-102273 Japanese Patent Laid-Open No. 11-162339 Japanese Patent Laid-Open No. 11-073875 Japanese Patent Laid-Open No. 11-044949

  The present invention relates to a material capable of forming an FPD member excellent in surface smoothness and transparency after firing, a transfer film having an inorganic powder-containing resin layer obtained from the material, and high surface smoothness and transparency. It aims at providing the manufacturing method of the FPD member which has this.

As a result of intensive studies to solve the above problems, the present inventors have completed the present invention. That is, the present invention relates to the following [1] to [7].
[1] An inorganic polymer (A) and an acrylic polymer (B) containing 0.01 to 50% by weight of a structural unit having a group represented by the following formula (i) in all structural units. The flat panel display member forming material characterized by the above-mentioned.

[In formula (i), n represents the integer of 0-3. X represents a hydroxyl group or a hydrolyzable group, and when two or more X exist, they may be the same or different. R represents a monovalent hydrocarbon group having 1 to 20 carbon atoms, and when two or more R exist, they may be the same or different. ]
[2] A flat panel display member forming material, wherein, in the formula (i), n is an integer of 1 to 3, and X is an alkoxy group.

[3] The flat panel display member forming material according to [1] or [2], wherein the flat panel display member is a dielectric.
[4] A support film, and an inorganic powder-containing resin layer formed on the support film and obtained from the flat panel display member forming material according to any one of [1] to [3] Transfer film.

  [5] A step of forming an inorganic powder-containing resin layer obtained from the flat panel display member forming material according to any one of [1] to [3] on a substrate, and firing the inorganic powder-containing resin layer The manufacturing method of the flat panel display member characterized by including the process to do.

  [6] Using the transfer film according to [4], a step of transferring an inorganic powder-containing resin layer obtained from a flat panel display member forming material onto a substrate, and firing the inorganic powder-containing resin layer A process for producing a flat panel display member.

  [7] The method for manufacturing a flat panel display member according to [5] or [6], wherein the flat panel display member is a dielectric.

By using the flat panel display member forming material of the present invention, a flat panel display member having high transparency can be formed. Moreover, leveling property improves when it coats and it can form the flat panel display member which has high surface smoothness.

  Hereinafter, the flat panel display member forming material, transfer film, and manufacturing method of the flat panel display member of the present invention will be described in detail. In the following description, the layer before firing obtained from the flat panel display member forming material is also referred to as “inorganic powder-containing resin layer”, and the flat panel display is also simply referred to as “FPD”.

[FPD material forming material]
The FPD member forming material of the present invention contains inorganic powder (A) and acrylic polymer (B) as essential components. Moreover, you may contain an additive (C) as an arbitrary component.

<Inorganic powder (A)>
As the inorganic powder (A) used in the present invention, various inorganic powders can be used depending on the type of FPD member to be formed. Examples thereof include glass powder; conductive powder such as Ag and Al. It is done.

  When a dielectric is formed as the FPD member, it is preferable to use glass powder having a softening point of 400 to 610 ° C, and more preferably glass powder having a temperature of 450 to 580 ° C. When the softening point of the glass powder is below the above range, the glass is not completely decomposed and removed in the baking step of the inorganic powder-containing resin layer, such as the acrylic polymer (B) used as the binder resin. Since the powder melts, a part of the organic substance may remain in the formed dielectric. For this reason, the outgas due to the organic substance may diffuse into the FPD cell and the lifetime of the phosphor may be reduced. On the other hand, if the softening point of the glass powder exceeds the above range, it may be difficult to form a high transmittance dielectric because the glass powder does not melt.

As a suitable specific example of the glass powder,
Lead oxide, boron oxide, silicon oxide and calcium oxide (PbO—B ₂ O ₃ —SiO ₂ —C
aO) system;
Zinc oxide, boron oxide and silicon oxide (ZnO—B ₂ O ₂ —SiO ₂ ) systems;
Lead oxide, boron oxide, silicon oxide and aluminum oxide (PbO—B ₂ O ₃ —SiO ₂ —
Al ₂ O ₃ ) system;
Lead oxide, zinc oxide, boron oxide and silicon oxide (PbO—ZnO—B ₂ O ₃ —SiO ₂ )
system;
Lead oxide, zinc oxide, boron oxide, silicon oxide and titanium oxide (PbO—ZnO—B ₂ O ₃ —SiO ₂ —TiO ₂ ) system;
Bismuth oxide, boron oxide and silicon oxide (Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ ) system;
Zinc oxide, phosphorus oxide and silicon oxide (ZnO—P ₂ O ₅ —SiO ₂ ) systems;
Zinc oxide, boron oxide and potassium oxide (ZnO—B ₂ O ₃ —K ₂ O) system;
Phosphorus oxide, boron oxide and aluminum oxide (P ₂ O ₅ —B ₂ O ₃ —Al ₂ O ₃ ) system;
Zinc oxide, phosphorus oxide, silicon oxide and aluminum oxide (ZnO—P ₂ O ₅ —SiO ₂ —
Al ₂ O ₃ ) system;
Zinc oxide, phosphorus oxide and titanium oxide (ZnO—P ₂ O ₅ —TiO ₂ ) systems;
Zinc oxide, boron oxide, silicon oxide and potassium oxide (ZnO—B ₂ O ₃ —SiO ₂ system—
K ₂ O) system;
Zinc oxide, boron oxide, silicon oxide, potassium oxide and calcium oxide (ZnO-B ₂
O ₃ —SiO ₂ —K ₂ O—CaO) system;
Zinc oxide, boron oxide, silicon oxide, potassium oxide and aluminum oxide (ZnO—B ₂ O ₃ —SiO ₂ —K ₂ O—Al ₂ O ₃ ) system;
Zinc oxide, boron oxide, silicon oxide, potassium oxide, calcium oxide and aluminum oxide (ZnO—B ₂ O ₃ —SiO ₂ —K ₂ O—CaO—Al ₂ O ₃ ) system;
Examples include zinc oxide, boron oxide, silicon oxide, potassium oxide, aluminum oxide, calcium oxide, and strontium oxide (ZnO—B ₂ O ₃ —SiO ₂ —K ₂ O—Al ₂ O ₃ —CaO—SrO).

  The average particle size of the glass powder is preferably 0.5 to 5.0 μm, and more preferably 1.5 to 3.5 μm. When the average particle diameter is in the above range, an FPD member excellent in transparency and adhesiveness can be formed. In addition, the average particle diameter of the glass powder in this invention is a value measured by the master sizer particle size distribution measuring method.

  Further, as the inorganic powder (A), together with the glass powder, for example, an inorganic oxide such as aluminum oxide, chromium oxide, manganese oxide, titanium oxide, zirconium oxide, silicon oxide, cerium oxide and cobalt oxide is blended. Also good.

<Acrylic polymer (B)>
The acrylic polymer (B) used in the present invention includes a structural unit having a group represented by the following formula (i) (hereinafter also referred to as “silicon-containing functional group (i)”) in all the structural units. 0.01 to 50% by weight, preferably 0.1 to 30% by weight, more preferably 1 to 10% by weight.

In formula (i), n represents an integer of 0 to 3, preferably 1 to 3. X represents a hydroxyl group or a hydrolyzable group, and when two or more X exist, they may be the same or different. R represents a monovalent hydrocarbon group having 1 to 20 carbon atoms, preferably 1 to 5 carbon atoms, and when two or more R atoms are present, they may be the same or different. Examples of the hydrolyzable group include halogen atoms such as fluorine, chlorine and bromine; alkoxy groups such as methoxy group and ethoxy group; alkenyloxy groups such as vinyloxy group and propenyloxy group; acyloxy groups such as acetoxy group and benzoyloxy group Ketoximate groups such as dimethyl ketoxymate group and cyclohexyl ketoximate group; amino groups; amide groups such as acetamide; aminooxy groups; mercapto groups and the like. Among the above X, an alkoxy group or the like is preferable from the viewpoint of affinity with inorganic particles.

  In the present invention, by using the acrylic polymer (B) as a binder resin, an inorganic powder-containing resin layer having excellent heat adhesion to the substrate can be formed. Therefore, the transfer film produced by applying the FPD member forming material of the present invention on the support film is also excellent in the transferability of the inorganic powder-containing resin layer, that is, the heat adhesion to the substrate.

In the present invention, the “acrylic polymer” refers to a polymer containing 50 to 100% by weight of a structural unit derived from a (meth) acrylate compound in all structural units.
The acrylic polymer (B) is preferably a polymer that is oxidized and removed at a firing temperature of 410 to 620 ° C. Thereby, in the baking process of the inorganic powder-containing resin layer, the acrylic polymer (B) is oxidized and removed, and an FPD member made of a good inorganic sintered body that does not generate outgas or the like can be formed.

  The weight average molecular weight (Mw) of the acrylic polymer (B) is usually 10,000 to 400,000, preferably 20,000 to 200,000, more preferably 30,000 to 16,000. When Mw is in the above range, an FPD member having excellent adhesion can be formed.

The acrylic polymer (B) used in the present invention can be produced, for example, by the methods (A) and (B) described below.
≪Method (I) ≫
A hydrosilane compound corresponding to the above formula (i) (hereinafter also referred to as “hydrosilane compound (b1)”) is converted into an acrylic polymer having a carbon-carbon double bond (hereinafter referred to as “unsaturated acrylic polymer (b2)”. It is also referred to as “)”. The acrylic polymer (B) can be produced by adding to the carbon-carbon double bond in the above).

  Examples of the hydrosilane compound (b1) include halogenated silanes such as methyldichlorosilane, trichlorosilane, and phenyldichlorosilane; methyldiethoxysilane, methyldimethoxysilane, phenyldimethoxysilane, trimethoxysilane, and triethoxysilane. Alkoxysilanes; acyloxysilanes such as methyldiacetoxysilane, phenyldiacetoxysilane, and triacetoxysilane; aminoxysilanes such as methyldiaminoxysilane, triaminoxysilane, and dimethyl / aminoxysilane . These hydrosilane compounds (b1) may be used individually by 1 type, and may use 2 or more types together.

  The unsaturated acrylic polymer (b2) is not particularly limited as long as it is other than the unsaturated acrylic polymer having a hydroxyl group. For example, the unsaturated acrylic polymer (b2) is produced by the following method (I-1) or (I-2) or a combination thereof. can do.

-Method (I-1)-
A monomer having a functional group (α) and a carbon-carbon double bond (hereinafter also referred to as “unsaturated monomer (α)”) may be used with another unsaturated monomer as necessary. (Co) polymerization.

  Next, by reacting the obtained (co) polymer with an unsaturated compound having a functional group (β) and a carbon-carbon double bond (hereinafter also referred to as “unsaturated compound (β)”). Unsaturated acrylic polymer (b2) can be manufactured. Here, the functional group (β) is a functional group capable of reacting with the functional group (α) of the (co) polymer.

-Method (I-2)-
Radical polymerization initiator having a functional group (α) (for example, 4,4-azobis-4-cyanovaleric acid), or radical polymerization initiator having a functional group (α) and a chain transfer agent (for example, 4, 4-azobis-4-cyanovaleric acid and dithioglycolic acid) are used to (co) polymerize the other unsaturated monomers described above. In this way, a (co) polymer having a functional group (α) derived from a radical polymerization initiator or a chain transfer agent at one or both ends of the molecular chain is obtained.

  Next, by reacting the obtained (co) polymer with the unsaturated compound (β), an unsaturated acrylic polymer having a carbon-carbon double bond at one or both ends of the molecular chain ( b2) can be produced.

Examples of the functional group (α) include a carboxyl group, a carboxylic acid anhydride group, a hydroxyl group, an amino group, an amineimide group, and an epoxy group.
Examples of the unsaturated monomer (α) include unsaturated carboxylic acids such as (meth) acrylic acid, crotonic acid, maleic acid, fumaric acid, and itaconic acid; unsaturated carboxylic acids such as maleic anhydride and itaconic anhydride. Acid anhydrides; hydroxyl group-containing unsaturation such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, N-methylol (meth) acrylamide, 2-hydroxyethyl vinyl ether Monomer; 2-aminoethyl (meth) acrylate, 2-aminopropyl (meth) acrylate, 3-aminopropyl (meth) acrylate, 2-dimethylaminoethyl (meth) acrylate, 2-diethylaminoethyl (meth) acrylate, 2-Dimethylaminopropyl (meth) a Amino group-containing unsaturated monomers such as relate, 3-dimethylaminopropyl (meth) acrylate, 2-aminoethyl vinyl ether, N, N-dimethylamino (meth) acrylamide, N, N-diethylamino (meth) acrylamide; 1 , 1,1-trimethylamine (meth) acrylimide, 1-methyl-1-ethylamine (meth) acrylimide, 1,1-dimethyl-1- (2-hydroxypropyl) amine (meth) acrylimide, 1,1- Dimethyl-1- (2′-phenyl-2′-hydroxyethyl) amine (meth) acrylimide, 1,1-dimethyl-1- (2′-hydroxy-2′-phenoxypropyl) amine (meth) acrylimide, etc. Amine imide group-containing unsaturated monomers: glycidyl (meth) acrylate, allyl glycidyl Ether, and the like epoxy-containing unsaturated monomers such as. These unsaturated monomers (α) may be used alone or in combination of two or more.

  Examples of the other unsaturated monomer include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, i-propyl (meth) acrylate, and (meth) acrylic acid. n-butyl, t-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, cyclohexyl (meth) acrylate, (meth) acrylamide, crotonamide, maleic acid diamide, fumaric acid diamide, itaconic acid diamide, α -Ethylacrylamide, N-butoxymethyl (meth) acrylamide, (meth) acrylonitrile, styrene, α-methylstyrene, vinyl chloride, vinyl acetate, vinyl propionate and the like. These other unsaturated monomers may be used individually by 1 type, and may use 2 or more types together.

  The unsaturated compound (β) is a compound having a functional group (β) that can react with the functional group (α), and is appropriately selected from the unsaturated monomers exemplified for the unsaturated monomer (α). The Further, as the unsaturated compound (β), an isocyanate group-containing unsaturated compound obtained by reacting the hydroxyl group-containing unsaturated monomer and the diisocyanate compound in an equimolar amount may be used.

  Specific examples of the reaction between the functional group (α) and the functional group (β) include, for example, an esterification reaction between a carboxyl group and a hydroxyl group, a ring-opening esterification reaction between a carboxylic acid anhydride group and a hydroxyl group, a carboxyl group Esterification reaction between carboxylic acid group and amino group, ring-opening amidation reaction between carboxylic anhydride group and amino group, ring-opening addition reaction between epoxy group and amino group, hydroxyl group and Examples thereof include a urethanization reaction with an isocyanate group, and a combination of these reactions.

≪Method (b) ≫
An unsaturated silane compound having at least one silicon-containing functional group (i) and a polymerizable functional group (hereinafter also referred to as “monomer (b3)”), and a monomer copolymerizable with the monomer (b3) An acrylic polymer (B) can be produced by copolymerizing with (b4). Here, the monomer (b3) and the monomer (b4) may be used alone or in combination of two or more.

In all the structural units of the copolymer, the content of the structural unit derived from the monomer (b3) is preferably 0.01 to 50% by weight, more preferably 0.1 to 30% by weight, and still more preferably 1-1.
0% by weight. When the content of the structural unit derived from the monomer (b3) is in the above range, an FPD member having excellent adhesion to the substrate and transparency can be formed.

(Monomer (b3))
The monomer (b3) is a monomer having at least one silicon-containing functional group (i) and a polymerizable functional group. For example, a monomer represented by the following general formula (b30) (hereinafter referred to as “monomer (b30)” And monomers represented by the following formulas (b31) to (b34).

In the formula (b30), n, X and R ¹ represent the same meaning as n, X and R in the formula (i), respectively. A represents a single bond, a methylene group or an alkylene group having 2 to 50 carbon atoms. Y represents a vinyl group, an epoxy group, a methacryloxy group, an acryloxy group or a styryl group, preferably a methacryloxy group or an acryloxy group.

Specific examples of the monomer (b30) include vinyl group-containing silane compounds such as vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltriacetoxysilane, and vinyltri (methoxyethoxy) silane;
3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane and 2- (3,4-epoxycyclohexyl) ) Epoxy group-containing silane compounds such as ethyltrimethoxysilane;
Contains methacryloxy groups such as 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane and 3-methacryloxypropyltrihexylsilane Silane compounds;
Acryloxy group-containing silane compounds such as 3-acryloxypropyltrimethoxysilane, 3-acryloxypropylmethyldimethoxysilane, 3-acryloxypropyltriethoxysilane and 3-acryloxypropylmethyldiethoxysilane;
Examples include styryl group-containing silane compounds such as p-styryltrimethoxysilane and p-styryltriethoxysilane.

These monomers (b3) may be used individually by 1 type, and may use 2 or more types together.
(Monomer (b4))
The monomer (b4) is a monomer copolymerizable with the monomer (b3). For example, the monomer (b4) is also referred to as a (meth) acrylate compound represented by the following general formula (b40) (hereinafter also referred to as “(meth) acrylate compound (b40)”). ); Aromatic vinyl compounds such as styrene, α-methylstyrene, vinyl benzoic acid, vinyl phthalic acid and vinyl toluene; Unsaturated carboxylic acid aminoalkyl esters such as aminoethyl acrylate; Unsaturation such as glycidyl (meth) acrylate Carboxylic acid glycidyl esters; carboxylic acid vinyl esters such as vinyl acetate and vinyl propionate; vinyl cyanide compounds such as (meth) acrylonitrile and α-chloroacrylonitrile; aliphatic conjugated dienes such as 1,3-butadiene and isoprene Class; (meta) Unsaturated monocarboxylic acids such as acrylic acid and crotonic acid; unsaturated dicarboxylic acids such as itaconic acid, maleic acid and fumaric acid; other unsaturated carboxylic acids; vinyl ethers such as vinylbenzyl methyl ether and vinyl glycidyl ether; Examples thereof include macromonomers having a (meth) acryloyl group such as polystyrene, polymethyl (meth) acrylate, polybutyl (meth) acrylate, and polysilicone.

  Among these monomers (b4), (meth) acrylate compound (b40) and glycidyl (meth) acrylate are preferable from the viewpoint of the combustibility of the acrylic polymer to be produced.

In the formula (b40), Z represents a hydrogen atom or a methyl group, and R ² represents a monovalent organic group.
Specific examples of the (meth) acrylate compound (b40) include alkyl (meth) acrylate, hydroxyalkyl (meth) acrylate, phenoxyalkyl (meth) acrylate, alkoxyalkyl (meth) acrylate, alkylglycidyl (meth) acrylate, and cycloalkyl. (Meth) acrylate, benzyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate and polyalkylene glycol mono (meth) acrylate are mentioned.

  Examples of the alkyl (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, tert-butyl (meth) ) Acrylate, pentyl (meth) acrylate, amyl (meth) acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, ethylhexyl (meth) acrylate Nonyl (meth) acrylate, Decyl (meth) acrylate, Isodecyl (meth) acrylate, Undecyl (meth) acrylate, Dodecyl (meth) acrylate, Lauri (Meth) acrylate, stearyl (meth) acrylate and isostearyl (meth) acrylate.

  Examples of the hydroxyalkyl (meth) acrylate include hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 3-hydroxybutyl (meth) ) Acrylate and 4-hydroxybutyl (meth) acrylate.

  Examples of the phenoxyalkyl (meth) acrylate include phenoxyethyl (meth) acrylate and 2-hydroxy-3-phenoxypropyl (meth) acrylate.

  Examples of the alkoxyalkyl (meth) acrylate include 2-methoxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2-propoxyethyl (meth) acrylate, 2-butoxyethyl (meth) acrylate and 2-methoxybutyl. Examples include (meth) acrylate.

Examples of the alkyl glycidyl (meth) acrylate include glycidyl (meth) acrylate and β-methylglycidyl (meth) acrylate.
Examples of the cycloalkyl (meth) acrylate include cyclohexyl (meth) acrylate, 4-butylcyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, and dicyclopentadienyl (meth). Examples include acrylate, bornyl (meth) acrylate, isobornyl (meth) acrylate, and tricyclodecanyl (meth) acrylate.

  Examples of the polyalkylene glycol mono (meth) acrylate include polyethylene glycol mono (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, phenoxypolyethylene glycol (meth) acrylate, and nonylphenoxypolyethylene glycol (meth). Examples include acrylate, polypropylene glycol mono (meth) acrylate, methoxypolypropylene glycol (meth) acrylate, ethoxypolypropylene glycol (meth) acrylate, and nonylphenoxypolypropylene glycol (meth) acrylate.

  Among these (meth) acrylate compounds (b40), butyl (meth) acrylate, ethylhexyl (meth) acrylate, lauryl (meth) acrylate, isodecyl (meth) acrylate and 2-ethoxyethyl (meth) acrylate are preferable.

(Polymerization initiator)
In producing the copolymer of the monomer (b3) and the monomer (b4), a polymerization initiator is preferably used. For example, azo compounds such as N, N′-azoisobutyronitrile and 4-azidobenzaldehyde Or an azide compound; benzyl, benzoin, benzophenone, camphorquinone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2,2-dimethoxy-2-phenylacetophenone, 2- Carbonyl compounds such as methyl- [4 ′-(methylthio) phenyl] -2-morpholino-1-propanone and 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one; t-Butyl peroxide, di-t-hexyl peroxide Benzoyl peroxide, dilauroyl peroxide, peroxide compounds and the like, such as t- butyl hydroperoxide and cumene hydroperoxide. These may be used alone or in combination of two or more.

<Additive (C)>
The FPD member forming material of the present invention may contain various additives (C). Examples of the additive (C) include solvents, plasticizers, dispersants, development accelerators, adhesion assistants, antihalation agents, leveling agents, storage stabilizers, antifoaming agents, antioxidants, and chain transfer agents. .

≪Solvent≫
The FPD member forming material of the present invention usually contains a solvent. The solvent usually used in the present invention has good affinity with the inorganic powder (A) and solubility with the acrylic polymer (B) used as the binder resin, and is suitable for the FPD member forming material. The solvent is preferably a solvent that can impart viscosity and can be easily evaporated and removed by a drying process. The solvent may also act as a plasticizer.

  Examples of the solvent include ketones, alcohols, and esters (hereinafter also referred to as “specific solvents”) having a normal boiling point (boiling point at 1 atm) of 60 to 200 ° C.

Specific examples of the specific solvent include ketones such as methyl ethyl ketone, diethyl ketone, methyl butyl ketone, dipropyl ketone and cyclohexanone;
alcohols such as n-pentanol, 4-methyl-2-pentanol, cyclohexanol and diacetone alcohol;
Ether based alcohols such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether and propylene glycol monoethyl ether;
Saturated aliphatic monocarboxylic acid alkyl esters such as acetic acid-n-butyl and amyl acetate; lactic acid esters such as ethyl lactate and lactate-n-butyl;
Examples thereof include ether type esters such as methyl cellosolve acetate, ethyl cellosolve acetate, propylene glycol monomethyl ether acetate and ethyl-3-ethoxypropionate.

  Among these, methyl butyl ketone, cyclohexanone, diacetone alcohol, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, ethyl lactate and ethyl-3-ethoxypropionate are preferable. Moreover, the said specific solvent may be used individually by 1 type, and may use 2 or more types together.

  Furthermore, solvents other than the above specific solvents may be used, and examples include turpentine oil, ethyl cellosolve, methyl cellosolve, terpineol, butyl carbitol acetate, butyl carbitol, isopropyl alcohol, and benzyl alcohol.

≪Plasticizer≫
In this invention, the inorganic powder containing resin layer excellent in the softness | flexibility can be obtained by mix | blending a plasticizer with FPD member formation material. In particular, it is suitable when the FPD member forming material of the present invention is used for a transfer film.

  Examples of the plasticizer include a plasticizer selected from a compound represented by the following general formula (1) and a compound represented by the following general formula (2), a monomer such as polypropylene glycol and the above-mentioned (meth) acrylate compound (b40), and the like. Is mentioned. These plasticizers preferably have a boiling point of 150 ° C. or higher. Moreover, the said plasticizer may be used individually by 1 type, or may use 2 or more types together.

In formula (1), R ³ and R ⁶ each independently represent a monovalent chain hydrocarbon group having 1 to 30 carbon atoms, preferably 2 to 20 carbon atoms, more preferably 4 to 10 carbon atoms. The chain hydrocarbon group is preferably a linear or branched alkyl group or alkenyl group. R ⁴ and R ⁵ each independently represents a methylene group or a divalent chain hydrocarbon group having 2 to 30 carbon atoms. In the case of a divalent chain hydrocarbon group, a linear or branched alkylene group or alkenylene group is preferable. s represents an integer of 0 to 5, and t represents an integer of 1 to 10.

When the number of carbon atoms of the chain hydrocarbon groups R ^{3 to} R ⁶ exceeds the above range, the solubility in a solvent becomes low, and it may be difficult to give good flexibility to the inorganic powder-containing resin layer. is there.

In formula (2), R ⁷ has 1 to 30 carbon atoms, preferably 2 to 20 carbon atoms, more preferably 10 to 1 carbon atoms.
8 represents a monovalent chain hydrocarbon group. The chain hydrocarbon group is preferably a linear or branched alkyl group or alkenyl group.

  Specific examples of the compound represented by the general formula (1) include dibutyl adipate, diisobutyl adipate, di-2-ethylhexyl adipate, di-2-ethylhexyl azelate, dibutyl sebacate and dibutyl diglycol adipate.

Specific examples of the compound represented by the general formula (2) include propylene glycol monolaurate and propylene glycol monooleate.
When polypropylene glycol is used as the plasticizer, the weight average molecular weight (Mw) of the polypropylene glycol is preferably in the range of 200 to 3000, and particularly preferably in the range of 300 to 2000. When Mw is less than the above range, it may be difficult to form an inorganic powder-containing resin layer having high film strength on the support film. For this reason, in the process of transferring the resin layer from the support film to the glass substrate, cohesive failure of the resin layer may occur when the support film is peeled off from the resin layer heat-bonded to the glass substrate. On the other hand, if Mw exceeds the above range, an inorganic powder-containing resin layer having good heat adhesion to the substrate that is the transfer target may not be obtained.

  Moreover, when using the (meth) acrylate compound (b40) mentioned above as a plasticizer, long-chain alkyl (meth) acrylates, such as isodecyl (meth) acrylate and lauryl (meth) acrylate, among alkyl (meth) acrylates, for example. Are preferred, and isodecyl methacrylate and lauryl methacrylate are particularly preferred.

≪Dispersant≫
The FPD member-forming material of the present invention can be used as a dispersant, for example, a compound represented by the following general formula (3), 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, or 3-methacryloxypropyl. Silane coupling agents such as methacryloxy group-containing silane compounds such as methyldiethoxysilane, 3-methacryloxypropyltriethoxysilane and 3-methacryloxypropyltrihexylsilane may be contained.

In formula (3), p is an integer of 3 to 20, preferably 4 to 16, m is an integer of 1 to 3, n is an integer of 1 to 3, and a is an integer of 1 to 3.

Specific examples of the compound represented by the general formula (3) include n-propyldimethylmethoxysilane, n-butyldimethylmethoxysilane, n-decyldimethylmethoxysilane, n-hexadecyldimethylmethoxysilane, and n-icosane. Saturated alkyldimethylmethoxysilanes such as dimethylmethoxysilane (a = 1, m = 1, n = 1);
Saturated alkyldiethylmethoxysilanes such as n-propyldiethylmethoxysilane, n-butyldiethylmethoxysilane, n-decyldiethylmethoxysilane, n-hexadecyldiethylmethoxysilane, n-icosanediethylmethoxysilane (a = 1, m = 1, n = 2);
Saturated alkyldipropylmethoxysilanes such as n-butyldipropylmethoxysilane, n-decyldipropylmethoxysilane, n-hexadecyldipropylmethoxysilane, n-icosanedipropylmethoxysilane (a = 1, m = 1, n = 3);
Saturated alkyldimethylethoxysilanes such as n-propyldimethylethoxysilane, n-butyldimethylethoxysilane, n-decyldimethylethoxysilane, n-hexadecyldimethylethoxysilane, n-icosanedimethylethoxysilane (a = 1, m = 2, n = 1);
Saturated alkyldiethylethoxysilanes such as n-propyldiethylethoxysilane, n-butyldiethylethoxysilane, n-decyldiethylethoxysilane, n-hexadecyldiethylethoxysilane, n-icosanediethylethoxysilane (a = 1, m = 2, n = 2);
Saturated alkyldipropylethoxysilanes (a = 1, m = 2, n-butyldipropylethoxysilane, n-decyldipropylethoxysilane, n-hexadecyldipropylethoxysilane, n-icosanedipropylethoxysilane) n = 3);
Saturated alkyldimethylpropoxysilanes such as n-propyldimethylpropoxysilane, n-butyldimethylpropoxysilane, n-decyldimethylpropoxysilane, n-hexadecyldimethylpropoxysilane, n-icosanedimethylpropoxysilane (a = 1, m = 3, n = 1);
Saturated alkyl diethylpropoxysilanes such as n-propyldiethylpropoxysilane, n-butyldiethylpropoxysilane, n-decyldiethylpropoxysilane, n-hexadecyldiethylpropoxysilane, n-icosanediethylpropoxysilane (a = 1, m = 3, n = 2);
Saturated alkyldipropylpropoxysilanes such as n-butyldipropylpropoxysilane, n-decyldipropylpropoxysilane, n-hexadecyldipropylpropoxysilane, n-icosanedipropylpropoxysilane (a = 1, m = 3, n = 3);
Saturated alkylmethyldimethoxysilanes such as n-propylmethyldimethoxysilane, n-butylmethyldimethoxysilane, n-decylmethyldimethoxysilane, n-hexadecylmethyldimethoxysilane, n-icosanemethyldimethoxysilane (a = 2, m = 1, n = 1);
Saturated alkylethyldimethoxysilanes such as n-propylethyldimethoxysilane, n-butylethyldimethoxysilane, n-decylethyldimethoxysilane, n-hexadecylethyldimethoxysilane, n-icosaneethyldimethoxysilane (a = 2, m = 1, n = 2);
Saturated alkylpropyldimethoxysilanes such as n-butylpropyldimethoxysilane, n-decylpropyldimethoxysilane, n-hexadecylpropyldimethoxysilane, n-icosanepropyldimethoxysilane (a = 2, m = 1, n = 3) ;
Saturated alkylmethyldiethoxysilanes such as n-propylmethyldiethoxysilane, n-butylmethyldiethoxysilane, n-decylmethyldiethoxysilane, n-hexadecylmethyldiethoxysilane, n-icosanemethyldiethoxysilane (A = 2, m = 2, n = 1);
Saturated alkylethyldiethoxysilanes such as n-propylethyldiethoxysilane, n-butylethyldiethoxysilane, n-decylethyldiethoxysilane, n-hexadecylethyldiethoxysilane, n-icosaneethyldiethoxysilane (A = 2, m = 2, n = 2);
Saturated alkylpropyldiethoxysilanes (a = 2, m = 2) such as n-butylpropyldiethoxysilane, n-decylpropyldiethoxysilane, n-hexadecylpropyldiethoxysilane, n-icosanepropyldiethoxysilane , N = 3);
Saturated alkylmethyldipropoxysilanes such as n-propylmethyldipropoxysilane, n-butylmethyldipropoxysilane, n-decylmethyldipropoxysilane, n-hexadecylmethyldipropoxysilane, n-icosanemethyldipropoxysilane (A = 2, m = 3, n = 1);
Saturated alkylethyldipropoxysilanes such as n-propylethyldipropoxysilane, n-butylethyldipropoxysilane, n-decylethyldipropoxysilane, n-hexadecylethyldipropoxysilane, n-icosaneethyldipropoxysilane (A = 2, m = 3, n = 2);
Saturated alkylpropyl dipropoxysilanes such as n-butylpropyldipropoxysilane, n-decylpropyldipropoxysilane, n-hexadecylpropyldipropoxysilane, n-icosanepropyldipropoxysilane (a = 2, m = 3) , N = 3);
Saturated alkyltrimethoxysilanes such as n-propyltrimethoxysilane, n-butyltrimethoxysilane, n-decyltrimethoxysilane, n-hexadecyltrimethoxysilane, n-icosanetrimethoxysilane (a = 3, m = 1);
Saturated alkyltriethoxysilanes such as n-propyltriethoxysilane, n-butyltriethoxysilane, n-decyltriethoxysilane, n-hexadecyltriethoxysilane, n-icosanetriethoxysilane (a = 3, m = 2);
Saturated alkyltripropoxysilanes such as n-propyltripropoxysilane, n-butyltripropoxysilane, n-decyltripropoxysilane, n-hexadecyltripropoxysilane, n-icosanetripropoxysilane (a = 3, m = 3). These may be used alone or in combination of two or more.

  Among these, n-butyltrimethoxysilane, n-decyltrimethoxysilane, n-hexadecyltrimethoxysilane, n-decyldimethylmethoxysilane, n-hexadecyldimethylmethoxysilane, n-butyltriethoxysilane, n- Decyltriethoxysilane, n-hexadecyltriethoxysilane, n-decylethyldiethoxysilane, n-hexadecylethyldiethoxysilane, n-butyltripropoxysilane, n-decyltripropoxysilane, n-hexadecyltripropoxy Silane and the like are particularly preferable.

<Combination ratio of each component>
In the FPD member forming material of the present invention, the content of the acrylic polymer (B) is usually 5 to 80 parts by weight, preferably 10 to 50 parts by weight with respect to 100 parts by weight of the inorganic powder (A). is there. When the content of the acrylic polymer (B) is excessively small, the inorganic powder (A) may not be securely bound and held. On the other hand, when the content of the acrylic polymer (B) is excessive, it is necessary to form a FPD member such as a dielectric that requires a long time for the firing process or has sufficient strength or film thickness. It can be difficult.

  The solvent is preferably used in an amount of 5 to 50 parts by weight, more preferably 10 to 40 parts by weight, based on 100 parts by weight of the inorganic powder (A). When the content of the solvent is in the above range, the viscosity of the FPD member forming material can be maintained in a suitable range. Moreover, the ratio of the said specific solvent with respect to all the solvents is 50 weight% or more normally, Preferably it is 70 weight% or more. In addition, when a solvent acts also as a plasticizer, the said content is calculated as a solvent.

The plasticizer is used in an amount of preferably 0.5% by weight or more, more preferably 1 to 10% by weight, based on 100% by weight of all components excluding the solvent from the FPD member forming material. When the content of the plasticizer is too small, it may be difficult to give good flexibility to the transfer film.

  The viscosity of the FPD member forming material of the present invention blended at the above blending ratio is usually 0.5 to 7 Pa · s, preferably 0.5 to 3 Pa · s. When the viscosity is in the above range, as described later, it becomes easy to apply the material onto a substrate or a support film, and an inorganic powder-containing resin layer can be efficiently formed.

[Transfer film]
The transfer film of the present invention has a support film and an inorganic powder-containing resin layer formed on the support film and obtained from the above-mentioned FPD member forming material. Moreover, you may have the cover film formed on the surface of the inorganic powder containing resin layer as needed. Hereinafter, each component of the transfer film will be specifically described.

(1) Support film The support film used in the present invention is preferably a resin film having heat resistance and solvent resistance and flexibility. When the support film has flexibility, the FPD member forming material can be applied to the surface of the support film by a roll coater or a blade coater. Moreover, the obtained transfer film can be preserve | saved and supplied in the state wound by roll shape.

  Examples of the resin forming the support film include fluorine-containing resins such as polyethylene terephthalate, polyester, polyethylene, polypropylene, polystyrene, polyimide, polyvinyl alcohol, polyvinyl chloride, and polyfluoroethylene; nylon and cellulose.

  The film thickness of the support film is usually 20 to 100 μm. Moreover, it is preferable that the surface of the support film is subjected to a release treatment, whereby the operation of peeling the inorganic powder-containing resin layer from the support film can be easily performed in the transfer process to the substrate.

(2) Cover film In the transfer film of the present invention, a cover film may be provided on the surface of the resin layer in order to protect the surface of the inorganic powder-containing resin layer. The cover film is preferably a flexible resin film. Thereby, the transfer film obtained can be preserve | saved and supplied in the state wound by roll shape.

Examples of the cover film include a polyethylene terephthalate film, a polyethylene film, and a polyvinyl alcohol film.
The film thickness of the cover film is usually 20 to 100 μm. Further, the surface of the cover film may be subjected to a release treatment, whereby the cover film can be easily peeled off.

Moreover, it is preferable that the adhesive force of a cover film and an inorganic powder containing resin layer is smaller than the adhesive force of an inorganic powder containing resin layer and a support film on the property of a transfer film.
(3) Inorganic powder-containing resin layer In general, an inorganic powder-containing resin layer is formed by applying an FPD member-forming material on a support film and drying the resulting coating film to remove all or part of the solvent. It is formed by.

As a method of applying the FPD member forming material on the support film, the uniformity of the film thickness is high,
In addition, it is preferably a method capable of efficiently forming a coating film having a large film thickness (for example, 10 μm or more). Specifically, a coating method using a roll coater, a coating method using a blade coater, and a coating method using a curtain coater. And a coating method using a wire coater.

  The drying condition of the coating film is, for example, about 0.5 to 30 minutes at 50 to 150 ° C., and the residual ratio of the solvent after drying (the content of the solvent in the inorganic powder-containing resin layer) is usually 2 Within weight percent.

  The film thickness of the inorganic powder-containing resin layer formed as described above is usually 10 to 300 μm, preferably 10 to 100 μm, although it depends on the height of the FPD member to be formed. When the film thickness is in the above range, for example, when the FPD member is a dielectric, the desired dielectric characteristics can be secured.

[Method for manufacturing FPD member]
The method for producing an FPD member of the present invention includes a step (a) of forming an inorganic powder-containing resin layer obtained from the above-mentioned FPD member-forming material on a substrate, and an inorganic powder-containing resin layer formed on the substrate. And (b) a step of baking.

<Process (A)>
In the step (a), as a method for forming the inorganic powder-containing resin layer obtained from the above-mentioned FPD member forming material on the substrate, (i) the forming material may be applied directly on the substrate; )
The inorganic powder-containing resin layer obtained from the FPD member forming material may be transferred onto the substrate using the transfer film described above.

-(I) FPD member forming material application process-
An example of the application process of the FPD member forming material is as follows.
(1) The FPD member forming material is coated on the substrate by a coating method using a roll coater, a coating method using a blade coater, a coating method using a curtain coater, a coating method using a wire coater, or the like.

  (2) The obtained coating film is dried, for example, at 60 to 120 ° C. for 0.5 to 30 minutes. The residual ratio of the solvent after drying (the content of the solvent in the inorganic powder-containing resin layer) is usually within 1.5% by weight.

  (3) The film thickness of the inorganic powder-containing resin layer formed as described above is usually 10 to 300 μm, preferably 10 to 100 μm, though it depends on the height of the FPD member to be formed. When the film thickness is in the above range, for example, when the FPD member is a dielectric, the desired dielectric characteristics can be secured.

-(Ii) Inorganic powder-containing resin layer transfer process-
An example of the transfer process of the inorganic powder-containing resin layer is as follows.
(1) The transfer film wound in a roll shape as shown in FIG. 2 [A] is cut into a size corresponding to the area of the substrate.

  (2) After removing the cover film provided as necessary from the surface of the inorganic powder-containing resin layer constituting the cut transfer film, the surface of the inorganic powder-containing resin layer is brought into contact with the surface of the substrate. Overlay the transfer film.

(3) A heating roller is moved on the transfer film superimposed on the substrate and thermocompression bonded. As the pressure bonding conditions at this time, for example, the surface temperature of the heating roller is 60 to 120 ° C., the roll pressure by the heating roller is 1 to 5 kg / cm ^2, and the moving speed of the heating roller is 0.2 to 10.0.
m / min. Such an operation (transfer) can be performed by a laminator apparatus. In addition, the board | substrate may be preheated and can be 40-100 degreeC as preheating temperature, for example.

(4) By peeling and removing the support film from the inorganic powder-containing resin layer fixed to the substrate by thermocompression bonding, the inorganic powder-containing resin layer on the support film is transferred onto the substrate.
<Process (I)>
The inorganic powder-containing resin layer formed on the substrate is fired to become an inorganic sintered body, and the film thickness is usually 5 to 100 μm, preferably 5 to 50 μm.

  Examples of the firing method include a method in which the substrate on which the inorganic powder-containing resin layer is formed is placed in a high temperature atmosphere. By the baking treatment, organic substances such as the acrylic polymer (B) contained in the inorganic powder-containing resin layer are decomposed and removed, and the inorganic powder (A) is melted and sintered. The firing conditions vary depending on the components contained in the inorganic powder-containing resin layer, but are, for example, a firing temperature of 550 to 620 ° C. and a firing time of 1 to 30 minutes.

[FPD members]
The inorganic sintered body obtained by the above-mentioned step (a), that is, the FPD member obtained by the production method of the present invention has high transparency. Moreover, since leveling property is improving when it apply | coats, it has high surface smoothness. For this reason, the said inorganic sintered compact is used as FPD members, such as a dielectric material, a partition, an electrode, fluorescent substance, a color filter, and a black stripe (or black matrix), for example, and is used suitably as a dielectric material especially.

EXAMPLES Hereinafter, although this invention is demonstrated more concretely based on an Example, this invention is not limited to these Examples. In the following, “part” means “part by weight”.
<Synthesis Example 1>
An autoclave equipped with a stirrer was charged with 58 parts of 2-ethylhexyl methacrylate, 39 parts of n-butyl methacrylate, 3 parts of 3-methacryloxypropyltrimethoxysilane, and 0.5 part of N, N′-azobisisobutyronitrile. Stir until uniform in a nitrogen atmosphere at room temperature.

  After stirring, the mixture is polymerized at 75 ° C. for 3 hours, further added with 0.25 part of N, N′-azobisisobutyronitrile, polymerized for 1 hour, further polymerized at 100 ° C. for 1 hour, and then cooled to room temperature. Thus, a polymer solution was obtained. The resulting polymer solution had a polymerization rate of 98%, and the Mw of the copolymer precipitated from this polymer solution (hereinafter also referred to as “resin (1)”) was 75,000. Moreover, content of the structural unit derived from 3-methacryloxypropyl trimethoxysilane in the said copolymer was 3 weight%.

<Synthesis Example 2>
A polymer solution was obtained in the same manner as in Synthesis Example 1 except that the components listed in Table 1 were charged into an autoclave equipped with a stirrer. The resulting polymer solution had a polymerization rate of 98%, and the Mw of the copolymer precipitated from this polymer solution (hereinafter also referred to as “resin (2)”) was 55000.

<Synthesis Example 3>
The components listed in Table 1 were charged into an autoclave equipped with a stirrer and stirred until uniform in a nitrogen atmosphere at room temperature.

  After stirring, polymerize at 65 ° C. for 4 hours, further add 0.25 part of N, N′-azoisobutyronitrile, polymerize for 1 hour, further polymerize at 100 ° C. for 1 hour, and then cool to room temperature. A polymer solution was obtained. The obtained polymer solution had a polymerization rate of 98%, and the Mw of the copolymer precipitated from this polymer solution (hereinafter also referred to as “resin (3)”) was 150,000.

<Synthesis Example 4>
A polymer solution was obtained in the same manner as in Synthesis Example 1 except that the components listed in Table 1 were charged into an autoclave equipped with a stirrer. The obtained polymer solution had a polymerization rate of 98%, and the Mw of the copolymer precipitated from this polymer solution (hereinafter also referred to as “resin (4)”) was 90000.

<Synthesis Example 5>
A polymer solution was obtained in the same manner as in Synthesis Example 1 except that the components listed in Table 1 were charged into an autoclave equipped with a stirrer. The resulting polymer solution had a polymerization rate of 98%, and the Mw of the copolymer precipitated from this polymer solution (hereinafter also referred to as “resin (5)”) was 75,000.

<Synthesis Example 6>
A polymer solution was obtained in the same manner as in Synthesis Example 1 except that the components listed in Table 1 were charged into an autoclave equipped with a stirrer. The resulting polymer solution had a polymerization rate of 98%, and the Mw of the copolymer precipitated from this polymer solution (hereinafter also referred to as “resin (6)”) was 75,000.

<Synthesis Example 7>
A polymer solution was obtained in the same manner as in Synthesis Example 1 except that the components listed in Table 1 were charged into an autoclave equipped with a stirrer. The resulting polymer solution had a polymerization rate of 98%, and the Mw of the copolymer precipitated from this polymer solution (hereinafter also referred to as “resin (7)”) was 75,000.

<Synthesis Example 8>
A polymer solution was obtained in the same manner as in Synthesis Example 1 except that the components listed in Table 1 were charged into an autoclave equipped with a stirrer. The obtained polymer solution had a polymerization rate of 98%, and the Mw of the copolymer precipitated from this polymer solution (hereinafter also referred to as “resin (8)”) was 75,000.

<Synthesis Example 9>
A polymer solution was obtained in the same manner as in Synthesis Example 1 except that the components listed in Table 1 were charged into an autoclave equipped with a stirrer. The obtained polymer solution had a polymerization rate of 98%, and the Mw of the copolymer precipitated from this polymer solution (hereinafter also referred to as “resin (9)”) was 90000.

[Example 1]
(1) Preparation of FPD member forming material Glass powder (ZnO—B ₂ O ₃ —SiO ₂ having a composition of 40 wt% zinc oxide, 40 wt% boron oxide and 20 wt% silicon oxide) as inorganic powder (A) System mixture, softening point 55
100 parts at 0 ° C., 30 parts of resin (1) as acrylic polymer (B), 3 parts of di-2-ethylhexyl azelate (hereinafter also referred to as “EHAz”) as plasticizer, and propylene glycol monomethyl as solvent An FPD member forming material having a viscosity of 2 Pa · s was prepared by kneading 35 parts of ether (hereinafter also referred to as “PEGME”) using a disperser.

(2) Production of Transfer Film A support film (width 400 mm, length 30 m, made of polyethylene terephthalate (hereinafter also referred to as “PET”), which has been subjected to release treatment in advance, for the FPD member forming material prepared in (1) above. The film was applied using a blade coater over a thickness of 38 μm.

Next, the formed coating film was dried at 100 ° C. for 5 minutes to remove the solvent, thereby forming an inorganic powder-containing resin layer having a thickness of 50 μm on the support film.
Next, a cover film (width 400 mm, length 30 m, thickness 25 μm) made of PET that has been subjected to mold release treatment is pasted onto the inorganic powder-containing resin layer, whereby the configuration shown in FIG. A transfer film was produced.

  The obtained transfer film was flexible and could be easily wound up into a roll. Moreover, even if this transfer film was bent, the surface of the inorganic powder-containing resin layer was not cracked (bent crack), and the resin layer had excellent flexibility.

  Further, after peeling the cover film from the transfer film and overlaying the transfer film without applying pressure so that the surface of the inorganic powder-containing resin layer is in contact with the surface of the glass substrate, the transfer film is I peeled it off the surface of the glass substrate. As a result, the resin layer shows moderate adhesiveness to the glass substrate, and the transfer film can be peeled off without causing cohesive failure of the resin layer, and the handling property as a transfer film is good. It was something.

(3) Production of FPD member (3-1) Transfer process of inorganic powder-containing resin layer After peeling the cover film from the transfer film obtained in (2) above, on the surface of the glass substrate for 20-inch panel, The transfer film was overlaid so that the surface of the inorganic powder-containing resin layer was in contact, and the transfer film was thermocompression bonded with a heating roll. As the pressure bonding conditions, the surface temperature of the heating roll was 110 ° C., the roll pressure was 3 kg / cm ^2, and the moving speed of the heating roll was 1 m / min.

After completion of the thermocompression treatment, the support film was peeled and removed from the inorganic powder-containing resin layer heat-bonded to the surface of the glass substrate to complete the transfer of the resin layer.
In this transfer step, the inorganic powder-containing resin layer did not cause cohesive failure when the support film was peeled off, and the resin layer had a sufficiently large film strength. Furthermore, the transferred inorganic powder-containing resin layer had good adhesion to the surface of the glass substrate.

(3-2) Firing step of inorganic powder-containing resin layer The inorganic powder-containing resin layer formed on the surface of the glass substrate obtained in (3-1) above was heated at 590 ° C in a firing furnace. Baking treatment was performed for 20 minutes in a temperature atmosphere. Thereby, an FPD member in which a dielectric having a thickness of 40 μm was formed on the surface of the glass substrate could be obtained. The results obtained according to the following evaluation method are shown in Table 2.

-Transparency-
After firing, the linear transmittance (measurement wavelength 550 nm) of the obtained FPD member (dielectric layer) was measured with a spectrophotometer (UV-2450: manufactured by Shimadzu Corporation). An FPD member having a transmittance of less than 80% was rated as x, an FPD member having a transmittance of 80% or more and less than 90% was rated as ◯, and an FPD member having a transmittance of 90% or more was rated as ◎.

-Surface smoothness-
After firing, the obtained FPD member (dielectric layer) was subjected to a measurement range of 5000 μm × 5000 μm and a measurement pitch of 100 μm using a non-contact three-dimensional shape measuring device (model number: NH-3, Mitaka Kogyo Co., Ltd.). The 10-point average roughness (Rz) was defined as the surface roughness. An FPD member having a surface roughness of 0.10 μm or more was rated as “×”, an FPD member having a surface roughness of 0.05 μm or more and less than 0.10 μm was marked as “◯”, and an FPD member having a surface roughness of less than 0.05 μm was marked as “◎”.

[Example 2]
An FPD member forming material, a transfer film and an FPD member were produced and evaluated in the same manner as in Example 1 except that the resin (2) was used as the acrylic polymer (B). The evaluation results are shown in Table 2.

[Example 3]
An FPD member forming material, a transfer film and an FPD member were produced and evaluated in the same manner as in Example 1 except that the resin (3) was used as the acrylic polymer (B). The evaluation results are shown in Table 2.

[Example 4]
An FPD member forming material, a transfer film and an FPD member were produced and evaluated in the same manner as in Example 1 except that the resin (4) was used as the acrylic polymer (B). The evaluation results are shown in Table 2.

[Example 5]
An FPD member forming material, a transfer film and an FPD member were produced and evaluated in the same manner as in Example 1 except that the resin (5) was used as the acrylic polymer (B). The evaluation results are shown in Table 2.

[Example 6]
An FPD member-forming material, a transfer film, and an FPD member were produced and evaluated in the same manner as in Example 1 except that the resin (6) was used as the acrylic polymer (B). The evaluation results are shown in Table 2.

[Example 7]
An FPD member-forming material, a transfer film and an FPD member were produced and evaluated in the same manner as in Example 1 except that the resin (7) was used as the acrylic polymer (B). The evaluation results are shown in Table 2.

[Example 8]
An FPD member forming material was prepared in the same manner as in Example 1 except that 1 part of n-decyltrimethoxysilane was introduced as a dispersant. Next, in the same manner as in Example 1, a transfer film and an FPD member were produced and evaluated. The evaluation results are shown in Table 2.

[Comparative Example 1]
An FPD member forming material, a transfer film and an FPD member were produced and evaluated in the same manner as in Example 1 except that the resin (8) was used as the acrylic polymer (B). The evaluation results are shown in Table 2.

[Comparative Example 2]
An FPD member-forming material, a transfer film, and an FPD member were produced and evaluated in the same manner as in Example 1 except that the resin (9) was used as the acrylic polymer (B). The evaluation results are shown in Table 2.

[Comparative Example 3]
In the same manner as in Example 1 except that the resin (8) was used as the acrylic polymer (B) and 1 part of 3-methacryloxypropyltrimethoxysilane was introduced as a dispersant, an FPD member forming material, a transfer film, and An FPD member was manufactured and evaluated. The evaluation results are shown in Table 2.

[Comparative Example 4]
In the same manner as in Example 1 except that the resin (9) was used as the acrylic polymer (B) and 1 part of 3-methacryloxypropyltrimethoxysilane was introduced as a dispersant, an FPD member forming material, a transfer film, and An FPD member was manufactured and evaluated. The evaluation results are shown in Table 2.

[Comparative Example 5]
FPD member forming material, transfer film and FPD member in the same manner as in Example 1 except that the resin (8) was used as the acrylic polymer (B) and 1 part of n-decyltrimethoxysilane was introduced as the dispersant. Were manufactured and evaluated. The evaluation results are shown in Table 2.

[Comparative Example 6]
FPD member forming material, transfer film and FPD member in the same manner as in Example 1 except that the resin (9) was used as the acrylic polymer (B) and 1 part of n-decyltrimethoxysilane was introduced as the dispersant. Were manufactured and evaluated. The evaluation results are shown in Table 2.

It is a schematic diagram which shows the cross-sectional shape of alternating current type PDP. It is the schematic of the structural example of the transfer film of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Glass substrate 3 Partition 4 Transparent electrode 5 Bus electrode 6 Address electrode 7 Phosphor 8 Dielectric layer 9 Dielectric layer 10 Protective layer 11 Partition F1 Support film F2 Inorganic powder containing resin layer F3 Cover film

Claims (7)

Inorganic powder (A), and acrylic polymer (B) containing 0.01 to 50% by weight of a structural unit having a group represented by the following formula (i) in all structural units
A flat panel display member forming material comprising:
[In formula (i), n represents the integer of 0-3. X represents a hydroxyl group or a hydrolyzable group, and when two or more X exist, they may be the same or different. R represents a monovalent hydrocarbon group having 1 to 20 carbon atoms, and when two or more R exist, they may be the same or different. ]   In the above formula (i), n is an integer of 1 to 3, and X is an alkoxy group.   The flat panel display member forming material according to claim 1, wherein the flat panel display member is a dielectric. A transfer film comprising a support film and an inorganic powder-containing resin layer formed on the support film and obtained from the flat panel display member forming material according to claim 1. Forming an inorganic powder-containing resin layer obtained from the flat panel display member forming material according to any one of claims 1 to 3 on a substrate;
And baking the inorganic powder-containing resin layer. A method for manufacturing a flat panel display member. Using the transfer film according to claim 4, a step of transferring an inorganic powder-containing resin layer obtained from a flat panel display member forming material onto a substrate;
And baking the inorganic powder-containing resin layer. A method for manufacturing a flat panel display member.   The method of manufacturing a flat panel display member according to claim 5, wherein the flat panel display member is a dielectric.